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WO2018181600A1 - Composition de résine époxy pour scellement, et dispositif à composant électronique - Google Patents

Composition de résine époxy pour scellement, et dispositif à composant électronique Download PDF

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Publication number
WO2018181600A1
WO2018181600A1 PCT/JP2018/013017 JP2018013017W WO2018181600A1 WO 2018181600 A1 WO2018181600 A1 WO 2018181600A1 JP 2018013017 W JP2018013017 W JP 2018013017W WO 2018181600 A1 WO2018181600 A1 WO 2018181600A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
mass
resin composition
inorganic filler
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/013017
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English (en)
Japanese (ja)
Inventor
実佳 田中
慧地 堀
東哲 姜
格 山浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN201880021591.7A priority Critical patent/CN110461939A/zh
Priority to JP2019510060A priority patent/JP7060011B2/ja
Priority to CN202211541808.1A priority patent/CN115785621A/zh
Publication of WO2018181600A1 publication Critical patent/WO2018181600A1/fr
Anticipated expiration legal-status Critical
Priority to JP2022065362A priority patent/JP7472931B2/ja
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Definitions

  • the present invention relates to an epoxy resin composition for sealing and an electronic component device.
  • JP 2010-24464 A JP 2008-297530 A Japanese Patent Laid-Open No. 2003-213089
  • the epoxy resin composition for sealing in which an inorganic filler having excellent heat dissipation such as alumina is highly filled has a problem that the hardness at the time of heating is lowered and the material is not necessarily excellent in continuous moldability. .
  • An object of one embodiment of the present invention is to provide an epoxy resin composition for sealing excellent in thermal hardness and thermal conductivity, and an electronic component device including an element sealed using the same.
  • ⁇ 1> (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler, and the inorganic filler contains 75% by mass or more of alumina with respect to the total amount of the inorganic filler.
  • An epoxy resin composition for sealing containing 98% by mass.
  • the inorganic filler includes alumina and at least one inorganic filler selected from the group consisting of silicon nitride, boron nitride, magnesium oxide, zinc oxide, silicon carbide, and aluminum nitride.
  • the epoxy resin composition for sealing as described.
  • ⁇ 3> The epoxy resin composition for sealing according to ⁇ 1> or ⁇ 2>, wherein the curing agent is a phenol curing agent.
  • An electronic component device comprising an element and a cured product of the sealing epoxy resin composition according to any one of ⁇ 1> to ⁇ 3>, which seals the element.
  • an epoxy resin composition for sealing excellent in thermal hardness and thermal conductivity and an electronic component device including an element sealed using the same.
  • each component may contain a plurality of corresponding substances.
  • the content of each component means the total content of the plurality of substances present in the composition unless otherwise specified.
  • the sealing epoxy resin composition of the present disclosure includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler, and the inorganic filler is the total amount of the inorganic filler. On the other hand, it contains 75% by mass to 98% by mass of alumina. Thereby, the epoxy resin composition for sealing which has high heat dissipation, suppressing the fall of the hardness at the time of heat
  • Epoxy resin composition The epoxy resin composition for sealing of the present disclosure (hereinafter also referred to as “epoxy resin composition”) includes (A) an epoxy resin. (A) The type of epoxy resin is not particularly limited as long as it has an epoxy group in the molecule.
  • the epoxy resin is selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A and bisphenol F, and naphthol compounds such as ⁇ -naphthol, ⁇ -naphthol and dihydroxynaphthalene.
  • phenol compounds such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A and bisphenol F
  • naphthol compounds such as ⁇ -naphthol, ⁇ -naphthol and dihydroxynaphthalene.
  • a novolak epoxy resin obtained by epoxidizing a novolak resin obtained by condensation or cocondensation of at least one phenolic compound and an aliphatic aldehyde compound such as formaldehyde, acetaldehyde or propionaldehyde under an acidic catalyst.
  • a triphenylmethane type epoxy resin obtained by epoxidizing a triphenylmethane type phenol resin obtained by condensation or cocondensation in the above phenol compound and naphthol compound, formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, salicylaldehyde, etc.
