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WO2017018103A1 - Procédé de fabrication de carte de câblage, et carte de câblage - Google Patents

Procédé de fabrication de carte de câblage, et carte de câblage Download PDF

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Publication number
WO2017018103A1
WO2017018103A1 PCT/JP2016/068543 JP2016068543W WO2017018103A1 WO 2017018103 A1 WO2017018103 A1 WO 2017018103A1 JP 2016068543 W JP2016068543 W JP 2016068543W WO 2017018103 A1 WO2017018103 A1 WO 2017018103A1
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WIPO (PCT)
Prior art keywords
free energy
surface free
pattern
compound
region
Prior art date
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Ceased
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PCT/JP2016/068543
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English (en)
Japanese (ja)
Inventor
牧八 伊藤
亮介 遠藤
後藤　一夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
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Dexerials Corp
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Publication date
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Priority claimed from JP2016123571A external-priority patent/JP6825832B2/ja
Publication of WO2017018103A1 publication Critical patent/WO2017018103A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Definitions

  • the present invention relates to a method for manufacturing a wiring board and a wiring board for forming a conductor pattern on a base material on which a surface free energy difference of an original plate is transferred.
  • This application includes Japanese Patent Application No. 2015-150835 filed on July 30, 2015 in Japan and Japanese Patent Application No. 2016-123571 filed on June 22, 2016 in Japan. And claims this priority, which is incorporated herein by reference.
  • Control of wettability is achieved by controlling surface free energy, and various methods have been proposed. Among them, a substrate having a pattern of surface free energy difference has been proposed.
  • Patent Document 1 describes a technique in which a surface is modified with radiation or generated ozone through a mask, a pattern is formed by a surface free energy difference, ink is applied to the surface, and coating is performed separately.
  • the surface free energy difference is formed on the base material, since the surface free energy difference is small, when ink is applied to the surface, complete coating cannot be performed, It is only possible to make a difference in the film thickness of the coating film.
  • Patent Document 2 a low surface free energy part is partially created by exposure due to a difference in light transmittance of a Fresnel lens, and then an unexposed part is exposed in water to thereby obtain a high surface free energy part.
  • Techniques for forming are described.
  • a technique is described in which a pattern is formed by applying ink to a pattern created there and then peeling off unnecessary ink.
  • a surface free energy difference is formed on the base material as in Patent Document 1, it is not possible to separate the ink by simply applying ink on the surface. It is necessary to remove the ink from a portion (a portion having a low surface free energy) where it is not desired to adhere the ink.
  • Patent Document 3 discloses a technique in which a surface is partially modified with radiation through a mask to form a pattern due to a surface free energy difference, and then a pattern is formed by transfer with heating and pressurization. Are listed. However, in the technique described in Patent Document 3, a pattern is formed by transferring a functional ink layer to a surface free energy pattern. However, heating and pressurization are required at the time of transfer, and a surplus is removed. is required.
  • Patent Document 4 describes a technique for selectively applying a coating composition to a coating film to which a pattern of a surface free energy difference of an original plate is transferred.
  • a coating composition exhibiting a high surface tension for example, a water-based conductive coating composition to form a pattern.
  • the present invention has been proposed in view of such a conventional situation, and a method of manufacturing a wiring board and a wiring that can easily form a pattern even when a coating composition exhibiting a high surface tension is used. Providing a substrate.
  • a method for manufacturing a wiring board according to the present invention includes a first compound that exhibits low surface free energy and a second compound that exhibits higher surface free energy than the first compound.
  • the wiring board according to the present invention includes a base material having a pattern of a high surface free energy region and a low surface free energy region, and a conductor pattern formed on the high surface free energy region, the high surface free energy
  • the surface free energy in the energy region is higher than 62 mJ / m 2 .
  • the manufacturing method of the pattern formation body which concerns on this invention is resin containing the 1st compound which expresses low surface free energy, and the 2nd compound which expresses surface free energy higher than the said 1st compound.
  • the composition is brought into contact with an original plate on which a desired surface free energy difference pattern is formed and cured to obtain a substrate on which the surface free energy difference pattern of the original plate is transferred, and pattern transfer of the substrate
  • the surface free energy of the region is higher than 62 mJ / m 2 .
