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WO2017008443A1 - Boîtier métallique de dispositif de communication et son procédé de fabrication - Google Patents

Boîtier métallique de dispositif de communication et son procédé de fabrication Download PDF

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Publication number
WO2017008443A1
WO2017008443A1 PCT/CN2015/098292 CN2015098292W WO2017008443A1 WO 2017008443 A1 WO2017008443 A1 WO 2017008443A1 CN 2015098292 W CN2015098292 W CN 2015098292W WO 2017008443 A1 WO2017008443 A1 WO 2017008443A1
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WO
WIPO (PCT)
Prior art keywords
communication device
metal substrate
metal
groove
metal casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/098292
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English (en)
Chinese (zh)
Inventor
廖重重
陈梁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BYD Co Ltd
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BYD Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BYD Co Ltd filed Critical BYD Co Ltd
Publication of WO2017008443A1 publication Critical patent/WO2017008443A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings

Definitions

  • the present invention relates to the field of materials, and in particular, to a metal casing for a communication device and a method of manufacturing the same.
  • the mobile phone antenna is a device for receiving signals on a mobile phone.
  • the antenna of the smart phone is mostly an internal antenna, which requires that the mobile phone case cannot shield the signal.
  • a mobile phone with a plastic case does not have the above problems.
  • the metal case has a more beautiful texture, wear resistance and scratch resistance, the metal case gradually replaces the plastic case for use in a communication device such as a mobile phone.
  • how to solve the signal shielding problem is one of the keys to its design and manufacture.
  • metal mobile phones use antenna slot and injection molding to solve the problem of signal shielding of the fuselage, such as the upper and lower antenna slots of HTC ONE, and the side antenna slots of iphone5/5s.
  • the above prior art all prevents the shielding of the signal by filling the antenna slot with plastic, but it causes certain damage to the overall structure of the metal mobile phone body, which affects the overall cleanliness and continuity of the appearance.
  • the plastic visible in the outer casing destroys the overall metallic texture of the fuselage.
  • the object of the present invention is to overcome the above problems in the prior art, and to provide a metal casing for a communication device and a preparation method thereof.
  • the metal casing of the communication device provided by the invention has a slit (ie, an antenna slot) which is invisible in appearance, and the metal casing is neat, smooth, and uniform in appearance.
  • the present invention provides a metal casing for a communication device, wherein the metal casing of the communication device includes a metal substrate and a decorative layer; the decorative layer covers an outer surface of the metal substrate; and the metal substrate The inner surface is provided with a groove, and a bottom of the groove is provided with a slit penetrating the metal substrate.
  • the invention provides a metal housing for a communication device.
  • the metal casing comprises: a metal substrate, the inner surface of the metal substrate is provided with a groove, a bottom of the groove is provided with a slit penetrating the metal substrate; and a decorative layer The decorative layer covers an outer surface of the metal substrate.
  • the invention also provides a method for preparing a metal casing of a communication device, wherein the method comprises the following steps:
  • the metal casing of the communication device obtained by the method of the invention has a slit for the communication signal to pass through to realize a normal communication function.
  • the metal casing of the communication device provided by the invention has a slit (ie, an antenna slot) that is invisible in appearance, and the metal casing is neat, smooth, and uniform in appearance.
  • a decorative layer on the surface of the metal substrate by one or more of electrophoresis, general anodizing, porcelain anodizing, hard anodizing, micro-arc oxidation, and spraying, and further filling the slit with a filling It can significantly improve its hardness, wear resistance, shock resistance and corrosion resistance.
  • Figure 1 is a schematic cross-sectional view showing a process of preparing a metal casing of a communication device of the present invention.
  • FIG. 2 is a schematic cross-sectional view showing a metal casing of a communication device according to an embodiment of the present invention.
  • the invention proposes a metal housing for a communication device.
  • the metal casing comprises: a metal substrate 1 and a decorative layer 6.
  • the inner surface of the metal substrate 1 is provided with a groove 3, and the bottom of the groove 3 is provided with a slit 8 penetrating the metal substrate 1.
