WO2017212964A1 - Printed circuit board connection structure - Google Patents

Abstract

A printed circuit board connection structure (100) is provided with a first printed circuit board (1) and a second printed circuit board (2). The first printed circuit board (1) has a hole portion (10) extending from one first surface (1a) to the other first surface (1b). The second printed circuit board (2) has one second surface (2a) and the other second surface (2b), and is inserted in the hole portion (10). The hole portion (10) extends in one direction along the one first surface (1a) and the other first surface (1b). A first electrode (3) of the first printed circuit board (1) and a second electrode (4) of the second printed circuit board (2) are electrically connected to each other by a solder fillet (5). Insulating members (6, 7) are provided on each of the one second surface (2a) and the other second surface (2b) of the second printed circuit board (2). At least a part of the insulating members (6, 7) is provided in the hole portion (10).

Description

PCB connection structure

The present invention relates to a printed circuit board connection structure, and in particular, the second printed circuit board is inserted vertically with respect to the first printed circuit board provided with a hole, and both electrodes are electrically connected to each other by a solder fillet. The present invention relates to a connection structure for a three-dimensional printed circuit board.

Examples of the connection structure between the first printed circuit board and the second printed circuit board fixed substantially perpendicular to the first printed circuit board include those disclosed in JP 2010-258190 A (Patent Document 1). In the connection body disclosed in Japanese Patent Application Laid-Open No. 2010-258190, a slit as a hole is provided in the first printed circuit board, and the second printed circuit board is inserted into the slit, and both electrodes are electrically connected by soldering. It is connected to the.

JP 2010-258190 A

Due to the problem of substrate processing accuracy, there is always a fit tolerance between the slit width and the thickness of the second printed circuit board. Due to this fitting tolerance, a gap is generated between the inner wall surface of the slit and the surface of the second printed circuit board during soldering. Due to this gap, the second printed circuit board may not be arranged at the center in the width direction of the slit during soldering, but may be arranged so as to be closer to one side in the width direction. In this case, the size of the solder fillet for fixing the two printed circuit boards is greatly different between one surface side of the second printed circuit board and the other surface side opposite to the second printed circuit board. As a result, stress due to thermal strain concentrates on the smaller solder fillet on one or the other surface side of the second printed circuit board, which may cause cracks in the solder fillet. However, JP 2010-258190 A does not consider this problem at all.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a printed circuit board connection structure having a structure in which a substrate inserted into a hole portion is joined without approaching one side in the width direction of the hole portion. Is to provide.

The printed circuit board connection structure of the present invention includes a first printed circuit board and a second printed circuit board. The first printed circuit board has one and the other first surface, and a hole reaching from the one first surface to the other first surface is formed. The second printed circuit board has one and other second surfaces and is inserted into the hole. The hole extends along one direction on one and the other first surfaces. The first electrode of the first printed circuit board and the second electrode of the second printed circuit board are electrically connected by a solder fillet. An insulating member is disposed on one and the other second surfaces of the second printed circuit board. At least a part of the insulating member is disposed in the hole.

According to the present invention, the insulating members on both surfaces of the second printed circuit board are disposed in the hole. For this reason, compared with the case where there is no insulating member, the difference in the distance between the inner wall surface of the hole and the insulating member surface between the second surface side of the second printed circuit board and the other second surface side is reduced. can do. In other words, the second printed circuit board inserted into the hole is joined without depending on one side in the width direction of the hole, and stress concentration due to thermal strain on the solder fillet can be suppressed.

