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WO2018016829A1 - Carte de circuit imprimé flexible et son procédé de fabrication - Google Patents

Carte de circuit imprimé flexible et son procédé de fabrication Download PDF

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Publication number
WO2018016829A1
WO2018016829A1 PCT/KR2017/007669 KR2017007669W WO2018016829A1 WO 2018016829 A1 WO2018016829 A1 WO 2018016829A1 KR 2017007669 W KR2017007669 W KR 2017007669W WO 2018016829 A1 WO2018016829 A1 WO 2018016829A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
layer
protective layer
base film
conductive pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2017/007669
Other languages
English (en)
Korean (ko)
Inventor
손동은
이재문
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stemco Co Ltd
Original Assignee
Stemco Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stemco Co Ltd filed Critical Stemco Co Ltd
Priority to CN201780044647.6A priority Critical patent/CN109804717A/zh
Priority to JP2019502734A priority patent/JP2019521528A/ja
Publication of WO2018016829A1 publication Critical patent/WO2018016829A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Definitions

  • the present invention relates to a flexible circuit board and a method of manufacturing the same.
  • FPDs flat panel displays
  • LCDs liquid crystal displays
  • OLED organic light emitting diode
  • the conductive pattern formed on the flexible circuit board connects the circuit elements and transfers electrical signals transmitted at high speed.
  • high integration of flexible circuit boards and conductive patterns formed thereon has also been progressed. Due to integration and precision, problems of malfunction of circuit elements due to heat generated on conductive patterns have arisen. have.
  • the technical problem to be solved by the present invention is to provide a flexible circuit board having good heat dissipation characteristics, including a heat dissipation layer containing a heat dissipation material on the protective layer covering the conductive pattern.
  • Another technical problem to be solved by the present invention is to provide a method for manufacturing a flexible circuit board on which a heat dissipation layer containing a heat dissipation material is formed on a protective layer covering the conductive pattern.
  • a flexible circuit board may include a base film, a plurality of first conductive patterns formed on one surface of the base film, and a plurality of first conductive patterns formed to cover the plurality of first conductive patterns.
  • the height of the top surface of the first protective layer from the base film may be equal to or higher than the height of the top surfaces of the plurality of conductive patterns from the base film.
  • the top surface of the first heat dissipation layer may be substantially flat.
  • the ratio of the thickness of the first protective layer and the first heat dissipation layer may be 2: 8 to 8: 2.
  • the thickness of the first protective layer is 1 ⁇ m to 30 ⁇ m
  • the thickness of the first heat dissipating layer is 1 ⁇ m to 30 ⁇ m
  • the thickness of the first protective layer and the first heat dissipating layer may be 2 ⁇ m to 60 ⁇ m.
  • the base material may include the same material as the material constituting the first protective layer.
  • a plurality of second conductive patterns formed on the other surface of the base film opposite to the one surface thereof, a second protective layer formed to cover the plurality of second conductive patterns, and the second protective layer may be covered. It may further include a second heat dissipation layer including a heat dissipation material therein.
  • the first passivation layer is formed along a profile of the plurality of first conductive patterns, and an upper surface of the first passivation layer is formed on the first surface of the first conductive pattern and the first passivation layer. And a second surface between the surfaces, wherein a height of the first surface from the base film may be higher than a height of the second surface from the base film.
  • the first heat dissipation layer may be formed along a profile of the upper surface of the first protective layer.
  • the semiconductor device may further include a plating layer interposed between the first conductive pattern and the first protective layer.
  • a method of manufacturing a flexible circuit board provides a base film having a plurality of conductive patterns formed on at least one surface thereof, and forms a protective layer to cover the plurality of conductive patterns. And forming a heat dissipation layer including a heat dissipation material mixed therein on the protective layer.
  • forming the heat dissipation layer may include forming a height of the heat dissipation layer from the base film to be higher than a top surface of the conductive pattern.
  • a heat radiation layer including a heat radiation material is formed on the base film, so that heat generated from the conductive pattern can be effectively released.
  • the protective layer interposed between the heat dissipation layer and the conductive pattern is formed so as to completely cover the conductive pattern, thereby preventing the electrical reliability deterioration due to the heat dissipation material included in the heat dissipation layer.
  • FIG. 1 is a cross-sectional view of a flexible circuit board according to an embodiment of the present invention.
  • FIG. 2 is an enlarged view enlarging a part of FIG. 1.
  • FIG 3 is a cross-sectional view of a flexible circuit board according to another embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a flexible circuit board according to another embodiment of the present invention.
  • FIG. 5 is a flowchart illustrating a method of manufacturing a flexible circuit board according to an embodiment of the present invention.
