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WO2017104903A1 - Ensemble électrode permettant une décharge à barrière diélectrique et dispositif de traitement au plasma utilisant ce dernier - Google Patents

Ensemble électrode permettant une décharge à barrière diélectrique et dispositif de traitement au plasma utilisant ce dernier Download PDF

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Publication number
WO2017104903A1
WO2017104903A1 PCT/KR2016/002919 KR2016002919W WO2017104903A1 WO 2017104903 A1 WO2017104903 A1 WO 2017104903A1 KR 2016002919 W KR2016002919 W KR 2016002919W WO 2017104903 A1 WO2017104903 A1 WO 2017104903A1
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Prior art keywords
unit
dielectric barrier
electrode
gas
gas supply
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PCT/KR2016/002919
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English (en)
Inventor
Wonho CHOE
Youbong LIM
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Korea Advanced Institute of Science and Technology KAIST
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Korea Advanced Institute of Science and Technology KAIST
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32348—Dielectric barrier discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2418—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the electrodes being embedded in the dielectric

Definitions

  • the present disclosure relates to an electrode assembly for dielectric barrier discharge and a plasma processing device using the same, and more particularly, to an electrode assembly for dielectric barrier discharge, which may stably supply activated plasma to a treatment target, and a plasma processing device using the same.
  • the high-temperature plasma is a gas composed of electrons, ions and neutral particles, generally generated by arc discharge, and its particles form a high-speed jet flame shape of 1,000 to 20,000°C and 100 to 2,000 m/s.
  • the high-temperature plasma having a large quantity of high-temperature, high-thermal capacity and high-speed activated particles is used in various industrial fields such as various efficient high-temperature heat sources, physical and chemical reactors, cutting pliers or the like.
  • a plasma device generating DC or AC arc discharge and a high-frequency plasma device using high-frequency (RF) magnetic field are generally used.
  • the low-temperature plasma is frequently used for surface-treating articles in a semiconductor fabrication process, a metal and ceramic film fabrication process, or the like.
  • the low-temperature plasma is used, property changes caused when a low melting material such as plastic is melted and deformed during surface treatment can be prevented, and thus it is possible to perform surface treatment to materials such as plastic and glass.
  • the low-temperature plasma is not generated in a vacuum state but generated in an atmospheric state.
  • low-temperature plasma may be obtained at an atmospheric pressure, and thus costs required for vacuum devices and other equipment in relation to inlet/outlet of a treatment target may be reduced.
  • a size of a treatment target is restricted, but the low-temperature plasma may solve this restriction to some extent.
  • the atmospheric plasma is generally generated by means of pulse corona discharge and dielectric barrier discharge (DBD), and this means a technique of generating low-temperature plasma while maintaining a gas pressure from 100 Torr over an atmospheric pressure (760 Torr).
  • DBD pulse corona discharge and dielectric barrier discharge
  • the plasma processing device using atmospheric plasma is economical since expensive vacuum devices are not required, and also productivity may be maximized since its process may be performed in an in-line type.
  • the plasma processing device using atmospheric plasma may be applied to various fields such as ultrahigh-speed etching and coating techniques, semiconductor packaging, displays, material surface modification and coating, or the like.
  • the dielectric barrier discharge (DBD) may realize high concentration of reactive species (radical) over 100 to 1,000 times in comparison to existing vacuum plasma and its temperature is low in a range of normal temperature to 150°C. Therefore, the dielectric barrier discharge (DBD) is suitable for surface treatment of polymer, glass and low melting metals.
  • a dielectric barrier layer is installed to any one of a first electrode to which a high-frequency power is applied and a second electrode separated from the first electrode to generate discharge between the first electrode and the dielectric barrier layer.
  • the present disclosure is directed to providing an electrode assembly for dielectric barrier discharge, which may improve a yield for a treatment target by stably supplying activated plasma to the treatment target, and a plasma processing device using the same.
  • the present disclosure provides an electrode assembly for dielectric barrier discharge, comprising: a first electrode unit configured to extend in a lengthwise direction of a treatment target; a dielectric barrier unit configured to surround a first edge of the first electrode unit which faces the treatment target; and a plasma supply module disposed to surround the first electrode unit and the dielectric barrier unit and configured to generate dielectric barrier discharge (DBD) between the plasma supply module and the first electrode unit on the basis of a power applied to the first electrode unit to make a process gas into plasma and supply the process gas in a plasma state toward the treatment target.
  • DBD dielectric barrier discharge
  • the plasma supply module may include: a body unit provided to surround the first electrode unit and the dielectric barrier unit and having an opening formed to expose the first edge of the first electrode unit toward the treatment target; a second electrode unit coupled to the body unit and disposed adjacent to the opening to face the first electrode unit with the dielectric barrier unit being interposed therebetween, the second electrode unit generating dielectric barrier discharge between the first electrode unit and the second electrode unit on the basis of a power applied to the first electrode unit; and a gas supply unit provided in the body unit to supply a process gas to the second electrode unit and the dielectric barrier unit.
  • the second electrode unit may include a pair of second electrodes respectively disposed in parallel to each other at both sides of the first edge which intersect each other, and width of the second electrodes is adjustable along a side of the first edge.
  • the gas supply unit may include a plurality of gas supply channels provided in the body unit to supply the process gas to discharge spaces formed between the pair of second electrodes and the dielectric barrier unit, respectively.
  • the plurality of gas supply channels may be respectively formed with a zigzag shape toward the discharge space, and a buffer space may be formed between the gas supply channel and the discharge space.
  • the plasma supply module may further include a first insulator provided in the buffer space to electrically insulate the first electrode unit and the body unit from each other.
  • the plasma supply module may further include a gas distribution unit coupled to a base of the body unit which faces the opening, to receive the process gas and supply the process gas to the plurality of gas supply channels to be distributed in a lengthwise direction of the body unit.
  • a gas distribution unit coupled to a base of the body unit which faces the opening, to receive the process gas and supply the process gas to the plurality of gas supply channels to be distributed in a lengthwise direction of the body unit.
  • the base may have a plurality of gas supply holes formed spaced apart from each other along a lengthwise direction of the body unit at rim portions of both sides of the body unit in the lengthwise direction, respectively, to communicate with the plurality of gas supply channels
  • the gas distribution unit may include: a plate coupled to the base; a plurality of gas distribution channels provided in the plate and formed along a lengthwise direction of the plate at rim portions of both sides of the plate in the lengthwise direction to communicate with the plurality of gas supply holes; and a plurality of gas injection holes formed at a center portion of the plate to communicate with the plurality of gas distribution channels so that the process gas is supplied from a gas supply source and injected into the plurality of gas distribution channels.
  • the plurality of gas supply holes may be alternately arranged with each other along the lengthwise direction of the body unit.
  • the electrode assembly may further include a second insulator provided between the body unit and the first electrode unit to electrically insulate the first electrode unit and the body unit from each other.
  • the electrode assembly may further include a cooling unit having a coolant channel formed in the first electrode unit along a lengthwise direction of the first electrode unit to cool the first electrode unit.
  • an electrode assembly for dielectric barrier discharge comprising: a first electrode unit configured to extend in a lengthwise direction of a treatment target and have a section with an isosceles triangular shape, the first electrode unit being disposed so that a first edge thereof faces the treatment target; a dielectric barrier unit disposed at both sides of the first edge which intersect each other, to surround the first edge; a body unit formed to have a hollow shape in which the first electrode unit and the dielectric barrier unit are accommodated, the body unit having an opening formed to expose the first edge of the first electrode unit toward the treatment target; a pair of second electrodes coupled to an inner surface of the body unit, provided symmetrically at both sides of the opening and disposed to face the first electrode unit with the dielectric barrier unit being interposed therebetween so that discharge spaces are formed between the pair of second electrodes and the dielectric barrier unit, the pair of second electrodes generating dielectric barrier discharge in the discharge spaces on the basis of a power applied to the first electrode unit; and a gas supply
  • the gas supply unit may include a plurality of gas supply channels provided in the body unit and formed symmetrically at both sides of the opening to supply the process gas to the discharge spaces, respectively.
  • the plurality of gas supply channels may be respectively formed with a zigzag shape toward the discharge space, and a buffer space may be formed between the gas supply channel and the discharge space.
  • the electrode assembly may further include a gas distribution unit coupled to a base of the body unit which faces the opening, to receive the process gas and supply the process gas to the plurality of gas supply channels to be distributed in a lengthwise direction of the body unit.
  • a gas distribution unit coupled to a base of the body unit which faces the opening, to receive the process gas and supply the process gas to the plurality of gas supply channels to be distributed in a lengthwise direction of the body unit.
  • the base may have a plurality of gas supply holes formed spaced apart from each other along a lengthwise direction of the body unit at rim portions of both sides of the body unit in the lengthwise direction, respectively, to communicate with the plurality of gas supply channels
  • the gas distribution unit may include: a plate coupled to the base; a plurality of gas distribution channels provided in the plate and formed along a lengthwise direction of the plate at rim portions of both sides of the plate in the lengthwise direction to communicate with the plurality of gas supply holes; and a plurality of gas injection holes formed at a center portion of the plate to communicate with the plurality of gas distribution channels so that the process gas is supplied from a gas supply source and injected into the plurality of gas distribution channels.
  • the electrode assembly may further include a cooling unit having a coolant channel formed in the first electrode unit along a lengthwise direction of the first electrode unit to cool the first electrode unit.
  • a plasma processing device comprising: a susceptor on which a treatment target is loaded; and an electrode assembly for dielectric barrier discharge disposed to face the susceptor with the treatment target being interposed therebetween and configured to generate dielectric barrier discharge between the electrode assembly and the susceptor on the basis of an applied power so that the process gas is made into plasma
  • the electrode assembly for dielectric barrier discharge includes: a first electrode unit configured to extend in a lengthwise direction of the treatment target; a dielectric barrier unit configured to surround a first edge of the first electrode unit which faces the treatment target; and a plasma supply module disposed to surround the first electrode unit and the dielectric barrier unit and configured to generate dielectric barrier discharge between the plasma supply module and the first electrode unit on the basis of a power applied to the first electrode unit to make a process gas into plasma and supply the process gas in a plasma state toward the treatment target.
  • the plasma supply module may include: a body unit provided to surround the first electrode unit and the dielectric barrier unit and having an opening formed to expose the first edge of the first electrode unit toward the treatment target; a pair of second electrodes coupled to an inner surface of the body unit, provided symmetrically at both sides of the opening and disposed to face the first electrode unit with the dielectric barrier unit being interposed therebetween so that discharge spaces are formed between the pair of second electrodes and the dielectric barrier unit, the pair of second electrodes generating dielectric barrier discharge in the discharge spaces on the basis of a power applied to the first electrode unit; and a gas supply unit provided in the body unit and disposed symmetrically at both sides of the opening to supply a process gas to the discharge spaces, respectively.
  • the gas supply unit may include a plurality of gas supply channels provided in the body unit and formed symmetrically at both sides of the opening to supply the process gas to the discharge spaces, respectively.
  • the plurality of gas supply channels may be respectively formed with a zigzag shape toward the discharge space, and a buffer space may be formed between the gas supply channel and the discharge space.
  • the plasma supply module may further include a gas distribution unit coupled to a base of the body unit which faces the opening, to receive the process gas and supply the process gas to the plurality of gas supply channels to be distributed in a lengthwise direction of the body unit.
  • a gas distribution unit coupled to a base of the body unit which faces the opening, to receive the process gas and supply the process gas to the plurality of gas supply channels to be distributed in a lengthwise direction of the body unit.
  • the base may have a plurality of gas supply holes formed spaced apart from each other along a lengthwise direction of the body unit at rim portions of both sides of the body unit in the lengthwise direction, respectively, to communicate with the plurality of gas supply channels
  • the gas distribution unit may include: a plate coupled to the base; a plurality of gas distribution channels provided in the plate and formed along a lengthwise direction of the plate at rim portions of both sides of the plate in the lengthwise direction to communicate with the plurality of gas supply holes; and a plurality of gas injection holes formed at a center portion of the plate to communicate with the plurality of gas distribution channels so that the process gas is supplied from a gas supply source and injected into the plurality of gas distribution channels.
  • a process gas is primarily made into plasma by means of dielectric barrier discharge, and the electrode assembly for dielectric barrier discharge supplies the process gas in a plasma state toward a treatment target to secondarily made the process gas into plasma by means of dielectric barrier discharge between an assembly for dielectric barrier discharge and a susceptor on which the treatment target is loaded, thereby stably supplying activated plasma to the treatment target and thus improving a yield for the treatment target.
  • Fig. 1 is a diagram showing a plasma processing device according to the present disclosure.
  • Fig. 2 is a perspective view showing an electrode assembly for dielectric barrier discharge according to an embodiment of the present disclosure.
  • Fig. 3 is a cross-sectional view showing an electrode assembly for dielectric barrier discharge according to another embodiment of the present disclosure.
  • Fig. 4a is a plane view showing a base of a body unit according to an embodiment of the present disclosure.
  • Fig. 4b is a plane view showing a gas distribution unit according to an embodiment of the present disclosure.
  • Fig. 5 is a graph showing a process gas flux distribution according to the present disclosure.
  • Fig. 1 is a diagram showing a plasma processing device according to the present disclosure
  • Fig. 2 is a perspective view showing an electrode assembly for dielectric barrier discharge according to an embodiment of the present disclosure
  • Fig. 3 is a cross-sectional view showing an electrode assembly for dielectric barrier discharge according to another embodiment of the present disclosure
  • Fig. 4a is a plane view showing a base of a body unit according to an embodiment of the present disclosure
  • Fig. 4b is a plane view showing a gas distribution unit according to an embodiment of the present disclosure
  • Fig. 5 is a graph showing a process gas flux distribution according to the present disclosure.
  • a plasma processing device 10 includes a susceptor 200 on which a treatment target M is loaded, an electrode assembly 100 for dielectric barrier discharge, disposed to face the susceptor 200 with the treatment target M being interposed therebetween to generate dielectric barrier discharge (DBD) between the electrode assembly 100 and the susceptor 200 on the basis of an applied power so that a process gas is made into plasma, a power supply source 400 configured to supply a power to the electrode assembly 100 for dielectric barrier discharge, and a gas supply source 300 configured to supply a process gas to the electrode assembly 100 for dielectric barrier discharge.
  • DBD dielectric barrier discharge
  • the plasma processing device 10 may be applied to various fields such as ultrahigh-speed etching and coating techniques, semiconductor packaging, display thin film deposition, material surface modification and coating, or the like, depending on the process gas.
  • the treatment target M of this embodiment includes a film, a metal, a glass, a plastic, a semiconductor wafer or the like.
  • a separator used for a secondary battery should be electrically separated from electrodes and maintain ion conductivity over a certain level between the electrodes. Therefore, the separator for a secondary battery is made of a thin porous insulating material which has high ion penetration, good mechanical strength, and good long-term stability with respect to solvents and chemical substances used in the electrolyte. In addition, the separator used for a secondary battery should be permanently elastic and should follow a movement in an electrode pack during a charging or discharging process.
  • an environment-friendly separator for a NI-MH secondary battery which uses an aqueous electrolyte, should have alkali-proof property since an alkali solution electrolyte is used, and also this separator should have no reactivity between electrodes and low price.
  • a hydrophilicity process should be separately needed in order to apply this material to a NI-MH secondary battery.
  • the plasma processing device 10 may be used.
  • a process gas used for performing the hydrophilicity process to the separator for a secondary battery may include at least one of oxygen (O 2 ), nitrogen (N 2 ), hydrogen (H 2 ) and argon (Ar).
  • the plasma processing device 10 primarily the makes the process gas into plasma by means of dielectric barrier discharge (DBD) in the electrode assembly 100 for dielectric barrier discharge and supplies the process gas in a plasma state toward a treatment target M.
  • DBD dielectric barrier discharge
  • the plasma processing device 10 may secondarily make the process gas into plasma by means of dielectric barrier discharge between the assembly for dielectric barrier discharge and the susceptor 200 on which the treatment target M is loaded, and supply the more activated plasma to the treatment target M stably to enhance process efficiency for the surface treatment of the treatment target M.
  • the plasma processing device 10 may improve surface treatment process efficiency and yield of the treatment target M by primarily making the process gas into plasma at the assembly for dielectric barrier discharge and supplying the process gas in a primary plasma state between the electrode assembly 100 for dielectric barrier discharge and the treatment target M so that plasma surface treatment is performed to the treatment target M in a direct way by means of dielectric barrier discharge between the electrode assembly 100 for dielectric barrier discharge and the susceptor 200.
  • the susceptor 200 plays a role of supporting the treatment target M loaded thereon.
  • the susceptor 200 may include a loading unit 210 on which a treatment target is loaded and placed, and a lifting unit (not shown) connected to the loading unit 210 to life up and down the treatment target M with respect to the electrode assembly 100 for dielectric barrier discharge.
  • the susceptor 200 according to this embodiment is grounded and interacts with the electrode assembly 100 for dielectric barrier discharge to generate dielectric barrier discharge.
  • An upper surface of the loading unit 210 may be fabricated as a surface plate so that the treatment target M may precisely maintain its horizontality.
  • the treatment target M may be lifted up and down adjacent to the electrode assembly 100 for dielectric barrier discharge by means of the lifting unit.
  • a distance between the treatment target M and the electrode assembly 100 for dielectric barrier discharge is maintained within a range of 0.1 to 3 mm, so that direct plasma discharge may be used.
  • the dielectric barrier discharge generated between the susceptor 200 and the electrode assembly 100 for dielectric barrier discharge secondarily makes the process gas, which has been primarily made into plasma by means of primary dielectric barrier discharge generated in the electrode assembly 100 for dielectric barrier discharge, into plasma.
  • the susceptor 200 may relatively move the treatment target M in a horizontal direction with respect to the electrode assembly 100 for dielectric barrier discharge.
  • the treatment target M may be placed on a tray (not shown) and then loaded on the loading unit 210, and a horizontal transfer unit (not shown) such as a roller may be installed at the loading unit 210 so that the treatment target M may perform surface treatment subsequently along a transfer direction by relatively moving the tray on which the treatment target M is placed along a horizontal direction with respect to the electrode assembly 100 for dielectric barrier discharge.
  • a horizontal transfer unit such as a roller
  • the power supply source 400 directly applies an AC high voltage to a first electrode unit 110, employed at the electrode assembly 100 for dielectric barrier discharge.
  • the power supply source 400 may supply an AC high voltage having a frequency of 1 to 100 KHz and a voltage of 3 to 15 KV to the first electrode unit 110.
  • a matching circuit (not shown) for efficiently transmitting a power between the power supply source 400 and the first electrode unit 110 may be further included.
  • the gas supply source 300 of this embodiment is connected to the electrode assembly 100 for dielectric barrier discharge and supplies a process gas to the electrode assembly 100 for dielectric barrier discharge.
  • the process gas supplied to the electrode assembly 100 for dielectric barrier discharge is primarily made into plasma in the electrode assembly 100 for dielectric barrier discharge and then supplied toward the treatment target M.
  • the process gas may employ various kinds of gases depending on plasma surface treatment for the treatment target M.
  • a process gas including at least one of oxygen (O 2 ), nitrogen (N 2 ), hydrogen (H 2 ) and argon (Ar) may be used.
  • the electrode assembly 100 for dielectric barrier discharge plays a role of improving surface treatment efficiency to the treatment target M by primarily making the process gas supplied from the gas supply source 300 into plasma therein and supplying the process gas toward the treatment target M, and then secondarily generating dielectric barrier discharge between the electrode assembly 100 and the susceptor 200 so that the process gas is secondarily made into plasma and then supplying the more activated plasma to the treatment target M stably.
  • the electrode assembly 100 for dielectric barrier discharge includes a first electrode unit 110 configured to extend in a lengthwise direction of the treatment target M, a dielectric barrier unit 120 configured to surround a first edge 111 of the first electrode unit 110 which faces the treatment target M, a plasma supply module 130 disposed to surround the first electrode unit 110 and the dielectric barrier unit 120 and configured to generate dielectric barrier discharge between the plasma supply module 130 and the first electrode unit 110 on the basis of a power applied to the first electrode unit 110 to make the process gas into plasma and supply the process gas in a plasma state toward the treatment target M, and a cooling unit 190 having a coolant channel 191 formed long in the first electrode unit 110 along a lengthwise direction of the first electrode unit 110 to cool the first electrode unit 110.
  • the first electrode unit 110 plays a role of making the process gas into plasma by means of dielectric barrier discharge on the basis of the applied AC high voltage.
  • the first electrode unit 110 is connected to the power supply source 400.
  • the first electrode unit 110 is formed to elongate in a lengthwise direction of the treatment target M and has a section with an isosceles triangular shape. In other words, in this embodiment, the first electrode unit 110 is formed with a triangular prism shape.
  • the first edge 111 of the first electrode unit 110 is disposed to face the treatment target M. At this time, an angle between both sides of the first edge 111 which intersect each other may be 30 to 90°. This is to enhance a density of surface charge at the first edge 111 and to prevent parasitic discharge which may occur at a periphery of main discharge during the dielectric barrier discharge generated between the susceptor 200 and the first electrode unit 110.
  • the dielectric barrier unit 120 plays a role of generating dielectric barrier discharge.
  • the dielectric barrier unit 120 is disposed to surround the first edge 111 of the first electrode unit 110.
  • the dielectric barrier unit 120 may be configured with a dielectric layer 120 coated to the first edge 111 of the first electrode unit 110, and the dielectric layer 120 may be formed as a thin film on the first edge 111 of the first electrode unit 110 with a thickness of 0.5 to 2 mm.
  • the dielectric material may employ ceramic, alumina, quartz, silicon resin or the like.
  • the plasma supply module 130 plays a role of generating dielectric barrier discharge between the plasma supply module 130 and the first electrode unit 110 and making the process gas supplied from the gas supply source 300 into plasma.
  • the plasma supply module 130 is disposed to surround the first electrode unit 110 and the dielectric barrier unit 120, and a process gas is supplied therein.
  • the plasma supply module 130 includes a body unit 140 provided to surround the first electrode unit 110 and the dielectric barrier unit 120 and having an opening 141 formed to expose the first edge 111 of the first electrode unit 110 toward the treatment target M, a second electrode unit 150 coupled to the body unit 140 and disposed adjacent to the opening 141 to face the first electrode unit 110 with the dielectric barrier unit 120 being interposed therebetween and configured to generate dielectric barrier discharge between the second electrode unit 150 and the first electrode unit 110 on the basis of a power applied to the first electrode unit 110, and a gas supply unit 160 provided in the body unit 140 and configured to supply a process gas between the second electrode unit 150 and the dielectric barrier unit 120.
  • the body unit 140 extends long in a lengthwise direction and has a hollow shape in which the first electrode unit 110 and the dielectric barrier unit 120 are accommodated.
  • the body unit 140 may have a hollow triangular prism shape corresponding to the triangular prism shape of the first electrode unit 110.
