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WO2017163337A1 - Appareil de chauffage du type pompe à chaleur - Google Patents

Appareil de chauffage du type pompe à chaleur Download PDF

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Publication number
WO2017163337A1
WO2017163337A1 PCT/JP2016/059202 JP2016059202W WO2017163337A1 WO 2017163337 A1 WO2017163337 A1 WO 2017163337A1 JP 2016059202 W JP2016059202 W JP 2016059202W WO 2017163337 A1 WO2017163337 A1 WO 2017163337A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
evaporator
refrigerant
switching valve
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2016/059202
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English (en)
Japanese (ja)
Inventor
裕輔 島津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to PCT/JP2016/059202 priority Critical patent/WO2017163337A1/fr
Priority to DE112016006644.9T priority patent/DE112016006644B4/de
Priority to GB1811796.0A priority patent/GB2563511B/en
Priority to JP2018506677A priority patent/JP6567166B2/ja
Publication of WO2017163337A1 publication Critical patent/WO2017163337A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B30/00—Heat pumps
    • F25B30/02—Heat pumps of the compression type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D3/00—Hot-water central heating systems
    • F24D3/18—Hot-water central heating systems using heat pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H4/00—Fluid heaters characterised by the use of heat pumps
    • F24H4/02—Water heaters
    • F24H4/04—Storage heaters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B47/00—Arrangements for preventing or removing deposits or corrosion, not provided for in another subclass
    • F25B47/02—Defrosting cycles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B6/00—Compression machines, plants or systems, with several condenser circuits
    • F25B6/04—Compression machines, plants or systems, with several condenser circuits arranged in series
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2339/00—Details of evaporators; Details of condensers
    • F25B2339/04—Details of condensers
    • F25B2339/047—Water-cooled condensers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • F25B25/005—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00 using primary and secondary systems

