TWI670997B - 軟性電路板及其製造方法 - Google Patents
軟性電路板及其製造方法 Download PDFInfo
- Publication number
- TWI670997B TWI670997B TW106124092A TW106124092A TWI670997B TW I670997 B TWI670997 B TW I670997B TW 106124092 A TW106124092 A TW 106124092A TW 106124092 A TW106124092 A TW 106124092A TW I670997 B TWI670997 B TW I670997B
- Authority
- TW
- Taiwan
- Prior art keywords
- protective layer
- heat dissipation
- circuit board
- flexible circuit
- layer
- Prior art date
Links
- 238000000034 method Methods 0.000 title description 10
- 239000011241 protective layer Substances 0.000 claims abstract description 110
- 239000010410 layer Substances 0.000 claims abstract description 98
- 230000017525 heat dissipation Effects 0.000 claims abstract description 97
- 239000000463 material Substances 0.000 claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 12
- 239000010408 film Substances 0.000 description 34
- 239000000470 constituent Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000013039 cover film Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160092169A KR101915947B1 (ko) | 2016-07-20 | 2016-07-20 | 연성 회로 기판 및 그 제조 방법 |
| ??10-2016-0092169 | 2016-07-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201804878A TW201804878A (zh) | 2018-02-01 |
| TWI670997B true TWI670997B (zh) | 2019-09-01 |
Family
ID=60992247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106124092A TWI670997B (zh) | 2016-07-20 | 2017-07-19 | 軟性電路板及其製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP2019521528A (fr) |
| KR (1) | KR101915947B1 (fr) |
| CN (1) | CN109804717A (fr) |
| TW (1) | TWI670997B (fr) |
| WO (1) | WO2018016829A1 (fr) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110972386A (zh) * | 2018-09-28 | 2020-04-07 | 深圳正峰印刷有限公司 | 适用于印刷电子元件的电路板 |
| KR102335624B1 (ko) * | 2020-05-20 | 2021-12-07 | 주식회사 코닉에스티 | 보강판 및 이를 포함하는 카메라모듈 |
| KR20220017171A (ko) * | 2020-08-04 | 2022-02-11 | 엘지이노텍 주식회사 | 칩 온 필름용 연성 회로기판 및 이를 포함하는 칩 패키지, 및 이를 포함하는 전자 디바이스 |
| CN114333592B (zh) * | 2021-12-31 | 2023-08-25 | 湖北长江新型显示产业创新中心有限公司 | 显示装置 |
| CN117812802A (zh) * | 2022-09-26 | 2024-04-02 | 鹏鼎控股(深圳)股份有限公司 | 具散热功能的电路板及其制造方法 |
| WO2025116341A1 (fr) * | 2023-11-30 | 2025-06-05 | 스템코(주) | Carte de circuit imprimé souple, dispositif électronique la comprenant et son procédé de fabrication |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI355214B (en) * | 2004-09-27 | 2011-12-21 | Canon Kk | Method of producing light emitting device |
| TWI541955B (zh) * | 2013-11-21 | 2016-07-11 | 東部高科股份有限公司 | Cof型半導體封裝及其製造方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05327192A (ja) * | 1992-05-15 | 1993-12-10 | Cmk Corp | フレキシブルプリント配線板の製造方法 |
| EP0891127A3 (fr) * | 1997-07-11 | 2000-03-22 | Lexmark International, Inc. | Revêtement protecteur d'un circuit TAB |
| JP2003338579A (ja) * | 2002-05-22 | 2003-11-28 | Kyocera Corp | 放熱板付き配線基板 |
| JP2004211060A (ja) * | 2002-12-16 | 2004-07-29 | Ceramission Kk | エマルジョン性組成物およびそれにより形成した塗膜並びにその塗膜を用いた冷却構造 |
| KR101211732B1 (ko) * | 2006-09-30 | 2012-12-12 | 엘지이노텍 주식회사 | 방열성이 우수한 연성 회로 기판 |
| CN101684181B (zh) * | 2008-09-26 | 2011-12-14 | 比亚迪股份有限公司 | 一种光敏聚酰亚胺及其柔性线路板 |
| JP2011199090A (ja) * | 2010-03-23 | 2011-10-06 | Shindo Denshi Kogyo Kk | フレキシブルプリント配線板の製造方法、半導体装置の製造方法、ディスプレイ装置の製造方法、フレキシブルプリント配線板、半導体装置及びディスプレイ装置 |
| KR20110117928A (ko) * | 2010-04-22 | 2011-10-28 | 이성규 | 회로기판용 커버 필름 및 이를 구비하는 회로기판 어셈블리 |
| KR101292643B1 (ko) * | 2011-10-26 | 2013-08-02 | 성균관대학교산학협력단 | 그래핀을 포함하는 전자파 감쇄 및 방열용 필름 및 이를 포함하는 전자기 소자 |
| JP2014207315A (ja) * | 2013-04-12 | 2014-10-30 | 船井電機株式会社 | フレキシブル基板および表示装置 |
| TW201524284A (zh) * | 2013-12-03 | 2015-06-16 | Toyo Ink Sc Holdings Co Ltd | 電子元件以及片材 |
| KR101547500B1 (ko) * | 2014-12-15 | 2015-08-26 | 스템코 주식회사 | 연성 회로 기판과 이를 포함하는 전자 장치 및 연성 회로 기판의 제조 방법 |
-
2016
- 2016-07-20 KR KR1020160092169A patent/KR101915947B1/ko not_active Expired - Fee Related
-
2017
- 2017-07-17 CN CN201780044647.6A patent/CN109804717A/zh active Pending
- 2017-07-17 JP JP2019502734A patent/JP2019521528A/ja active Pending
- 2017-07-17 WO PCT/KR2017/007669 patent/WO2018016829A1/fr not_active Ceased
- 2017-07-19 TW TW106124092A patent/TWI670997B/zh not_active IP Right Cessation
-
2020
- 2020-12-10 JP JP2020204951A patent/JP2021040167A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI355214B (en) * | 2004-09-27 | 2011-12-21 | Canon Kk | Method of producing light emitting device |
| TWI541955B (zh) * | 2013-11-21 | 2016-07-11 | 東部高科股份有限公司 | Cof型半導體封裝及其製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180010064A (ko) | 2018-01-30 |
| KR101915947B1 (ko) | 2019-01-30 |
| CN109804717A (zh) | 2019-05-24 |
| JP2019521528A (ja) | 2019-07-25 |
| JP2021040167A (ja) | 2021-03-11 |
| TW201804878A (zh) | 2018-02-01 |
| WO2018016829A1 (fr) | 2018-01-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |