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WO2017212964A1 - Structure de connexion de cartes de circuit imprimé - Google Patents

Structure de connexion de cartes de circuit imprimé Download PDF

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Publication number
WO2017212964A1
WO2017212964A1 PCT/JP2017/019857 JP2017019857W WO2017212964A1 WO 2017212964 A1 WO2017212964 A1 WO 2017212964A1 JP 2017019857 W JP2017019857 W JP 2017019857W WO 2017212964 A1 WO2017212964 A1 WO 2017212964A1
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WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
slit
standing substrate
connection structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/019857
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English (en)
Japanese (ja)
Inventor
規央 鈴木
田邊　剛
佐々木　俊介
佳郎 西中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to CN201780031079.6A priority Critical patent/CN109196961B/zh
Priority to JP2018522425A priority patent/JP6659839B2/ja
Publication of WO2017212964A1 publication Critical patent/WO2017212964A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits

Definitions

  • the present invention relates to a printed circuit board connection structure, and in particular, the second printed circuit board is inserted vertically with respect to the first printed circuit board provided with a hole, and both electrodes are electrically connected to each other by a solder fillet.
  • the present invention relates to a connection structure for a three-dimensional printed circuit board.
  • connection structure between the first printed circuit board and the second printed circuit board fixed substantially perpendicular to the first printed circuit board examples include those disclosed in JP 2010-258190 A (Patent Document 1).
  • Patent Document 1 JP 2010-258190 A
  • a slit as a hole is provided in the first printed circuit board, and the second printed circuit board is inserted into the slit, and both electrodes are electrically connected by soldering. It is connected to the.
  • the second printed circuit board Due to the problem of substrate processing accuracy, there is always a fit tolerance between the slit width and the thickness of the second printed circuit board. Due to this fitting tolerance, a gap is generated between the inner wall surface of the slit and the surface of the second printed circuit board during soldering. Due to this gap, the second printed circuit board may not be arranged at the center in the width direction of the slit during soldering, but may be arranged so as to be closer to one side in the width direction. In this case, the size of the solder fillet for fixing the two printed circuit boards is greatly different between one surface side of the second printed circuit board and the other surface side opposite to the second printed circuit board.
  • JP 2010-258190 A does not consider this problem at all.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a printed circuit board connection structure having a structure in which a substrate inserted into a hole portion is joined without approaching one side in the width direction of the hole portion. Is to provide.
  • the printed circuit board connection structure of the present invention includes a first printed circuit board and a second printed circuit board.
  • the first printed circuit board has one and the other first surface, and a hole reaching from the one first surface to the other first surface is formed.
  • the second printed circuit board has one and other second surfaces and is inserted into the hole. The hole extends along one direction on one and the other first surfaces.
  • the first electrode of the first printed circuit board and the second electrode of the second printed circuit board are electrically connected by a solder fillet.
  • An insulating member is disposed on one and the other second surfaces of the second printed circuit board. At least a part of the insulating member is disposed in the hole.
  • the insulating members on both surfaces of the second printed circuit board are disposed in the hole. For this reason, compared with the case where there is no insulating member, the difference in the distance between the inner wall surface of the hole and the insulating member surface between the second surface side of the second printed circuit board and the other second surface side is reduced. can do. In other words, the second printed circuit board inserted into the hole is joined without depending on one side in the width direction of the hole, and stress concentration due to thermal strain on the solder fillet can be suppressed.
  • FIG. 1 is a schematic perspective view of a printed circuit board connection structure according to the present invention. It is a schematic plan view which shows the structure of the 1st printed circuit board which concerns on this invention.
  • FIG. 3 is a schematic plan view showing a configuration of a second printed circuit board in Embodiment 1 and a positional relationship with the first printed circuit board connected to the second printed circuit board.
  • FIG. 4 is a schematic enlarged plan view of the second printed circuit board of FIG. 3, clearly showing the range of support portions included in the second printed circuit board of FIG. 3.
  • FIG. 2 is a schematic cross-sectional view of the printed circuit board connection structure according to the first embodiment, taken along line AA in FIG. It is a schematic sectional drawing of the part which follows the AA line of FIG.
  • FIG. 1 of the connection structure of the printed circuit board in a comparative example.
  • FIG. 8 is a schematic cross-sectional view illustrating a molten solder supply mode at the time of charging into the molten solder tank illustrated in FIG. 7 when the second printed circuit board is disposed in the center portion in the width direction of the slit in the first embodiment.
  • It is a schematic sectional drawing which shows the dimension of each member especially in the inside of the slit 10 in FIG.
  • FIG. 6 is a schematic cross-sectional view of a portion along the line AA in FIG. 1 of a first modification example different from FIG.
  • FIG. 6 is a schematic cross-sectional view of a portion along the line AA in FIG. 1 of a second modification example different from FIG. 5 of the printed circuit board connection structure in the first embodiment.