1 is a schematic perspective view of a printed circuit board connection structure according to the present invention. It is a schematic plan view which shows the structure of the 1st printed circuit board which concerns on this invention. FIG. 3 is a schematic plan view showing a configuration of a second printed circuit board in Embodiment 1 and a positional relationship with the first printed circuit board connected to the second printed circuit board. FIG. 4 is a schematic enlarged plan view of the second printed circuit board of FIG. 3, clearly showing the range of support portions included in the second printed circuit board of FIG. 3. FIG. 2 is a schematic cross-sectional view of the printed circuit board connection structure according to the first embodiment, taken along line AA in FIG. It is a schematic sectional drawing of the part which follows the AA line of FIG. 1 of the connection structure of the printed circuit board in a comparative example. It is a schematic perspective view which shows the motion of the system of the printed circuit board in the process of forming a solder fillet. FIG. 8 is a schematic cross-sectional view illustrating a molten solder supply mode at the time of charging into the molten solder tank illustrated in FIG. 7 when the second printed circuit board is disposed in the center portion in the width direction of the slit in the first embodiment. It is a schematic sectional drawing which shows the dimension of each member especially in the inside of the slit 10 in FIG. It is a schematic sectional drawing which shows the aspect connected with the 2nd printed circuit board in a comparative example in the state inclined with respect to the 1st printed circuit board. It is a schematic sectional drawing which shows the aspect connected with the 2nd printed circuit board in Embodiment 1 in the state inclined with respect to the 1st printed circuit board. FIG. 6 is a schematic cross-sectional view of a portion along the line AA in FIG. 1 of a first modification example different from FIG. FIG. 6 is a schematic cross-sectional view of a portion along the line AA in FIG. 1 of a second modification example different from FIG. 5 of the printed circuit board connection structure in the first embodiment. FIG. 6 is a schematic cross-sectional view of a portion taken along line AA of FIG. 1 in the printed circuit board connection structure in the second embodiment. FIG. 10 is a schematic plan view showing a configuration of a second printed circuit board in Embodiment 2 and a positional relationship with the first printed circuit board connected to the second printed circuit board. FIG. 10 is a schematic cross-sectional view of the printed circuit board connection structure according to the third embodiment taken along line AA in FIG. FIG. 10 is a schematic plan view showing a configuration of a second printed circuit board in a first example of Embodiment 3 and a positional relationship with the first printed circuit board connected to the second printed circuit board. FIG. 19 is a schematic plan view (A) of the second printed circuit board in Embodiment 1, and a schematic cross-sectional view (B) of a portion along the line XVIIIB-XVIIIB in FIG. 18 (A). FIG. 20 is a schematic plan view (A) of a second printed circuit board according to Embodiment 3, and a schematic cross-sectional view (B) of a portion along line XIXB-XIXB in FIG. 19 (A). Schematic plan view (A) showing the configuration of the second printed circuit board in the second example of the third embodiment and the positional relationship with the first printed circuit board connected to the second printed circuit board, and the third embodiment of the third embodiment It is a schematic plan view (B) which shows the structure of the 2nd printed circuit board in an example, and the positional relationship with the 1st printed circuit board connected to this. It is the schematic plan view which looked at the area | region XXI enclosed with the dotted line of FIG. 20 (A) from the Z direction lower side.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Embodiment 1 FIG.
FIG. 1 is a perspective view schematically showing a connection structure of a three-dimensional printed circuit board according to the present embodiment. For convenience of explanation, an X direction, a Y direction, and a Z direction are introduced. FIG. 2 is a schematic plan view of the first printed circuit board constituting the printed circuit board connection structure of FIG. 1 as viewed from the lower side in the Z direction in FIG. 3 and 4 are schematic plan views of the second printed circuit board constituting the printed circuit board connection structure of FIG. 1 as viewed from the left side in the X direction, that is, from the back side. 5 and 9 are schematic cross-sectional views of the portion along the line AA in FIG. 1 in the present embodiment.

Referring to FIGS. 1 to 3, the printed circuit board connection structure of the present embodiment includes a main board 1 as a first printed board and a standing board 2 as a second printed board. .

The main board 1 is a flat printed board having, for example, a rectangular shape in plan view, and has one rectangular first surface 1a and the other first surface 1b. Here, one of the first surfaces 1a is one of the main surfaces, which is a main surface that does not include the dimension in the thickness direction when the main substrate 1 is viewed in plan. The other first surface 1b is a main surface opposite to the first surface 1a. That is, for example, if one first surface 1a faces downward in the Z direction, the other first surface 1b faces upward in the Z direction, which is the opposite side. The main substrate 1 is formed with a slit 10 as a hole penetrating from the first surface 1a so as to reach the other first surface 1b.

For example, as shown in FIG. 2, the slit 10 includes a slit 10 a, a slit 10 b, and a slit 10 c that are spaced apart from each other in the direction along the long side when the main substrate 1 is viewed in plan, that is, the Y direction. May be. The slits 10a, 10b, and 10c are arranged in this order with respect to the Y direction. Each of the slits 10a, 10b, 10c has a rectangular shape in plan view, and has a shape in which a part of the standing substrate 2 can be inserted. The slits 10a, 10b, and 10c all extend along one direction on the first surface 1a and the other first surface 1b. In FIG. 2, all of the slits 10a, 10b, and 10c extend along the Y direction, and the central slit 10b in the Y direction extends the longest. However, it is not limited to such a mode.

The standing board 2 is a flat printed board and has one second surface 2a and the other second surface 2b. Here, one of the second surfaces 2a is one of the main surfaces that are the main surfaces not including the dimension in the thickness direction when the standing substrate 2 is viewed in plan. The other second surface 2b is a main surface opposite to the one second surface 2a. A partial region of the standing substrate 2 is formed as a support portion 11.

Referring to FIGS. 3 and 4, for example, as shown in FIG. 3, the support portion 11 is a region adjacent to the lower end surface in the Z direction extending along the Y direction which is the longitudinal direction thereof. In other words, in the state of FIG. 1 in which the standing substrate 2 is inserted into the slit 10 of the main substrate 1, the support portion 11 is on the one first surface 1 a side, that is, in the Z direction lower than the other first surface 1 b of the main substrate 1. This is a portion of the standing substrate 2 located on the side. The standing substrate 2 may include support portions 11a, 11b, and 11c formed at intervals in the support portion 11 with respect to the Y direction. The support portions 11a, 11b, and 11c are arranged in this order in the Y direction. In the region between the support portion 11a and the support portion 11b and the region between the support portion 11b and the support portion 11c, the notch 12 of the standing substrate 2 is provided. Therefore, the standing substrate 2 has a rectangular shape in plan view if the notch 12 is temporarily filled. In particular, as shown in FIG. 4, the support portion 11 means a region having the same position coordinates in the Z direction as the region where the notch 12 is formed.

