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WO2018149574A1 - Liaison adhésive améliorée par micro-structuration d'une surface au moyen d'un laser - Google Patents

Liaison adhésive améliorée par micro-structuration d'une surface au moyen d'un laser Download PDF

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Publication number
WO2018149574A1
WO2018149574A1 PCT/EP2018/050830 EP2018050830W WO2018149574A1 WO 2018149574 A1 WO2018149574 A1 WO 2018149574A1 EP 2018050830 W EP2018050830 W EP 2018050830W WO 2018149574 A1 WO2018149574 A1 WO 2018149574A1
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WIPO (PCT)
Prior art keywords
adhesive
laser
sensor
structuring
superstructure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2018/050830
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German (de)
English (en)
Inventor
Ingo Buschke
Simon Keßler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser SE and Co KG
Original Assignee
Endress and Hauser SE and Co KG
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Filing date
Publication date
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Publication of WO2018149574A1 publication Critical patent/WO2018149574A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3584—Increasing rugosity, e.g. roughening
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B19/00—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica
    • B32B19/04—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica next to another layer of the same or of a different material
    • B32B19/041—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/28—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer comprising a deformed thin sheet, i.e. the layer having its entire thickness deformed out of the plane, e.g. corrugated, crumpled
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
    • G01F23/28—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring the variations of parameters of electromagnetic or acoustic waves applied directly to the liquid or fluent solid material
    • G01F23/296—Acoustic waves
    • G01F23/2966—Acoustic waves making use of acoustical resonance or standing waves
    • G01F23/2967—Acoustic waves making use of acoustical resonance or standing waves for discrete levels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B32B2307/7145—Rot proof, resistant to bacteria, mildew, mould, fungi
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/73—Hydrophobic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Definitions