  • FIG. 6 is a schematic cross-sectional view of a portion taken along line AA of FIG. 1 in the printed circuit board connection structure in the second embodiment.
  • FIG. 10 is a schematic plan view showing a configuration of a second printed circuit board in Embodiment 2 and a positional relationship with the first printed circuit board connected to the second printed circuit board.
  • FIG. 10 is a schematic cross-sectional view of the printed circuit board connection structure according to the third embodiment taken along line AA in FIG.
  • FIG. 10 is a schematic plan view showing a configuration of a second printed circuit board in a first example of Embodiment 3 and a positional relationship with the first printed circuit board connected to the second printed circuit board.
  • FIG. 19 is a schematic plan view (A) of the second printed circuit board in Embodiment 1, and a schematic cross-sectional view (B) of a portion along the line XVIIIB-XVIIIB in FIG. 18 (A).
  • FIG. 20 is a schematic plan view (A) of a second printed circuit board according to Embodiment 3, and a schematic cross-sectional view (B) of a portion along line XIXB-XIXB in FIG. 19 (A).
  • Schematic plan view (A) showing the configuration of the second printed circuit board in the second example of the third embodiment and the positional relationship with the first printed circuit board connected to the second printed circuit board, and the third embodiment of the third embodiment
  • It is a schematic plan view (B) which shows the structure of the 2nd printed circuit board in an example, and the positional relationship with the 1st printed circuit board connected to this. It is the schematic plan view which looked at the area
  • FIG. 1 is a perspective view schematically showing a connection structure of a three-dimensional printed circuit board according to the present embodiment.
  • FIG. 2 is a schematic plan view of the first printed circuit board constituting the printed circuit board connection structure of FIG. 1 as viewed from the lower side in the Z direction in FIG. 3 and 4 are schematic plan views of the second printed circuit board constituting the printed circuit board connection structure of FIG. 1 as viewed from the left side in the X direction, that is, from the back side.
  • 5 and 9 are schematic cross-sectional views of the portion along the line AA in FIG. 1 in the present embodiment.
  • the printed circuit board connection structure of the present embodiment includes a main board 1 as a first printed board and a standing board 2 as a second printed board. .
  • the main board 1 is a flat printed board having, for example, a rectangular shape in plan view, and has one rectangular first surface 1a and the other first surface 1b.
  • one of the first surfaces 1a is one of the main surfaces, which is a main surface that does not include the dimension in the thickness direction when the main substrate 1 is viewed in plan.
  • the other first surface 1b is a main surface opposite to the first surface 1a. That is, for example, if one first surface 1a faces downward in the Z direction, the other first surface 1b faces upward in the Z direction, which is the opposite side.
  • the main substrate 1 is formed with a slit 10 as a hole penetrating from the first surface 1a so as to reach the other first surface 1b.
  • the slit 10 includes a slit 10 a, a slit 10 b, and a slit 10 c that are spaced apart from each other in the direction along the long side when the main substrate 1 is viewed in plan, that is, the Y direction. May be.
  • the slits 10a, 10b, and 10c are arranged in this order with respect to the Y direction.
  • Each of the slits 10a, 10b, 10c has a rectangular shape in plan view, and has a shape in which a part of the standing substrate 2 can be inserted.
  • the slits 10a, 10b, and 10c all extend along one direction on the first surface 1a and the other first surface 1b. In FIG. 2, all of the slits 10a, 10b, and 10c extend along the Y direction, and the central slit 10b in the Y direction extends the longest. However, it is not limited to such a mode.
  • the standing board 2 is a flat printed board and has one second surface 2a and the other second surface 2b.
  • one of the second surfaces 2a is one of the main surfaces that are the main surfaces not including the dimension in the thickness direction when the standing substrate 2 is viewed in plan.
  • the other second surface 2b is a main surface opposite to the one second surface 2a.
  • a partial region of the standing substrate 2 is formed as a support portion 11.
  • the support portion 11 is a region adjacent to the lower end surface in the Z direction extending along the Y direction which is the longitudinal direction thereof.
  • the support portion 11 in the state of FIG. 1 in which the standing substrate 2 is inserted into the slit 10 of the main substrate 1, the support portion 11 is on the one first surface 1 a side, that is, in the Z direction lower than the other first surface 1 b of the main substrate 1.
  • This is a portion of the standing substrate 2 located on the side.
  • the standing substrate 2 may include support portions 11a, 11b, and 11c formed at intervals in the support portion 11 with respect to the Y direction.
  • the support portions 11a, 11b, and 11c are arranged in this order in the Y direction.
  • the notch 12 of the standing substrate 2 is provided in the region between the support portion 11a and the support portion 11b and the region between the support portion 11b and the support portion 11c. Therefore, the standing substrate 2 has a rectangular shape in plan view if the notch 12 is temporarily filled.
  • the support portion 11 means a region having the same position coordinates in the Z direction as the region where the notch 12 is formed.
  • the support portion 11a can be inserted into the slit 10a, the support portion 11b can be inserted into the slit 10b, and the support portion 11c can be inserted into the slit 10c.
  • a part of the standing substrate 2 is inserted into the slit 10.
  • the support portions 11a, 11b, and 11c all extend along the Y direction, and the central support portion 11b in the Y direction extends the longest.
  • the support portion 11 extending in the Z direction passes through the slit 10 of the main substrate 1.
  • a three-dimensional printed circuit board connection structure in which the main substrate 1 and the standing substrate 2 intersect is formed such that one first surface 1a and one second surface 2a are substantially orthogonal to each other.