Definitions

  • the present invention relates to a heat pump type heating device.
  • Patent Document 1 discloses a hot water storage type hot water supply apparatus that heats an evaporator with warm water from a hot water storage tank as a defrosting operation.
  • the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a heat pump heating device that can suppress the generation of frost in the evaporator while continuing the heating operation. It is.
  • the heat pump heating device heats a room by supplying heat to a heating terminal.
  • the heat pump heating device includes a refrigeration cycle, a heat exchange unit, a heat radiating unit, and a blower.
  • the refrigeration cycle is configured to circulate the first refrigerant in the order of the compressor, the condenser, the expansion valve, and the evaporator.
  • a heat exchange part is comprised so that the 2nd refrigerant
  • the heat radiating unit is configured to release heat of the second refrigerant flowing from the heating terminal to the heat exchange unit.
  • the blower is configured to blow air from the heat radiating unit to the evaporator.
  • the residual heat of the second refrigerant during the heating operation can be used for heating the evaporator. Therefore, the evaporator can be heated while continuing the heating operation to suppress the generation of frost, and the user's comfort can be improved.
  • FIG. 6 is a Ph diagram showing the relationship between the pressure of the primary refrigerant circulating in the refrigeration cycle and enthalpy. It is a figure for comparing the heating capability of a heat pump type heating device, and a coefficient of performance COP (Coefficient Of Performance). It is a flowchart for demonstrating the process which controls the switching valve performed by a control apparatus. It is a functional block diagram which shows the structure of the heat pump type heating apparatus which concerns on the modification of embodiment.
  • FIG. 1 is a configuration diagram of a heat pump heating device 1 according to an embodiment.
  • the heat pump heating device 1 includes a refrigeration cycle 10, a pump 20, a cooler 32, a switching valve 40, a fan 50, and a control device 100.
  • the refrigeration cycle 10 includes a compressor 11, a condenser 12, an expansion valve 13, and an evaporator 14.
  • the primary refrigerant circulates in the order of the compressor 11, the condenser 12, the expansion valve 13, and the evaporator 14.
  • a heat exchanger 31 is incorporated in the condenser 12.
  • the primary refrigerant (for example, R32) releases heat to the secondary refrigerant that passes through the heat exchange unit 31 in the condenser 12.
  • the secondary refrigerant that has received heat from the primary refrigerant is output to the heating terminal 70 (for example, a fan coil or a radiator) by the pump 20.
  • the heating terminal 70 is warmed by the heat released from the secondary refrigerant.
  • the secondary refrigerant that has released heat to the heating terminal 70 returns to the condenser 12, receives heat from the primary refrigerant again, and is output to the heating terminal 70 by the pump 20.
  • the cooler 32 is connected to the heat exchange unit 31 and the heating terminal 70.
  • a switching valve 40 is connected in the middle of the flow path that branches from the flow path connecting the cooler 32 and the heating terminal 70 and is connected to the heat exchange unit 31.
  • the secondary refrigerant is, for example, water or brine.
  • Brine is an antifreeze having a freezing point lower than 0 ° C., and includes, for example, a sodium chloride aqueous solution, a calcium chloride aqueous solution, or an ethylene glycol aqueous solution.
  • the compressor 11 compresses and outputs a gaseous primary refrigerant (gas refrigerant) from the evaporator 14.
  • the drive frequency of the compressor 11 is controlled by the control device 100, and the amount of refrigerant discharged per unit time is controlled.
  • the condenser 12 the high-temperature and high-pressure gas refrigerant from the compressor 11 is cooled and condensed, and a liquid primary refrigerant (liquid refrigerant) is output.
  • the condenser 12 releases heat (condensation heat) when the gas refrigerant is condensed to the secondary refrigerant.
  • the expansion valve 13 adiabatically expands the liquid refrigerant from the condenser 12 to reduce the pressure.
  • the opening degree of the expansion valve 13 is adjusted by the control device 100.
  • the primary refrigerant decompressed by the expansion valve 13 is in a gas-liquid two-phase state (wet steam).
  • the expansion valve 13 is, for example, an electronically controlled expansion valve (LEV: Linear Expansion Valve).
  • the evaporator 14 receives heat from the outside air through heat exchange, and evaporates the liquid refrigerant contained in the wet steam from the expansion valve 13. A gas refrigerant is output from the evaporator 14. The evaporator 14 takes heat (evaporation heat) from the surrounding air and evaporates the liquid refrigerant.
  • the fan 50 promotes the air flow from the cooler 32 to the evaporator 14 by blowing air.
  • the fan 50 may be arranged to blow air to the cooler 32 as shown in FIG. 1 or may be arranged to suck air from the evaporator 14.
  • the control device 100 controls the opening degree of the expansion valve 13 so that, for example, the superheat degree of the refrigerant output from the evaporator 14 approaches the target superheat degree (superheat degree control).
  • the control device 100 controls the pump 20 to output the secondary refrigerant to the heating terminal.
  • the control device 100 controls the drive frequency of the compressor 11 so that the temperature of the refrigerant that has passed through the condenser 12 becomes a constant temperature, and adjusts the amount of refrigerant that is output from the compressor 11 per unit time. To do.
  • the control device 100 controls the fan 50 and sends air to the cooler 32.
  • the control device 100 controls opening and closing of the switching valve 40.
  • the control device 100 receives the temperature around the evaporator 14 from the temperature sensor 60. Even when the heating operation of the heat pump heating device 1 is stopped, the control device 100 circulates the secondary refrigerant intermittently to prevent the secondary refrigerant from freezing.