  • Copolymerization type epoxy resin obtained by epoxidizing a novolak resin obtained by cocondensation with an aldehyde compound under an acidic catalyst; diphenylmethane type epoxy resin that is diglycidyl ether such as bisphenol A, bisphenol AD, bisphenol F; alkyl Biphenyl type epoxy resin which is diglycidyl ether of substituted or unsubstituted biphenol; Stilbene type epoxy resin which is diglycidyl ether of stilbene phenol compound Sulfur atom-containing epoxy resins that are diglycidyl ethers such as bisphenol S; epoxy resins that are glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; and many other resins such as phthalic acid, isophthalic acid, tetrahydrophthalic acid, and dimer acid
  • a glycidyl ester type epoxy resin which is a glycidyl ester of a
  • the epoxy equivalent (molecular weight / number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of balance of various properties such as moldability, reflow resistance, and electrical reliability, it is preferably 100 g / eq to 1000 g / eq, and more preferably 150 g / eq to 500 g / eq.
  • the epoxy equivalent of the epoxy resin is a value measured by a method according to JIS K 7236: 2009.
  • the melting point or softening point of the epoxy resin is not particularly limited. From the viewpoint of moldability and reflow resistance, the temperature is preferably 40 ° C to 180 ° C, and from the viewpoint of handleability when preparing the epoxy resin composition, it is more preferably 50 ° C to 130 ° C.
  • the melting point or softening point of the epoxy resin is a value measured by a single cylinder rotational viscometer method described in JIS K 7234: 1986 and JIS K 7233: 1986.
  • the content of the epoxy resin (A) in the epoxy resin composition is preferably 2% by mass to 10% by mass, and 2.5% by mass to 7% by mass from the viewpoints of strength, fluidity, heat resistance, moldability and the like. It is more preferably 5% by mass, and further preferably 3% by mass to 6.5% by mass.
  • the epoxy resin composition of the present disclosure includes (B) a curing agent.
  • curing agent is not restrict
  • (B) curing agents include phenol curing agents, amine curing agents, acid anhydride curing agents, polymercaptan curing agents, polyaminoamide curing agents, isocyanate curing agents, and blocked isocyanate curing agents.
  • the curing agent is preferably a phenol curing agent.
  • phenol curing agent examples include resorcin, catechol, bisphenol A, bisphenol F, phenol compounds such as phenol, cresol, xylenol, phenylphenol, and aminophenol, and naphthol compounds such as ⁇ -naphthol, ⁇ -naphthol, and dihydroxynaphthalene.
  • a novolak-type phenol resin obtained by condensation or cocondensation of at least one phenolic compound selected from the group consisting of aldehyde compounds such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde with an acidic catalyst; Compounds such as phenol aralkyl resins and naphthol aralkyl resins synthesized from dimethoxyparaxylene, bis (methoxymethyl) biphenyl, etc.
  • aldehyde compounds such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde with an acidic catalyst
  • Compounds such as phenol aralkyl resins and naphthol aralkyl resins synthesized from dimethoxyparaxylene, bis (methoxymethyl) biphenyl, etc.
  • Ralalkyl-type phenol resin paraxylylene-modified phenol resin; metaxylylene-modified phenol resin; melamine-modified phenol resin; terpene-modified phenol resin; Examples thereof include cyclopentadiene type naphthol resin; cyclopentadiene modified phenol resin; polycyclic aromatic ring modified phenol resin; biphenyl type phenol resin.
  • a phenol aralkyl resin is preferable from the viewpoint of improving reflow resistance.
  • These phenol curing agents may be used alone or in combination of two or more.
  • the functional group equivalent of the curing agent (hydroxyl equivalent in the case of a phenol curing agent) is not particularly limited. From the viewpoint of balance of various properties such as moldability, reflow resistance, and electrical reliability, it is preferably 70 g / eq to 1000 g / eq, and more preferably 80 g / eq to 500 g / eq.
  • the hydroxyl equivalent of the phenol curing agent is a value measured by a method according to JIS K 0070: 1992.
  • the melting point or softening point of the curing agent is not particularly limited. From the viewpoint of moldability and reflow resistance, the temperature is preferably 40 ° C to 180 ° C, and from the viewpoint of handleability during production of the epoxy resin composition, it is more preferably 50 ° C to 130 ° C.
  • the melting point or softening point of the curing agent is a value measured by a single cylinder rotational viscometer method described in JIS K 7234: 1986 and JIS K 7233: 1986.
