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WO2017199463A1 - Composition adhésive sensible à la pression et ruban adhésif sensible à la pression - Google Patents

Composition adhésive sensible à la pression et ruban adhésif sensible à la pression Download PDF

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Publication number
WO2017199463A1
WO2017199463A1 PCT/JP2017/000744 JP2017000744W WO2017199463A1 WO 2017199463 A1 WO2017199463 A1 WO 2017199463A1 JP 2017000744 W JP2017000744 W JP 2017000744W WO 2017199463 A1 WO2017199463 A1 WO 2017199463A1
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WO
WIPO (PCT)
Prior art keywords
sensitive adhesive
pressure
silicone
adhesive composition
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/000744
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English (en)
Japanese (ja)
Inventor
靖史 土屋
勝弘 齋藤
岩本　太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teraoka Seisakusho Co Ltd
Original Assignee
Teraoka Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teraoka Seisakusho Co Ltd filed Critical Teraoka Seisakusho Co Ltd
Priority to KR1020187030735A priority Critical patent/KR102231628B1/ko
Priority to JP2018518071A priority patent/JP6554232B2/ja
Priority to CN201780030105.3A priority patent/CN109196070B/zh
Publication of WO2017199463A1 publication Critical patent/WO2017199463A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Definitions

  • the adhesive tape used in a surface treatment process of a member such as heat-resistant glass or a manufacturing process of a semiconductor component such as a glass wafer does not leave adhesive when peeled even when used in a high temperature environment (for example, 300 ° C.).
  • the present invention relates to a silicone-based pressure-sensitive adhesive composition and a pressure-sensitive adhesive tape that can be peeled off with a light force.
  • Silicone adhesive composition is excellent in heat resistance, cold resistance, weather resistance, electrical insulation and chemical resistance. Further, the pressure-sensitive adhesive tape having a silicone-based pressure-sensitive adhesive layer is unlikely to have adhesive residue at the time of peeling even when used in a high temperature environment. Therefore, such adhesive tapes are widely used in applications such as protection of members and parts, masking, temporary fixing, fixing during transportation, for example, in the surface treatment process of members such as heat-resistant glass and the manufacturing process of semiconductor parts such as glass wafers. It's being used.
  • Patent Document 1 discloses a silicone pressure-sensitive adhesive composition having no adhesive residue in an adhesive residue test at 250 ° C. to 290 ° C.
  • Patent Document 2 discloses an adhesive tape for surface protection that has a small increase in adhesive force when reflowed at 260 ° C. in the manufacturing process of a semiconductor component and that has little transfer foreign matter (adhesive residue) to the component.
  • Patent Document 1 and Patent Document 2 relate to an adhesive tape used in a manufacturing process of a semiconductor component, and the temperature of the usage environment is assumed to be 250 ° C. to 290 ° C. or 260 ° C. .
  • an adhesive tape may be used at a temperature exceeding 290 ° C. (for example, 300 ° C.). If a conventional general adhesive tape is used in such a high temperature environment, adhesive residue is likely to occur at the time of peeling.
  • an object of the present invention is to provide a silicone-based pressure-sensitive adhesive composition and a pressure-sensitive adhesive tape that can be peeled off with a light force without leaving adhesive residue even when used in a high-temperature environment (for example, 300 ° C.).
  • the inventors of the present invention have a balance between the gel fraction and the swelling degree of the silicone-based pressure-sensitive adhesive layer, and the adhesive residue at the time of peeling when used in a high-temperature environment (for example, 300 ° C.), The present inventors have found that it is related to various performances such as peeling force, and have completed the present invention.
  • the present invention includes a crosslinked silicone structure, a gel fraction measured by the following method is 70% or more and 95% or less, and a degree of swelling measured by the following method is 260% or less.
  • the silicone-based pressure-sensitive adhesive composition. (Gel fraction)
  • the gel fraction is obtained by the following formula, which is the ratio of the insoluble matter when the silicone pressure-sensitive adhesive composition is immersed in toluene at room temperature for 1 day.