  • spatially relative terms below “, “ beneath “, “ lower”, “ above “, “ upper” It may be used to easily describe the correlation of a device or components with other devices or components. Spatially relative terms are to be understood as including terms in different directions of the device in use or operation in addition to the directions shown in the figures. For example, when flipping a device shown in the figure, a device described as “below” or “beneath” of another device may be placed “above” of another device. Thus, the exemplary term “below” can encompass both an orientation of above and below. The device can also be oriented in other directions, so that spatially relative terms can be interpreted according to orientation.
  • first, second, etc. are used to describe various elements or components, these elements or components are of course not limited by these terms. These terms are only used to distinguish one element or component from another element or component. Therefore, the first device or component mentioned below may be a second device or component within the technical idea of the present invention.
  • FIG. 1 is a cross-sectional view of a flexible circuit board according to an exemplary embodiment of the present invention
  • FIG. 2 is an enlarged view of a portion of FIG. 1.
  • a flexible circuit board may include a base film 10, a first conductive pattern 20, a first protective layer 30, and a first heat dissipation layer 40. It may include.
  • the base film 10 may be formed of a flexible material and may be included as the substrate in the flexible circuit board 1 to allow the flexible circuit board 1 to be bent or folded.
  • the base film 10 may be, for example, a polyimide film.
  • the base film 10 may be a PET film, polyethylene naphthalate film, polycarbonate film or insulating metal foil.
  • the base film 10 will be described as being a polyimide film.
  • the first conductive pattern 20 may be formed on the base film 10.
  • the first conductive pattern 110 may have at least one strip-shaped conductive line having a predetermined width.
  • the first conductive pattern 20 may transfer electrical signals between the circuit elements mounted on the base film 10 and the electronic devices to which the flexible circuit board 1 is connected.
  • the first conductive pattern 20 may include, for example, a conductive material such as copper, but the present invention is not limited thereto. Specifically, the first conductive pattern 20 may be made of a material having electrical conductivity, such as gold and aluminum.
  • the first passivation layer 30 may be formed to cover the first conductive pattern 20.
  • the first protective layer 30 may include an insulating material, and the insulating material may be, for example, a solder resist. Alternatively, the first protective layer 30 may include a coverlay film.
  • the first passivation layer 30 may completely cover the first conductive pattern 20. That is, the level of the upper surface 35 of the first protective layer 30 may be equal to or higher than the level of the uppermost surface 25 of the first conductive pattern 20. Therefore, the height of the upper surface 35 of the first protective layer 30 from the base film 10 may be equal to or higher than the height of the uppermost surface 25 of the first conductive pattern 20 from the base film 10.
  • an additional plating layer may be formed between the first conductive pattern 20 and the first protective layer 30 to cover the surface of the first conductive pattern 20.
  • the plating layer may be formed by plating a material such as copper, tin, nickel, palladium, gold, or an alloy thereof on the first conductive pattern 20.
  • the upper surface 35 of the first protective layer 30 may be substantially flat.
  • Substantially flat herein may include a case where some unevenness is formed on an upper surface of the first protective layer 30.
  • the height difference between the uppermost part and the lowermost part of the upper surface of the first protective layer 30 can be negligible compared to the overall thickness of the first protective layer 30.
  • the first protective layer 30 is formed.
  • the process of planarizing the upper surface of the may be added.
  • the first heat dissipation layer 40 may be formed on the first protective layer 30.
  • the first heat dissipation layer 40 may be formed to cover the top surface of the first passivation layer 30. As shown in FIG. 1, the first heat dissipation layer 40 may be formed to completely cover the surface of the first protective layer 30, but the present invention is not limited thereto.
  • the first heat dissipation layer 40 may be formed so as to cover only an area on the first protective layer 30 overlapping the first conductive pattern 20.
  • the first passivation layer 30 may be covered.
  • the height of the lower surface 41 of the first heat dissipation layer 40 may also be equal to or higher than the height of the uppermost surface 25 of the first conductive pattern 20.
  • the ratio of the thickness of the first protective layer 30 and the first heat dissipation layer 40 may be 2: 8 to 8: 2.
  • the thickness of the first protective layer 30 refers to the height from the top surface of the first conductive pattern 20 to the top surface 35 of the first protective layer 30, the thickness of the first heat dissipation layer 40 The height from the lower surface 41 of the first heat dissipation layer 40 on the upper surface 35 of the first protective layer 30 to the uppermost surface of the first heat dissipation layer 40 is referred to.
  • the heat dissipation effect of the first conductive pattern 20 by the first heat dissipation layer 40 may be insufficient. have.
  • the thickness of the first protective layer 30 is too thin compared to the first heat dissipation layer 40, there is a fear that the insulating property is lowered, compared to the thickness of the first protective layer 30, the first heat dissipation layer
  • the thickness of 40 is formed more than necessary, the manufacturing cost of the flexible circuit board 1 may be excessively increased compared with the increase in the heat radiation effect.
  • the thickness of the first protective layer 30 may be 1 ⁇ m to 30 ⁇ m