  • the metal housing of the communication device comprises a metal substrate 1 and a decorative layer 6; the decorative layer 6 covers the outer surface of the metal substrate 1; the inner surface of the metal substrate 1 is provided with a recess 3,
  • the bottom of the groove is provided with a slit 8 penetrating the metal substrate. Therefore, the metal casing can realize the communication of the communication signal by using the slit 8, and avoid the problem that the outer casing of the metal casing is filled with plastic and the overall appearance of the casing is not beautiful, and the metal casing is not continuous.
  • the communication device may be, for example, a mobile phone, a tablet computer, a notebook computer, a Bluetooth headset, or the like.
  • the metal housing of the communication device is a metal casing of a mobile phone.
  • the inner surface of the metal casing is defined as a surface facing the interior of the communication device when it is used in a communication device, also referred to as a lower surface.
  • the outer surface of the metal casing is defined as the surface of the metal casing facing the outside when it is used in a communication device, and also becomes the upper surface.
  • the inner and outer surfaces (upper and lower surfaces) of the metal substrate for preparing the metal outer casing are also applicable to the above definition.
  • the metal casing may have a plurality of grooves 3 for better communication of communication signals.
  • the inner surface of the plurality of grooves can be provided with the slits 8.
  • a plurality of slits 8 can be formed in the same groove 3.
  • the specific number and corresponding relationship of the slit 8 and the groove 3 are not particularly limited, and those skilled in the art can set the above parameters according to the specific conditions of the signal transmission of the communication device, as long as the groove 3 is disposed on the inner surface of the metal substrate 1.
  • the slit 8 is opened at the bottom of the groove 3 and penetrates the metal substrate 1 at the bottom of the groove 3.
  • the metal casing of the communication device of the present invention may obviously have a plurality of slits.
  • the groove and the slit are connected to each other for ensuring signal transmission between the antenna and the outside, and realizing communication.
  • the groove may have a depth of 0.22-0.5 mm, and in some embodiments of the invention, the groove has a depth of 0.22-0.4. In some embodiments of the invention, the groove has a depth of 0.22-0.3.
  • the grooves may have a width of 2-5 mm, and in some embodiments of the invention, the grooves have a width of 3-4 mm.
  • the grooves may have a length of 10-100 mm, and in some embodiments of the invention, the grooves have a length of 10-60 mm.
  • the depth of the slit is 0.08-0.15 mm.
  • the depth of the slit is 0.08-0.12 mm. In some embodiments of the invention, the depth of the slit It is 0.08-0.1mm.
  • the slit may have a width of 30 to 60 ⁇ m, and in some embodiments of the invention, the slit has a width of 40 to 50 ⁇ m.
  • the slit may have a length of 10-100 mm; in some embodiments of the invention, the slit has a length of 10-60 mm. Additionally, in some embodiments of the invention, the length of the slit is the same as the length of the groove.
  • the inventors have found that when the size of the above-mentioned groove and the slit is too large, the overall mechanical strength of the metal substrate 1 is affected, so that the metal casing is easily deformed, broken, etc. during use; When the size of the slot and the slit is too small, it is easy to adversely affect the signal transmission of the communication device.
  • the inventors have found through extensive use that when the size of the grooves and slits are within the above range, signal transmission of most current communication devices can be ensured, and the metal casing can maintain reliable mechanical strength.
  • FIG. 2 a cross-sectional view of a metal casing according to an embodiment of the present invention is shown.
  • the horizontal direction is the groove and the width of the slit
  • the vertical direction along the figure is a groove and a slit.
  • the depth, the slit and the length of the groove are not shown in FIG.
  • the number of the grooves and the slits is not particularly limited as long as communication can be realized, for example, 1 to 200. In some embodiments of the present invention, the number of the grooves and the slits is 5-50. In addition, when there are a plurality of grooves and slits, the spacing between adjacent two grooves may be 2-5 mm. In some embodiments of the invention, the spacing between adjacent two grooves It is 2-3mm.