  • this invention is an adhesive tape which has an adhesive layer which consists of said adhesive composition on the at least single side
  • a silicone-based pressure-sensitive adhesive composition and a pressure-sensitive adhesive tape that can be peeled off with a light force without leaving adhesive residue even when used in a high-temperature environment (for example, 300 ° C.).
  • a high-temperature environment for example, 300 ° C.
  • the pressure-sensitive adhesive tape of the present invention has the specific pressure-sensitive adhesive layer, even when heated at a high temperature (for example, 300 ° C.) in a surface treatment process such as heat-resistant glass or a semiconductor component manufacturing process such as a glass wafer, No adhesive remains at the time of peeling after the process, and it can be peeled with a light force.
  • the adhesive tape of the present invention is very useful in this respect.
  • the pressure-sensitive adhesive composition of the present invention is a pressure-sensitive adhesive composition containing a silicone-based pressure-sensitive adhesive as a main component.
  • the gel fraction of the pressure-sensitive adhesive composition of the present invention is 70% to 95%, preferably 70% to 90%, more preferably 70% to 85%.
  • the swelling degree with respect to toluene of the adhesive composition of this invention is 260% or less, Preferably it is 250% or less, More preferably, it is 240% or less. Specific methods for measuring the gel fraction and the degree of swelling are described in the Examples section described below. In general, the degree of swelling depends on the crosslinking density of the pressure-sensitive adhesive composition.
  • the crosslinking density When the crosslinking density is high, the three-dimensionally crosslinked polymer chain constituting the pressure-sensitive adhesive is difficult to spread even when immersed in toluene, and the degree of swelling is low. On the other hand, when the crosslinking density is low, the polymer chain is easy to spread and the degree of swelling is high.
  • the gel fraction and the degree of swelling are within the specific ranges of the present invention, even if used in a high-temperature environment (for example, 300 ° C.), no adhesive remains and it can be peeled off with a light force.
  • the gel fraction is less than 70%, the adhesive force to the adherend becomes strong, so that the force required for peeling increases, and adhesive residue due to insufficient cohesive force tends to occur.
  • the gel fraction exceeds 95%, the silicone rubber contained in the pressure-sensitive adhesive tends to undergo oxidative degradation under high temperature environment, and adhesive residue is likely to occur. Even if the gel fraction is in the range of 70% or more and 95% or less, if the swelling degree exceeds 260%, adhesive residue due to insufficient cohesion due to low crosslinking density is likely to occur, and peeling The power required for is increased.
  • silicone-based pressure-sensitive adhesive used in the present invention include silicone raw rubber (polydimethylsiloxane long-chain polymer having a structure composed mainly of D units [(CH 3 ) 2 SiO)) and MQ resin (M units). And a pressure-sensitive adhesive containing [(CH 3 ) 3 SiO 1/2 ] and a polymer of a three-dimensional silicone resin having a structure consisting of Q units [SiO 4/2 ]).
  • a pressure-sensitive adhesive containing a raw silicone rubber and an MQ resin is superior in adhesiveness compared to a single silicone raw rubber.
  • basic adhesive properties such as adhesive strength, holding power, and tack can be controlled.
  • Silicone pressure-sensitive adhesives are roughly classified into an addition-curing type and a peroxide-curing type depending on the curing mechanism.
  • the addition-curable silicone-based pressure-sensitive adhesive includes, for example, a main agent made of silicone raw rubber containing alkenyl groups, MQ resin, and a crosslinking agent made of polyorganosiloxane containing SiH groups. And it hardens
  • the silicone raw rubber containing an alkenyl group is typically a polyorganosiloxane having at least two alkenyl groups (for example, vinyl groups) bonded to silicon atoms in one molecule.