The support portion 11a can be inserted into the slit 10a, the support portion 11b can be inserted into the slit 10b, and the support portion 11c can be inserted into the slit 10c. Thereby, a part of the standing substrate 2 is inserted into the slit 10. Accordingly, in FIG. 3, the support portions 11a, 11b, and 11c all extend along the Y direction, and the central support portion 11b in the Y direction extends the longest. However, it is not limited to such a mode. The support portion 11 extending in the Z direction passes through the slit 10 of the main substrate 1. As a result, for example, a three-dimensional printed circuit board connection structure in which the main substrate 1 and the standing substrate 2 intersect is formed such that one first surface 1a and one second surface 2a are substantially orthogonal to each other. The

Referring to FIG. 2 again, on one first surface 1 a of main substrate 1, main substrate electrode 3 as a first electrode is formed in a region adjacent to slit 10. Referring again to FIG. 3, on one first surface 2 a of the standing substrate 2, the standing substrate electrode 4 as the second electrode is provided in a region adjacent to the slit 10 when it is inserted into the slit 10. Is formed.

In the state where the standing substrate 2 is inserted into the slit 10, the other first surface 1b of the main substrate 1 indicated by a dotted line in FIG. 3 and the standing substrate electrode 4 are formed below the first surface 1a. Yes. That is, the standing substrate electrode 4 is formed on the support portion 11 of the standing substrate 2. When the standing substrate electrode 4 is inserted into the slit 10, in FIG. 2, only a region of the three slits 10 that is adjacent to the slit 10 b in plan view is spaced apart in the Y direction by a plurality of main substrate electrodes 3. However, the present invention is not limited to this, and the main substrate electrode 3 may be similarly formed in a region adjacent to the slits 10a and 10c in plan view. Further, in FIG. 3, a plurality of standing substrate electrodes 4 are formed at intervals in the Y direction only on the support portion 11b among the three support portions 11, but not limited thereto, the support portions 11a and 11c are also provided. Similarly, the standing substrate electrode 4 may be formed. Although not shown in FIG. 3, the standing substrate electrode 4 is formed on the other second surface 2 b of the standing substrate 2 in the same manner as on the second surface 2 a.

Referring to FIG. 5, in printed circuit board connection structure 100 according to the present embodiment, main substrate electrode 3 on one first surface 1 a of main substrate 1, and particularly on the lower side in the Z direction than main substrate 1. A standing substrate electrode 4 on one second surface 2 a and the other second surface 2 b of the standing substrate 2 to be disposed is connected by a solder fillet 5. With this solder fillet 5, the main board electrode 3 and the standing board electrode 4 are electrically connected, and the main board 1 and the standing board 2 are mechanically connected. That is, the solder fillet 5 is formed on both the second surface 2a of the standing substrate 2 and the other second surface 2b.

Referring to FIG. 2, FIG. 3, and FIG. 5, in printed circuit board connection structure 100 of the present embodiment, resist film 6 is formed so as to cover main substrate electrode 3 on one first surface 1a. ing. Further, a resist film 6 is formed so as to cover the standing substrate electrode 4 on one second surface 2a and the other second surface 2b. The resist film 6 may be formed as a pattern only in a region adjacent to the slit 10, but is connected by a solder fillet 5 out of the first surface 1a, the second surface 2a, and the second surface 2b. For this purpose, the main substrate electrode 3 and the standing substrate electrode 4 may be formed so as to cover almost the entire surface except the exposed region. That is, the resist film 6 is formed on the main substrate electrode 3 and the standing substrate electrode 4 that electrically connect the elements formed on the main substrate 1 and the standing substrate 2 from the viewpoint of not exposing them except in a desired region. Insulating film. Hereinafter, a region where the main substrate electrode 3 and the standing substrate electrode 4 are exposed without being covered with an insulating member such as the resist film 6 is defined as a region where the main substrate electrode 3 and the standing substrate electrode 4 are formed.

Referring to FIGS. 3 and 5 again, a partial region on one second surface 2a and the other second surface 2b of standing substrate 2 is mainly composed of, for example, an acrylic resin or an epoxy resin. A silk pattern 7 made of an insulating material is formed. The silk pattern 7 is formed so as to cover at least part of the surface of the resist film 6 formed so as to cover the standing substrate electrode 4. Specifically, the silk pattern 7 is formed so as to cover the lowermost region in the Z direction of the resist film 6 of the standing substrate 2. That is, the silk pattern 7 is formed so as to overlap the resist film 6, and the portion where the silk pattern 7 and the resist film 6 overlap is disposed as an insulating member.

At least a part of this insulating member is disposed in the slit 10. In other words, in FIG. 5, the lower half of the insulating member where the silk pattern 7 and the resist film 6 overlap is disposed in the slit 10. The end surface on the first surface 1a side of the insulating member is disposed in the slit 10. That is, in FIG. 5, the lower end surface 6e that is one end surface on the first surface 1a side of the resist film 6, that is, the lower end surface in the Z direction, and the lower end surface 7e that is the end surface on one first surface 1a side of the silk pattern 7 are In the slit 10, it is arranged in a region near the middle between one first surface 1a and the other first surface 1b. Referring to FIG. 3 again, the silk pattern 7 has a strip shape extending linearly along the Y direction, which is one direction in which the slit 10 extends. In FIG. 3, only one silk pattern 7 is arranged in the Z direction, but two or more silk patterns 7 may be arranged at intervals in the Z direction.