  • the thickness of the first heat dissipation layer 40 may be 1 ⁇ m to 30 ⁇ m
  • the first protective layer 30 may be used.
  • the thickness of the first heat dissipation layer 40 may be 2 ⁇ m to 60 ⁇ m.
  • the first heat dissipation layer 40 may include a base material and a heat dissipation member 45.
  • the base material may include, for example, a solder resist or coverlay film.
  • the base material of the first heat dissipation layer 40 may include the same material as the first protective layer 30.
  • the heat dissipation member 45 as the heat dissipation material included in the first heat dissipation layer 40 may include a material having good thermal conductivity, and for example, a metallic material such as aluminum or copper or a carbon material such as graphene or carbon nanotubes. It may include or may contain a compound thereof.
  • the heat dissipation member 45 may include a spherical heat dissipation ball, but the present invention is not limited thereto.
  • the heat dissipation member 45 may have a polyhedron shape such as a hexahedron, and may be mixed with the base material of the first heat dissipation layer 40 so as to transfer heat generated in the first conductive pattern 20 to the air without limitation in shape. It can be applied to the invention.
  • the heat generated from the first conductive pattern 20 is discharged to the outside by the heat radiating material 45 included in the first heat radiating layer 40. I can promote it. Therefore, the circuit element and the electronic device mounted on the first conductive pattern 20 by the first heat dissipation layer 40 reduce the influence of heat received from the heat generated in the first conductive pattern 20, and the flexible circuit board 1 Operating reliability) may be increased.
  • first heat dissipation layer 40 on the first protective layer 30 may be advantageous in terms of production process and production cost rather than forming a separate metal tape on the back surface of the base film 10. Can be.
  • the first heat dissipation layer 40 may be spaced apart from the first conductive pattern 20 due to the first protective layer 30.
  • the height of the upper surface 35 of the first protective layer 30 is equal to or higher than the height of the uppermost surface of the first conductive pattern 25, the first heat dissipation between the plurality of first conductive patterns 20.
  • the heat dissipation member 45 included in the layer 40 and the first heat dissipation layer 40 is not located.
  • the heat dissipation member 45 reacts with moisture, and the like. Due to the leakage current formed to flow between the patterns 20, the insulation effect between the plurality of first conductive patterns 20 may be reduced. Therefore, the operation reliability of the flexible circuit board 1 can also be lowered.
  • the first heat dissipation layer 40 of the flexible circuit board 1 may include the first heat dissipation layer 40 and the first heat dissipation layer 40 between the plurality of first conductive patterns 20. Since the heat dissipation member 45 included in the 40 is not positioned, even when the heat dissipation member 45 in the first heat dissipation layer 40 reacts with moisture, a leakage current is generated between the first conductive patterns 20. Can be prevented and effectively insulated between the first conductive patterns 20.
  • FIG. 3 is a cross-sectional view of a flexible circuit board according to another embodiment of the present invention.
  • the description of the parts in common with the above-described embodiments will be omitted and the differences will be mainly described.
  • the flexible circuit board 2 differs in shape of the flexible circuit board and the first protective layer 130 and the first heat dissipation layer 140 in the above-described embodiment. Can be.
  • the upper surface 135 of the first protective layer 130 may be formed along the profile of the upper surface of the first conductive pattern 20. That is, the upper surface 135 of the first protective layer 130 includes a first surface 136 on the first conductive pattern 20 and a second surface 137 between the first surface 136, the base The height of the first face 136 from the film 10 is higher than the height of the second face 137.
  • the top surface 135 of the first passivation layer 130 is formed along the profile of the top surface of the first conductive pattern 20, it may still be equal to or higher than the height of the top surface of the first conductive pattern 20. have. That is, the level of the second surface 137 that is lower than the height of the first surface 136 of the upper surface 135 of the first protective layer 130 is still equal to or higher than the level of the uppermost surface of the first conductive pattern 20.
  • the heat dissipation material included in the first heat dissipation layer 140 and the first heat dissipation layer 40 may be prevented from being disposed between the first conductive patterns 20. Therefore, despite the shape of the upper surface 135 of the deformed first passivation layer 130, the insulation effect between the first passivation layer 130 and the first conductive pattern 20 due to the first heat dissipation layer 140 remains the same. Can be maintained.
  • the shape of the first heat dissipation layer 140 covering the first passivation layer 130 is also defined by the first passivation layer 130. It can be formed along the profile of). Accordingly, the upper surface of the first heat dissipation layer 140 may include a first surface 141 on the first conductive pattern 20 and a second surface 142 between the first surface, and the first surface 141. The height of may be higher than the height of the second surface 142.
  • the height of the bottom surface of the first heat dissipation layer 140 may be equal to or higher than the height of the top surface of the first conductive pattern 20.