  • the material of the metal substrate may be various metals commonly used in communication equipment in the art, such as aluminum alloy, stainless steel, magnesium alloy or titanium alloy, etc.
  • the metal substrate is made of an aluminum alloy.
  • the thickness of the metal substrate is not particularly limited, and those skilled in the art can appropriately select according to a specific communication device.
  • the metal substrate may have a thickness of 0.3-0.6 mm.
  • the metal substrate has a thickness of 0.3-0.5 mm; in some embodiments of the invention, the metal base The thickness of the material is 0.3-0.4 mm. Therefore, the metal substrate can be ensured to have a certain mechanical strength, and the current communication equipment can meet the requirement that the thickness of the outer casing tends to be slim.
  • the decorative layer 6 covers the outer surface of the metal substrate 1. Specifically, a decorative layer 6 is formed on the outer surface of the metal substrate 1.
  • the decorative layer 6 may cover the entire outer surface of the metal substrate 1, or may cover a part of the outer surface of the metal substrate 1.
  • the decorative layer 6 covers the slit 8 so that the slit 8 is not visible on the outer surface of the metal substrate, thereby making the metal casing more aesthetically pleasing. That is to say, the metal housing of the communication device also has a decorative layer on the outer surface of the metal substrate, the decorative layer covering the slit.
  • the decorative layer may be a decorative layer formed by one or more of electrophoresis, general anodization, hard anodization, micro-arc oxidation, and spray coating.
  • a person skilled in the art can select a method of forming the decorative layer 6 within the above range according to the specific material of the metal substrate 1.
  • the thickness of the decorative layer is not particularly limited and may be a conventional thickness in the art.
  • the decorative layer may have a thickness of 15 to 35 ⁇ m. In some embodiments of the invention, the thickness of the decorative layer is 25-35 ⁇ m.
  • the metal housing of the communication device may further comprise a protective layer 4.
  • the protective layer 4 covers a region other than the slit 8 on the inner surface of the metal substrate 1.
  • the communication device metal housing further includes a protective layer 4 that covers an area of the inner surface of the metal substrate other than the slit. Thereby, the inner surface of the metal substrate 1 can be protected by the protective layer 4, so that the overall mechanical properties of the metal casing can be enhanced.
  • the protective layer may be a protective layer formed by electrophoresis and/or spray coating.
  • the thickness of the protective layer is not particularly limited.
  • the protective layer may have a thickness of 5 to 25 ⁇ m.
  • the protective layer has a thickness of 5 to 15 ⁇ m. The inventors have found through extensive experiments that when the thickness of the protective layer is within the above range, the metal substrate 1 can be provided with effective additional protection without affecting the transmission of communication signals.
  • the metal housing of the communication device may further comprise a filler member 9. That is, in some embodiments of the invention, the communication device metal housing further includes a filler member, the filler member being located in the recess and the slit. Thereby, the overall mechanical properties of the metal casing can be improved by the filler member, and the mechanical strength drop due to the thinness of the metal substrate can be alleviated in the groove and the slit.
  • the filler member 9 described above is formed of a UV curable glue.
  • the filler is a filler formed by UV glue curing.
  • the UV glue is, for example, a 3211 model UV glue purchased from Loctite Corporation.
  • the metal housing of the communication device includes a metal substrate 1, a decorative layer 6, a protective layer 4, and a filler member 9; the decorative layer 6 is covered
  • the outer surface of the metal substrate 1; the inner surface of the metal substrate 1 is provided with a groove 3; the bottom of the groove is provided with a slit 8 penetrating the metal substrate; the protective layer 4 covers the A region other than the slit 8 of the inner surface of the metal substrate 1; the filler member 9 is located in the groove 3 and the slit 8.
  • the invention provides a method of making a metal casing for a communication device. According to an embodiment of the invention, the method comprises:
  • a first protective layer is formed on the surface of the metal substrate.
  • the thickness of the metal substrate to be used is not particularly limited, and those skilled in the art can appropriately select according to a specific communication device.