  • the invention relates to a method for producing an adhesive bond between a first body which consists at least partially of stainless steel and a second body. Furthermore, the present invention relates to a sensor unit for a vibronic sensor, which is produced by the method according to the invention, and a vibronic sensor with a corresponding sensor unit.
  • Joining processes for joining two components made of different materials are becoming increasingly important today. Depending on the materials used, some completely different problems can be considered, and proven methods can not easily be applied to other material classes. Typical joining methods involve gluing, or thermal processes such as laser welding. It is known that the quality of the respective joint decisively depends on the surface quality of the respective components. To ensure adequate adhesion, at least one of the surfaces to be joined of one of the two components is suitably pretreated in many cases, in particular surfaces are roughened in order to increase the contact surface of the components to be bonded. In the case of plastics, for example, various chemical processes are known, while for metals in particular structuring of the respective surface, for example by means of a variety of grinding or blasting processes, in particular sandblasting, offers.
  • WO2014 / 094729A2 discloses a method for structuring a non-conductive workpiece surface in order to achieve a selective and adherent metallization thereof.
  • the document also deals with the use of ultra-short pulse lasers, which are particularly suitable when the surface to be structured does not withstand high thermal stress.
  • metallic surfaces again reference is made, for example, to the article "High-rate laser processing of metals using high-average power ultra-short pulse lasers" by J. Schille, L. Schneider, L. Hartwig and U. Loeschner, published in the paper No. 3932 - 38th MATADOR Conference.
  • Typical laser-induced structures are, for example, various periodic trench and grating structures, which are also referred to as corrugations.
  • CLPs cone-like-protrusions
  • Vibronic sensors are widely used in process and / or automation technology and serve to determine and / or monitor at least one process variable
  • level measuring devices they have at least one mechanical
  • oscillatory unit such as a tuning fork, a monobloc or a membrane. This is in operation by means of a drive / receiving unit, often in the form of a
  • electromechanical transducer unit excited to mechanical vibrations which in turn may be, for example, a piezoelectric actuator or an electromagnetic drive.
  • the mechanically oscillatable unit can also be designed as a vibratable tube which is flowed through by the respective medium, for example in a measuring device operating according to the Coriolis principle.
  • Corresponding field devices are manufactured by the applicant in great variety and distributed in the case of level measuring devices, for example under the name LIQUIPHANT or SOLIPHANT.
  • the underlying measurement principles are in principle made of a variety of
  • the drive / receiver actuation stimulates the mechanically oscillatable unit to generate mechanical vibrations by means of an electrical signal. Conversely, the drive / receiving unit, the mechanical vibrations of the mechanical
  • the drive / receiving unit is in many cases part of a feedback electrical resonant circuit, by means of which the excitation of the mechanically oscillatable unit to mechanical vibrations takes place.
  • the resonant circuit condition according to which the amplification factor is> 1 and all phases occurring in the resonant circuit are multiples of 360 ° must be satisfied.
  • a certain phase shift between the excitation signal and the received signal must be ensured.
  • a predefinable value for the phase shift that is to say a setpoint value for the phase shift between the excitation signal and the received signal, is frequently set.
  • both analogous and digital methods such as, for example, the documents DE102006034105A1, DE102007013557A1, DE 102005015547A1, DE102009026685A1, are known from the prior art.
  • vibronic sensors are also suitable for determining the density and / or viscosity, as described for example in DE10050299A1, DE102007043811A1, DE10057974A1, or DE102015102834A1.
  • a steatite disk is usually glued before the drive / receiver unit is integrated.
  • the quality of the sensor depends on the sensitive
  • the present invention seeks to provide a way to produce a high quality adhesive bond between a stainless steel and a non-metallic component.
  • the object according to the invention is achieved by a method for producing an adhesive bond between a first body which at least partially consists of a stainless steel and a second non-metallic body, comprising the following
  • Stainless steel is a chemically resistant material with a passive surface. Adhesives therefore adhere to stainless steel comparatively poorly. Due to the surface structuring by means of an ultrashort pulse laser on the one hand an enlargement of the one for the production of the
  • Adhere adhesive bond to the available surface Furthermore, a targeted
  • the surface is preferably structured such that a substantially complete wetting of the enlarged surface can be realized or achieved by means of the adhesive. This allows a uniform flow of the adhesive, which essential for the greatest possible adhesion and, accordingly, crucial for the reproducibility and long-term stability of the adhesive bond.
  • Another advantage of using an ultrashort pulse laser is that the respective structured surface has fewer so-called melting artifacts or even spikes. Due to the short pulse durations in the range of picoseconds or femtoseconds can be achieved in conjunction with a targeted spatial focusing of the laser beam, that the heat introduced sufficient to evaporate material in a given region of the surface (removal) without a larger heat affected zone can form ,
  • only one surface of one of the two bodies is structured by means of the laser. This leads to an increased reproducibility of the splice.
  • the second body has a substantially smooth surface, lateral displacements between the first and second surfaces of the first and second bodies do not result in altered geometry around the joint.
  • the second body consists at least partially of steatite or soapstone.
  • the realization of high quality joining of stainless steel and steatite is generally difficult to realize.
  • the adhesion properties of both materials are usually very different with respect to different adhesives.
  • the laser is operated in a burst mode.
  • burst mode the energy of a single laser pulse is split into a group of individual pulses of different frequencies. This allows a precise adjustment of the laser fluence and, consequently, a particularly gentle possibility of surface structuring. It can be achieved that the respectively structured surface is substantially free of artifacts, in particular melts or spikes.
  • An embodiment of the method includes that the laser is operated at a power of about 50-200 ⁇ and / or a scanning speed parallel to a longitudinal direction of the first surface of about 0.1-1cm / s. Preferred pulse lengths are 5-30ps. Furthermore, a laser with a frequency of 100-1000 kHz is preferably used. Frequencies ⁇ 500 kHz are particularly preferred since so-called shielding effects can be avoided at these frequencies. In the text which follows, a shielding effect is understood to mean that an incident laser pulse is absorbed or scattered on plasma and / or material vapor clouds generated by pulses preceding this pulse. A further embodiment includes that structuring in the form of a superstructure and a fine structure superimposed on the superstructure is produced at least in the first subregion of the first surface. The parameters used for the operation of the laser are thus set appropriately.
  • the superstructure is a periodic structure with a periodicity in the micrometer range, in particular in the range of up to 50 ⁇ m.
  • Particularly preferred are structures having a periodicity in the range of 5-30 ⁇ .