Here, the resist film 6 and the silk pattern 7 as insulating members on the standing substrate 2 are basically formed by a generally known method. Specifically, the material constituting the standing substrate 2 is cut into a flat plate shape, and a copper foil, for example, is formed on one second surface 2a and the other second surface 2b by a generally known photolithography technique and etching technique. Pattern is formed. A resist solution is applied on the copper foil pattern, and the resist solution is partially formed as a resist film 6 which is a resist pattern by photolithography. Next, a silk pattern 7 is formed on the surface of the resist film 6 by silk printing. The method for forming the resist film 6 on the main substrate 1 is basically the same as described above, and detailed description thereof is omitted.

Next, the operational effects of the present embodiment will be described while describing a comparative example of the present embodiment.

With reference to FIG. 6, in the printed circuit board connection structure 900 of the comparative example, due to the problem of the processing accuracy of the substrate, the X-direction width of the slit 10 and the support portion 11 of the standing substrate 2 are always fitted. Tolerances are provided. That is, a gap is formed between the inner wall surface of the slit 10 and the surface of the standing substrate 2 (including the surface of the standing substrate electrode 4). In this case, when the support portion 11 is inserted into the slit 10, the support portion 11 of the standing substrate 2 may not be disposed at the center portion in the X direction of the slit 10 but may be disposed so as to be closer to one side in the X direction. For example, in FIG. 6, the standing substrate 2 is disposed so as to be closer to the right side than the central portion in the X direction of the slit 10.

If the main board 1 and the standing board 2 are connected by the solder fillet 5 in a state where the standing board 2 is shifted to one side as shown in FIG. 6, the solder fillet 5 after the connection is formed on one second surface 2a of the standing board 2 There is a possibility that the size and the shape are greatly different between the side and the second surface 2b side. This will be described with reference to FIG.

Referring to FIG. 7, in the process of forming solder fillet 5, in a state where support portion 11 of substrate 2 is inserted in slit 10 of main substrate 1, for example, the long side direction of each substrate, that is, the Y direction It is thrown into the molten solder bath while moving in the direction along Accordingly, by movement of each substrate along the Y direction, molten solder is supplied onto the main substrate electrode 3 and the standing substrate electrode 4 from the first surface 1a side, which is the lower side of the main substrate 1, and the main substrate electrode A solder fillet 5 is formed so as to connect 3 and the standing substrate electrode 4. By arranging the standing substrate electrode 4 below the support portion 11, that is, one of the first surfaces 1a, the solder fillet 5 that connects the standing substrate electrode 4 and the main substrate electrode 3 can be formed more easily.

At this time, when the standing substrate 2 is close to one side as shown in FIG. 6 and the whole is not line symmetric, when the entire system is put into the molten solder bath as shown in FIG. The molten solder supply mode is physically different between the second surface 2a side and the other second surface 2b side. For this reason, in this case, the size and shape of the solder fillet 5 on one second surface 2a side and the other second surface 2b side are greatly different. Thus, if the size of the solder fillet 5 becomes uneven, the stress due to thermal strain concentrates on the smaller one of the second surface 2a side and the other second surface 2b side, and the solder fillet 5 There is a risk that cracks may be formed.

In the first place, manufacturing variations between the main board 1 and the standing board 2 can be considered as a cause of the standing board 2 moving to one side as shown in FIG. That is, when the fitting tolerance, that is, the gap between the slit 10 and the standing substrate 2 becomes very large due to manufacturing variations, the distance between the main substrate electrode 3 and the standing substrate electrode 4 becomes very large. As a result, the solder fillet 5 that connects the main substrate electrode 3 and the standing substrate electrode 4 may not be formed. On the other hand, when the fitting tolerance, that is, the gap becomes zero or a negative value (the thickness of the standing substrate is larger than the width of the slit) due to manufacturing variations, the support portion 11 is placed in the slit 10. It cannot be inserted, and the inner wall surface of the slit 10 needs to be shaved.

Referring to FIG. 8, the distance between the uppermost surface on the second surface 2 a side of the standing substrate 2 and the inner wall surface of the slit 10, the uppermost surface on the other second surface 2 b side, and the inner wall surface of the slit 10. If the distance between the two is substantially equal, the entire system illustrated with the standing substrate 2 as the axis C is line-symmetric. At this time, the supply mode of the molten solder 50 to the one second surface 2a side and the supply mode of the molten solder 50 to the other second surface 2b side indicated by an arrow F in the drawing are physically equivalent. For this reason, the size and shape of the solder fillet 5 due to solidification of the molten solder 50 are substantially equal on the second surface 2a side and the second surface 2b side. Accordingly, the stress caused by thermal strain applied to the solder fillet 5 on one second surface 2a side and the solder fillet 5 on the other second surface 2b side can be evenly distributed, and the occurrence of cracks in the solder fillet 5 is suppressed. can do.