  • the opening 141 is formed in the body unit 140 so that the first edge 111 of the first electrode unit 110 is exposed toward the treatment target M.
  • the body unit 140 is symmetrically formed on the basis of the opening 141 and is grounded.
  • the second electrode unit 150 plays a role of generating dielectric barrier discharge in a state where the dielectric barrier unit 120 is interposed between the first electrode unit 110 and the second electrode unit 150.
  • the first electrode unit 110 is connected to the power supply source 400, and the second electrode unit 150 is grounded.
  • the second electrode unit 150 is coupled to an inner surface of the body unit 140 adjacent to the opening 141.
  • the second electrode unit 150 is disposed to face the first electrode unit 110 in parallel with the dielectric barrier unit 120 being interposed therebetween. Therefore, the second electrode unit 150 generates dielectric barrier discharge between the first electrode unit 110 and the second electrode unit 150 on the basis of a power applied to the first electrode unit 110.
  • the second electrode unit 150 includes a pair of second electrodes 151 coupled to the inner surface of the body unit 140 and respectively provided at both sides of the opening 141 symmetrically.
  • the pair of second electrodes 151 are parallel to both sides of the first edge 111, which intersect each other, and are disposed to face each other. In addition, the pair of second electrodes 151 form discharge spaces S between the second electrodes 151 and the dielectric barrier unit 120 disposed to surround the first edge 111.
  • each of the pair of second electrodes 151 has a width adjustable along a side of the first edge 111. Therefore, the widths of the pair of second electrodes 151 may be adjusted along the sidewalls of the first edge 111 to control areas of the discharge spaces S between the second electrodes 151 and the dielectric barrier unit 120.
  • the pair of second electrodes 151 generate dielectric barrier discharge in the discharge spaces S on the basis of a power applied to the first electrode unit 110.
  • the gas supply unit 160 is provided in the body unit 140 and symmetrically disposed at both sides of the opening 141 to supply a process gas to the discharge spaces S.
  • the gas supply unit 160 includes a plurality of gas supply channels 161 formed in the body unit 140 to supply a process gas to each discharge space S.
  • the plurality of gas supply channels 161 are provided in the body unit 140 and symmetrically formed at both sides of the opening 141, respectively.
  • the plurality of gas supply channels 161 may be disposed in parallel to each other along both sides of the first edge 111, respectively.
  • the process gas is supplied from the gas supply channel 161 to the discharge space S.
  • the plurality of gas supply channels 161 are formed to have a zigzag shape along both sides of the first edge 111, respectively.
  • the gas supply channel 161 is formed to have a zigzag shape toward the discharge space S along the side of the first edge 111.
  • a buffer space B is formed between the gas supply channel 161 and the discharge space S.
  • the buffer space B is formed in an area adjacent to the discharge space S.
  • the buffer space B allows the process gas to have uniform pressure distribution in the lengthwise direction of the body unit 140, thereby improving uniformity degree of the process gas supplied to the discharge space S.
  • the buffer space B allows the grounded body unit 140 to be spaced apart from the first electrode unit 110, and thus it is possible to prevent parasitic discharge from occurring between the first electrode unit 110 and the body unit 140 in which the dielectric barrier unit 120 is interposed, thereby enhancing discharge efficiency in a desired discharge space S.
  • the second electrode 151 since the second electrode 151 has a width adjustable toward the buffer space B, a sectional area of the discharge space S may be increased.
  • the plasma supply module 130 may further include a first insulator 185 provided in the buffer space B to electrically insulate the first electrode unit 110 and the body unit 140 from each other.
  • the first insulator 185 is accommodated in the buffer space B.
  • the first insulator 185 may be made of insulating material such as Teflon, acetal, PEEK or the like.
  • the electrode assembly 100 for dielectric barrier discharge may further include a second insulator 180 provided between the body unit 140 and the first electrode unit 110 to electric insulate the first electrode unit 110 and the body unit 140 from each other.
  • the second insulator 180 may be disposed to be inserted between the first electrode unit 110 accommodated in the body unit 140 and a base 142 of the body unit 140 which faces the opening 141.
  • the second insulator 180 may be made of insulating material such as Teflon, acetal, PEEK or the like.
  • the second insulator 180 prevents the heat generated from the first electrode unit 110 while performing plasma treatment to the treatment target M from being transferred to the base 142 of the body unit 140 and also prevents parasitic discharge which may occur between the first electrode unit 110 and the base 142 of the body unit 140.
  • the process gas flowing in the electrode assembly 100 for dielectric barrier discharge is moved to the discharge space S along the plurality of gas supply channels 161 from the gas supply source 300, and the plasma supply module 130 according to this embodiment further includes a gas distribution unit 170 configured to receive a process gas from the gas supply source 300 and supply the process gas to the plurality of gas supply channels 161.