  • the pattern forming body according to the present invention comprises a substrate having a pattern of a high surface free energy region and a low surface free energy region, and a pattern formed on the high surface free energy region, and the high surface free energy
  • the surface free energy in the energy region is higher than 62 mJ / m 2 .
  • the base material according to the present invention is cured by a resin composition containing a first compound that expresses low surface free energy and a second compound that expresses higher surface free energy than the first compound.
  • the substrate thus formed has a pattern of a high surface free energy region and a low surface free energy region, and the surface free energy of the high surface free energy region is higher than 62 mJ / m 2 .
  • the resin composition according to the present invention contains a first compound that expresses low surface free energy and a second compound that expresses higher surface free energy than the first compound, and the second compound.
  • the compound contains monofunctional (meth) acrylate, and the content of the monofunctional (meth) acrylate is 40 to 70 parts by mass with respect to 100 parts by mass of the second compound.
  • the surface free energy in the high surface free energy region of the substrate is high, a coating composition exhibiting high surface tension can be used, and a pattern can be easily formed.
  • FIG. 1 is a cross-sectional view illustrating an outline of a coating process for coating a resin composition on a support film.
  • FIG. 2 is a cross-sectional view showing an outline of a curing step in which the resin composition is cured by contacting the original plate.
  • FIG. 3 is a cross-sectional view showing an example of a substrate to which a pattern is transferred.
  • FIG. 4 is a cross-sectional view showing an example of a wiring board having a conductor pattern formed on the surface of a base material.
  • FIG. 5 is a perspective view showing an outline of the original A.
  • FIG. FIG. 6 is a cross-sectional view schematically showing a transfer process for transferring the pattern of the original A.
  • FIG. 7 is an observation image of the conductor pattern formed on the base material A3 in Example 1 with an optical microscope.
  • FIG. 8 is an observation image of the conductor pattern formed on the base material A4 in Example 2 with an optical microscope.
  • FIG. 9 is an observation image of the conductor pattern formed on the base material A1 in Comparative Example 1 with an optical microscope.
  • FIG. 10 is an observation image of the conductor pattern formed on the base material A2 in Comparative Example 2 with an optical microscope.
  • the manufacturing method of the wiring board which concerns on one embodiment of this invention contains the 1st compound which expresses low surface free energy, and the 2nd compound which expresses surface free energy higher than a 1st compound.
  • a resin composition is brought into contact with an original plate on which a desired surface free energy difference pattern is formed and cured to obtain a substrate on which the surface free energy difference pattern of the original plate is transferred, and pattern transfer of the substrate
  • the substrate has a pattern of a high surface free energy region and a low surface free energy region, and the surface free energy of the high surface free energy region is higher than 62 mJ / m 2 , thereby exhibiting a high surface tension.
  • a composition can be used, for example, an aqueous conductive coating composition can be selectively applied to form a conductive pattern.
  • a resin composition containing a first compound that expresses low surface free energy and a second compound that expresses higher surface free energy than the first compound is prepared.
  • the resin composition include an acrylic resin and an epoxy resin.
  • a photo-curable acrylic resin composition having a fast curing reaction is preferably used.
  • a photocurable acrylic resin composition containing a first compound, a second compound, and a photopolymerization initiator will be described as an example.
  • a fluororesin compound such as a perfluoropolyether derivative or a silicone resin compound is preferably used.
  • fluororesin compounds include perfluoropolyether group-containing (meth) acrylates and perfluoroalkyl group-containing (meth) acrylates
  • silicone resin compounds include polydimethylsiloxane-containing (meth) acrylates and polyalkyls. Examples thereof include siloxane-containing (meth) acrylate. These may be used alone or in combination of two or more.
  • perfluoropolyether group-containing (meth) acrylates can be preferably used from the viewpoint of solubility and the like.
  • examples of commercially available perfluoropolyether group-containing (meth) acrylates include the trade name “KY-1203” (Shin-Etsu Chemical Co., Ltd.).
  • (meth) acrylate is meant to include acrylic acid ester (acrylate) and methacrylic acid ester (methacrylate).
  • the content of the first compound in the resin composition is too small, a pattern of surface free energy difference cannot be obtained. If the content is too large, the surface free energy difference tends to decrease. It is 0.01 mass part or more and 30 mass parts or less with respect to 100 mass parts, More preferably, it is 0.1 mass part or more and 10 mass parts or less.