  • the polyorganosiloxane containing SiH groups is typically a polyorganosiloxane having at least two hydrogen atoms bonded to silicon atoms in one molecule.
  • the gel fraction increases when the blending ratio of the MQ resin to the silicone raw rubber is lowered or the content ratio of the alkenyl group in the silicone raw rubber (and / or MQ resin) is increased. Tend to be. In general, when the content ratio of alkenyl groups in the silicone raw rubber (and / or MQ resin) is increased, the degree of swelling tends to decrease.
  • a method for obtaining a pressure-sensitive adhesive composition having a specific gel fraction and swelling degree of the present invention using an addition-curing type silicone pressure-sensitive adhesive for example, the blending ratio of MQ resin to the silicone raw rubber and the silicone raw rubber (and There is a method of appropriately adjusting the content ratio of alkenyl groups in (/ MQ resin).
  • the pressure-sensitive adhesive composition of the present invention is not limited to that obtained by such an adjustment method.
  • the peroxide-curing silicone-based pressure-sensitive adhesive contains, for example, a main agent made of silicone raw rubber not containing an alkenyl group, and MQ resin. And after adding peroxides, such as benzoyl peroxide, as a hardening
  • peroxides such as benzoyl peroxide
  • curing agent removing a solvent
  • the gel fraction tends to increase when the blending ratio of the MQ resin to the silicone raw rubber is lowered or the amount of peroxide added is increased. In general, when the amount of peroxide added is increased, the degree of swelling tends to decrease.
  • a method for obtaining a pressure-sensitive adhesive composition having a specific gel fraction and swelling degree of the present invention using a peroxide-curable silicone pressure-sensitive adhesive for example, the blending ratio of MQ resin to silicone raw rubber and the peroxide
  • a method of appropriately adjusting the amount of the product added for example, the pressure-sensitive adhesive composition of the present invention is not limited to that obtained by such an adjustment method.
  • the pressure-sensitive adhesive composition of the present invention preferably contains a cross-linked addition-curable silicone pressure-sensitive adhesive.
  • the crosslinking curing reaction of the silicone pressure-sensitive adhesive is usually carried out by heating.
  • the crosslinking curing can be performed by a condensation reaction or ultraviolet irradiation.
  • the amount of the crosslinking agent made of a polyorganosiloxane containing a SiH group may be appropriately adjusted.
  • a pressure-sensitive adhesive composition having a specific gel fraction and swelling degree of the present invention can be obtained using a mixture of two or more types of silicone-based pressure-sensitive adhesives.
  • a silicone pressure-sensitive adhesive having a relatively high gel fraction and swelling degree and a silicone pressure-sensitive adhesive having a relatively low gel fraction and swelling degree are mixed at an appropriate ratio and crosslinked and cured.
  • a pressure-sensitive adhesive composition having a gel fraction and a swelling degree within the range of the present invention can be obtained.
  • the pressure-sensitive adhesive composition of the present invention is not limited to those obtained by such a method.
  • An additive may be added to the pressure-sensitive adhesive composition of the present invention for the purpose of improving various properties.
  • additives include inorganic fillers such as carbon black and silica; polyorganosiloxanes such as silicone resin, polydimethylsiloxane and polydimethylphenylsiloxane; and antioxidants such as phenolic antioxidants and amine antioxidants. Agents; silane coupling agents.
  • the type and amount of the additive must be appropriately selected so as not to impair the effects of the invention.
  • the pressure-sensitive adhesive tape of the present invention is a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer composed of the pressure-sensitive adhesive composition of the present invention described above on at least one side of a base material, and typically the pressure-sensitive adhesive is applied to one side or both sides of a base film. It is an adhesive tape having an agent layer.
  • the thickness of the pressure-sensitive adhesive layer is not particularly limited, but is preferably 5 to 100 ⁇ m, more preferably 5 to 75 ⁇ m, and particularly preferably 5 to 50 ⁇ m.