  • the gas distribution unit 170 is coupled to the base 142 of the body unit 140 to receive a process gas from the gas supply source 300 and supply the process gas to the plurality of gas supply channels 161 to be distributed in a lengthwise direction of the body unit 140.
  • the base 142 of the body unit 140 includes a plurality of gas supply holes 143 formed spaced apart from each other along a lengthwise direction of the body unit 140 at rim portions of both lateral sides of the body unit 140, respectively, to communicate with the plurality of gas supply channels 161.
  • the plurality of gas supply holes 143 communicate with the gas supply channels 161 described above to supply the process gas to the plurality of gas supply channels 161.
  • the plurality of gas supply holes 143 may include three gas supply holes formed at a left rim portion of the base 142 in a lengthwise direction to be spaced apart from each other or include two gas supply holes formed at a right rim portion of the base 142 in a lengthwise direction to be spaced apart from each other.
  • the plurality of gas supply holes 143 formed at the left and right rim portions of the base 142 in a lengthwise direction are alternately arranged along the lengthwise direction.
  • the plurality of gas supply holes 143 receives a process gas from the gas distribution unit 170.
  • the gas distribution unit 170 includes a plate 171 coupled to the base 142, a plurality of gas distribution channels 172 provided in the plate 171 and formed along a lengthwise direction of the plate 171 at rim portions of both lateral sides of the plate 171 to communicate with the plurality of gas supply holes 143, and a plurality of gas injection holes 173 formed at a center portion of the plate 171 to communicate with the plurality of gas distribution channels 172 so that the process gas is supplied from the gas supply source 300 and injected into the plurality of gas distribution channels 172.
  • the plate 171 is coupled to the base 142 of the body unit 140 to be stacked thereon.
  • the plurality of gas distribution channels 172 are formed in the plate 171 to distribute the process gas to the plurality of gas supply holes 143 formed in the base 142.
  • the plurality of gas injection holes 173 connected to the gas supply source 300 are formed in the plate 171 to receive a process gas from the gas supply source 300 and inject the process gas into the plurality of gas distribution channels 172.
  • Fig. 4b it is depicted that two gas injection holes 173 are formed at the center portion of the plate 171, and a single gas injection hole 173 is connected to communicate with the gas distribution channels 172 formed at a left rim portion of the plate 171 in the lengthwise direction so that the process gas is supplied to the left rim portion of the plate 171 in the lengthwise direction.
  • the other gas injection hole 173 is connected to communicate with the gas distribution channels 172 formed at a right rim portion of the plate 171 in the lengthwise direction to supply the process gas to the right rim portion of the plate 171 in the lengthwise direction.
  • the process gas moves along the gas distribution channels 172 formed at the left and right rim portions of the plate 171 along the lengthwise direction through the plurality of gas injection holes 173, and is supplied to the gas supply channels 161 symmetrically provided at right and left sides of the body unit 140 through the plurality of gas supply holes 143 formed at the right and left rim portions of the base 142 in the lengthwise direction to be spaced apart from each other and alternately arranged in the lengthwise direction.
  • Fig. 5 shows uniformity degrees (a, b) of the flux of a process gas supplied from the gas supply channels 161 respectively provided at right and left sides of the body unit 140 along the lengthwise direction of the body unit 140 on the basis of the center of the body unit 140 and a uniformity degree (c) of the sum of fluxes of process gases supplied from the gas supply channels 161 respectively provided at the right and left sides of the body unit 140.
  • a vertical axis represents a value obtained by dividing the flux of a process gas supplied from the gas supply channels 161 respectively provided at the right and left sides of the body unit 140 and the sum of fluxes of process gases supplied from the gas supply channels 161 respectively provided at the right and left sides of the body unit 140 by a maximum flux of the process gas supplied from the gas supply channels 161 respectively provided at the right and left sides of the body unit 140 and a maximum sum thereof
  • a horizontal axis represents a length of the body unit 140 to both lateral ends of the body unit 140 on the basis of the center of the body unit 140.
  • Fig. 5 shows a uniformity degree (a) of the flux of a process gas supplied along a lengthwise direction of the body unit 140 to the gas supply channels 161 provided at the left side of the body unit 140 with respect to locations of the plurality of gas supply holes 143 of the base 142 and locations of the plurality of gas distribution channels 172 and the plurality of gas injection holes 173 of the gas distribution unit 170 and a uniformity degree (b) of the flux of a process gas supplied along the lengthwise direction of the body unit 140 to the gas supply channels 161 provided at the right side of the body unit 140.
  • the process gas supplied to the gas supply channels 161 provided at the right and left sides of the body unit 140 is irregular along the lengthwise direction of the body unit 140.
