WO2018181600A1 - Epoxy resin composition for sealing, and electronic component device - Google Patents

Abstract

An epoxy resin composition for sealing, which contains (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator and (D) an inorganic filler, and which is configured such that the inorganic filler contains 75% by mass to 98% by mass of alumina relative to the total mass of the inorganic filler.

Description

Epoxy resin composition for sealing and electronic component device

The present invention relates to an epoxy resin composition for sealing and an electronic component device.

In recent years, electronic devices such as smartphones are becoming lighter, thinner, and more functional. Along with this, heat generated from electronic devices that handle high-speed and large-capacity information is increasing, and the electronic devices may malfunction. Therefore, it is required to efficiently dissipate heat generated from the inside of the electronic device, that is, high heat dissipation (high thermal conductivity). In addition to studying equipment structures with high heat dissipation, etc., higher heat dissipation of the sealing material itself is also being studied. As such a technique, the use of an inorganic filler such as alumina, which has excellent heat dissipation, and high filling of the inorganic filler have been studied (for example, Patent Documents 1 to 3).

JP 2010-24464 A JP 2008-297530 A Japanese Patent Laid-Open No. 2003-213089

However, the epoxy resin composition for sealing in which an inorganic filler having excellent heat dissipation such as alumina is highly filled has a problem that the hardness at the time of heating is lowered and the material is not necessarily excellent in continuous moldability. .

An object of one embodiment of the present invention is to provide an epoxy resin composition for sealing excellent in thermal hardness and thermal conductivity, and an electronic component device including an element sealed using the same.

As mentioned above, as a method for dissipating the heat generated from electronic equipment, high filling of alumina with excellent heat dissipation has been carried out so far, but the hardness during heat decreases and there is a problem with continuous formability There is. As a result of intensive studies, the present inventors have achieved a balance between excellent thermal conductivity and excellent hot hardness of the epoxy resin composition by replacing a part of alumina with another inorganic filler.
For example, the following embodiments are included in the means for solving the above problems.

<1> (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler, and the inorganic filler contains 75% by mass or more of alumina with respect to the total amount of the inorganic filler. An epoxy resin composition for sealing containing 98% by mass.
<2> The inorganic filler includes alumina and at least one inorganic filler selected from the group consisting of silicon nitride, boron nitride, magnesium oxide, zinc oxide, silicon carbide, and aluminum nitride. The epoxy resin composition for sealing as described.
<3> The epoxy resin composition for sealing according to <1> or <2>, wherein the curing agent is a phenol curing agent.

<4> An electronic component device comprising an element and a cured product of the sealing epoxy resin composition according to any one of <1> to <3>, which seals the element.

According to one embodiment of the present invention, it is possible to provide an epoxy resin composition for sealing excellent in thermal hardness and thermal conductivity, and an electronic component device including an element sealed using the same.

Hereinafter, embodiments for carrying out the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the components (including element steps and the like) are not essential unless otherwise specified. The same applies to numerical values and ranges thereof, and the present invention is not limited thereto.

In the present disclosure, numerical ranges indicated using “to” include numerical values described before and after “to” as the minimum value and the maximum value, respectively.
In the numerical ranges described stepwise in the present disclosure, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerical description. . Further, in the numerical ranges described in the present disclosure, the upper limit value or the lower limit value of the numerical range may be replaced with the values shown in the examples.
In the present disclosure, each component may contain a plurality of corresponding substances. When a plurality of substances corresponding to each component are present in the composition, the content of each component means the total content of the plurality of substances present in the composition unless otherwise specified.

[Epoxy resin composition for sealing]
The sealing epoxy resin composition of the present disclosure includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler, and the inorganic filler is the total amount of the inorganic filler. On the other hand, it contains 75% by mass to 98% by mass of alumina. Thereby, the epoxy resin composition for sealing which has high heat dissipation, suppressing the fall of the hardness at the time of heat | fever is provided. Moreover, the epoxy resin composition for sealing of this indication is used in order to seal an electronic component apparatus, for example.

[(A) Epoxy resin]
The epoxy resin composition for sealing of the present disclosure (hereinafter also referred to as “epoxy resin composition”) includes (A) an epoxy resin. (A) The type of epoxy resin is not particularly limited as long as it has an epoxy group in the molecule.