  • the 2nd compound should just be a compound which expresses higher surface free energy than the 1st compound, for example, monofunctional (meth) acrylate, bifunctional (meth) acrylate, trifunctional or more (meth) acrylate, etc. Is mentioned.
  • Examples of monofunctional (meth) acrylates include polyalkylene glycol ester monomers and alkyl (meth) acrylates having a linear or branched alkyl group.
  • Specific examples of the polyalkylene glycol ester monomer include, for example, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, polybutylene glycol mono ( (Meth) acrylate, polyethylene glycol polypropylene glycol mono (meth) acrylate and the like can be mentioned, and one or more of these can be used.
  • polyethylene glycol mono (meth) acrylate can be preferably used in terms of reactivity, crosslinkability, surface hardness, and the like.
  • examples of commercially available products of polyethylene glycol mono (meth) acrylate include trade name “AE-400” (NOF Co., Ltd.).
  • bifunctional (meth) acrylate examples include, for example, tricyclodecane dimethanol di (meth) acrylate, dimethylol-tricyclodecane di (meth) acrylate, bisphenol AEO-modified di (meth) acrylate, 1,9-nonane.
  • tri- or higher functional (meth) acrylates include pentaerythritol tri (meth) acrylate, propylene glycol-modified glycerin triacrylate, EO-modified pentaerythritol tri (meth) acrylate, isocyanuric acid EO-modified tri (meth) ) Acrylate, ⁇ -caprolactone modified tris-(-2-acryloxyethyl) isocyanurate, trimethylolpropane tri (meth) acrylate, ⁇ -caprolactone modified tris (acryloxyethyl) (meth) acrylate, ethoxylated (20) tri Methylolpropane tri (meth) acrylate, propoxylated (3) trimethylolpropane tri (meth) acrylate, propoxylated (6) trimethylolpropane tri (meth) acrylate, ethoxylated (9) trimethyl Roll propane tri (meth) acrylate
  • pentaerythritol tri (meth) acrylate and propylene glycol-modified glycerin triacrylate can be preferably used in terms of reactivity, crosslinkability, surface hardness, and the like.
  • examples of commercially available products of pentaerythritol tri (meth) acrylate include the trade name “TMM-3” (Shin Nakamura Chemical Co., Ltd.).
  • examples of commercially available products of propylene glycol-modified glycerin triacrylate include the trade name “ OTA-480 "(Daicel Ornex Co., Ltd.).
  • the second compound contains monofunctional (meth) acrylate, and the content of monofunctional (meth) acrylate is preferably 40 to 70 parts by mass with respect to 100 parts by mass of the second compound.
  • the content of the monofunctional (meth) acrylate is too small, it is difficult to obtain high surface free energy.
  • the content is too large, the reactivity, crosslinkability and the like tend to decrease.
  • the photopolymerization initiator can be appropriately selected from known radical photopolymerization initiators.
  • Examples of the photopolymerization initiator include ⁇ -hydroxyalkylphenone, benzyldimethyl ketal, ⁇ -aminoalkylphenone, and the like, and one or more of these can be used.
  • photopolymerization initiators available on the market include ⁇ -hydroxyalkylphenone, 1-hydroxy-cyclohexyl-phenyl-ketone (IRGACURE 184, BASF Japan Ltd.), 2-hydroxy-2 -Methyl-1-phenyl-propan-1-one (DAROCUR 1173, BASF Japan Ltd.), 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1 -Propan-1-one (IRGACURE 2959, BASF Japan Ltd.), 2-hydroxy-1- ⁇ 4- [2-hydroxy-2-methyl-propionyl] -benzyl ⁇ phenyl ⁇ -2-methyl- Propan-1-one (IRGACURE 127, BA F Japan Co., Ltd.), and the like.
  • benzyldimethyl ketal examples include 2,2-dimethoxy-1,2-diphenylethane-1-one (IRGACURE 651, BASF Japan Ltd.). Further, as ⁇ -aminoalkylphenone, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one (IRGACURE 907, BASF Japan Ltd.), 2-benzyl-2 -Dimethylamino-1- (4-morpholinophenyl) -butanone-1 (IRGACURE 369, BASF Japan K.K.) and the like. Among these, 1-hydroxy-cyclohexyl-phenyl-ketone (IRGACURE 184, BASF Japan Ltd.) is preferably used from the viewpoint of realizing smooth photocuring.
  • the content of the photopolymerization initiator in the resin composition is too small, there is a tendency that the adhesiveness is lowered or the hardness is insufficient due to a decrease in hardness performance. Since there exists a tendency, Preferably they are 0.1 mass part or more and 10 mass parts or less with respect to 100 mass parts of 2nd compounds, More preferably, they are 1 mass part or more and 5 mass parts or less.
  • the resin composition contains additives such as a solvent, a leveling agent, a hue adjusting agent, a colorant, an ultraviolet absorber, an antistatic agent, and various thermoplastic resin materials as long as the effects of the present invention are not impaired. Can do.
  • FIG. 1 is a cross-sectional view showing an outline of a coating process for coating a resin composition on a support film.
  • a bar coater, spray coater, spin coater or the like can be used for coating.
  • the support film 11 is not particularly limited, and PET (Polyethylene terephthalate), glass, polyimide, or the like can be used. Moreover, although either a transparent material or an opaque material can be used, ultraviolet rays can be irradiated from the support film 11 side by using a transparent material that transmits ultraviolet rays.
  • the resin composition 12 contains the first compound, the second compound, and the photopolymerization initiator, and the first compound is present on the surface.
  • a fluororesin type compound is illustrated as a 1st compound, it is not limited to this.
  • the resin composition 12 is brought into contact with the original 20 and cured to obtain a substrate on which the pattern of the surface free energy difference of the original 20 is transferred.
  • FIG. 2 is a cross-sectional view showing an outline of a curing step in which the resin composition is cured by contacting the original plate.
  • the resin composition 12 is brought into contact with the original plate 20 on which the pattern due to the surface free energy difference is formed and cured to form a cured resin layer on which the pattern of the original plate 20 is transferred on the support film 11.
  • the original plate 20 has a high surface free energy region 21 and a low surface free energy region 22 on the surface.
  • the high surface free energy region 21 is a region such as a metal oxide including a metal such as silicon, aluminum, or copper, glass, silicon oxide, or aluminum oxide
  • the low surface free energy region 22 is, for example, a fluorine coating, This is a region of a low surface free energy coating film such as a silicone coating, or an inert gas such as nitrogen or carbon dioxide.
  • the material of the original 20 is preferably glass that can be easily coated with fluorine. Further, the surface of the original 20 is preferably smooth.
  • the interface state between the original 20 and the resin composition 12 tends to decrease ⁇ in the following formula (1).
  • the first compound on the 12 surface moves to the low surface free energy region 21 of the original 20, and the second compound moves to the high surface free energy region 22.
  • a fluororesin type compound is illustrated as a 1st compound in FIG. 2, it is not limited to this.
  • ⁇ ⁇ m ⁇ i (1)
  • ⁇ m the surface free energy on the surface of the original 20
  • ⁇ i the surface free energy on the surface of the resin composition 12.
  • the base material 13 made of a cured resin layer having the pattern of the original plate 20 transferred onto the support film 11 can be obtained.
  • the curing method of the resin composition 12 can be appropriately selected according to the type of the resin, and irradiation with energy rays such as heat and ultraviolet rays can be used.
  • FIG. 3 is a cross-sectional view showing an example of a substrate to which a pattern is transferred.
  • a fluororesin type compound is illustrated as a 1st compound, it is not limited to this.
  • the base material 13 has a pattern of a high surface free energy region a and a low surface free energy region b on the surface of the cured resin layer.
  • the substrate 13 is obtained by curing a resin composition containing a first compound that expresses low surface free energy and a second compound that expresses higher surface free energy than the first compound. Have a high surface free energy region a and a low surface free energy region b.
  • region b are optically smooth surfaces, and the level
  • the high surface free energy region a is higher than 62 mJ / m 2 , and the difference in surface free energy between the high surface free energy region a and the low surface free energy region b is preferably 30 mJ / m 2 or more. More specifically, the surface free energy of the high surface free energy region a is preferably 63 to 80 mJ / m 2 , and more preferably 66 to 75 mJ / m 2 .
  • the surface free energy of a low surface free energy area b is preferably from 10 ⁇ 25mJ / m 2, and more preferably 10 ⁇ 20mJ / m 2.
  • the conductive coating composition can be selectively applied to the high surface free energy region a by using a simple construction method, for example, a printing method such as dipping, without using a complicated apparatus.