  • the pressure-sensitive adhesive tape of the present invention is a double-sided pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer made of the pressure-sensitive adhesive composition of the present invention on one side of a substrate and a pressure-sensitive adhesive layer made of a conventional pressure-sensitive adhesive composition on the other side.
  • the double-sided tape remains on the carrier side and does not remain on the component side when the component is peeled after the process.
  • the pressure-sensitive adhesive layer can be formed by cross-linking and curing reaction of the pressure-sensitive adhesive composition.
  • the pressure-sensitive adhesive composition can be applied on a base material and crosslinked and cured by heating or condensation reaction or ultraviolet irradiation to form a pressure-sensitive adhesive layer on the base material.
  • the pressure-sensitive adhesive composition is applied onto a release paper or other film, and is subjected to crosslinking and curing by heating or condensation reaction or ultraviolet irradiation to form a pressure-sensitive adhesive layer.
  • the pressure-sensitive adhesive layer is applied to one or both sides of the substrate. It can also be combined.
  • a solvent may be added.
  • the solvent include aromatic solvents such as toluene and xylene; aliphatic solvents such as hexane, octane and isoparaffin; ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone; ester solvents such as ethyl acetate and isobutyl acetate.
  • ether solvents such as diisopropyl ether and 1,4-dioxane.
  • the coating method is not particularly limited, and a known method may be used. Specific examples thereof include coating using a comma coater, lip coater, roll coater, die coater, knife coater, blade coater, rod coater, kiss coater or gravure coater; screen coating; dip coating; cast coating. It is done.
  • the substrate is not particularly limited, but a film-like substrate is preferable.
  • a resin film having high heat resistance that can be processed at a high temperature is preferable.
  • Specific examples thereof include polyimide (PI), polyetheretherketone (PEEK), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyamideimide (PAI), polyethersulfone ( Examples thereof include resin films such as PES) and polytetrafluoroethylene (PTFE). These films can be used as a single layer or a laminated film of two or more layers. Of these, a polyimide film is preferred.
  • the thickness of the substrate is not particularly limited, but is preferably 5 to 200 ⁇ m, more preferably 5 to 160 ⁇ m, and particularly preferably 5 to 130 ⁇ m.
  • the surface on which the pressure-sensitive adhesive layer of the substrate is provided may be subjected to an easy adhesion treatment as necessary.
  • the easy adhesion treatment include primer treatment, corona treatment, etching treatment, plasma treatment, and sandblast treatment.
  • a release liner may be provided on the adhesive tape of the present invention.
  • the release liner is for protecting the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape, and is peeled off immediately before application, and the pressure-sensitive adhesive is exposed and the pressure-sensitive adhesive tape is attached to the adherend.
  • the kind of release liner is not particularly limited, and a known release liner can be used. Specific examples thereof include those obtained by subjecting the surface of a base material such as fine paper, glassine paper, and synthetic resin film to a release agent treatment.
  • a release agent such as a fluorine-substituted alkyl-modified silicone resin may be used.
  • the release liner to be laminated on the silicone-based pressure-sensitive adhesive layer is preferably one obtained by releasing the surface of the polyethylene terephthalate film with a fluorine-substituted alkyl-modified silicone resin.
  • a resin film that has not been subjected to a release treatment may be used as a release liner.
  • Specific examples thereof include a polyethylene terephthalate (PET) film, a polyethylene (PE) film, and a polypropylene (PP) film.
  • the adhesive tape of the present invention does not leave glue even when used in a high temperature environment and can be peeled off with a light force.
  • the adhesive strength after heating at 300 ° C. measured by the following method of the pressure-sensitive adhesive tape of the present invention is preferably 0.70 N / 10 mm or less, more preferably 0.50 N / 10 mm or less. More detailed measurement conditions are described in the column of Examples described later.