(A) Specifically, the epoxy resin is selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A and bisphenol F, and naphthol compounds such as α-naphthol, β-naphthol and dihydroxynaphthalene. A novolak epoxy resin obtained by epoxidizing a novolak resin obtained by condensation or cocondensation of at least one phenolic compound and an aliphatic aldehyde compound such as formaldehyde, acetaldehyde or propionaldehyde under an acidic catalyst. Phenol novolac type epoxy resin, orthocresol novolak type epoxy resin, etc.); the above phenolic compounds and aromatic aldehyde compounds such as benzaldehyde and salicylaldehyde in an acidic catalyst A triphenylmethane type epoxy resin obtained by epoxidizing a triphenylmethane type phenol resin obtained by condensation or cocondensation in the above; phenol compound and naphthol compound, formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, salicylaldehyde, etc. Copolymerization type epoxy resin obtained by epoxidizing a novolak resin obtained by cocondensation with an aldehyde compound under an acidic catalyst; diphenylmethane type epoxy resin that is diglycidyl ether such as bisphenol A, bisphenol AD, bisphenol F; alkyl Biphenyl type epoxy resin which is diglycidyl ether of substituted or unsubstituted biphenol; Stilbene type epoxy resin which is diglycidyl ether of stilbene phenol compound Sulfur atom-containing epoxy resins that are diglycidyl ethers such as bisphenol S; epoxy resins that are glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; and many other resins such as phthalic acid, isophthalic acid, tetrahydrophthalic acid, and dimer acid A glycidyl ester type epoxy resin which is a glycidyl ester of a polyvalent carboxylic acid compound; a glycidyl amine type epoxy resin in which an active hydrogen bonded to a nitrogen atom such as aniline, diaminodiphenylmethane, isocyanuric acid or the like is substituted with a glycidyl group; Dicyclopentadiene type epoxy resin that is epoxidized co-condensation resin of phenol compound; Vinylcyclohexene diepoxy that is epoxidized olefin bond in the molecule Fats such as side, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 2- (3,4-epoxy) cyclohexyl-5,5-spiro (3,4-epoxy) cyclohexane-m-dioxane Cyclic epoxy resin; paraxylylene-modified epoxy resin that is glycidyl ether of paraxylylene-modified phenolic resin; metaxylylene-modified epoxy resin that is glycidyl ether of metaxylylene-modified phenolic resin; terpene-modified epoxy resin that is glycidyl ether of terpene-modified phenolic resin; dicyclopentadiene Dicyclopentadiene modified epoxy resin which is glycidyl ether of modified phenolic resin; Cyclopentadiene modified epoxy resin which is glycidyl ether of cyclopentadiene modified phenolic resin Poxy resin; Polycyclic aromatic ring modified epoxy resin that is glycidyl ether of polycyclic aromatic ring modified phenolic resin; Naphthalene type epoxy resin that is glycidyl ether of phenol resin containing naphthalene ring; Halogenated phenol novolac type epoxy resin; Hydroquinone type epoxy resin ; Trimethylolpropane type epoxy resin; linear aliphatic epoxy resin obtained by oxidizing olefinic bond with peracid such as peracetic acid; epoxidized aralkyl type phenolic resin such as phenol aralkyl resin and naphthol aralkyl resin Aralkyl type epoxy resin; and the like. Furthermore, an epoxidized product of a silicone resin, an epoxidized product of an acrylic resin, and the like are also exemplified as the epoxy resin. These epoxy resins may be used alone or in combination of two or more.

(A) The epoxy equivalent (molecular weight / number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of balance of various properties such as moldability, reflow resistance, and electrical reliability, it is preferably 100 g / eq to 1000 g / eq, and more preferably 150 g / eq to 500 g / eq.

(A) The epoxy equivalent of the epoxy resin is a value measured by a method according to JIS K 7236: 2009.

(A) The melting point or softening point of the epoxy resin is not particularly limited. From the viewpoint of moldability and reflow resistance, the temperature is preferably 40 ° C to 180 ° C, and from the viewpoint of handleability when preparing the epoxy resin composition, it is more preferably 50 ° C to 130 ° C.

(A) The melting point or softening point of the epoxy resin is a value measured by a single cylinder rotational viscometer method described in JIS K 7234: 1986 and JIS K 7233: 1986.