  • main substrate electrode 3 as a first electrode is formed in a region adjacent to slit 10.
  • the standing substrate electrode 4 as the second electrode is provided in a region adjacent to the slit 10 when it is inserted into the slit 10. Is formed.
  • the standing substrate electrode 4 is formed on the support portion 11 of the standing substrate 2.
  • the standing substrate electrode 4 is inserted into the slit 10, in FIG. 2, only a region of the three slits 10 that is adjacent to the slit 10 b in plan view is spaced apart in the Y direction by a plurality of main substrate electrodes 3.
  • the present invention is not limited to this, and the main substrate electrode 3 may be similarly formed in a region adjacent to the slits 10a and 10c in plan view. Further, in FIG.
  • a plurality of standing substrate electrodes 4 are formed at intervals in the Y direction only on the support portion 11b among the three support portions 11, but not limited thereto, the support portions 11a and 11c are also provided. Similarly, the standing substrate electrode 4 may be formed. Although not shown in FIG. 3, the standing substrate electrode 4 is formed on the other second surface 2 b of the standing substrate 2 in the same manner as on the second surface 2 a.
  • a standing substrate electrode 4 on one second surface 2 a and the other second surface 2 b of the standing substrate 2 to be disposed is connected by a solder fillet 5.
  • the main board electrode 3 and the standing board electrode 4 are electrically connected, and the main board 1 and the standing board 2 are mechanically connected. That is, the solder fillet 5 is formed on both the second surface 2a of the standing substrate 2 and the other second surface 2b.
  • resist film 6 is formed so as to cover main substrate electrode 3 on one first surface 1a. ing. Further, a resist film 6 is formed so as to cover the standing substrate electrode 4 on one second surface 2a and the other second surface 2b.
  • the resist film 6 may be formed as a pattern only in a region adjacent to the slit 10, but is connected by a solder fillet 5 out of the first surface 1a, the second surface 2a, and the second surface 2b.
  • the main substrate electrode 3 and the standing substrate electrode 4 may be formed so as to cover almost the entire surface except the exposed region.
  • the resist film 6 is formed on the main substrate electrode 3 and the standing substrate electrode 4 that electrically connect the elements formed on the main substrate 1 and the standing substrate 2 from the viewpoint of not exposing them except in a desired region. Insulating film.
  • a region where the main substrate electrode 3 and the standing substrate electrode 4 are exposed without being covered with an insulating member such as the resist film 6 is defined as a region where the main substrate electrode 3 and the standing substrate electrode 4 are formed.
  • a partial region on one second surface 2a and the other second surface 2b of standing substrate 2 is mainly composed of, for example, an acrylic resin or an epoxy resin.
  • a silk pattern 7 made of an insulating material is formed.
  • the silk pattern 7 is formed so as to cover at least part of the surface of the resist film 6 formed so as to cover the standing substrate electrode 4.
  • the silk pattern 7 is formed so as to cover the lowermost region in the Z direction of the resist film 6 of the standing substrate 2. That is, the silk pattern 7 is formed so as to overlap the resist film 6, and the portion where the silk pattern 7 and the resist film 6 overlap is disposed as an insulating member.
  • this insulating member is disposed in the slit 10.
  • the lower half of the insulating member where the silk pattern 7 and the resist film 6 overlap is disposed in the slit 10.
  • the end surface on the first surface 1a side of the insulating member is disposed in the slit 10. That is, in FIG. 5, the lower end surface 6e that is one end surface on the first surface 1a side of the resist film 6, that is, the lower end surface in the Z direction, and the lower end surface 7e that is the end surface on one first surface 1a side of the silk pattern 7 are In the slit 10, it is arranged in a region near the middle between one first surface 1a and the other first surface 1b. Referring to FIG.
  • the silk pattern 7 has a strip shape extending linearly along the Y direction, which is one direction in which the slit 10 extends.
  • the silk pattern 7 is arranged in the Z direction, but two or more silk patterns 7 may be arranged at intervals in the Z direction.
  • the resist film 6 and the silk pattern 7 as insulating members on the standing substrate 2 are basically formed by a generally known method. Specifically, the material constituting the standing substrate 2 is cut into a flat plate shape, and a copper foil, for example, is formed on one second surface 2a and the other second surface 2b by a generally known photolithography technique and etching technique. Pattern is formed. A resist solution is applied on the copper foil pattern, and the resist solution is partially formed as a resist film 6 which is a resist pattern by photolithography. Next, a silk pattern 7 is formed on the surface of the resist film 6 by silk printing.
  • the method for forming the resist film 6 on the main substrate 1 is basically the same as described above, and detailed description thereof is omitted.
  • the X-direction width of the slit 10 and the support portion 11 of the standing substrate 2 are always fitted. Tolerances are provided. That is, a gap is formed between the inner wall surface of the slit 10 and the surface of the standing substrate 2 (including the surface of the standing substrate electrode 4).
  • the support portion 11 of the standing substrate 2 may not be disposed at the center portion in the X direction of the slit 10 but may be disposed so as to be closer to one side in the X direction.
  • the standing substrate 2 is disposed so as to be closer to the right side than the central portion in the X direction of the slit 10.