  • frost When the temperature around the evaporator decreases, frost may be generated in the evaporator. It is known that when frost is generated in the evaporator, the heat exchange efficiency in the evaporator is lowered and the capacity of the refrigeration cycle is lowered. In such a case, the heat pump heating device performs a defrosting operation for removing frost generated in the evaporator. Examples of the defrosting operation include a method of reversing the circulation of the primary refrigerant in the refrigeration cycle or using hot water heated by a heating terminal.
  • the normal operation of the refrigeration cycle 10 is normally stopped in order to stop heat absorption by the evaporator and complete the defrosting quickly. If the defrosting operation is frequently performed, the continuation of the heating operation is hindered, and thus the user's comfort may be impaired.
  • the evaporator 14 is heated using the residual heat of the secondary refrigerant during the heating operation, and the generation of frost in the evaporator 14 is suppressed. As a result, heating operation can be performed continuously, and user comfort can be improved.
  • the secondary refrigerant returned from the heating terminal 70 returns to the condenser 12 after passing through the cooler 32 when the switching valve 40 is closed.
  • the cooler 32 cools the secondary refrigerant.
  • the secondary refrigerant releases heat when passing through the cooler 32.
  • the air warmed by the heat is blown to the evaporator 14 by the fan 50.
  • the evaporator 14 is heated by the air.
  • the switching valve 40 When the switching valve 40 is open, the flow path passing through the cooler 32 has a higher flow path resistance than the flow path passing through the switching valve 40, so that most of the secondary refrigerant returned from the heating terminal 70 is switched. It is input to the condenser 12 via the valve 40. When the switching valve 40 is open, the evaporator 14 is hardly heated by the secondary refrigerant.
  • the cooler 32 when the switching valve 40 is closed, the cooler 32 further takes heat from the secondary refrigerant that has released heat to the heating terminal 70, and the evaporator 14 is heated using the heat.
  • the temperature of the secondary refrigerant input to the condenser 12 is lower when the switching valve 40 is closed than when the switching valve 40 is open.
  • condensation is performed more than when the switching valve 40 is open. It is necessary to give much heat to the secondary refrigerant in the vessel 12.
  • the compressor 11 of the refrigeration cycle 10 is controlled by the control device 100 so that the amount of work (energy) performed on the primary refrigerant is higher when the switching valve 40 is closed than when the switching valve 40 is open. Be controlled.
  • FIG. 2 is a Ph diagram showing the relationship between the pressure of the primary refrigerant circulating in the refrigeration cycle 10 and enthalpy.
  • a curve LC is a saturated liquid line of the primary refrigerant.
  • a curve GC is a saturated vapor line of a single primary refrigerant.
  • Point CP is the critical point of the primary refrigerant.
  • the critical point is a point indicating a limit of a range in which a phase change can occur between the liquid refrigerant and the gas refrigerant, and is an intersection of the saturated liquid line and the saturated vapor line.
  • the pressure of the primary refrigerant becomes higher than the pressure at the critical point, no phase change occurs between the liquid refrigerant and the gas refrigerant.
  • the primary refrigerant is liquid, and in the region where the enthalpy is higher than the saturated vapor line, the primary refrigerant is a gas.
  • the primary refrigerant In the region sandwiched between the saturated liquid line and the saturated vapor line, the primary refrigerant is in a gas-liquid two-phase state (wet steam).
  • the circulation of the primary refrigerant is from point R11 to point R12, point R13, and point. It is represented as a cycle C1 (broken line) that returns to point R11 via R14.
  • the state change from the point R11 to the point R12 represents the process of compression of the primary refrigerant by the compressor 11.
  • the state change from the point R12 to the point R13 represents the process of condensing the primary refrigerant by the condenser 12.
  • the state change from the point R13 to the point R14 represents the process of adiabatic expansion of the primary refrigerant by the expansion valve 13.
  • the state change from the point R14 to the point R11 represents the process of evaporation of the primary refrigerant by the evaporator 14.
  • the state change from the point R21 to the point R22 represents the process of compression of the primary refrigerant by the compressor 11.
  • the state change from the point R22 to the point R23 represents the process of condensing the primary refrigerant by the condenser 12.
  • the state change from the point R23 to the point R24 represents the process of adiabatic expansion of the primary refrigerant by the expansion valve 13.
  • the state change from the point R24 to the point R21 represents the process of evaporation of the primary refrigerant by the evaporator 14.
  • the state of the point R22 is the point R21 with respect to the end point of the adiabatic compression process by the compressor 11. Both the enthalpy and pressure are higher than the state of. This is a result of the compressor 11 being controlled by the control device 100 so as to compress the primary refrigerant when the switching valve 40 is closed rather than when it is open.
  • the state at the point R23 has a smaller enthalpy than the state at the point R13. This is because when the switching valve 40 is closed, the secondary refrigerant returned from the heating terminal 70 passes through the cooler 32, so that the temperature of the secondary refrigerant input to the condenser 12 is low. Lower than if you are.