  • Adhesive strength after heating at 300 ° C A 20 mm wide adhesive tape is attached to a heat-resistant glass plate, heated at 300 ° C. for 1 hour, then cooled, and the force (N / 10 mm) required to peel the tape at an angle of 180 ° at a speed of 300 mm / min. taking measurement.
  • the adhesive strength before heating of the adhesive tape of the present invention that is, the adhesive strength at normal temperature (23 ° C.) measured by the following method is not particularly limited, but is preferably 0.01 N / 10 mm or more. is there. (Normal temperature adhesive strength) A 20 mm wide adhesive tape is attached to a heat resistant glass plate, and the force (N / 10 mm) required to peel the tape at an angle of 180 ° at a speed of 300 mm / min is measured.
  • the pressure-sensitive adhesive tape of the present invention is particularly useful for use in a high temperature environment (preferably over 290 ° C., more preferably 300 ° C.).
  • a high temperature environment preferably over 290 ° C., more preferably 300 ° C.
  • the protection of the adherend for example, heat-resistant glass, glass wafer
  • masking temporary fixing, fixing during transportation Applications are listed.
  • the use of the pressure-sensitive adhesive tape of the present invention is not limited to the use in the high temperature environment as described above.
  • plasma processing may be performed in the manufacturing process of various electronic components.
  • the temperature at the time of plasma treatment itself is from room temperature to about 120 ° C., but in that case, the side surface of the end of the adhesive tape may be directly exposed to the plasma, and the adhesive residue tends to be generated at the end due to the influence.
  • the pressure-sensitive adhesive tape of the present invention has a characteristic that it is difficult for adhesive residue to remain, so that the problem can be reduced even when used in a process including plasma treatment. That is, the pressure-sensitive adhesive tape of the present invention is very useful in applications where a problem of adhesive residue occurs due to factors other than temperature.
  • part means “part by mass”.
  • Example 1 a plurality of prototypes (I to IX) of an addition curing type silicone-based adhesive stock solution were prepared.
  • the plurality of prototypes are obtained by appropriately changing the blending ratio of the MQ resin to the silicone raw rubber and the content ratio of the alkenyl group in the silicone raw rubber (and / or the MQ resin), after the crosslinking and curing measured by the method described later.
  • This is a prototype of an adhesive adjusted so that the gel fraction and the degree of swelling exhibit various values.
  • These prototypes all use a common MQ resin.
  • an addition-curable silicone-based adhesive stock solution (I) having a gel fraction after cross-linking and curing of 81% and a swelling degree of 247% was selected and used. .
  • the pressure-sensitive adhesive solution was applied to one side of a primer-treated 25 ⁇ m-thick polyimide (PI) film so that the thickness of the pressure-sensitive adhesive layer after drying was 30 ⁇ m.
  • PI polyimide
  • an untreated PET film having a thickness of 38 ⁇ m was bonded to the adhesive layer as a release liner to obtain an adhesive tape.
  • Example 2 From the plurality of prototypes described above, the addition-curing silicone-based pressure-sensitive adhesive stock solution (II) (solid content concentration 50% by mass) having a gel fraction of 81% after crosslinking and a swelling degree of 207% is selected.
  • a pressure-sensitive adhesive solution (2) was prepared in the same manner as in Example 1 except that it was used in place of the pressure-sensitive adhesive stock solution (I) to prepare a pressure-sensitive adhesive tape.
  • Example 3 Of the plurality of prototypes described above, the addition-curing silicone pressure-sensitive adhesive stock solution (III) (solid content concentration 50% by mass) having a gel fraction after crosslinking and curing of 89% and a swelling degree of 222% is selected.
  • a pressure-sensitive adhesive solution (3) was prepared in the same manner as in Example 1 except that it was used in place of the pressure-sensitive adhesive stock solution (I) to prepare a pressure-sensitive adhesive tape.