In order to set the standing substrate 2 in line symmetry with respect to the slit 10, as shown in FIG. 8, a resist film 6 as an insulating member is formed on one second surface 2a and the other second surface 2b of the standing substrate 2. The silk pattern 7 is disposed, and at least a part of the silk pattern 7 is disposed in the slit 10. More specifically, the end surface on the first surface 1 a side of the insulating member is disposed in the slit 10. Thereby, for example, even when the width of the slit 10 is larger than the width of the standing substrate 2 due to manufacturing variations, both the one of the second surface 2a side and the other second surface 2b side are within the standing substrate electrode 4 and the slit 10. The distance from the wall surface can be secured at least by the thickness of the insulating member.

For this reason, for example, compared to the case where the resist film 6 and the silk pattern 7 are not provided, the inner wall surface of the slit 10 on the second surface 2a side and the second surface 2b side of the standing substrate 2 is provided. And the difference in distance between the insulating member and the insulating member can be reduced. Therefore, it can suppress that the support part 11 moves to the one side extremely in the slit 10, and it can be set as the aspect close | similar to the state by which the board | substrate 2 is arrange | positioned in the center part shown in FIG. On the other hand, even when the width of the slit 10 is substantially equal to the width of the standing substrate 2 or smaller than the width of the standing substrate 2, for example, the slit 10 Since the silk pattern 7 can be inserted while cutting at the edge portion, the substrate 2 can be inserted into the slit 10 without cutting the slit 10. Since the shavings of the silk pattern 7 generated at this time are nonconductive, the yield of the printed circuit board connection structure 100 is not lowered even if the shavings are scattered.

FIG. 9 shows the dimensions of each part where the substrate 2 is inserted in the slit 10. Referring to FIG. 9, the width in the X direction of slit 10 in FIG. 1 is W, and the thickness of standing substrate 2, that is, the dimension of standing substrate 2 in the X direction in FIG. Here, the thickness t of the standing substrate 2 includes the thickness of the standing substrate electrode 4 formed on one second surface 2a and the other second surface 2b. The distance between the surface of the standing substrate electrode 4 on one second surface 2a and the inner wall surface of the slit 10 is d1, and the distance between the surface of the standing substrate electrode 4 on the other second surface 2b and the inner wall surface of the slit 10 is. Is d2. The thickness of the resist film 6 on one second surface 2a and the other second surface 2b is t1, and the thickness of the silk pattern 7 is t2.

At this time, the sum of the values of d1 and d2 is preferably 0 mm or more and 0.5 mm or less, and the difference between d1 and d2 is preferably as small as possible (more preferably zero). Further, the sum of the values of t1 and t2 on both surfaces of the standing substrate 2 is preferably 0 mm or more and 0.5 mm or less in the finished product, but before the excessive thickness of the silk pattern 7 is cut as described above, for example. In this case, the sum may be more than 0.5 mm and less than 0.7 mm. Here, the sum of the values of t1 and t2 is shown in consideration of the case where only one of the resist film 6 and the silk pattern 7 is formed, as will be described later.

Next, FIG. 10 and FIG. 11 are not connected so that the standing board 2 is substantially perpendicular to the main board 1 in each of the comparative example and the present embodiment, and is connected in a state where the standing board 2 is inclined. FIG. Referring to FIG. 10, when the resist film 6 and the silk pattern 7 as the insulating members are not arranged inside the slit 10 as in the printed circuit board connection structure 901 of the comparative example, the width of the slit 10 stands up to the thickness of the substrate 2. If it becomes very large compared to the above, there is a possibility that the standing substrate 2 is greatly inclined with respect to the direction perpendicular to the main substrate 1. However, referring to FIG. 11, if the resist film 6 and the silk pattern 7 as insulating members are arranged inside the slit 10 as in the printed circuit board connection structure 101 of the present embodiment, the standing substrate 2 is inclined. Sometimes an insulating member such as the silk pattern 7 immediately contacts the inner wall surface of the slit 10. Therefore, the tilt of the standing substrate 2 can be suppressed as compared with the case of FIG. If the inclination of the standing substrate 2 is suppressed, the difference in size and shape of the solder fillet 5 between the one second surface 2a side and the other second surface 2b side of the standing substrate 2 can be reduced. Stress concentration due to strain can be suppressed.

As shown in FIGS. 5 and 8, the insulating member may have a structure in which both a resist film 6 and a silk pattern 7 covering at least part of the surface of the resist film 6 are laminated. However, referring to FIG. 12, in printed circuit board connection structure 102 of the present exemplary embodiment, the insulating member may be composed of only resist film 6. Alternatively, referring to FIG. 13, in printed circuit board connection structure 103 according to the present exemplary embodiment, the insulating member may be formed only of silk pattern 7. That is, the insulating member only needs to be constituted by at least one of the resist film 6 and the silk pattern 7.

The insulating member provides a thickness for securing a distance between the standing substrate electrode 4 and the inner wall surface of the slit 10 and suppressing uneven distribution of the standing substrate 2. Therefore, for example, as long as the sum of the thickness t1 and the thickness t2 shown in FIG. 9 is a sufficiently large value, even if only one of the resist film 6 and the silk pattern 7 or another insulating material, The effect of this Embodiment can be show | played. The other insulating material is, for example, a functional treatment film such as a coating agent for moisture-proof treatment mainly composed of acrylic resin, urethane resin, polyurethane resin, polyolefin resin or the like. Alternatively, the other insulating material may be an insulating tape mainly composed of polyimide resin or polyethylene resin. Therefore, in any of the configurations of FIGS. 12 and 13, the solder fillets 5 can be evenly formed on both sides of the standing substrate 2 as in the configuration of FIG. 5.