  • the primary refrigerant that has passed through the condenser 12 is cooled when the switching valve 40 is closed rather than when the switching valve 40 is open. As a result, the degree of supercooling is higher when the switching valve 40 is closed than when the switching valve 40 is open, and the enthalpy is smaller at the point R23 than at the point R13. .
  • the switching valve 40 when the evaporator valve 14 is heated using the secondary refrigerant with the switching valve 40 closed, the amount of work (energy) performed by the compressor 11 on the primary refrigerant increases. That is, the energy consumed by the heat pump heating device 1 increases. Therefore, if the switching valve 40 is closed and the evaporator 14 is heated using the secondary refrigerant, the efficiency of the heat pump heating device 1 is lowered. So, in embodiment, when the heating capability of the heat pump type heating apparatus 1 can be improved by suppressing generation
  • FIG. 3 is a diagram for comparing the heating capacity of the heat pump type heating device 1 with a coefficient of performance COP (Coefficient Of Performance).
  • the heating capacity of the heat pump heating device 1 is the amount of heat that the heating terminal receives from the secondary refrigerant.
  • the COP of the heat pump heating device 1 is a ratio between the heating capacity and the energy given to the primary refrigerant by the compressor 11 and is an index indicating the efficiency of the heat pump heating device 1.
  • the graph shown in FIG. 3 can be obtained by actual machine experiments or simulations.
  • FIG. 3A is a diagram showing the relationship between the heating capacity and the temperature around the evaporator 14.
  • a curve PN indicates a case where it is assumed that no frost is generated in the evaporator 14.
  • a curve PC indicates a case where the switching valve 40 is closed.
  • a curve PO shows a case where the switching valve 40 is open.
  • the heating capacity is when the switching valve 40 is closed. Is larger than when it is open.
  • the temperature T is lower than the temperature T1, the humidity is low, so that the evaporator 14 is unlikely to generate frost.
  • the heating capacity hardly changes between when the switching valve 40 is closed and when it is open. Further, when the temperature T is higher than the temperature T2, the temperature is sufficiently higher than 0 ° C., which is the freezing point of water, so that the heating capacity hardly changes between when the switching valve 40 is closed and when it is open.
  • FIG. 3B is a diagram showing the relationship between the COP and the ambient temperature of the evaporator 14.
  • the curve EN shows the case where it assumes that frost does not generate
  • FIG. A curve EC indicates a case where the switching valve 40 is closed.
  • a curve EO indicates a case where the switching valve 40 is open. As shown in FIG. 3B, the COP when the switching valve 40 is closed is lower than the COP when the switching valve 40 is open. That is, if the switching valve 40 is closed and the evaporator 14 is heated using the residual heat of the secondary refrigerant, the efficiency of the heat pump heating device 1 decreases.
  • the heating capacity (FIG. 3 (a)) is improved because the temperature T around the evaporator 14 is changed from the temperature T1 to the temperature T2. This is a case where there is an interval (T1 ⁇ T ⁇ T2). Therefore, in the embodiment, when the temperature T around the evaporator 14 is between the temperature T1 and the temperature T2 (T1 ⁇ T ⁇ T2), the switching valve 40 is closed and the cooler 32 is used as the secondary refrigerant. The evaporator 14 is heated through.
  • FIG. 4 is a flowchart for explaining processing for controlling opening and closing of the switching valve 40 performed by the control device 100.
  • the process shown in FIG. 3 is performed by a main routine (not shown) executed by the control device 100 for controlling the heat pump heating device 1.
  • step (hereinafter simply referred to as S) S101 the control device 100 measures the temperature T around the evaporator 14 with the temperature sensor 60, and advances the process to S102.
  • the control device 100 determines whether or not the temperature T is higher than the reference temperature T1 and lower than the reference temperature T2.
  • control device 100 closes switching valve 40 and warms evaporator 14 in S103 to suppress the generation of frost. Return processing to the main routine.
  • control device 100 opens switching valve 40 in S104 and stops heating evaporator 14.
  • the COP is lowered by cooling the secondary refrigerant in the cooler 32.
  • the temperature T around the evaporator 14 is between the temperature T1 and the temperature T2 (T1 ⁇ T ⁇ T2). It can be limited to the case.
  • generation of frost in the evaporator 14 can be suppressed while continuing the heating operation.
  • heating operation can be performed continuously, and user comfort can be improved.
  • the heat exchange unit 31 may be separated from the condenser 12.
  • the switching valve 40 is not an essential component in the present invention.
  • the secondary refrigerant returned from the heating terminal may be input to the cooler 32 without including the switching valve 40 as in the heat pump heating device 1A shown in FIG. According to the heat pump heating device 1A, since the switching valve is unnecessary, the manufacturing cost can be suppressed.
  • the switching valve 40 may be controlled based on the humidity around the evaporator 14.
  • the switching valve 40 may be controlled based on the temperature and humidity around the evaporator 14.
  • the ventilation resistance in the evaporator 14 can be reduced by making the fin pitch of the cooler 32 larger than the fin pitch of the evaporator 14. Or the ventilation resistance of the evaporator 14 in suppressing the raising and raising of the fin of the cooler 32 from the raising and raising of the fin of the evaporator 14 can be reduced.
  • 1,1A heat pump heating device 10 refrigeration cycle, 11 compressor, 12 condenser, 13 expansion valve, 14 evaporator, 20 pump, 31 heat exchange section, 32 cooler, 40 switching valve, 50 fan, 70 heating terminal , 100 control unit, T1, T2 reference temperature.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Heat-Pump Type And Storage Water Heaters (AREA)
  • Steam Or Hot-Water Central Heating Systems (AREA)
  • Defrosting Systems (AREA)