  • solder fillet 5 in a state where support portion 11 of substrate 2 is inserted in slit 10 of main substrate 1, for example, the long side direction of each substrate, that is, the Y direction It is thrown into the molten solder bath while moving in the direction along Accordingly, by movement of each substrate along the Y direction, molten solder is supplied onto the main substrate electrode 3 and the standing substrate electrode 4 from the first surface 1a side, which is the lower side of the main substrate 1, and the main substrate electrode A solder fillet 5 is formed so as to connect 3 and the standing substrate electrode 4.
  • the standing substrate electrode 4 below the support portion 11, that is, one of the first surfaces 1a, the solder fillet 5 that connects the standing substrate electrode 4 and the main substrate electrode 3 can be formed more easily.
  • manufacturing variations between the main board 1 and the standing board 2 can be considered as a cause of the standing board 2 moving to one side as shown in FIG. That is, when the fitting tolerance, that is, the gap between the slit 10 and the standing substrate 2 becomes very large due to manufacturing variations, the distance between the main substrate electrode 3 and the standing substrate electrode 4 becomes very large. As a result, the solder fillet 5 that connects the main substrate electrode 3 and the standing substrate electrode 4 may not be formed.
  • the fitting tolerance that is, the gap becomes zero or a negative value (the thickness of the standing substrate is larger than the width of the slit) due to manufacturing variations, the support portion 11 is placed in the slit 10. It cannot be inserted, and the inner wall surface of the slit 10 needs to be shaved.
  • the size and shape of the solder fillet 5 due to solidification of the molten solder 50 are substantially equal on the second surface 2a side and the second surface 2b side. Accordingly, the stress caused by thermal strain applied to the solder fillet 5 on one second surface 2a side and the solder fillet 5 on the other second surface 2b side can be evenly distributed, and the occurrence of cracks in the solder fillet 5 is suppressed. can do.
  • a resist film 6 as an insulating member is formed on one second surface 2a and the other second surface 2b of the standing substrate 2.
  • the silk pattern 7 is disposed, and at least a part of the silk pattern 7 is disposed in the slit 10. More specifically, the end surface on the first surface 1 a side of the insulating member is disposed in the slit 10.
  • the inner wall surface of the slit 10 on the second surface 2a side and the second surface 2b side of the standing substrate 2 is provided.
  • the difference in distance between the insulating member and the insulating member can be reduced. Therefore, it can suppress that the support part 11 moves to the one side extremely in the slit 10, and it can be set as the aspect close
  • the width of the slit 10 is substantially equal to the width of the standing substrate 2 or smaller than the width of the standing substrate 2, for example, the slit 10 Since the silk pattern 7 can be inserted while cutting at the edge portion, the substrate 2 can be inserted into the slit 10 without cutting the slit 10. Since the shavings of the silk pattern 7 generated at this time are nonconductive, the yield of the printed circuit board connection structure 100 is not lowered even if the shavings are scattered.
  • FIG. 9 shows the dimensions of each part where the substrate 2 is inserted in the slit 10.
  • the width in the X direction of slit 10 in FIG. 1 is W
  • the thickness of standing substrate 2 that is, the dimension of standing substrate 2 in the X direction in FIG.
  • the thickness t of the standing substrate 2 includes the thickness of the standing substrate electrode 4 formed on one second surface 2a and the other second surface 2b.
  • the distance between the surface of the standing substrate electrode 4 on one second surface 2a and the inner wall surface of the slit 10 is d1, and the distance between the surface of the standing substrate electrode 4 on the other second surface 2b and the inner wall surface of the slit 10 is. Is d2.
  • the thickness of the resist film 6 on one second surface 2a and the other second surface 2b is t1
  • the thickness of the silk pattern 7 is t2.
  • the sum of the values of d1 and d2 is preferably 0 mm or more and 0.5 mm or less, and the difference between d1 and d2 is preferably as small as possible (more preferably zero).
  • the sum of the values of t1 and t2 on both surfaces of the standing substrate 2 is preferably 0 mm or more and 0.5 mm or less in the finished product, but before the excessive thickness of the silk pattern 7 is cut as described above, for example. In this case, the sum may be more than 0.5 mm and less than 0.7 mm.
  • the sum of the values of t1 and t2 is shown in consideration of the case where only one of the resist film 6 and the silk pattern 7 is formed, as will be described later.
  • FIG. 10 and FIG. 11 are not connected so that the standing board 2 is substantially perpendicular to the main board 1 in each of the comparative example and the present embodiment, and is connected in a state where the standing board 2 is inclined.
  • FIG. 10 when the resist film 6 and the silk pattern 7 as the insulating members are not arranged inside the slit 10 as in the printed circuit board connection structure 901 of the comparative example, the width of the slit 10 stands up to the thickness of the substrate 2. If it becomes very large compared to the above, there is a possibility that the standing substrate 2 is greatly inclined with respect to the direction perpendicular to the main substrate 1. However, referring to FIG.
  • the standing substrate 2 is inclined. Sometimes an insulating member such as the silk pattern 7 immediately contacts the inner wall surface of the slit 10. Therefore, the tilt of the standing substrate 2 can be suppressed as compared with the case of FIG. If the inclination of the standing substrate 2 is suppressed, the difference in size and shape of the solder fillet 5 between the one second surface 2a side and the other second surface 2b side of the standing substrate 2 can be reduced. Stress concentration due to strain can be suppressed.
  • the insulating member may have a structure in which both a resist film 6 and a silk pattern 7 covering at least part of the surface of the resist film 6 are laminated.
  • the insulating member may be composed of only resist film 6.
  • the insulating member may be formed only of silk pattern 7. That is, the insulating member only needs to be constituted by at least one of the resist film 6 and the silk pattern 7.