However, even if a laminated structure of the resist film 6 and the silk pattern 7 is used as the insulating member as shown in FIG. 5, the resist film 6 and the silk pattern 7 formed in other areas in the region other than the slit 10 are used simultaneously. Since the resist film 6 and the silk pattern 7 can be formed, it is not necessary to provide a separate step of forming an insulating member, and the configuration of FIG. 5 can be easily formed. The resist film 6 and the silk pattern 7 may be applied or printed in double or multiple (three or more layers) in order to ensure the thickness.

In addition, when the silk pattern 7 is formed in a strip shape extending linearly along the Y direction in which the slit 10 extends, as in the present embodiment, when the standing substrate 2 is fitted to the main substrate 1, the inside of the slit 10 The amount of the silk pattern 7 that is visible and hidden can be easily measured by appearance inspection or sensory inspection. Thereby, it is possible to easily determine whether the main substrate 1 is warped or whether the standing substrate 2 is lifted upward with respect to the main substrate 1 in the Z direction.

In the above description, the silk pattern 7 is formed as a single band-shaped pattern extending in the Y direction. However, this may be formed as two or more band-shaped patterns formed at intervals with respect to the Z direction, for example. . When the thickness of the main substrate 1 is large and the dimension of the slit 10 in the Z direction is large, or when the silk pattern 7 can be printed more finely, the silk pattern as two or more patterns is thus obtained. 7 may be formed.

Furthermore, in the present embodiment, it is more preferable to adjust the width of the silk pattern 7 and, in some cases, the pattern of the resist film 6. Thereby, in the supply process of the molten solder 50 shown in FIG. 8, the amount of the molten solder 50 supplied to the region between the support portion 11 of the standing board 2 and the slit 10 of the main board 1 can be secured constant. The strength of the joint portion between the main board electrode 3 and the standing board electrode 4 by the solder fillet 5 can be controlled to an arbitrary value. Similarly, since the amount of solder forming the solder fillet 5 can be controlled to be constant, the solder between the plurality of main board electrodes 3 adjacent to each other and the plurality of standing board electrodes 4 in the Y direction. The occurrence of bridging can be suppressed.

Embodiment 2. FIG.
FIG. 14 corresponds to FIG. 5 in the first embodiment, and FIG. 15 corresponds to FIG. 3 in the first embodiment. Referring to FIG. 14 and FIG. 15, printed circuit board connection structure 200 of the present embodiment basically has the same configuration as printed circuit board connection structure 100 of the first embodiment, and therefore the same components Are denoted by the same reference numerals, and the description thereof will not be repeated as long as the functions and effects are the same. Similar to the printed circuit board connection structure 100, the printed circuit board connection structure 200 of the present embodiment includes a resist film 6 and a silk pattern 7 as insulating members.

However, in the present embodiment, the end surface of the insulating member on the first surface 1a side is disposed at a position overlapping the first surface 1a of the slit 10. In other words, the lower end surface 6e of the resist film 6 and the lower end surface 7e of the silk pattern 7 are substantially equal in position to one first surface 1a of the main substrate 1 with respect to the Z direction, that is, one first surface 1a and the pliant. It is arranged so that. That is, in the present embodiment, the resist film 6 and the silk pattern 7 are disposed in the entire region in the Z direction inside the slit 10. Even in this case, in the state where the standing substrate 2 is inserted into the slit 10, the other first surface 1b of the main substrate 1 indicated by the dotted line in FIG. 3 and the standing substrate below the first surface 1a. An electrode 4 is formed. In this respect, the present embodiment is different from the first embodiment in which the lower end surface 6e and the lower end surface 7e are arranged in a region near the middle between one first surface 1a and the other first surface 1b in the slit 10. ing.

Next, the function and effect of this embodiment will be described. In addition to the same functions and effects as those of the first embodiment, the present embodiment has the following functions and effects.

In the present embodiment, since the lower end surface 6e and the lower end surface 7e are arranged at the lowermost part of the slit 10 that overlaps the first surface 1a, the standing substrate electrode 4 and the main array electrode 4 that are arranged at intervals from each other in the Y direction. Even when the substrate electrodes 3 have a narrow pitch, the standing substrate electrodes 4 can be formed without forming a solder bridge between the pair of adjacent standing substrate electrodes 4 and the pair of main substrate electrodes 3 adjacent to each other. And the main substrate electrode 3 can be joined by the solder fillet 5. Also, even if a solder bridge is formed, the solder fillet 5 is not inside the slit 10 and the solder bridge is highly visible, so the presence or absence of the solder bridge can be easily determined visually. . Further, according to the present embodiment, for example, by visually confirming that the lower end surface 7e of the silk pattern 7 protrudes below the slit 10 in the Z direction, it is easily determined whether the main substrate 1 is warped. be able to.