  • a simple construction method for example, a printing method such as dipping
  • an aqueous coating composition exhibiting a high surface tension can be used, and the variation of the coating composition can be increased. it can.
  • the conductive coating composition is applied to the pattern transfer surface of the substrate to form a conductor pattern.
  • the conductor pattern is selectively formed on the high surface free energy portion or the low surface free energy portion.
  • Examples of the coating method of the conductive coating composition include dip coating, spin coating, flow coating, spray coating, squeegee method, etc. Among these, it is preferable to use dip coating with a simple apparatus.
  • the conductive coating composition is selectively applied to a high surface free energy region or a low surface free energy region on the substrate surface, and becomes a conductor pattern by drying, heating, firing, or the like.
  • the conductive coating composition include what are called conductive inks and metal inks in which metal particles having a particle diameter of 1 to 100 nm are dispersed in a solvent at a high concentration.
  • the metal particles include conductive metals such as silver, gold, copper, nickel, and palladium. Among these, it is preferable to use silver exhibiting high conductivity.
  • an electroconductive coating composition contains an organic compound (ligand) and dissolves metal particles in a solution by the dispersing power of the ligand.
  • a solvent it is preferable from a soluble viewpoint of a ligand to use polar solvents, such as water, methanol, and ethanol, and an electroconductive coating composition shows hydrophilicity.
  • polar solvents such as water, methanol, and ethanol
  • electroconductive coating composition shows hydrophilicity.
  • commercially available conductive coating compositions include, for example, trade names “TEC-PR-010” (InkTec Co., Ltd.), “TEC-IJ-010” (InkTec Co., Ltd.), “Dry Cure Ag” (Colloidal Ink Co., Ltd.).
  • the surface free energy in the high surface free energy region is preferably higher than the surface free energy of the coating composition by ⁇ 10 mJ / m 2 and higher by ⁇ 6 mJ / m 2 or more. It is more preferable. That is, the surface free energy in the high surface free energy region is preferably lower than the surface free energy of the coating composition by less than 10 mJ / m 2 , more preferably 6 mJ / m 2 or less. In order to obtain good adhesion between the substrate and the coating composition (ink), it is necessary for the ink to sufficiently wet the substrate surface.
  • the substrate tends to wet well when the surface tension of the substrate is greater than the surface tension of the ink.
  • the surface tension is the surface free energy per unit area. If the surface tension of the surface of a liquid is ⁇ (mN / m), the surface free energy of the liquid is ⁇ (mJ / m 2 ) It is the same as that.
  • a wiring board includes a substrate having a pattern of a high surface free energy region and a low surface free energy region, and a conductor pattern formed on the high surface free energy region, and has a high surface.
  • the surface free energy in the free energy region is higher than 62 mJ / m 2 .
  • FIG. 4 is a cross-sectional view showing an example of a wiring board having a conductor pattern formed on the surface of a base material.
  • the wiring board has a substrate 13 having a low surface free energy region and a high surface free energy region on the surface, and a conductive pattern 14 formed in the high surface free energy region on the support film 11.
  • a fluororesin type compound is illustrated as a 1st compound, it is not limited to this.
  • the support film 11 and the base material 13 are the same as the support film 11 and the base material 13 shown in FIGS.
  • the conductive pattern is formed by adhering the conductive coating composition described above to the high surface free energy region on the surface of the base material 13 by drying, heating, firing, or the like.
  • the conductor pattern is formed on the high surface free energy region, and the surface free energy in the low surface free energy region where the conductor pattern is not formed is preferably 10 to 25 mJ / m 2. more preferably m 2.
  • the conductive coating composition does not stay between the wirings, and it is possible to prevent a short circuit between the wirings. Therefore, the wiring board according to the present embodiment is very useful in the field of electronics such as electronic circuit patterns.
  • the formation of the conductor pattern has been described.
  • the present invention is not limited to the formation of the conductor pattern, and can be applied to the formation of a non-conductive pattern. That is, the manufacturing method of the pattern formation body which concerns on one embodiment of this invention is the 1st compound which expresses low surface free energy, and the 2nd compound which expresses surface free energy higher than a 1st compound,
  • the substrate has a pattern of a high surface free energy region and a low surface free energy region, and the surface free energy of the high surface free energy region is higher than 62 mJ / m 2 , thereby exhibiting a high surface tension.