  • the metal substrate may have a thickness of 0.3-0.6 mm.
  • the metal substrate has a thickness of 0.3-0.5 mm.
  • the metal base The thickness of the material is 0.3-0.4 mm.
  • the material of the metal substrate can be various metals commonly used in communication equipment in the field, for example, aluminum alloy Gold, stainless steel, magnesium alloy or titanium alloy, etc.; In some embodiments of the invention, the metal substrate is made of an aluminum alloy.
  • the first protective layer 2 is formed on both the inner surface and the outer surface of the metal substrate 1.
  • the first protective layer is a UV ink layer. That is, as shown in (a) of FIG. 1, the metal substrate obtained by the step 1) has a structure in which a first protective layer (UV ink layer) 2 is formed on the upper and lower surfaces of the metal substrate 1.
  • the method of forming a UV ink layer on the surface of the metal substrate may employ various methods and conditions commonly used in the art. For example, it may be baked at 70-90 degrees Celsius after spraying the UV ink on the surface of the metal substrate. minute.
  • the above UV inks may use various UV inks commonly used in the art, and may be, for example, a 5680 series UV ink.
  • the thickness of the ink layer formed by the above method is not particularly limited and may be a conventional thickness in the art, for example, the thickness may be 10 to 30 ⁇ m, and in some embodiments of the present invention, the ink layer is The thickness is 15-25 ⁇ m.
  • the step is for opening the groove on an inner surface of the metal substrate, as described above, the groove penetrating the first protective layer and a part of the metal
  • the groove of the substrate that is, the groove penetrates the first protective layer but does not completely penetrate the metal substrate, thereby forming a groove on the inner surface of the metal substrate.
  • the method of forming the groove is not particularly limited, and may be a method conventionally used in the art.
  • the UV ink layer formed in the step 1) is exposed by ultraviolet light exposure, thereby exposing and developing more than one substrate tape on the outer surface of the metal substrate.
  • the recess is then formed by etching a metal substrate of the region. It should be noted that the number of the above-mentioned substrate strips is determined by the number of grooves to be formed, and those skilled in the art can adjust the number of the above-mentioned substrate strips according to actual conditions.
  • the substrate strip may have a width of from 2 to 5 mm. In some embodiments of the invention, the substrate strip has a width of from 3 to 4 mm. In some embodiments of the invention, the length of the substrate strip is 10-100 mm, and in some embodiments of the invention, the length of the substrate strip is 10-60 mm. When the plurality of substrate strips are multiple, the spacing between adjacent two substrate strips is 2-5 mm. In some embodiments of the invention, the spacing between adjacent two substrate strips is 2- 3mm.
  • the groove is formed on the outer surface of the metal substrate by the step 2), that is, the metal of the substrate region of the metal is etched by the etching, and the substrate of the metal substrate is The belt region forms a groove.
  • the thickness of the metal substrate thickness of the substrate strip region is such as 0.08-0.15 mm by etching; in some embodiments of the invention, the substrate strip is etched The thickness of the metal substrate of the region is from 0.08 to 0.12 mm; in some embodiments of the invention, the substrate is stripped by etching The thickness of the metal substrate of the domain is 0.08-0.1 mm.
  • the etching comprises an acid etchant etch and an alkaline etchant etch.
  • the acidic etching solution is a mixed solution of ferric chloride, hydrochloric acid and water.
  • the ferric chloride may be from 550 to 600 g and the hydrochloric acid may be from 30 to 50 g with respect to 100 g of water.
  • the conditions for etching the above acidic etching solution include a temperature of 10-35 degrees Celsius and a time of 8-10 minutes.
  • the alkaline etchant is a solution containing 50-60 g/L sodium hydroxide, 50-60 g/L sodium carbonate, and 50-60 g/L sodium nitrate.
  • the conditions for etching the alkaline etching solution include a temperature of 35-45 degrees Celsius and a time of 20-40 minutes.