  • the insulating member provides a thickness for securing a distance between the standing substrate electrode 4 and the inner wall surface of the slit 10 and suppressing uneven distribution of the standing substrate 2. Therefore, for example, as long as the sum of the thickness t1 and the thickness t2 shown in FIG. 9 is a sufficiently large value, even if only one of the resist film 6 and the silk pattern 7 or another insulating material, The effect of this Embodiment can be show
  • the other insulating material is, for example, a functional treatment film such as a coating agent for moisture-proof treatment mainly composed of acrylic resin, urethane resin, polyurethane resin, polyolefin resin or the like.
  • the other insulating material may be an insulating tape mainly composed of polyimide resin or polyethylene resin. Therefore, in any of the configurations of FIGS. 12 and 13, the solder fillets 5 can be evenly formed on both sides of the standing substrate 2 as in the configuration of FIG. 5.
  • the resist film 6 and the silk pattern 7 formed in other areas in the region other than the slit 10 are used simultaneously. Since the resist film 6 and the silk pattern 7 can be formed, it is not necessary to provide a separate step of forming an insulating member, and the configuration of FIG. 5 can be easily formed.
  • the resist film 6 and the silk pattern 7 may be applied or printed in double or multiple (three or more layers) in order to ensure the thickness.
  • the silk pattern 7 is formed in a strip shape extending linearly along the Y direction in which the slit 10 extends, as in the present embodiment, when the standing substrate 2 is fitted to the main substrate 1, the inside of the slit 10 The amount of the silk pattern 7 that is visible and hidden can be easily measured by appearance inspection or sensory inspection. Thereby, it is possible to easily determine whether the main substrate 1 is warped or whether the standing substrate 2 is lifted upward with respect to the main substrate 1 in the Z direction.
  • the silk pattern 7 is formed as a single band-shaped pattern extending in the Y direction. However, this may be formed as two or more band-shaped patterns formed at intervals with respect to the Z direction, for example. .
  • the silk pattern as two or more patterns is thus obtained. 7 may be formed.
  • the amount of the molten solder 50 supplied to the region between the support portion 11 of the standing board 2 and the slit 10 of the main board 1 can be secured constant.
  • the strength of the joint portion between the main board electrode 3 and the standing board electrode 4 by the solder fillet 5 can be controlled to an arbitrary value.
  • the amount of solder forming the solder fillet 5 can be controlled to be constant, the solder between the plurality of main board electrodes 3 adjacent to each other and the plurality of standing board electrodes 4 in the Y direction. The occurrence of bridging can be suppressed.
  • FIG. FIG. 14 corresponds to FIG. 5 in the first embodiment
  • FIG. 15 corresponds to FIG. 3 in the first embodiment
  • printed circuit board connection structure 200 of the present embodiment basically has the same configuration as printed circuit board connection structure 100 of the first embodiment, and therefore the same components Are denoted by the same reference numerals, and the description thereof will not be repeated as long as the functions and effects are the same.
  • the printed circuit board connection structure 200 of the present embodiment includes a resist film 6 and a silk pattern 7 as insulating members.
  • the end surface of the insulating member on the first surface 1a side is disposed at a position overlapping the first surface 1a of the slit 10.
  • the lower end surface 6e of the resist film 6 and the lower end surface 7e of the silk pattern 7 are substantially equal in position to one first surface 1a of the main substrate 1 with respect to the Z direction, that is, one first surface 1a and the pliant. It is arranged so that. That is, in the present embodiment, the resist film 6 and the silk pattern 7 are disposed in the entire region in the Z direction inside the slit 10. Even in this case, in the state where the standing substrate 2 is inserted into the slit 10, the other first surface 1b of the main substrate 1 indicated by the dotted line in FIG.
  • the present embodiment is different from the first embodiment in which the lower end surface 6e and the lower end surface 7e are arranged in a region near the middle between one first surface 1a and the other first surface 1b in the slit 10. ing.
  • the present embodiment has the following functions and effects.
  • the standing substrate electrode 4 and the main array electrode 4 that are arranged at intervals from each other in the Y direction. Even when the substrate electrodes 3 have a narrow pitch, the standing substrate electrodes 4 can be formed without forming a solder bridge between the pair of adjacent standing substrate electrodes 4 and the pair of main substrate electrodes 3 adjacent to each other. And the main substrate electrode 3 can be joined by the solder fillet 5.
  • the solder fillet 5 is not inside the slit 10 and the solder bridge is highly visible, so the presence or absence of the solder bridge can be easily determined visually. . Further, according to the present embodiment, for example, by visually confirming that the lower end surface 7e of the silk pattern 7 protrudes below the slit 10 in the Z direction, it is easily determined whether the main substrate 1 is warped. be able to.
  • FIG. 16 corresponds to FIG. 5 in the first embodiment
  • FIG. 17 corresponds to FIG. 3 in the first embodiment
  • printed circuit board connection structure 300 of the present embodiment basically has the same configuration as printed circuit board connection structures 100 and 200 of the first and second embodiments.
  • the same constituent elements are denoted by the same reference numerals, and the description thereof will not be repeated as long as the functions and effects are the same.
  • the printed circuit board connection structure 300 of this embodiment includes a resist film 6 and a silk pattern 7 as insulating members.
  • a plurality of silk patterns 7 are arranged at intervals along the Y direction, which is one direction of the slit 10.