  • the composition can be selectively applied to form a pattern.
  • a pattern forming body comprises a substrate having a pattern of a high surface free energy region and a low surface free energy region, and a pattern formed on the high surface free energy region,
  • the surface free energy in the high surface free energy region is higher than 62 mJ / m 2 .
  • the base material which concerns on one embodiment of this invention contains the 1st compound which expresses low surface free energy, and the 2nd compound which expresses surface free energy higher than the said 1st compound.
  • the base material formed by curing the resin composition has a pattern of a high surface free energy region and a low surface free energy region, and the surface free energy of the high surface free energy region is higher than 62 mJ / m 2 . As a result, even when a coating composition showing a high surface tension is used, a pattern can be formed on the high surface free energy region.
  • the resin composition according to one embodiment of the present invention contains a first compound that expresses low surface free energy and a second compound that expresses higher surface free energy than the first compound.
  • the second compound contains a monofunctional (meth) acrylate, and the content of the monofunctional (meth) acrylate is 40 to 70 parts by mass with respect to 100 parts by mass of the second compound.
  • Example> Examples of the present invention will be described in detail below.
  • a master A having a pattern formed by a difference in surface free energy, a master B having a low surface free energy over the entire surface, and a master C having a high surface free energy over the entire surface are prepared.
  • the resin composition was transferred.
  • the present invention is not limited to these examples.
  • Exposure machine A Mask aligner MA-20 (Mikasa Co., Ltd.)
  • Exposure machine B Alignment exposure system (manufactured by Toshiba Lighting & Technology Corp.)
  • Contact angle meter DM-701 (manufactured by Kyowa Interface Science)
  • Microscope VHX-1000 (manufactured by Keyence Corporation)
  • AFM SPA400 (manufactured by Hitachi High-Tech Science Co., Ltd.)
  • a negative photoresist (trade name: OFPR-800LB, manufactured by Tokyo Ohka Kogyo Co., Ltd.) was applied to a 10 cm ⁇ 10 cm glass substrate by a spin coating method and dried on a hot plate at 110 ° C. for 90 seconds.
  • the developed substrate was cleaned in the order of pure water and a cleaning solution (trade name: Novec7300, manufactured by 3M), and then a fluorine coating agent (trade name: DS-5210F, manufactured by HARVES) was applied by droplet dropping. . After being left overnight, it was washed with a cleaning solution (trade name: Novec 7300, manufactured by 3M), and then a fluorine coating agent (trade name: DS-5210F, manufactured by HARVS) was applied dropwise. Furthermore, after leaving overnight, it wash
  • a cleaning solution trade name: Novec7300, manufactured by 3M
  • a fluorine coating agent trade name: DS-5210F, manufactured by HARVS
  • the substrate was immersed in a stripping solution for 5 minutes, the remaining resist film was removed, and the substrate was washed with acetone and a cleaning solution (trade name: Novec 7300, manufactured by 3M) in this order.
  • acetone and a cleaning solution (trade name: Novec 7300, manufactured by 3M) in this order.
  • Novec 7300 a cleaning solution
  • FIG. 5 an original A having a high surface free energy region 31 and a low surface free energy region 32 patterned (partially fluorine coated) on the glass substrate 30 was obtained.
  • Table 1 shows the compositions of inks 1 to 6.
  • TMM-3 (Shin Nakamura Chemical Co., Ltd.): Pentaerythritol triacrylate OTA-480 (Daicel Ornex Co.): Propylene glycol-modified glycerin triacrylate AE-400 (Nippon Oil Co., Ltd.): Polyethylene glycol monoacrylate # 400 Irgacure 184 (BASF Corp.): 1-hydroxycyclohexyl phenyl ketone KY-1203 (Shin-Etsu Chemical Co., Ltd.): Perfluoropolyether-containing acrylate
  • FIG. 6 is a cross-sectional view schematically showing a transfer process for transferring the pattern of the original A.
  • inks 1 to 6 are applied onto a PET film with a bar coater (equivalent to a wet film thickness of 8 ⁇ m), and this is brought into close contact with the original plate A. ) was exposed and cured from the PET surface to obtain a substrate having a cured resin layer. The irradiation dose at this time was 6 J / cm 2 .
  • the original A was peeled from the surface of the cured resin layer to obtain substrates A1 to A6 having a cured resin layer on which the surface free energy of the original A was transferred onto a PET film.