  • Example 4 Of the plurality of prototypes described above, the addition-curing silicone pressure-sensitive adhesive stock solution (IV) (solid content concentration: 50% by mass) having a gel fraction after cross-linking and curing of 73% and a swelling degree of 211% A pressure-sensitive adhesive solution (4) was prepared in the same manner as in Example 1 except that it was used in place of the pressure-sensitive adhesive stock solution (I) to prepare a pressure-sensitive adhesive tape.
  • the obtained sample was cut into 50 mm ⁇ 50 mm, the release liner was peeled off, and a measurement sample comprising a sheet-like pressure-sensitive adhesive composition was obtained.
  • Table 1 shows the results of the above measurements.
  • the adhesive tape of Comparative Example 1 had a high gel fraction and a high degree of swelling (that is, a low crosslink density), so that adhesive residue was generated.
  • the adhesive tape of Comparative Example 2 had a gel fraction within the range of the present invention, the degree of swelling was high (that is, the crosslink density was low), and adhesive residue was generated. Moreover, since the gel fraction was lower than that of Comparative Example 1, the increase in adhesive strength after heating at 300 ° C. was larger than that of Comparative Example 1. Such a high adhesive force increases the force required for peeling.
  • the pressure-sensitive adhesive composition of the present invention is particularly useful as a material for forming a pressure-sensitive adhesive layer of a pressure-sensitive adhesive tape, for example.
  • the adhesive tape of the present invention is a process that requires treatment in a high-temperature environment, for example, a surface treatment process of a member such as heat-resistant glass or a manufacturing process of a semiconductor component such as a glass wafer. It is very useful for applications such as fixing during transportation. Furthermore, it is very useful in applications such as a process including plasma treatment where a problem of adhesive residue occurs due to factors other than temperature.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne : une composition adhésive sensible à la pression à base de silicone, qui comprend une structure réticulée de silicone et qui présente une teneur en gel de 70-95 % et un degré de gonflement de 260 % ou moins ; et un ruban adhésif sensible à la pression qui comprend un substrat et, disposée sur au moins une surface correspondante, une couche adhésive sensible à la pression comprenant la composition adhésive sensible à la pression. La composition adhésive sensible à la pression et le ruban adhésif sensible à la pression, même lorsqu'ils sont utilisés dans des environnements à température élevée (par exemple, 300°C), ne laissent pas de résidus adhésifs lors du pelage et peuvent être pelés avec une force légère.
PCT/JP2017/000744 2016-05-16 2017-01-12 Composition adhésive sensible à la pression et ruban adhésif sensible à la pression Ceased WO2017199463A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020187030735A KR102231628B1 (ko) 2016-05-16 2017-01-12 점착제 조성물 및 점착 테이프
JP2018518071A JP6554232B2 (ja) 2016-05-16 2017-01-12 粘着剤組成物及び粘着テープ
CN201780030105.3A CN109196070B (zh) 2016-05-16 2017-01-12 粘着剂组合物和粘着带

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016097677 2016-05-16
JP2016-097677 2016-05-16

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WO2017199463A1 true WO2017199463A1 (fr) 2017-11-23

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JP (1) JP6554232B2 (fr)
KR (1) KR102231628B1 (fr)
CN (1) CN109196070B (fr)
TW (1) TWI738716B (fr)
WO (1) WO2017199463A1 (fr)

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CN108003810A (zh) * 2017-12-18 2018-05-08 昆山裕凌电子科技有限公司 一种高附着力矽胶布与导热硅胶垫片复合材料及其制备方法
CN115362218A (zh) * 2020-03-31 2022-11-18 株式会社寺冈制作所 树脂组合物及粘合带
CN117074296A (zh) * 2023-08-22 2023-11-17 派乐玛光学薄膜(东莞)有限公司 一种有机硅oca离型膜的检测方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114958295A (zh) * 2022-05-16 2022-08-30 江苏至昕新材料有限公司 超低粘合力、低爬升有机硅压敏胶及其制备方法和应用

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TW201807146A (zh) 2018-03-01
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