  • the silk pattern 7 has a circular shape in a plan view shown in FIG. 17, for example, and a plurality of the silk patterns 7 are arranged at intervals.
  • the resist film 6 is superimposed on the lower layer of the silk pattern 7 in the same manner as in the other embodiments, and the lower layer is exposed at the lowermost portion in the Z direction of the standing substrate 2 as in the other embodiments.
  • a standing substrate electrode 4 is formed.
  • a plurality of silk patterns 7 are arranged to have a circular shape at the same position as the position where the standing substrate electrode 4 is exposed in the Y direction, generally above the position where the standing substrate electrode 4 is exposed in the Z direction.
  • the present embodiment is structurally different from the first and second embodiments in which the silk pattern 7 has a strip shape extending linearly along the Y direction, which is one direction in which the slit 10 extends.
  • the silk pattern 7 has a position where the uppermost portion in the Z direction overlaps the other first surface 1 b of the main substrate 1, and the lowermost portion in the Z direction is one first surface of the main substrate 1. It is arranged at a position overlapping 1a. That is, in the present embodiment, the silk pattern 7 is arranged in the entire region in the Z direction inside the slit 10. Then, the lower end surface 7e of the silk pattern 7 and the lower end surface 6e of the resist film 6 are arranged at a position overlapping one of the first surfaces 1a of the slit 10 as in the second embodiment.
  • the present invention is not limited to such a mode, and also in the present embodiment, as in the first embodiment, for example, the lower end surface 7e of the circular silk pattern 7 has one first surface 1a inside the slit 10 and the other first surface 1a. You may arrange
  • the silk pattern 7 has a circular shape in plan view, but is not limited thereto, and may be an arbitrary shape such as a rectangular shape or an elliptical shape.
  • the silk pattern 7 has a circular shape in plan view, but is not limited thereto, and may be an arbitrary shape such as a rectangular shape or an elliptical shape.
  • only one row of silk patterns 7 is arranged in the Z direction.
  • two or more rows of silk patterns 7 are spaced apart from each other in the Z direction. Rows may be arranged.
  • FIG. 18 shows a cross-sectional shape of the belt-like silk pattern 7 formed as in the first embodiment.
  • FIG. 19 shows the cross-sectional shape when the silk pattern 7 divided into a plurality of parts is formed as in the present embodiment.
  • the dimension in the extending direction, that is, the Y direction is large, and particularly in the central part in the Y direction, the silk in the Y direction.
  • the distance from the edge of the pattern 7 becomes very large, and the force that supports the surface is weaker than near the edge.
  • a recess 7d is formed in the center of the silk pattern 7.
  • the resist film 6 is disposed so as to cover the standing substrate electrode 4 as in the other drawings. The same applies to FIG. 19B below.
  • FIG. 19 on the other hand, when a plurality of, for example, circular silk patterns 7 are formed at intervals in the Y direction as shown in FIG. The distance from the edge of the silk pattern 7 is reduced. That is, in FIG. 19, the force to support the surface of the silk pattern 7 is stronger than in FIG. For this reason, as shown in the cross-sectional view of FIG. 19B, when the resin material is scraped off with a squeegee, for example, when the belt-like silk pattern 7 is printed, the concave portion 7d is not formed at the center of the silk pattern 7.
  • the thickness of the silk pattern 7 in the X direction is substantially uniform over the wide range. That is, in this embodiment, when the standing substrate 2 is inserted into the slit 10 of the main substrate 1 and the silk pattern 7 is disposed in the slit 10, the inner wall surface of the slit 10 and the silk pattern 7 are fitted together.
  • the accuracy of the tolerance can be increased as compared with the first embodiment. That is, in the present embodiment, the thickness of the silk pattern 7 can be controlled with higher accuracy than in the first embodiment.
  • the amount of the silk pattern 7 applied is smaller than when a continuous belt-like silk pattern 7 is formed. For this reason, the insertion pressure when inserting the standing substrate 2 on which the silk pattern 7 is formed into the slit 10 of the main substrate 1 can be reduced.
  • FIGS. 20A and 20B show a modification of FIG. 17, and both correspond to FIG. 3 in Embodiment 1 as in FIG. Referring to FIGS. 20A and 20B, these are basically the same as those in FIG. 17, and the description thereof will not be repeated.
  • the silk pattern 7 is exposed at a position different from the position where the standing substrate electrode 4 is exposed in the Y direction, that is, the plurality of standing substrate electrodes 4 are exposed at intervals from each other in the Y direction. It is arranged at a position sandwiched between areas to be. Accordingly, the exposed standing substrate electrodes 4 and silk patterns 7 are alternately arranged in the Y direction.
  • FIGS. 20A and 20B are structurally different from FIG. 17 in which the silk pattern 7 is arranged in the same position as the position where the substrate electrode 4 is exposed in the Y direction.
  • the silk pattern 7 may have a rectangular planar shape as shown in FIG. 20A, but the silk pattern 7 may have a circular or elliptical planar shape as shown in FIG. 20B. .
  • FIG. 21 is a schematic plan view of a region XXI surrounded by a dotted line in FIG. 20A when viewed from the same direction as FIG. 2, that is, from the lower side in the Z direction.
  • the silk pattern 7 is disposed between the exposed portions of the standing substrate electrodes 4 adjacent to each other in the Y direction as shown in FIG. 20, so that the standing substrate electrodes 4 in the Y direction as shown in FIG.
  • the area of the exposed portion of the standing substrate electrode 4 can be increased. For this reason, the quantity of the solder which forms the solder fillet 5 can be increased.
  • the value obtained by subtracting the sum of the thicknesses of the standing substrate electrodes 4 on the surface 2a side and the surface 2b side is preferably 0.5 mm or less.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