  • the inks 1 to 6 were cured to obtain base materials B1 to B6 and base materials C1 to C6 to which surface free energy was transferred.
  • Table 2 shows the surface free energy of the base material B and the base material C.
  • the surface free energy was calculated by the Kelble-Wu method by measuring the contact angles of the substrates B1 to B6 and the substrates C1 to C6 using a contact angle meter. Accordingly, the base surface A1 to A6 low surface free energy region is regarded as the surface free energy of the base materials B1 to B6, respectively, and the base surface A1 to A6 high surface free energy region is the surface free energy of the base materials C1 to C6, respectively. Regarded as energy.
  • a metal ink (Dry Cure Ag, Colloidal Ink Co., Ltd., surface tension: 72 mN / m) was filled in the sample bottle. Substrates A1 to C6 were dipped in this sample bottle, pulled up vertically at a speed of 1 cm / min, and left at room temperature for 10 minutes. The surface after coating was observed with an optical microscope at 2000 times. When the pattern is applied on the observation surface, it is evaluated as “ ⁇ ”, and when it is not applied as a pattern in some areas on the observation surface, it is evaluated as “ ⁇ ”. The case where it was not evaluated was evaluated as “ ⁇ ”.
  • Ink 3 is applied onto a PET film with a bar coater (equivalent to a wet film thickness of 8 ⁇ m), and this is brought into close contact with the original A and exposed and cured from the PET surface using an exposure machine B (alignment exposure device, Toshiba Lighting & Technology Corp.). To form a cured resin layer.
  • the irradiation dose at this time was 6 J / cm 2 .
  • the original A was peeled from the surface of the cured resin layer to obtain a substrate A3 having a cured resin layer on which the surface free energy of the original A was transferred onto a PET film.
  • the ink 3 was exposed and cured using the original plate B and the original plate C to obtain a base material B3 and a base material C3.
  • FIG. 7 is an observation image of the conductor pattern formed on the base material A3 in Example 1 with an optical microscope. The conductive coating composition was selectively applied only to the high surface free energy portion, and the evaluation of the coating property was ⁇ .
  • Example 2 Substrate A4, substrate B4, and substrate C4 were obtained in the same manner as in Example 1 except that ink 4 was used. As shown in Table 3, the surface free energy of the base material B4 was 17 mJ / m 2 , and the surface free energy of the base material C4 was 69 mJ / m 2 . Therefore, the surface free energy in the low surface free energy region of the substrate A4 was regarded as 17 mJ / m 2 , and the surface free energy in the high surface free energy region was regarded as 69 mJ / m 2 . Further, the difference between the surface free energy in the high surface free energy region and the surface tension of the metal ink was regarded as 3 mJ / m 2 .
  • FIG. 8 is an observation image of the conductor pattern formed on the base material A4 in Example 2 with an optical microscope. The conductive coating composition was selectively applied only to the high surface free energy portion, and the evaluation of the coating property was ⁇ .
  • Example 3 Substrate A5, substrate B5, and substrate C5 were obtained in the same manner as in Example 1 except that ink 5 was used. As shown in Table 3, the surface free energy of the substrate B5 was 17 mJ / m 2 , and the surface free energy of the substrate C5 was 68 mJ / m 2 . Therefore, the surface free energy in the low surface free energy region of the substrate A5 was regarded as 17 mJ / m 2 and the surface free energy in the high surface free energy region was regarded as 68 mJ / m 2 . Further, the difference between the surface free energy in the high surface free energy region and the surface tension of the metal ink was regarded as 4 mJ / m 2 . As a result of observation with an optical microscope, the conductive coating composition was selectively applied only to the high surface free energy portion, and the evaluation of the color separation property was good.
  • Example 4 Substrate A6, substrate B6, and substrate C6 were obtained in the same manner as in Example 1 except that ink 6 was used. As shown in Table 3, the surface free energy of the substrate B6 was 17 mJ / m 2 , and the surface free energy of the substrate C5 was 63 mJ / m 2 . Therefore, the surface free energy in the low surface free energy region of the substrate A6 was regarded as 17 mJ / m 2 and the surface free energy in the high surface free energy region was regarded as 63 mJ / m 2 . Further, the difference between the surface free energy in the high surface free energy region and the surface tension of the metal ink was regarded as 9 mJ / m 2 . As a result of observation with an optical microscope, it was not possible to apply as a pattern in a partial region on the observation surface, and the evaluation of the color separation property was ⁇ .