  • the metal substrate obtained by the above step 2) has a structure in which the inner surface of the metal substrate 1 is provided with the groove 3, and the groove 3 of the metal substrate 1 is not The surface is covered with a first protective layer (UV ink layer) 2.
  • a first protective layer UV ink layer
  • the first protective layer is removed, and a second protective layer is formed on the inner surface of the metal substrate.
  • the first protective layer is first removed to obtain a metal substrate having the recess.
  • the structure of the metal substrate after removing the first protective layer is as shown in (c) of FIG.
  • the method for removing the first protective layer may be various methods conventional in the art.
  • the metal substrate having the first protective layer may be immersed in the paint stripper for 10-20 minutes at a temperature of 10-35 degrees Celsius, the paint stripper
  • the paint stripper For example, it can be a paint remover of SH-665 model purchased from Dongguan Sihui Surface Treatment Technology Co., Ltd.
  • the shield for shielding the outer surface of the metal substrate
  • various shields commonly used in the art can be employed.
  • the shield can be, for example, an insulating tape.
  • the insulating tape can be purchased from Shenzhen Ximeng Te Electronics Co., Ltd.
  • the method of forming the second protective layer is not particularly limited, and in some embodiments of the present invention, in this step, the second protective layer is formed by electrophoresis and/or spraying.
  • the conditions for the electrophoresis may include: a temperature of 29-31 degrees Celsius, an electrophoresis voltage of 120-140 V, a pH of 7-9, and a time of 1-3 min.
  • the electrophoresis liquid of the electrophoresis may be a matte containing Japanese Shimizu Co., Ltd. Electrophoresis liquid of varnish (WNO-1) and varnish (NNO-4) of Japan Shimizu Co., Ltd., including matte lacquer (WNO-1) of Japan Shimizu Co., Ltd.
  • the electrophoretic fluid may have a solids content of from 8 to 15% by weight. In some embodiments of the invention, the electrophoretic fluid has a solids content of 13% by weight.
  • the spraying means spraying one or more layers of an organic or inorganic coating on the surface of the metal substrate, and the coating thickness can be controlled to be 10-25 ⁇ m.
  • the sprayed coating can be, for example, an epoxy resin.
  • the thickness of the second protective layer formed by the above method may be 5 to 25 ⁇ m, and in some embodiments of the present invention, the thickness of the second protective layer formed by the above method is 5 to 15 ⁇ m.
  • the metal substrate obtained by the above step 3) has a structure in which the outer surface of the metal substrate 1 is shielded with a shield member 5, and the inner surface of the metal substrate 1 is formed with a second surface.
  • Protective layer 4 As shown in (d) of FIG. 1, the metal substrate obtained by the above step 3) has a structure in which the outer surface of the metal substrate 1 is shielded with a shield member 5, and the inner surface of the metal substrate 1 is formed with a second surface.
  • Protective layer 4 4
  • this step a decorative layer is formed on the outer surface of the metal substrate. That is, this step is for forming a decorative layer on the outer surface of the metal substrate obtained in the step 3).
  • the shielding member of the outer surface of the metal substrate is first removed, and then a decorative layer is formed on the outer surface of the metal substrate.
  • the decorative layer can be carried out by conventional methods and conditions in the art, for example, by one or more of electrophoresis, general anodizing, porcelain anodizing, hard anodizing, micro-arc oxidation, and spraying.
  • the surface forms a decorative layer.
  • the decorative layer may have a thickness of 15 to 35 ⁇ m.
  • the conditions for the electrophoresis may include a temperature of 28-32 degrees Celsius, a voltage of 140-200 V, a time of 1-3 min, and a pH of 7-9.
  • the electrophoresis liquid of the electrophoresis may be an electrophoretic liquid containing a matt lacquer (WNO-1) of Nippon Seisakusho Co., Ltd. and a varnish (NNO-4) of Nippon Seisakusho Co., Ltd., wherein the matte of Japan Shimizu Co., Ltd.
  • the weight ratio of the lacquer (WNO-1) and the varnish (NNO-4) of Japan Shimizu Co., Ltd. may be 0-4:1.