The content of the epoxy resin (A) in the epoxy resin composition is preferably 2% by mass to 10% by mass, and 2.5% by mass to 7% by mass from the viewpoints of strength, fluidity, heat resistance, moldability and the like. It is more preferably 5% by mass, and further preferably 3% by mass to 6.5% by mass.

[(B) Curing agent]
The epoxy resin composition of the present disclosure includes (B) a curing agent. The kind in particular of hardening | curing agent is not restrict | limited, It can select according to the kind of (A) kind of epoxy resin, the desired characteristic of an epoxy resin composition, etc.

Specific examples of (B) curing agents include phenol curing agents, amine curing agents, acid anhydride curing agents, polymercaptan curing agents, polyaminoamide curing agents, isocyanate curing agents, and blocked isocyanate curing agents. From the viewpoint of improving heat resistance, the curing agent is preferably a phenol curing agent.

Specific examples of the phenol curing agent include resorcin, catechol, bisphenol A, bisphenol F, phenol compounds such as phenol, cresol, xylenol, phenylphenol, and aminophenol, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene. A novolak-type phenol resin obtained by condensation or cocondensation of at least one phenolic compound selected from the group consisting of aldehyde compounds such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde with an acidic catalyst; Compounds such as phenol aralkyl resins and naphthol aralkyl resins synthesized from dimethoxyparaxylene, bis (methoxymethyl) biphenyl, etc. Ralalkyl-type phenol resin; paraxylylene-modified phenol resin; metaxylylene-modified phenol resin; melamine-modified phenol resin; terpene-modified phenol resin; Examples thereof include cyclopentadiene type naphthol resin; cyclopentadiene modified phenol resin; polycyclic aromatic ring modified phenol resin; biphenyl type phenol resin. For example, a phenol aralkyl resin is preferable from the viewpoint of improving reflow resistance.
These phenol curing agents may be used alone or in combination of two or more.

(B) The functional group equivalent of the curing agent (hydroxyl equivalent in the case of a phenol curing agent) is not particularly limited. From the viewpoint of balance of various properties such as moldability, reflow resistance, and electrical reliability, it is preferably 70 g / eq to 1000 g / eq, and more preferably 80 g / eq to 500 g / eq.

The hydroxyl equivalent of the phenol curing agent is a value measured by a method according to JIS K 0070: 1992.

(B) The melting point or softening point of the curing agent is not particularly limited. From the viewpoint of moldability and reflow resistance, the temperature is preferably 40 ° C to 180 ° C, and from the viewpoint of handleability during production of the epoxy resin composition, it is more preferably 50 ° C to 130 ° C.

(B) The melting point or softening point of the curing agent is a value measured by a single cylinder rotational viscometer method described in JIS K 7234: 1986 and JIS K 7233: 1986.

(A) Equivalent ratio of epoxy resin and (B) curing agent, ie, ratio of the number of functional groups in (B) curing agent to the number of functional groups in (A) epoxy resin ((B) number of functional groups in curing agent / ( A) The number of functional groups in the epoxy resin is not particularly limited. From the viewpoint of reducing the amount of each unreacted component, it is preferably set in the range of 0.5 to 1.5, more preferably in the range of 0.6 to 1.3, and 0.7 More preferably, it is set in the range of -1.2.

[(C) Curing accelerator]
The epoxy resin composition of the present disclosure includes (C) a curing accelerator. The kind in particular of hardening accelerator is not restrict | limited, It can select according to the kind of (A) kind of epoxy resin, the desired characteristic of an epoxy resin composition, etc. Moreover, as (C) hardening accelerator, a phosphorus type hardening accelerator is preferable from a viewpoint of the electrical reliability of an epoxy resin composition, and the fluidity | liquidity at the time of shaping | molding.

(C) Specific examples of the curing accelerator include 1,8-diaza-bicyclo (5,4,0) undecene-7, 1,5-diaza-bicyclo (4,3,0) nonene, 5,6- Tertiary amines such as dibutylamino-1,8-diaza-bicyclo (5,4,0) undecene-7, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol and their derivatives Imidazoles such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole and their derivatives, organic phosphines such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine, and phenylphosphine; These phosphines include maleic anhydride and ben Phosphorus compounds having intramolecular polarization formed by adding a compound having a π bond such as quinone and diazophenylmethane, tetraphenylphosphonium tetraphenylborate, triphenylphosphinetetraphenylborate, 2-ethyl-4-methylimidazoletetraphenylborate N-methylmotetraphenylphosphonium tetraphenylborate, an adduct of triphenylphosphine and benzoquinone, an adduct of triparatolylphosphine and benzoquinone, triphenylphosphonium triphenylborane, and the like. These curing accelerators may be used alone or in combination of two or more.