  • the number of functional groups in the epoxy resin is not particularly limited. From the viewpoint of reducing the amount of each unreacted component, it is preferably set in the range of 0.5 to 1.5, more preferably in the range of 0.6 to 1.3, and 0.7 More preferably, it is set in the range of -1.2.
  • the epoxy resin composition of the present disclosure includes (C) a curing accelerator.
  • the kind in particular of hardening accelerator is not restrict
  • a phosphorus type hardening accelerator is preferable from a viewpoint of the electrical reliability of an epoxy resin composition, and the fluidity
  • the curing accelerator examples include 1,8-diaza-bicyclo (5,4,0) undecene-7, 1,5-diaza-bicyclo (4,3,0) nonene, 5,6- Tertiary amines such as dibutylamino-1,8-diaza-bicyclo (5,4,0) undecene-7, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol and their derivatives Imidazoles such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole and their derivatives, organic phosphines such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine, and phenylphosphine; These phosphines include maleic anhydride and ben Phosphorus compounds having intramolecular polarization formed by adding
  • the content of the (C) curing accelerator in the epoxy resin composition is not particularly limited as long as a curing acceleration effect is obtained.
  • the content of (C) curing accelerator in the epoxy resin composition is 0.1% by mass to 8.0% by mass with respect to the total amount of (A) epoxy resin and (B) curing agent.
  • the content is 0.5% by mass to 5.0% by mass, and more preferably 1.0% by mass to 3.0% by mass.
  • the curing time tends to be shortened.
  • the content is 0.0 mass% or less, the curing rate is not too high and a good molded product tends to be obtained.
  • the epoxy resin composition of the present disclosure includes (D) an inorganic filler.
  • the inorganic filler contains 75% by mass to 98% by mass of alumina with respect to the total amount of the inorganic filler.
  • alumina an epoxy resin composition excellent in thermal conductivity is obtained, and by containing 98 mass% or less of alumina, an epoxy resin composition in which a decrease in hardness during heating is suppressed is obtained.
  • the inorganic filler preferably contains 75% by mass to 95% by mass of alumina, more preferably 75% by mass to 92% by mass, and more preferably 75% by mass to 90% by mass with respect to the total amount of the inorganic filler. More preferably, the content is 75% by mass to 85% by mass.
  • inorganic filler contains 75 mass% to 98 mass% of alumina, it contains 2 mass% to 25 mass% of inorganic filler other than alumina.
  • inorganic fillers other than alumina include fused silica, crystalline silica, silicon nitride, boron nitride, magnesium oxide, zinc oxide, silicon carbide, aluminum nitride, zircon, and silicic acid.
  • Powders such as calcium, calcium carbonate, potassium titanate, beryllia, zirconia, fosterite, steatite, spinel, mullite, titania, beads spheroidized from these, single crystal fiber such as potassium titanate, glass fiber, aramid fiber And carbon fiber.
  • Other inorganic fillers include aluminum hydroxide, zinc borate, magnesium hydroxide and the like from the viewpoint of flame retardancy. Other inorganic fillers may be used alone or in combination of two or more.
  • the inorganic filler is at least one selected from the group consisting of silicon nitride, boron nitride, magnesium oxide, zinc oxide, silicon carbide and aluminum nitride as an inorganic filler other than alumina from the viewpoint of thermal conductivity. It is preferable that an inorganic filler is included. Of these, silicon carbide is more preferable.
  • the inorganic filler preferably contains 5% by mass to 25% by mass of inorganic fillers other than alumina, more preferably 8% by mass to 25% by mass, and more preferably 10% by mass with respect to the total amount of the inorganic filler. More preferably, it is contained in an amount of from 25 to 25% by mass, and particularly preferably 15 to 25% by mass.
  • the (D) inorganic filler preferably contains 5% by mass to 25% by mass of silicon carbide, more preferably 8% by mass to 25% by mass, and more preferably 10% by mass to 25% by mass with respect to the total amount of the inorganic filler. More preferably, the content is more preferably 15% by mass to 25% by mass.
  • the content of the inorganic filler (D) in the epoxy resin composition is 83% by mass to 97% by mass with respect to the total amount of the epoxy resin composition from the viewpoints of hygroscopicity, reduction of linear expansion coefficient, strength improvement, and solder heat resistance. It is preferably 85% by mass to 94% by mass, more preferably 88% by mass to 93% by mass.