  • the matte lacquer of Japan Shimizu Co., Ltd. WNO- 1
  • the weight ratio of the varnish (NNO-4) of Japan Shimizu Co., Ltd. is 7:3.
  • the electrophoretic fluid may have a solids content of from 8 to 15% by weight. In some embodiments of the invention, the electrophoretic fluid has a solids content of 13% by weight.
  • the thickness of the decorative layer formed by the above electrophoresis method is usually 25 to 35 ⁇ m.
  • the conditions for the ordinary anodization may include an anode voltage of 13-17 V, a temperature of 17-21 degrees Celsius, and an oxidation time of 30-60 min. Further, the anodizing solution is 180-200 g/L sulfuric acid. The thickness of the decorative layer formed by the above anodizing method is usually 15 to 25 ⁇ m.
  • the conditions for the hard anodization may include a current density of 4 A/dm 2 , a time of 30 to 60 minutes, a temperature of 5 to 10 degrees Celsius, an electrolyte of 180 to 200 g/L of sulfuric acid, and 5 to 15 g/L of oxalic acid.
  • the thickness of the decorative layer formed by the above hard anodization method is usually 25 to 45 ⁇ m.
  • the conditions for the anodizing of the ceramic may include a voltage of 80-120 V, an oxidation time of 30-60 min, and an oxidation temperature of 30-50 degrees Celsius.
  • the porcelain anolyte is 40-50 g/L of potassium oxalate, 1-4 g/L of oxalic acid, 6-10 g/L of boric acid, and 0.5-2 g/L of citric acid.
  • the thickness of the decorative layer formed by the above-described ceramic anodizing method is usually 15 to 30 ⁇ m.
  • the conditions for the micro-arc oxidation may include an oxidation temperature of 20 to 30 degrees Celsius, an oxidation forward voltage of 400 to 600 V, and an oxidation time of 40 to 100 minutes.
  • the composition of the micro-arc oxidation electrolyte is: 0.02-0.05 mol/L sodium silicate and 0.03-0.07 mol/L sodium hydroxide.
  • the thickness of the decorative layer formed by the above micro-arc oxidation method is usually 15 to 40 ⁇ m.
  • the spraying means spraying one or more layers of an organic or inorganic coating on the surface of the metal substrate, and the coating thickness can be controlled to be 10-50 ⁇ m.
  • the sprayed coating can be, for example, an epoxy resin.
  • the metal substrate is pretreated to clean the surface and improve the surface before the decorative layer is formed on the surface of the metal substrate. luster.
  • the method of pre-processing is performed using the following steps:
  • the metal substrate is alkali-etched in an alkali etching solution for 1-2 min, and then washed twice with deionized water;
  • the alkaline etching solution is a 15-20 g/L sodium hydroxide solution; in some embodiments of the invention, the light-emitting liquid is a 200-300 ml/L nitric acid solution; in some of the present invention
  • the chemical polishing liquid is a solution containing 650-750 ml/L phosphoric acid and 350-250 ml/L sulfuric acid.
  • the metal substrate obtained by the above step 4) has a structure in which the outer surface of the metal substrate 1 is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a recess 3 And the inner surface of the metal substrate 1 is formed with the second protective layer 4.
  • a slit penetrating the metal substrate is formed at the bottom of the groove.
  • a slit penetrating the metal substrate may be formed at the bottom of the groove by a method conventional in the art.
  • the step of forming a slit penetrating the metal substrate at the bottom of the groove includes:
  • the exposed metal substrate is etched with an alkaline etching solution to form a slit.
  • an opening is formed by a laser on the second protective layer at the bottom of the groove.
  • the conditions under which the laser forms an opening may be: power 70%, light travel speed 3000 mm/s, frequency 80 KHz.
  • the length of the opening formed in the recess is the same as the length of the recess.
  • the opening may have a width of 30-60 ⁇ m; preferably 30-40 ⁇ m.