The content of the (C) curing accelerator in the epoxy resin composition is not particularly limited as long as a curing acceleration effect is obtained. The content of (C) curing accelerator in the epoxy resin composition is 0.1% by mass to 8.0% by mass with respect to the total amount of (A) epoxy resin and (B) curing agent. Preferably, the content is 0.5% by mass to 5.0% by mass, and more preferably 1.0% by mass to 3.0% by mass. When the content of the (C) curing accelerator is 0.1% by mass or more with respect to the total amount of the (A) epoxy resin and the (B) curing agent, the curing time tends to be shortened. When the content is 0.0 mass% or less, the curing rate is not too high and a good molded product tends to be obtained.

[(D) Inorganic filler]
The epoxy resin composition of the present disclosure includes (D) an inorganic filler. (D) By including an inorganic filler, it is possible to reduce moisture absorption and improve strength when a cured product is obtained.

Furthermore, (D) the inorganic filler contains 75% by mass to 98% by mass of alumina with respect to the total amount of the inorganic filler. By containing 75 mass% or more of alumina, an epoxy resin composition excellent in thermal conductivity is obtained, and by containing 98 mass% or less of alumina, an epoxy resin composition in which a decrease in hardness during heating is suppressed is obtained. Further, from the viewpoint of hygroscopicity, reduction of linear expansion coefficient, improvement of strength and solder heat resistance, it is preferable to contain 75% by mass to 98% by mass of alumina.

(D) The inorganic filler preferably contains 75% by mass to 95% by mass of alumina, more preferably 75% by mass to 92% by mass, and more preferably 75% by mass to 90% by mass with respect to the total amount of the inorganic filler. More preferably, the content is 75% by mass to 85% by mass.

(D) Since the inorganic filler contains 75 mass% to 98 mass% of alumina, it contains 2 mass% to 25 mass% of inorganic filler other than alumina. Examples of inorganic fillers other than alumina (hereinafter also referred to as “other inorganic fillers”) include fused silica, crystalline silica, silicon nitride, boron nitride, magnesium oxide, zinc oxide, silicon carbide, aluminum nitride, zircon, and silicic acid. Powders such as calcium, calcium carbonate, potassium titanate, beryllia, zirconia, fosterite, steatite, spinel, mullite, titania, beads spheroidized from these, single crystal fiber such as potassium titanate, glass fiber, aramid fiber And carbon fiber. Other inorganic fillers include aluminum hydroxide, zinc borate, magnesium hydroxide and the like from the viewpoint of flame retardancy. Other inorganic fillers may be used alone or in combination of two or more.

(D) The inorganic filler is at least one selected from the group consisting of silicon nitride, boron nitride, magnesium oxide, zinc oxide, silicon carbide and aluminum nitride as an inorganic filler other than alumina from the viewpoint of thermal conductivity. It is preferable that an inorganic filler is included. Of these, silicon carbide is more preferable.

(D) The inorganic filler preferably contains 5% by mass to 25% by mass of inorganic fillers other than alumina, more preferably 8% by mass to 25% by mass, and more preferably 10% by mass with respect to the total amount of the inorganic filler. More preferably, it is contained in an amount of from 25 to 25% by mass, and particularly preferably 15 to 25% by mass.
For example, the (D) inorganic filler preferably contains 5% by mass to 25% by mass of silicon carbide, more preferably 8% by mass to 25% by mass, and more preferably 10% by mass to 25% by mass with respect to the total amount of the inorganic filler. More preferably, the content is more preferably 15% by mass to 25% by mass.

The content of the inorganic filler (D) in the epoxy resin composition is 83% by mass to 97% by mass with respect to the total amount of the epoxy resin composition from the viewpoints of hygroscopicity, reduction of linear expansion coefficient, strength improvement, and solder heat resistance. It is preferably 85% by mass to 94% by mass, more preferably 88% by mass to 93% by mass.