  • the content of alumina in the epoxy resin composition is preferably 60% by mass to 95% by mass with respect to the total amount of the epoxy resin composition from the viewpoints of hygroscopicity, reduction of linear expansion coefficient, strength improvement, and solder heat resistance. 65 mass% to 90 mass% is more preferable, and 75 mass% to 85 mass% is still more preferable.
  • the shape of the (D) inorganic filler is not particularly limited, and examples thereof include powder, sphere, and fiber. Among them, a spherical shape is preferable from the viewpoint of fluidity and mold wear during molding of the epoxy resin composition.
  • the epoxy resin composition of this indication may contain other ingredients other than the above-mentioned (A) epoxy resin, (B) hardening agent, (C) hardening accelerator, and (D) inorganic filler.
  • the other components are not particularly limited as long as the effects of the present invention are achieved, and include mold release agents; coupling agents; flame retardants such as brominated epoxy resins and phosphorus compounds; flame retardants such as antimony trioxide and antimony tetraoxide.
  • Various additives such as auxiliary agents; coloring agents; stress relaxation agents;
  • specific examples of a mold release agent, a coupling agent, a colorant, and a stress relaxation agent will be described as other components.
  • the epoxy resin composition may further contain a release agent from the viewpoint of obtaining good release properties from the mold during molding.
  • the release agent is not particularly limited, and conventionally known release agents can be used. Specifically, higher fatty acids such as carnauba wax, montanic acid, stearic acid, higher fatty acid metal salts, fatty acid ester waxes such as paraffin wax, montanic acid ester, polyolefin waxes such as polyethylene oxide and non-oxidized polyethylene, etc. Can be mentioned.
  • a mold release agent may be used individually by 1 type, or may be used in combination of 2 or more type.
  • the content of the release agent is preferably 10% by mass or less based on the total amount of (A) the epoxy resin and (B) the curing agent, and the effect From the viewpoint of exhibiting the above, it is preferably 0.5% by mass or more.
  • the epoxy resin composition may further contain a coupling agent.
  • the kind in particular of coupling agent is not restrict
  • Examples of the coupling agent include a silane coupling agent and a titanium coupling agent.
  • a coupling agent may be used individually by 1 type, or may be used in combination of 2 or more type.
  • silane coupling agents examples include vinyltrichlorosilane, vinyltriethoxysilane, vinyltris ( ⁇ -methoxyethoxy) silane, ⁇ -methacryloxypropyltrimethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane.
  • ⁇ -glycidoxypropyltrimethoxysilane vinyltriacetoxysilane, ⁇ -mercaptopropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, ⁇ - [bis ( ⁇ -hydroxyethyl)] aminopropyltriethoxysilane, N - ⁇ - (aminoethyl) - ⁇ -aminopropyltrimethoxysilane, ⁇ - ( ⁇ -aminoethyl) aminopropyldimethoxymethylsilane, N- (trimethoxysilylpropyl) ethylenediamine, N- (dimethoxymethylsilyloxy) Propyl) ethylenediamine, methyltrimethoxysilane, methyltriethoxysilane, N- ⁇ - (N-vinylbenzylaminoethyl) - ⁇ -aminopropyltrimethoxysilane, ⁇ -chlor
  • titanium coupling agent examples include isopropyl triisostearoyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, isopropyl tri (N-aminoethyl-aminoethyl) titanate, tetraoctyl bis (ditridecyl phosphite) titanate, tetra ( 2,2-diallyloxymethyl-1-butyl) bis (ditridecylphosphite) titanate, bis (dioctylpyrophosphate) oxyacetate titanate, bis (dioctylpyrophosphate) ethylene titanate, isopropyltrioctanoyl titanate, isopropyldimethacryloiso Stearoyl titanate, isopropyltridodecylbenzenesulfonyl titanate, isopropylisostearoyl diacrylic Titanate,
  • an epoxy resin composition contains a coupling agent
  • the content rate of a coupling agent is 3 mass% or less with respect to the whole epoxy resin composition, from a viewpoint of exhibiting the effect, it is 0. It is preferable that it is 1 mass% or more.
  • the epoxy resin composition may further contain a colorant.
  • a colorant include known colorants such as carbon black, organic dyes, organic pigments, iron oxide, red lead, and bengara.
  • the content of the colorant can be appropriately selected according to the purpose and the like.
  • a coloring agent may be used individually by 1 type, or may be used in combination of 2 or more type.
  • conductive particles such as carbon black are used in combination as the colorant
  • the epoxy resin composition may further contain a stress relaxation agent such as silicone oil, silicone rubber particles, and synthetic rubber. By including the stress relaxation agent, warpage deformation of the package and generation of package cracks can be further reduced.