  • a total amount of the fluxes of process gases supplied from the gas supply channels 161 provided at the right and left sides of the body unit 140 is uniformly compensated along the lengthwise direction of the body unit 140 by means of the plurality of gas supply holes 143 alternately arranged with each other.
  • a total amount of the fluxes of process gases in a plasma state, supplied through the discharge spaces S formed between the pair of second electrodes 151 and the dielectric barrier unit 120 has a uniformity degree (c) of 0.9 or above along the lengthwise direction of the body unit 140.
  • the cooling unit 190 plays a role of cooling the first electrode unit 110 to ensure thermal stability of the first electrode unit 110 under a high-power condition while a plasma treatment is performed to the treatment target M.
  • the cooling unit 190 includes a coolant channel 191 in the first electrode unit 110, and the coolant channel 191 extends long along a lengthwise direction of the first electrode unit 110.
  • the cooling unit 190 circulates a coolant along the coolant channel 191 to cool the first electrode unit 110.
  • the present disclosure may improve a yield for a treatment target by stably supplying activated plasma to the treatment target.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Electromagnetism (AREA)

Abstract

La présente invention porte sur un ensemble électrode permettant une décharge à barrière diélectrique et sur un dispositif de traitement au plasma utilisant ce dernier. L'ensemble électrode permettant une décharge à barrière diélectrique comprend une première unité d'électrode configurée de sorte à s'étendre dans une direction longitudinale d'une cible de traitement ; une unité de barrière diélectrique configurée de sorte à entourer un premier bord de la première unité d'électrode qui fait face à la cible de traitement ; et un module d'alimentation en plasma disposé de sorte à entourer la première unité d'électrode et l'unité de barrière diélectrique et configuré de sorte à générer une décharge à barrière diélectrique (DBD pour Dielectric Barrier Discharge) entre le module d'alimentation en plasma et la première unité d'électrode sur la base d'une énergie appliquée à la première unité d'électrode pour produire un gaz de traitement en plasma et fournir le gaz de traitement dans un état plasmatique vers la cible de traitement.
PCT/KR2016/002919 2015-12-18 2016-03-23 Ensemble électrode permettant une décharge à barrière diélectrique et dispositif de traitement au plasma utilisant ce dernier Ceased WO2017104903A1 (fr)

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KR1020150181506A KR101771667B1 (ko) 2015-12-18 2015-12-18 유전체 장벽 방전용 전극 조립체 및 이를 이용한 플라즈마 처리장치
KR10-2015-0181506 2015-12-18

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WO2017104903A1 true WO2017104903A1 (fr) 2017-06-22

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Cited By (1)

* Cited by examiner, † Cited by third party
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JP2019075364A (ja) * 2017-09-04 2019-05-16 コリア ベーシック サイエンス インスティテュート デュアルタイプのプラズマ吐出部を備えているプラズマ装置

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US20050011456A1 (en) * 2001-11-30 2005-01-20 Tokyo Electron Limited Processing apparatus and gas discharge suppressing member
KR20090130936A (ko) * 2008-06-17 2009-12-28 주식회사 케이씨텍 상압 플라즈마 발생장치
KR101002335B1 (ko) * 2003-10-08 2010-12-17 엘지디스플레이 주식회사 상압 플라즈마 처리 장치
US20110263138A1 (en) * 2006-04-27 2011-10-27 Joseph Michael Ranish Substrate processing chamber with dielectric barrier discharge lamp assembly
JP2012167614A (ja) * 2011-02-15 2012-09-06 Mitsui Eng & Shipbuild Co Ltd プラズマ発生装置

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JP3399887B2 (ja) * 1999-09-22 2003-04-21 パール工業株式会社 プラズマ処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050011456A1 (en) * 2001-11-30 2005-01-20 Tokyo Electron Limited Processing apparatus and gas discharge suppressing member
KR101002335B1 (ko) * 2003-10-08 2010-12-17 엘지디스플레이 주식회사 상압 플라즈마 처리 장치
US20110263138A1 (en) * 2006-04-27 2011-10-27 Joseph Michael Ranish Substrate processing chamber with dielectric barrier discharge lamp assembly
KR20090130936A (ko) * 2008-06-17 2009-12-28 주식회사 케이씨텍 상압 플라즈마 발생장치
JP2012167614A (ja) * 2011-02-15 2012-09-06 Mitsui Eng & Shipbuild Co Ltd プラズマ発生装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019075364A (ja) * 2017-09-04 2019-05-16 コリア ベーシック サイエンス インスティテュート デュアルタイプのプラズマ吐出部を備えているプラズマ装置

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KR101771667B1 (ko) 2017-08-28

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