  • the first protective layer 130 is formed along the profile of the surface of the first conductive pattern 20, the upper surface 135 of the curved first protective layer 130 is formed. ), The surface area of the top surface 135 of the first protective layer 130 may increase.
  • the contact area between the first passivation layer 130 and the first heat dissipation layer 140 may also increase due to the increased surface area of the upper surface 135 of the first passivation layer 130. Therefore, the heat transfer efficiency of the first conductive pattern 20 transferred to the first heat dissipation layer 140 through the first protective layer 130 may increase.
  • first passivation layer 130 is formed along the profile of the first conductive pattern 20, after forming the first passivation layer 130, planarizing the top surface of the first passivation layer 130. This may not be done.
  • FIG. 4 is a cross-sectional view of a flexible circuit board according to another embodiment of the present invention.
  • the flexible circuit board 3 may include a second conductive pattern 120 and a second conductive pattern 120 formed on a surface opposite to the first conductive pattern 20 of the base film 10.
  • the via layer 51 may further include a via 51 penetrating the protective layer 230, the second heat dissipating layer 240, and the base film 10.
  • the second conductive pattern 120 may be formed on an opposite surface of one surface on which the first conductive pattern 20 of the base film 10 is formed. Like the first conductive pattern 20, the second conductive pattern 120 may include at least one or more conductive wires having a predetermined width.
  • the second conductive pattern 120 may be electrically connected to the first conductive pattern 20 through the via 51 penetrating the substrate.
  • the via 51 may fill the via hole 50 formed through the base film 10.
  • the via 51 may include a conductive material such as copper or gold, or an alloy thereof.
  • one or more additional metal layers may be included between the inner wall of the via hole 50 and the via 51.
  • first conductive pattern 20 and the second conductive pattern 120 are formed at positions corresponding to the base film 10, but the present invention is not limited thereto. It will be apparent to those skilled in the art that the arrangement of the first and second conductive patterns 20 may vary according to the design of the flexible circuit board 1 and the arrangement of the circuit elements mounted thereon. .
  • the second protective layer 230 may be formed to cover the second conductive pattern 120. Like the first passivation layer 30, the second passivation layer 230 may be formed to completely cover the second conductive pattern 120. Therefore, the height of the upper surface of the second protective layer 230 from the other surface of the base film 10 may be equal to or higher than the height of the uppermost surface of the second conductive pattern 120.
  • the second heat dissipation layer 240 may be formed on the second protective layer 230.
  • the second heat dissipation layer 240 may include a base material which is an insulating material and a heat dissipation material contained in the base material.
  • the first heat dissipation layer 40 and the second heat dissipation layer 240 may include the same material. That is, the base material and the heat dissipation layer constituting the first heat dissipation layer 40 and the second heat dissipation layer 240 may include the same material.
  • the second heat dissipation layer 240 may be formed to completely cover the second protective layer 230.
  • the second heat dissipation layer 240 may include the second conductive pattern 120. It may be formed to cover only the upper surface of the second protective layer 230 on the formed region.
  • the second heat dissipation layer 240 is not interposed between the second conductive patterns 120. This is the same as the description associated with the first heat dissipation layer 40. Therefore, the shape of the second heat dissipation layer 240 helps to release heat generated in the second conductive pattern 120 into the air, and at the same time, a leakage current is generated between the second conductive pattern 120 and the heat dissipating material, thereby providing a flexible circuit. It is possible to prevent reducing the operating reliability of the substrate 3.
  • FIG. 5 is a flowchart illustrating a method of manufacturing a flexible circuit board according to an embodiment of the present invention.
  • a method of manufacturing a flexible circuit board provides a base film having a plurality of conductive patterns formed on at least one surface thereof (S10), and forming the plurality of conductive patterns.
  • a first protective layer is formed to cover (S20), and a heat radiation layer having a heat dissipating material formed therein is formed on the first protective layer (S30).
  • the first conductive pattern 20 may be formed by, for example, a semi additive process of forming a resist on the base film 10 and performing plating in an electrolytic or non-electrolytic manner.
  • a conductive layer may be formed on the layer 10 and may be formed by an etching process of etching the conductive layer.
  • Forming the first protective layer 30 to cover the plurality of first conductive patterns 20 may include forming a solder resist or coverlay film on the first conductive pattern 20 by printing or laminating. Can be.
  • the first protective layer 30 needs to be sufficiently formed so that the level of the upper surface of the first protective layer 30 can be higher than the level of the uppermost surface of the first conductive pattern 20.
  • Flattening the upper surface of the first protective layer 30 may include, for example, pressing the upper surface of the first protective layer 30 with a press.
  • Forming the first heat dissipation layer 40 to cover the first passivation layer 30 may include printing or laminating a solder resist or coverlay film including the heat dissipation material 45 on the first passivation layer 30. It may include forming into.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