  • a stress relaxation agent the well-known stress relaxation agent (flexible agent) generally used is mentioned.
  • thermoplastic elastomers such as silicone, styrene, olefin, urethane, polyester, polyether, polyamide, polybutadiene, NR (natural rubber), NBR (acrylonitrile-butadiene rubber), acrylic Rubber particles such as rubber, urethane rubber and silicone powder, core-shell such as methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, methyl methacrylate-butyl acrylate copolymer Examples thereof include rubber particles having a structure.
  • a stress relaxation agent may be used individually by 1 type, or may be used in combination of 2 or more type.
  • the method for preparing the epoxy resin composition is not particularly limited.
  • a general technique there can be mentioned a method in which components of a predetermined blending amount are sufficiently mixed by a mixer or the like, and then melt-kneaded by a mixing roll, an extruder or the like, cooled and pulverized. More specifically, for example, a method in which predetermined amounts of the above-described components are stirred and mixed, kneaded with a kneader, roll, extruder, or the like that has been heated to 70 ° C. to 140 ° C., cooled, and pulverized. be able to.
  • An electronic component device of the present disclosure includes an element and a cured product of the above-described sealing epoxy resin composition that seals the element.
  • Electronic component devices include lead frames, pre-wired tape carriers, wiring boards, glass, silicon wafers, organic substrates and other supporting members, active elements such as semiconductor chips, transistors, diodes, and thyristors, capacitors, and resistors. And an element portion obtained by mounting a passive element such as a coil) with an epoxy resin composition. More specifically, the element is fixed on the lead frame, the terminal part of the element such as a bonding pad and the lead part are connected by wire bonding, bump, etc., and then sealed by transfer molding or the like using an epoxy resin composition.
  • DIP Device Inline Package
  • PLCC Physical Leaded Chip Carrier
  • QFP Quad Flat Package
  • SOP Small Outline Package T
  • SOJ Small Outline J-Lead Package
  • General resin-sealed IC Integrated Circuit
  • TQFP Thin Quad Flat Package
  • TCP Tepe Carrier Package having a structure in which elements connected to bumpers by bumps are sealed with an epoxy resin composition; elements connected to wiring formed on a support member by wire bonding, flip chip bonding, solder, etc.
  • COB Chip On Board
  • COB Chip On Board module having a structure sealed with an epoxy resin composition, hybrid IC, multi-chip module, etc .
  • an element is mounted on the surface of a support member in which terminals for connecting a wiring board are formed on the back surface, and bumps Or after connecting an element and the wiring formed in the support member by wire bonding, BGA (Ball Grid Array), CSP (Chip Size Package), MCP (Multi Chip) which has the structure which sealed the element with the epoxy resin composition Packag e).
  • an epoxy resin composition can be used suitably also in a printed wiring board.
  • Examples of a method for sealing an electronic component device using an epoxy resin composition include a low-pressure transfer molding method, an injection molding method, and a compression molding method. Among these, the low-pressure transfer molding method is common.
  • Alumina filler, Denka Co., Ltd., product name "DAB10FCAll” ⁇ DA-2 ⁇ ⁇ ⁇ Alumina filler, Admatechs Co., Ltd., product name “AE-2000SI” DB-1 ... Alumina filler / silica filler 9/1 (mass ratio), Denka Co., Ltd., product name "DAB-10FC” DC-1 ... average particle diameter (D50, particle diameter corresponding to 50% volume accumulation from the small diameter side) 14.0 ⁇ m and specific surface area 0.3 m 2 / g silicon carbide.
  • DC-2 average Silicon carbide with particle size (D50, particle size corresponding to 50% volume accumulation from the small diameter side) 18.6 ⁇ m and specific surface area 0.3 m 2 / g
  • Evaluation of the thermal conductivity of the epoxy resin composition was performed as follows.
  • the epoxy resin composition prepared as described above was subjected to a test piece for thermal conductivity evaluation using a vacuum hand press molding machine under conditions of a mold temperature of 175 ° C. to 180 ° C., a molding pressure of 7.0 MPa, and a curing time of 600 seconds ( 1.1 cm square and 1.1 mm thickness).
  • the molded specimen was measured for thermal diffusivity in the thickness direction.
  • the thermal diffusivity was measured by a laser flash method (apparatus: LFA447 nanoflash, manufactured by NETZSCH). Pulse light irradiation was performed under the conditions of a pulse width of 0.31 (ms) and an applied voltage of 247V.