  • FIG. 9 is an observation image of the conductor pattern formed on the base material A1 in Comparative Example 1 with an optical microscope. It was not able to be applied according to the pattern on the observation surface, and the evaluation of the color separation property was x.
  • FIG. 10 is an observation image of the conductor pattern formed on the base material A2 in Comparative Example 2 with an optical microscope. It was not able to be applied according to the pattern on the observation surface, and the evaluation of the color separation property was x.
  • the surface free energy in the high surface free energy region is higher than ⁇ 10 mJ / m 2 of the surface free energy of the coating composition, and more than ⁇ 6 mJ / m 2 , that is, The surface free energy in the high surface free energy region is less than the surface free energy of the coating composition by less than 10 mJ / m 2 , and further 6 mJ / m 2 or less, which indicates that excellent coating characteristics can be obtained. It was. This is presumably because the metal ink was well wetted on the substrate surface.
  • a base material is prepared using inks 3 to 6 having a monofunctional (meth) acrylate content of 40 to 70 parts by mass with respect to 100 parts by mass of all (meth) acrylates.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne : un procédé de fabrication de carte de câblage avec lequel un motif peut être formé facilement même si une composition de revêtement présentant une tension surfacique élevée est utilisée ; et une carte de câblage. Le procédé de fabrication de carte de câblage comprend : une étape de transfert, à laquelle une composition de résine, qui contient un premier composé qui présente une faible énergie libre de surface et un second composé qui présente une énergie libre de surface supérieure à celle du premier composé, est mise en contact avec une plaque originale sur laquelle un motif de différence d'énergie libre de surface souhaitée a été formé, et la composition de résine est laissée durcir pour obtenir un substrat sur lequel le motif de différence d'énergie libre de surface de la plaque originale a été transféré ; et une étape de formation de motif conducteur, à laquelle une composition de revêtement conductrice est appliquée sur la surface de transfert de motif du substrat pour former un motif conducteur. Le substrat présente un motif composé d'une région à haute énergie libre de surface et d'une région à faible énergie libre de surface, et l'énergie libre de surface de la région à haute énergie libre de surface est supérieure à 62 mJ/m2.
PCT/JP2016/068543 2015-07-30 2016-06-22 Procédé de fabrication de carte de câblage, et carte de câblage Ceased WO2017018103A1 (fr)

Applications Claiming Priority (4)

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JP2015150835 2015-07-30
JP2015-150835 2015-07-30
JP2016-123571 2016-06-22
JP2016123571A JP6825832B2 (ja) 2015-07-30 2016-06-22 配線基板の製造方法、及び配線基板

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003238608A (ja) * 2002-02-18 2003-08-27 Toyobo Co Ltd 活性エネルギー線反応型樹脂組成物及びこれを用いた積層体
JP2005071308A (ja) * 2003-08-21 2005-03-17 Shinichi Umeda Ｉｃタグ製造方法
JP2013512568A (ja) * 2009-11-24 2013-04-11 ユニ−ピクセル・ディスプレイズ・インコーポレーテッド 表面エネルギーの調節による電気伝導パターンの形成
JP2014232277A (ja) * 2013-05-30 2014-12-11 リンテック株式会社 防眩性ハードコートフィルム
WO2015087634A1 (fr) * 2013-12-10 2015-06-18 デクセリアルズ株式会社 Corps formé d'un motif

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003238608A (ja) * 2002-02-18 2003-08-27 Toyobo Co Ltd 活性エネルギー線反応型樹脂組成物及びこれを用いた積層体
JP2005071308A (ja) * 2003-08-21 2005-03-17 Shinichi Umeda Ｉｃタグ製造方法
JP2013512568A (ja) * 2009-11-24 2013-04-11 ユニ−ピクセル・ディスプレイズ・インコーポレーテッド 表面エネルギーの調節による電気伝導パターンの形成
JP2014232277A (ja) * 2013-05-30 2014-12-11 リンテック株式会社 防眩性ハードコートフィルム
WO2015087634A1 (fr) * 2013-12-10 2015-06-18 デクセリアルズ株式会社 Corps formé d'un motif

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