La présente invention concerne une carte de circuit imprimé flexible et son procédé de fabrication. Une carte de circuit imprimé flexible comprend : un film de base ; une pluralité de premiers motifs conducteurs formés sur une surface du film de base ; une première couche de protection formée pour recouvrir la pluralité de premiers motifs conducteurs ; et une première couche de dissipation de chaleur recouvrant la première couche de protection, la première couche de dissipation de chaleur comprenant un matériau de base et un matériau de dissipation de chaleur contenu dans le matériau de base.
PCT/KR2017/007669 2016-07-20 2017-07-17 Carte de circuit imprimé flexible et son procédé de fabrication Ceased WO2018016829A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201780044647.6A CN109804717A (zh) 2016-07-20 2017-07-17 软性电路板及其制造方法
JP2019502734A JP2019521528A (ja) 2016-07-20 2017-07-17 フレキシブル回路基板及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160092169A KR101915947B1 (ko) 2016-07-20 2016-07-20 연성 회로 기판 및 그 제조 방법
KR10-2016-0092169 2016-07-20

Publications (1)

Publication Number Publication Date
WO2018016829A1 true WO2018016829A1 (fr) 2018-01-25

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Application Number Title Priority Date Filing Date
PCT/KR2017/007669 Ceased WO2018016829A1 (fr) 2016-07-20 2017-07-17 Carte de circuit imprimé flexible et son procédé de fabrication

Country Status (5)

Country Link
JP (2) JP2019521528A (fr)
KR (1) KR101915947B1 (fr)
CN (1) CN109804717A (fr)
TW (1) TWI670997B (fr)
WO (1) WO2018016829A1 (fr)

Cited By (2)

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CN114068448A (zh) * 2020-08-04 2022-02-18 Lg伊诺特有限公司 用于膜上芯片的柔性电路板、包括其的芯片封装及包括其的电子装置
CN114333592A (zh) * 2021-12-31 2022-04-12 湖北长江新型显示产业创新中心有限公司 显示装置

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CN110972386A (zh) * 2018-09-28 2020-04-07 深圳正峰印刷有限公司 适用于印刷电子元件的电路板
KR102335624B1 (ko) * 2020-05-20 2021-12-07 주식회사 코닉에스티 보강판 및 이를 포함하는 카메라모듈
CN117812802A (zh) * 2022-09-26 2024-04-02 鹏鼎控股(深圳)股份有限公司 具散热功能的电路板及其制造方法
KR20250082732A (ko) * 2023-11-30 2025-06-09 스템코 주식회사 연성회로기판, 이를 포함하는 전자장치 및 이의 제조방법

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TWI670997B (zh) 2019-09-01
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