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  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)

Abstract

L'invention concerne une composition de résine époxy pour scellement, qui contient (A) une résine époxy, (B) un agent de durcissement, (C) un accélérateur de durcissement et (D) une charge inorganique, et qui est configurée de telle sorte que la charge inorganique contienne 75% en masse à 98% en masse d'alumine par rapport à la masse totale de la charge inorganique.
PCT/JP2018/013017 2017-03-31 2018-03-28 Composition de résine époxy pour scellement, et dispositif à composant électronique Ceased WO2018181600A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201880021591.7A CN110461939A (zh) 2017-03-31 2018-03-28 密封用环氧树脂组合物和电子部件装置
JP2019510060A JP7060011B2 (ja) 2017-03-31 2018-03-28 封止用エポキシ樹脂組成物及び電子部品装置
CN202211541808.1A CN115785621A (zh) 2017-03-31 2018-03-28 密封用环氧树脂组合物和电子部件装置
JP2022065362A JP7472931B2 (ja) 2017-03-31 2022-04-11 封止用エポキシ樹脂組成物及び電子部品装置

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JP2017-072892 2017-03-31
JP2017072892 2017-03-31

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WO2018181600A1 true WO2018181600A1 (fr) 2018-10-04

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CN (2) CN110461939A (fr)
TW (1) TW201842021A (fr)
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WO2023210493A1 (fr) * 2022-04-28 2023-11-02 住友化学株式会社 Composition de résine, et poudre d'alumine mise en œuvre dans celle-ci
WO2023210492A1 (fr) * 2022-04-28 2023-11-02 住友化学株式会社 Composition de résine, et poudre d'alumine mise en œuvre dans celle-ci
KR20240101780A (ko) 2021-11-16 2024-07-02 나믹스 가부시끼가이샤 에폭시 수지 조성물, 액상 컴프레션 몰드재, 글로브 탑재, 및 반도체 장치

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Publication number Priority date Publication date Assignee Title
CN111349414A (zh) * 2018-12-21 2020-06-30 上海得荣电子材料有限公司 一种低应力绝缘胶及其制备方法
CN115449184B (zh) * 2022-08-31 2024-02-20 江苏中科科化新材料股份有限公司 一种低翘曲热固性环氧树脂复合材料及其制备方法与应用

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