Embodiment 3 FIG.
16 corresponds to FIG. 5 in the first embodiment, and FIG. 17 corresponds to FIG. 3 in the first embodiment. Referring to FIGS. 16 and 17, printed circuit board connection structure 300 of the present embodiment basically has the same configuration as printed circuit board connection structures 100 and 200 of the first and second embodiments. The same constituent elements are denoted by the same reference numerals, and the description thereof will not be repeated as long as the functions and effects are the same. Similar to the printed circuit board connection structures 100 and 200, the printed circuit board connection structure 300 of this embodiment includes a resist film 6 and a silk pattern 7 as insulating members.

However, in the present embodiment, a plurality of silk patterns 7 are arranged at intervals along the Y direction, which is one direction of the slit 10. Specifically, the silk pattern 7 has a circular shape in a plan view shown in FIG. 17, for example, and a plurality of the silk patterns 7 are arranged at intervals. The resist film 6 is superimposed on the lower layer of the silk pattern 7 in the same manner as in the other embodiments, and the lower layer is exposed at the lowermost portion in the Z direction of the standing substrate 2 as in the other embodiments. A standing substrate electrode 4 is formed. A plurality of silk patterns 7 are arranged to have a circular shape at the same position as the position where the standing substrate electrode 4 is exposed in the Y direction, generally above the position where the standing substrate electrode 4 is exposed in the Z direction. In this respect, the present embodiment is structurally different from the first and second embodiments in which the silk pattern 7 has a strip shape extending linearly along the Y direction, which is one direction in which the slit 10 extends.

16 and 17, the silk pattern 7 has a position where the uppermost portion in the Z direction overlaps the other first surface 1 b of the main substrate 1, and the lowermost portion in the Z direction is one first surface of the main substrate 1. It is arranged at a position overlapping 1a. That is, in the present embodiment, the silk pattern 7 is arranged in the entire region in the Z direction inside the slit 10. Then, the lower end surface 7e of the silk pattern 7 and the lower end surface 6e of the resist film 6 are arranged at a position overlapping one of the first surfaces 1a of the slit 10 as in the second embodiment. However, the present invention is not limited to such a mode, and also in the present embodiment, as in the first embodiment, for example, the lower end surface 7e of the circular silk pattern 7 has one first surface 1a inside the slit 10 and the other first surface 1a. You may arrange | position in the area | region of intermediate | middle with 1 surface 1b. Further, the silk pattern 7 may be arranged so as to partially protrude beyond the other first surface 1b in the region above the Z direction. Further, the silk pattern 7 is arranged in the same width and the same width as the standing substrate electrode 4 with respect to the Y direction, and is arranged in the same number as the standing substrate electrode 4. Further, a different number from the standing substrate electrode 4 may be arranged at different intervals.

Further, in FIG. 17, the silk pattern 7 has a circular shape in plan view, but is not limited thereto, and may be an arbitrary shape such as a rectangular shape or an elliptical shape. In FIG. 17, only one row of silk patterns 7 is arranged in the Z direction. However, especially when the thickness of the main substrate 1 is large or when the size of the silk pattern 7 in plan view can be printed smaller, two or more rows of silk patterns 7 are spaced apart from each other in the Z direction. Rows may be arranged.

Next, the function and effect of this embodiment will be described. In addition to the same functions and effects as those of Embodiments 1 and 2, the present embodiment has the following functions and effects.

FIG. 18 shows a cross-sectional shape of the belt-like silk pattern 7 formed as in the first embodiment. FIG. 19 shows the cross-sectional shape when the silk pattern 7 divided into a plurality of parts is formed as in the present embodiment.

Referring to FIG. 18, in the case of silk pattern 7 printed in a strip shape as shown in FIG. 18 (A), the dimension in the extending direction, that is, the Y direction is large, and particularly in the central part in the Y direction, the silk in the Y direction. The distance from the edge of the pattern 7 becomes very large, and the force that supports the surface is weaker than near the edge. For this reason, as shown in the cross-sectional view of FIG. 18B, when the resin material is scraped off with a squeegee, for example, at the time of printing the belt-like silk pattern 7, a recess 7d is formed in the center of the silk pattern 7. In FIG. 18B, although the illustration of the standing substrate electrode 4 is omitted from the viewpoint of simplifying the drawing, the resist film 6 is disposed so as to cover the standing substrate electrode 4 as in the other drawings. The same applies to FIG. 19B below.

Referring to FIG. 19, on the other hand, when a plurality of, for example, circular silk patterns 7 are formed at intervals in the Y direction as shown in FIG. The distance from the edge of the silk pattern 7 is reduced. That is, in FIG. 19, the force to support the surface of the silk pattern 7 is stronger than in FIG. For this reason, as shown in the cross-sectional view of FIG. 19B, when the resin material is scraped off with a squeegee, for example, when the belt-like silk pattern 7 is printed, the concave portion 7d is not formed at the center of the silk pattern 7.

Therefore, according to the present embodiment, compared to the first embodiment, the thickness of the silk pattern 7 in the X direction is substantially uniform over the wide range. That is, in this embodiment, when the standing substrate 2 is inserted into the slit 10 of the main substrate 1 and the silk pattern 7 is disposed in the slit 10, the inner wall surface of the slit 10 and the silk pattern 7 are fitted together. The accuracy of the tolerance can be increased as compared with the first embodiment. That is, in the present embodiment, the thickness of the silk pattern 7 can be controlled with higher accuracy than in the first embodiment.