  • the fine structure is a periodic structure with a periodicity in the nanometer range.
  • the fine structure is characterized in particular by a comparatively low aspect ratio. This in turn leads to a significant increase in the wettable surface by means of the adhesive.
  • the fine structure has a periodicity in the range of ⁇ 1 ⁇ .
  • CLPS cone-like protrusions
  • the superstructure has an average structure height (peak-to-valley) of up to 25 ⁇ , preferably 2-20 ⁇ .
  • the average structure height of the fine structure is preferably in a range of about 300-1500 nm.
  • the structures produced according to the invention have comparatively low average structural heights and, consequently, a low aspect ratio, both for the superstructure and also for the fine structure. This is surprisingly particularly advantageous with respect to the wetting of the surface with the adhesive. Although the surface increases with increasing mean structure height.
  • the surface can be wetted completely with the adhesive, since the adhesive can not flow completely into the structures.
  • the transition here is fluid and depends in particular on the viscosity of the adhesive.
  • the periodicity of the structures plays a decisive role in this respect. The larger the periodicity, the greater the average structure height can be selected. However, with increasing periodicity, the effect of surface augmentation may be lower than at lower periodicity with lower average struc- tural height.
  • at least the first subregion of the first surface of the first body, in particular by means of the laser is rendered hydrophobic. The structuring thus leads to a hydrophobization of the surface.
  • a hydrophobic surface leads to improved wetting with, preferably heat-curing, adhesives in the form of epoxy resins.
  • adhesives are cured at temperatures> 100 ° C and have at the beginning of the thermally induced curing usually comparatively low mixing viscosities.
  • At least the first subregion of the first surface is structured in such a way that the adhesive bond produced in each case
  • Method according to at least one of the preceding claims having an adhesive tensile strength of at least 20 MPa.
  • the adhesive tensile strength represents a measure of the quality of the adhesive bond.
  • a sensor unit for a vibronic sensor comprising at least one mechanically oscillatable unit made of a stainless steel and a steatite disk fastened to the sensor unit by means of an adhesive connection, wherein the adhesive connection is produced by means of a method according to one of the preceding claims.
  • the adhesive connection between the vibronic sensor is produced by means of a method according to one of the preceding claims.
  • the adhesive bond has a great influence on the rigidity of the oscillatable unit, from which the resonant frequency of the oscillatable unit directly depends.
  • the structuring of a surface of the oscillatable unit also influences its rigidity, so that structuring with a low average structural height is advantageous here in two respects.
  • a substantially complete wetting of the surface can be achieved by the adhesive used.
  • the rigidity of the oscillatable unit is influenced as little as possible.
  • the adhesive connection is produced in such a way that an anti-resonance frequency of the oscillatable unit is at a maximum of 600 Hz.
  • Antiresonance is determined inter alia by the mechanical coupling between the oscillatable unit and the drive-receiving unit, which in turn depends on the adhesive bond between the oscillatory unit and the steatite disc. Basically, in the case of a vibronic sensor, the distance between the
  • Resonance frequency and the anti-resonant frequency can be influenced by various measures, for. B .:
  • the bond between the oscillatable unit and steatite disk can be optimized without having to accept a loss in terms of mechanical vibration quality.
  • Conventional laser structures with larger mean heights of structure adversely affect the mechanical vibration quality of the vibronic sensor.
  • the present invention relates to a vibronic sensor, comprising at least one sensor unit produced according to the invention.
  • FIGS. 1 to 3 shows two components joined by means of an adhesive connection, wherein the first component is a stainless steel, and wherein the second component consists of a non-metallic material,
  • FIG. 2 shows two images of two surfaces structured according to the invention
  • FIG. 3 shows a schematic sketch (a) of a vibronic sensor according to the prior art, and (b) a tuning fork with a steatite disk attached thereto.
  • Fig. 1 a are a first body 1 made of stainless steel and a second body 2 of a
  • the first surface has a structuring 4, which was produced by means of a method according to the invention.
  • FIG. 1 b A more detailed view of a preferred embodiment of the achieved structuring is shown in Fig. 1 b.
  • the structuring 4 is composed of a superstructure 5 and a superstructure 6 superimposed on this superstructure 5, which is shown only in a partial area.
  • the parameters used for the operation of the laser are thus set appropriately.
  • the superstructure 5 has a periodicity pi in the micrometer range, while the
  • Periodicity p2 (not shown) of the fine structure 6 is in the nanometer range. Moreover, it is advantageous if the superstructure 5 has an average structure height hi (peak-to-valley) of up to 25 ⁇ , preferably 2-20 ⁇ .
  • the aspect ratio is generally understood to mean the ratio of depth or height h of a structure in comparison to its lateral extent, that is to say in comparison with its periodicity p. In the case where an adhesive bond is to be made, a comparatively low aspect ratio h / p is desirable, as this generally results in a significant increase in the surface wettable by the adhesive.
  • Fig. 2 shows two stainless steel surfaces, which were structured according to the invention.
  • Structuring was a picosecond laser with a wavelength of 1064nm at a power of 150 ⁇ used.
  • the feed (lateral velocity along the surface) was 600mm / s for the surface shown in Fig. 2a and 200mm / s for the surface shown in Fig. 2b.
  • At the top right of each image are enlarged sections of the sample surface for a more detailed view.
  • the periodicity pi of the superstructure for the surface shown in Fig. 2a is about 18 ⁇ , and the average structure height ⁇ is.
  • the fine structures are similar for both figures with a periodicity p2 of ⁇ 1 ⁇ and an average structure height of about 0.8 ⁇ . While the surface of Fig. 2a is surprisingly hydrophobic, that of Fig. 2b is hydrophilic. Although no significant difference was found with respect to the adhesion of adhesives with respect to the two different surface structures. However, it has been found that in a structuring according to the example of the sample according to FIG. 2a, an increased quality of the adhesive bond could be achieved. Thus, for example, consistently adhesive strengths of the two respectively joined bodies of> 50 MPa were achieved.
  • a vibronic sensor 7 is shown with a sensor unit 8 comprising a vibratable unit 9 in the form of a tuning fork, which partially immersed in a medium 10, which is located in a container 11.
  • the oscillatable unit 9 is excited by the exciting / receiving unit 12 to mechanical vibrations, and may be, for example, a piezoelectric stack or bimorph drive.
  • an electronic unit 13 is shown, by means of which the signal detection, evaluation and / or - power supply takes place.
  • Fig. 3b is a more detailed view of a sensor unit 8 for a vibronic sensor 7 is shown, which also has an oscillatable unit 9 in the form of a tuning fork, as they are integrated, for example, in the marketed by the applicant under the name LIQUIPHANT vibronic sensors 1.
  • the tuning fork 9 comprises two prongs 15a, 15b which are integrally formed on a membrane 14 and which each consist of a vibrating rod and a paddle formed thereon.
  • Steatitility 18 is attached by means of an adhesive bond to the oscillatable unit 9 in the region of the diaphragm 17.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Acoustics & Sound (AREA)
  • Electromagnetism (AREA)
  • Thermal Sciences (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