  • the metal substrate obtained by the above step (1) has a structure in which the outer surface of the metal substrate 1 is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a groove. 3.
  • the inner surface of the metal substrate 1 is formed with a second protective layer 4 having an opening 7 at the bottom of the recess 3.
  • the alkaline etching solution is a solution containing 50-60 g/L sodium hydroxide, 50-60 g/L sodium carbonate, and 50-60 g/L sodium nitrate, and the alkaline liquid etching conditions include: The temperature is 35-45 degrees Celsius and the time is 10-20 minutes.
  • the metal substrate obtained by the above step (2) has a structure in which the outer surface of the metal substrate 1 is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a groove. 3.
  • the inner surface of the metal substrate 1 is formed with a second protective layer 4, and a slit 8 penetrating the metal substrate 1 is formed at the bottom of the groove 3.
  • the method may further include:
  • a filler is formed in the groove and the slit to alleviate a decrease in mechanical properties due to the thinner metal substrate at the groove and the slit.
  • the filler described above may be formed of a UV curable adhesive (also known as UV glue). That is, in some embodiments of the present invention, the method for preparing the metal casing of the communication device of the present invention further includes the step of: filling the groove and the slit with UV glue and curing.
  • the second protective layer may or may not be removed before the grooves and the slits are filled with UV glue.
  • the UV glue may be various UV glues commonly used in the art, such as the 3211 model UV glue purchased from Loctite Corporation.
  • the curing method of the UV glue may be carried out by a conventional method in the art, for example, exposure to ultraviolet light.
  • the conditions under which the ultraviolet light is exposed are well known in the art and are not described herein.
  • the metal substrate obtained by the above step 6) has a structure in which the outer surface of the metal substrate 1 is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a recess 3
  • the inner surface of the metal substrate 1 is formed with a second protective layer 4, and a slit 8 penetrating the metal substrate 1 is opened at the bottom of the groove 3, and the groove 3 and the slit 8 have a filling member 9 therein (that is, Filler 9 is filled).
  • the above method for preparing a metal casing includes the following steps:
  • the appearance of the metal casing prepared by the method can maintain the texture and consistency of the metal, and has a certain mechanical strength, and can ensure the smooth transmission of various communication signals.
  • Aluminum alloy purchased from Dongguan Gangxiang Metal Materials Co., Ltd., grade 6063, thickness 0.4mm
  • Spray 5680 series UV ink on the surface of the metal substrate purchased in Shenzhen Wanjiayuan Jinghua Technology Co., Ltd., the same below
  • bake at 80 degrees Celsius for 25 minutes then perform UV exposure (exposure condition is 2 min, The light intensity was 800 mJ/cm 2 )
  • two 2 mm wide substrate strips were formed, wherein the length of the substrate strip was 75 mm, and the spacing between adjacent two substrate strips was 3 mm. Further, the thickness of the formed UV ink layer was 20 ⁇ m.
  • an alkaline etching solution is further etched.
  • the acidic etching solution is a mixed solution of 550 g of ferric chloride, 30 g of hydrochloric acid, and 100 g of water, and the acidic etching solution is etched under the conditions of a temperature of 30 degrees Celsius and a time of 10 minutes;
  • the etching solution was a solution containing 50 g/L of sodium hydroxide, 50 g/L of sodium carbonate, and 50 g/L of sodium nitrate, and the alkaline etching solution was etched under the conditions of a temperature of 40 ° C and a time of 33 minutes.
  • a metal substrate having a groove formed on the inner surface of the metal substrate wherein the width of the groove is about 2 mm, the thickness of the metal substrate in the groove region is about 0.08 mm, and the length of the groove is 75mm, the spacing between adjacent grooves is 2mm.
  • the outer surface of the metal substrate is shielded with an insulating tape (purchased from Shenzhen Ximeng Electronics Co., Ltd., the same below), and a protective layer having a thickness of 10 ⁇ m is formed on the inner surface of the metal substrate by electrophoresis.
  • the conditions for electrophoresis were a voltage of 140 V, a time of 1 min, a temperature of 30 degrees Celsius, and a pH of 7.8.