Also, when a plurality of small circular silk patterns 7 are formed as in the present embodiment, the amount of the silk pattern 7 applied is smaller than when a continuous belt-like silk pattern 7 is formed. For this reason, the insertion pressure when inserting the standing substrate 2 on which the silk pattern 7 is formed into the slit 10 of the main substrate 1 can be reduced.

20A and 20B show a modification of FIG. 17, and both correspond to FIG. 3 in Embodiment 1 as in FIG. Referring to FIGS. 20A and 20B, these are basically the same as those in FIG. 17, and the description thereof will not be repeated. However, in FIGS. 20A and 20B, the silk pattern 7 is exposed at a position different from the position where the standing substrate electrode 4 is exposed in the Y direction, that is, the plurality of standing substrate electrodes 4 are exposed at intervals from each other in the Y direction. It is arranged at a position sandwiched between areas to be. Accordingly, the exposed standing substrate electrodes 4 and silk patterns 7 are alternately arranged in the Y direction. In this respect, FIGS. 20A and 20B are structurally different from FIG. 17 in which the silk pattern 7 is arranged in the same position as the position where the substrate electrode 4 is exposed in the Y direction.

The silk pattern 7 may have a rectangular planar shape as shown in FIG. 20A, but the silk pattern 7 may have a circular or elliptical planar shape as shown in FIG. 20B. .

FIG. 21 is a schematic plan view of a region XXI surrounded by a dotted line in FIG. 20A when viewed from the same direction as FIG. 2, that is, from the lower side in the Z direction. Referring to FIG. 21, the silk pattern 7 is disposed between the exposed portions of the standing substrate electrodes 4 adjacent to each other in the Y direction as shown in FIG. 20, so that the standing substrate electrodes 4 in the Y direction as shown in FIG. Compared with the case where the silk pattern 7 is arranged on the upper side in the Z direction at the same position as the exposed portion, the area of the exposed portion of the standing substrate electrode 4 can be increased. For this reason, the quantity of the solder which forms the solder fillet 5 can be increased. Therefore, the strength of the joint portion between the main substrate electrode 3 and the standing substrate electrode 4 by the solder fillet 5 can be increased. Furthermore, referring to FIG. 21, exposed portions of a pair of standing substrate electrodes 4 adjacent to each other in the Y direction are physically separated by silk pattern 7. Thereby, generation | occurrence | production of the solder bridge inside the slit 10 can be suppressed.

In FIG. 21, from the sum of the sum of the thickness of the resist film 6 on the surface 2a side and the surface 2b side of the standing substrate 2 and the sum of the thickness of the silk pattern 7 on the surface 2a side and the surface 2b side, The value obtained by subtracting the sum of the thicknesses of the standing substrate electrodes 4 on the surface 2a side and the surface 2b side is preferably 0.5 mm or less.

The features described in the embodiments described above (each example included in the embodiments) may be applied so as to be appropriately combined within a technically consistent range.

The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

1 main substrate, 1a one first surface, 1b other first surface, 2 standing substrate, 2a one second surface, 2b other second surface, 3 main substrate electrode, 4 standing substrate electrode, 5 solder fillet, 6 resist film, 6e, 7e lower end face, 7 silk pattern, 7d recess, 10, 10a, 10b, 10c slit, 11, 11a, 11b, 11c support part, 12 notch, 50 molten solder, 100, 101, 102, 103, 200, 300, 900, 901 Printed circuit board connection structure.

Claims (7)

A first print having one first surface and the other first surface opposite to the one first surface, wherein a hole reaching the other first surface from the one first surface is formed A substrate,
A second printed circuit board having one second surface and the other second surface opposite to the one second surface, and being inserted into the hole,
The hole extends along one direction on the first surface of the one and the other,
A first electrode disposed in a region adjacent to the hole portion on the one first surface of the first printed circuit board; and the hole portion on the one and other second surfaces of the second printed circuit board. And a second electrode arranged in a region adjacent to is electrically connected by a solder fillet,
An insulating member is disposed on the second surface of the one and the other of the second printed circuit board,
A printed circuit board connection structure, wherein at least a part of the insulating member is disposed in the hole. The second printed circuit board inserted into the hole includes a support portion located on the one first surface side with respect to the other first surface,
The printed circuit board connection structure according to claim 1, wherein the second electrode is disposed on the support portion. 3. The printed circuit board connection structure according to claim 1, wherein the insulating member is formed of at least one of a resist film and a resin material. 4. The printed circuit board connection structure according to claim 3, wherein the resin material extends linearly along the one direction of the hole. 4. The printed circuit board connection structure according to claim 3, wherein a plurality of the resin materials are arranged at intervals along the one direction of the hole. 6. The printed circuit board connection structure according to claim 1, wherein an end surface of the one first surface side of the insulating member is disposed in the hole. The printed circuit board connection according to any one of claims 1 to 5, wherein an end surface on the one first surface side of the insulating member is disposed at a position overlapping the one first surface of the hole. Construction.

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