La présente invention concerne un procédé d'obtention d'une liaison adhésive entre un premier corps (1), lequel est constitué au moins en partie d'un acier inoxydable, et un deuxième corps (2), le procédé comprenant les étapes suivantes : - la formation de motifs (4) sur au moins une première partie d'une première surface (1a) du premier corps (1) au moyen d'un laser à impulsions ultra-courtes, et - l'obtention d'une liaison adhésive au moins entre la première partie de la première surface (1a) du premier corps (1) et au moins une deuxième partie d'une deuxième surface (2a) du deuxième corps (2) au moyen d'un adhésif (3). La présente invention concerne en outre une unité de détection pour un capteur vibronique, une liaison adhésive étant obtenue au moyen du procédé selon l'invention, ainsi qu'un capteur vibronique pourvu d'une unité de détection selon l'invention.
PCT/EP2018/050830 2017-02-15 2018-01-15 Liaison adhésive améliorée par micro-structuration d'une surface au moyen d'un laser Ceased WO2018149574A1 (fr)

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DE102017103001.8A DE102017103001A1 (de) 2017-02-15 2017-02-15 Verbesserte Klebeverbindung durch Mikrostrukturierung einer Oberfläche
DE102017103001.8 2017-02-15

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CN114728376A (zh) * 2019-09-12 2022-07-08 博朗有限公司 胶粘金属部件的方法
US11578604B2 (en) 2020-03-17 2023-02-14 Raytheon Technologies Corporation Adhesive bonded composite-to-metal hybrid vanes and method of manufacture
WO2023180201A1 (fr) 2022-03-23 2023-09-28 Bayerische Motoren Werke Aktiengesellschaft Procédé de prétraitement d'une surface d'une pièce
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DE102020129495A1 (de) * 2020-11-09 2022-05-12 Endress+Hauser SE+Co. KG Spülaufsatz und Verfahren zur Bearbeitung, insbesondere Strukturierung, einer Oberfläche eines Werkstücks mittels Laser

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