Abstract

La présente invention concerne un appareil de chauffage (1) du type pompe à chaleur qui apporte de la chaleur à un terminal de chauffage (70). L'appareil de chauffage (1) du type pompe à chaleur comprend un cycle de refroidissement (10), une partie échange de chaleur (31), une partie dissipation de chaleur (32) et un dispositif de soufflage d'air (50). Le cycle de refroidissement (10) est conçu pour permettre la circulation d'un premier agent de refroidissement à travers un compresseur (11), un condenseur (12), un détendeur (13) et un évaporateur (14), dans cet ordre. La partie échange de chaleur (31) est conçue pour chauffer, au moyen de la chaleur en provenance du condenseur (12), un second agent de refroidissement coulant vers le terminal de chauffage (70). La partie dissipation de chaleur (32) est conçue pour dissiper la chaleur du second agent de refroidissement coulant du terminal de chauffage (70) vers la partie échange de chaleur (31). Le dispositif de soufflage d'air (50) est conçu pour souffler de l'air de la partie dissipation de chaleur (32) à l'évaporateur (14).
PCT/JP2016/059202 2016-03-23 2016-03-23 Appareil de chauffage du type pompe à chaleur Ceased WO2017163337A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2016/059202 WO2017163337A1 (fr) 2016-03-23 2016-03-23 Appareil de chauffage du type pompe à chaleur
DE112016006644.9T DE112016006644B4 (de) 2016-03-23 2016-03-23 Heizvorrichtung vom wärmepumpentyp
GB1811796.0A GB2563511B (en) 2016-03-23 2016-03-23 Heat pump type heater
JP2018506677A JP6567166B2 (ja) 2016-03-23 2016-03-23 ヒートポンプ式暖房装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/059202 WO2017163337A1 (fr) 2016-03-23 2016-03-23 Appareil de chauffage du type pompe à chaleur

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WO2017163337A1 true WO2017163337A1 (fr) 2017-09-28

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DE (1) DE112016006644B4 (fr)
GB (1) GB2563511B (fr)
WO (1) WO2017163337A1 (fr)

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US20240418422A1 (en) * 2023-06-13 2024-12-19 Trane International Inc. Thermal system having hydronic system heat exchange

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JPH06273008A (ja) * 1993-03-16 1994-09-30 Osaka Gas Co Ltd 空気調和装置
JP2001012829A (ja) * 1999-06-30 2001-01-19 Sanyo Electric Co Ltd ヒートポンプ式空気調和機
JP2005077051A (ja) * 2003-09-03 2005-03-24 Sharp Corp ヒートポンプ式給湯機
JP2008032346A (ja) * 2006-07-31 2008-02-14 Sanden Corp 給湯装置
JP2012007751A (ja) * 2010-06-22 2012-01-12 Fujitsu General Ltd ヒートポンプサイクル装置
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WO2015118580A1 (fr) * 2014-02-10 2015-08-13 三菱電機株式会社 Dispositif d'alimentation en eau chaude d'une pompe à chaleur

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DE112016006644T5 (de) 2018-12-13
JP6567166B2 (ja) 2019-08-28
GB201811796D0 (en) 2018-09-05
GB2563511B (en) 2020-06-03
JPWO2017163337A1 (ja) 2018-11-29
DE112016006644B4 (de) 2021-11-04
GB2563511A (en) 2018-12-19

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