La présente invention concerne une structure de connexion de cartes de circuit imprimé (PCB) (100) comportant une première PCB (1) et une seconde PCB (2). La première PCB (1) possède une partie trou (10) s'étendant d'une première surface (1a) à l'autre première surface (1b). La seconde PCB (2) dispose d'une seconde surface (2a) ainsi qu'une l'autre seconde surface (2b), et est introduite dans la partie trou (10). La partie trou (10) s'étend dans une direction le long de la première surface (1a) et de l'autre première surface (1b). Une première électrode (3) de la première PCB (1) et une seconde électrode (4) de la seconde PCB (2) sont électriquement connectées l'une à l'autre par un cordon de brasure (5). Des éléments isolants (6, 7) sont disposés sur la seconde surface (2a) ainsi que sur l'autre seconde surface (2b) de la seconde PCB (2). Au moins une partie des éléments isolants (6, 7) est située dans la partie trou (10).
PCT/JP2017/019857 2016-06-08 2017-05-29 Structure de connexion de cartes de circuit imprimé Ceased WO2017212964A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201780031079.6A CN109196961B (zh) 2016-06-08 2017-05-29 印刷基板的连接结构
JP2018522425A JP6659839B2 (ja) 2016-06-08 2017-05-29 プリント基板の接続構造

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-114146 2016-06-08
JP2016114146 2016-06-08

Publications (1)

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WO2017212964A1 true WO2017212964A1 (fr) 2017-12-14

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PCT/JP2017/019857 Ceased WO2017212964A1 (fr) 2016-06-08 2017-05-29 Structure de connexion de cartes de circuit imprimé

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JP (1) JP6659839B2 (fr)
CN (1) CN109196961B (fr)
WO (1) WO2017212964A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6573063B1 (ja) * 2018-07-26 2019-09-11 三菱電機株式会社 プリント回路板
US12442701B2 (en) 2020-03-04 2025-10-14 Brp Megatech Industries Inc. Structural locating sensors for a sensor module using a printed circuit board assembly

Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
DE102021119551A1 (de) 2021-07-28 2023-02-02 Tridonic Gmbh & Co Kg Leiterplatte umfassend Öffnung zum Anordnen einer weiteren Leiterplatte auf der Leiterplatte

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JPS59149082A (ja) * 1983-02-15 1984-08-25 松下電器産業株式会社 厚膜ハイブリツド集積回路基板
JPS59172288A (ja) * 1983-03-18 1984-09-28 松下電器産業株式会社 プリント基板装置
JPS59177986U (ja) * 1983-05-17 1984-11-28 日本ビクター株式会社 サブプリント基板のプリント基板への取付構造
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JPS5873358A (ja) * 1981-10-28 1983-05-02 坂井　修一 発熱針
JPS59217391A (ja) * 1983-05-26 1984-12-07 松下電器産業株式会社 プリント基板装置
JPS6273792A (ja) * 1985-09-27 1987-04-04 山水電気株式会社 プリント配線基板の結合装置
JPH066530Y2 (ja) * 1988-09-30 1994-02-16 株式会社富士通ゼネラル プリント配線板
WO2017002720A1 (fr) * 2015-06-29 2017-01-05 三菱電機株式会社 Dispositif électronique

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6573063B1 (ja) * 2018-07-26 2019-09-11 三菱電機株式会社 プリント回路板
US12442701B2 (en) 2020-03-04 2025-10-14 Brp Megatech Industries Inc. Structural locating sensors for a sensor module using a printed circuit board assembly

Also Published As

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JP6659839B2 (ja) 2020-03-04
CN109196961A (zh) 2019-01-11
JPWO2017212964A1 (ja) 2019-01-17
CN109196961B (zh) 2021-03-16

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