The content of alumina in the epoxy resin composition is preferably 60% by mass to 95% by mass with respect to the total amount of the epoxy resin composition from the viewpoints of hygroscopicity, reduction of linear expansion coefficient, strength improvement, and solder heat resistance. 65 mass% to 90 mass% is more preferable, and 75 mass% to 85 mass% is still more preferable.

In addition, the shape of the (D) inorganic filler is not particularly limited, and examples thereof include powder, sphere, and fiber. Among them, a spherical shape is preferable from the viewpoint of fluidity and mold wear during molding of the epoxy resin composition.

[Other ingredients]
The epoxy resin composition of this indication may contain other ingredients other than the above-mentioned (A) epoxy resin, (B) hardening agent, (C) hardening accelerator, and (D) inorganic filler. The other components are not particularly limited as long as the effects of the present invention are achieved, and include mold release agents; coupling agents; flame retardants such as brominated epoxy resins and phosphorus compounds; flame retardants such as antimony trioxide and antimony tetraoxide. Various additives such as auxiliary agents; coloring agents; stress relaxation agents;
Hereinafter, specific examples of a mold release agent, a coupling agent, a colorant, and a stress relaxation agent will be described as other components.

(Release agent)
The epoxy resin composition may further contain a release agent from the viewpoint of obtaining good release properties from the mold during molding. The release agent is not particularly limited, and conventionally known release agents can be used. Specifically, higher fatty acids such as carnauba wax, montanic acid, stearic acid, higher fatty acid metal salts, fatty acid ester waxes such as paraffin wax, montanic acid ester, polyolefin waxes such as polyethylene oxide and non-oxidized polyethylene, etc. Can be mentioned. A mold release agent may be used individually by 1 type, or may be used in combination of 2 or more type.

When the epoxy resin composition contains a release agent, the content of the release agent is preferably 10% by mass or less based on the total amount of (A) the epoxy resin and (B) the curing agent, and the effect From the viewpoint of exhibiting the above, it is preferably 0.5% by mass or more.

(Coupling agent)
The epoxy resin composition may further contain a coupling agent. The kind in particular of coupling agent is not restrict | limited, A well-known coupling agent can be used. Examples of the coupling agent include a silane coupling agent and a titanium coupling agent. A coupling agent may be used individually by 1 type, or may be used in combination of 2 or more type.

Examples of silane coupling agents include vinyltrichlorosilane, vinyltriethoxysilane, vinyltris (β-methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane. , Γ-glycidoxypropyltrimethoxysilane, vinyltriacetoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ- [bis (β-hydroxyethyl)] aminopropyltriethoxysilane, N -Β- (aminoethyl) -γ-aminopropyltrimethoxysilane, γ- (β-aminoethyl) aminopropyldimethoxymethylsilane, N- (trimethoxysilylpropyl) ethylenediamine, N- (dimethoxymethylsilyloxy) Propyl) ethylenediamine, methyltrimethoxysilane, methyltriethoxysilane, N-β- (N-vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, hexamethyldisilane, γ-ani Examples include linopropyltrimethoxysilane, vinyltrimethoxysilane and γ-mercaptopropylmethyldimethoxysilane.

Examples of the titanium coupling agent include isopropyl triisostearoyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, isopropyl tri (N-aminoethyl-aminoethyl) titanate, tetraoctyl bis (ditridecyl phosphite) titanate, tetra ( 2,2-diallyloxymethyl-1-butyl) bis (ditridecylphosphite) titanate, bis (dioctylpyrophosphate) oxyacetate titanate, bis (dioctylpyrophosphate) ethylene titanate, isopropyltrioctanoyl titanate, isopropyldimethacryloiso Stearoyl titanate, isopropyltridodecylbenzenesulfonyl titanate, isopropylisostearoyl diacrylic Titanate, isopropyl tri (dioctyl phosphate) titanate, isopropyl tricumylphenyl titanate and tetraisopropyl bis (dioctyl phosphite) titanate and the like.

When an epoxy resin composition contains a coupling agent, it is preferable that the content rate of a coupling agent is 3 mass% or less with respect to the whole epoxy resin composition, from a viewpoint of exhibiting the effect, it is 0. It is preferable that it is 1 mass% or more.

(Coloring agent)
The epoxy resin composition may further contain a colorant. Examples of the colorant include known colorants such as carbon black, organic dyes, organic pigments, iron oxide, red lead, and bengara. The content of the colorant can be appropriately selected according to the purpose and the like. A coloring agent may be used individually by 1 type, or may be used in combination of 2 or more type.

When conductive particles such as carbon black are used in combination as the colorant, it is preferable to use particles having a particle size of 10 μm or more of 1% by mass or less based on the total amount of conductive particles. It is preferable that it is 3 mass% or less with respect to the total amount of A) epoxy resin and (B) hardening | curing agent.

(Stress relaxation agent)
The epoxy resin composition may further contain a stress relaxation agent such as silicone oil, silicone rubber particles, and synthetic rubber. By including the stress relaxation agent, warpage deformation of the package and generation of package cracks can be further reduced. As a stress relaxation agent, the well-known stress relaxation agent (flexible agent) generally used is mentioned. Specifically, thermoplastic elastomers such as silicone, styrene, olefin, urethane, polyester, polyether, polyamide, polybutadiene, NR (natural rubber), NBR (acrylonitrile-butadiene rubber), acrylic Rubber particles such as rubber, urethane rubber and silicone powder, core-shell such as methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, methyl methacrylate-butyl acrylate copolymer Examples thereof include rubber particles having a structure. A stress relaxation agent may be used individually by 1 type, or may be used in combination of 2 or more type.

[Method for preparing epoxy resin composition]
The method for preparing the epoxy resin composition is not particularly limited. As a general technique, there can be mentioned a method in which components of a predetermined blending amount are sufficiently mixed by a mixer or the like, and then melt-kneaded by a mixing roll, an extruder or the like, cooled and pulverized. More specifically, for example, a method in which predetermined amounts of the above-described components are stirred and mixed, kneaded with a kneader, roll, extruder, or the like that has been heated to 70 ° C. to 140 ° C., cooled, and pulverized. be able to.

[Electronic component equipment]
An electronic component device of the present disclosure includes an element and a cured product of the above-described sealing epoxy resin composition that seals the element.
Electronic component devices include lead frames, pre-wired tape carriers, wiring boards, glass, silicon wafers, organic substrates and other supporting members, active elements such as semiconductor chips, transistors, diodes, and thyristors, capacitors, and resistors. And an element portion obtained by mounting a passive element such as a coil) with an epoxy resin composition.
More specifically, the element is fixed on the lead frame, the terminal part of the element such as a bonding pad and the lead part are connected by wire bonding, bump, etc., and then sealed by transfer molding or the like using an epoxy resin composition. DIP (Dual Inline Package), PLCC (Plastic Leaded Chip Carrier), QFP (Quad Flat Package), SOP (Small Outline Package T), SOJ (Small Outline J-Lead Package) ), General resin-sealed IC (Integrated Circuit) such as TQFP (Thin Quad Flat Package); TCP (Tape Carrier Package) having a structure in which elements connected to bumpers by bumps are sealed with an epoxy resin composition; elements connected to wiring formed on a support member by wire bonding, flip chip bonding, solder, etc. COB (Chip On Board) module having a structure sealed with an epoxy resin composition, hybrid IC, multi-chip module, etc .; an element is mounted on the surface of a support member in which terminals for connecting a wiring board are formed on the back surface, and bumps Or after connecting an element and the wiring formed in the support member by wire bonding, BGA (Ball Grid Array), CSP (Chip Size Package), MCP (Multi Chip) which has the structure which sealed the element with the epoxy resin composition Packag e). Moreover, an epoxy resin composition can be used suitably also in a printed wiring board.

Examples of a method for sealing an electronic component device using an epoxy resin composition include a low-pressure transfer molding method, an injection molding method, and a compression molding method. Among these, the low-pressure transfer molding method is common.

Hereinafter, the present invention will be specifically described with reference to examples, but the scope of the present invention is not limited to these examples.

[Preparation of epoxy resin composition]
The components shown below were premixed (dry blended) at the blending ratio (parts by mass) shown in Table 1, then kneaded with a biaxial kneader, cooled and ground to prepare epoxy resin compositions of Examples and Comparative Examples.

(A) Epoxy resin, A1 ... Bisphenol type epoxy resin, Nippon Steel & Sumikin Chemical Co., Ltd., product name "YSLV-80XY"
A2: Biphenyl type epoxy resin, Mitsubishi Chemical Corporation, product name “YX-4000”
(B) Curing agent · B1 · · · Triphenylmethane type phenol resin, Air Water Co., Ltd., product name "HE910"
(C) Curing accelerator / C1 ... Phosphorus curing accelerator (addition of tributylphosphine and benzoquinone)
(D) Inorganic filler, DA-1 ... Alumina filler, Denka Co., Ltd., product name "DAB10FCAll"
・ DA-2 ・ ・ ・ Alumina filler, Admatechs Co., Ltd., product name “AE-2000SI”
DB-1 ... Alumina filler / silica filler = 9/1 (mass ratio), Denka Co., Ltd., product name "DAB-10FC"
DC-1 ... average particle diameter (D50, particle diameter corresponding to 50% volume accumulation from the small diameter side) 14.0 μm and specific surface area 0.3 m ² / g silicon carbide. DC-2 ... average Silicon carbide with particle size (D50, particle size corresponding to 50% volume accumulation from the small diameter side) 18.6 μm and specific surface area 0.3 m ² / g

(Evaluation of hot hardness)
Evaluation of the hot hardness of the epoxy resin composition was performed as follows.
The epoxy resin composition prepared as described above was tested with a transfer molding machine under the conditions of a mold temperature of 175 ° C. to 180 ° C., a molding pressure of 6.9 MPa, and a curing time of 90 seconds (diameter 50 mm X disk having a thickness of 3 mm). Immediately after molding, the hot hardness of the test piece was measured using a Shore D hardness tester.
The results are shown in Table 2.

As shown in Table 2, in Examples 1 to 3, the hot hardness was higher than in Comparative Examples 1 to 3 in which the content of alumina with respect to the total amount of the inorganic filler was 100% by mass, and the continuous formability was excellent. It was.

(Evaluation of thermal conductivity)
Evaluation of the thermal conductivity of the epoxy resin composition was performed as follows.
The epoxy resin composition prepared as described above was subjected to a test piece for thermal conductivity evaluation using a vacuum hand press molding machine under conditions of a mold temperature of 175 ° C. to 180 ° C., a molding pressure of 7.0 MPa, and a curing time of 600 seconds ( 1.1 cm square and 1.1 mm thickness).
The molded specimen was measured for thermal diffusivity in the thickness direction. The thermal diffusivity was measured by a laser flash method (apparatus: LFA447 nanoflash, manufactured by NETZSCH). Pulse light irradiation was performed under the conditions of a pulse width of 0.31 (ms) and an applied voltage of 247V. The measurement was performed at an ambient temperature of 25 ° C. ± 1 ° C. The density of the test piece was measured using an electronic hydrometer (SD-200L, manufactured by Alpha Mirage Co., Ltd.).
Subsequently, the value of thermal conductivity was obtained by multiplying the thermal diffusivity by specific heat and density using the formula (1).
λ = α × Cp × ρ Formula (1)
(In formula (1), λ is thermal conductivity (W / (m · K)), α is thermal diffusivity (m ² / s), Cp is specific heat (J / (kg · K)), and ρ is density. (D: kg / m ³ )
The results are shown in Table 3.

As shown in Table 3, in Examples 1 to 3, the thermal conductivity was higher than that in Comparative Examples 1 to 3 in which the content of alumina with respect to the total amount of the inorganic filler was 100% by mass.

The disclosure of Japanese Patent Application No. 2017-072892 filed on March 31, 2017 is incorporated herein by reference in its entirety.
All documents, patent applications, and technical standards mentioned in this specification are to the same extent as if each individual document, patent application, and technical standard were specifically and individually stated to be incorporated by reference, Incorporated herein by reference.

Claims (4)

(A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler, wherein the inorganic filler is 75% by mass to 98% by mass of alumina with respect to the total amount of the inorganic filler. An epoxy resin composition for sealing. 2. The seal according to claim 1, wherein the inorganic filler includes alumina and at least one inorganic filler selected from the group consisting of silicon nitride, boron nitride, magnesium oxide, zinc oxide, silicon carbide, and aluminum nitride. Stopping epoxy resin composition. The epoxy resin composition for sealing according to claim 1 or 2, wherein the curing agent is a phenol curing agent. An electronic component device comprising: an element; and a cured product of the sealing epoxy resin composition according to any one of claims 1 to 3, which seals the element.