  • the alkaline etching solution was a solution containing 50 g/L sodium hydroxide, 50 g/L sodium carbonate, and 50 g/L sodium nitrate, and the alkaline liquid etching conditions included a temperature of 40 degrees Celsius and a time of 12 minutes.
  • the groove and the slit of the metal substrate are filled with glue (purchased by Loctite Corporation's Model 3211 UV glue), and then cured under ultraviolet light irradiation intensity of 800 mJ/cm 2 , thereby obtaining Communication equipment metal casing.
  • glue purchased by Loctite Corporation's Model 3211 UV glue
  • the structure of the metal casing of the communication device prepared as described above is as shown in (h) of FIG. 1 : the outer surface of the metal casing of the communication device is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a groove 3, and the metal substrate 1 is The inner surface is formed with a second protective layer 4, and a slit 8 penetrating the metal substrate 1 is formed at the bottom of the groove 3, and the filling member 9 is provided in the groove 3 and the slit 8.
  • the metal casing of the communication device has a slit (ie, an antenna slot) that is invisible in appearance, and the metal casing is neat, smooth, and uniform in appearance.
  • Aluminum alloy purchased from Dongguan Gangxiang Metal Materials Co., Ltd., grade 6063, thickness 0.4mm
  • a metal substrate of 15mm x 80mm After spraying 5680 series UV ink on the surface of the metal substrate, and then baking at 80 degrees Celsius for 25 minutes, ultraviolet exposure (exposure condition: time 2 min, light intensity: 800 mJ/cm 2 ) was formed to form two 3 mm wide substrate strips. Wherein the length of the substrate strip is 75 mm and the spacing between adjacent two substrate strips is 3 mm. Further, the thickness of the formed UV ink layer was 20 ⁇ m.
  • the acidic etching solution is a mixed solution of 550 g of ferric chloride, 30 g of hydrochloric acid and 100 g of water, and the acidic etching solution is etched under the conditions of a temperature of 30 degrees Celsius and a time of 10 hours;
  • the etching solution was a solution containing 50 g/L of sodium hydroxide, 50 g/L of sodium carbonate, and 50 g/L of sodium nitrate, and the alkaline etching solution was etched under the conditions of a temperature of 40 ° C and a time of 27 minutes.
  • a metal substrate having a groove formed on the inner surface of the metal substrate wherein the width of the groove is about 3 mm, the thickness of the metal substrate in the groove region is about 0.12 mm, and the length of the groove is 75mm, the spacing between adjacent grooves is 3mm.
  • the temperature was 30 degrees Celsius and the pH was 7.8.
  • An insulating tape for removing the outer surface of the metal substrate was obtained, and a decorative layer having a thickness of 20 ⁇ m was obtained by ordinary anodization.
  • the general anodizing conditions are: the anode voltage is 15V, the temperature is 19 degrees Celsius, and the oxidation time is 50 minutes. Further, the anodizing solution was 190 g/L of sulfuric acid.
  • the groove and the slit of the metal substrate are filled with glue (purchased by Loctite Corporation's Model 3211 UV glue), and then cured under ultraviolet light irradiation intensity of 800 mJ/cm 2 , thereby obtaining Communication equipment metal casing.
  • glue purchased by Loctite Corporation's Model 3211 UV glue
  • the structure of the metal casing of the communication device prepared as described above is as shown in (h) of FIG. 1 : the outer surface of the metal casing of the communication device is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a groove 3, and the metal substrate 1 is The inner surface is formed with a second protective layer 4, and a slit 8 penetrating the metal substrate 1 is formed at the bottom of the groove 3, and the filling member 9 is provided in the groove 3 and the slit 8.
  • the metal casing of the communication device has a slit (ie, an antenna slot) that is invisible in appearance, and the metal casing is neat, smooth, and uniform in appearance.
  • Aluminum alloy purchased from Dongguan Gangxiang Metal Materials Co., Ltd., grade 6063, thickness 0.4mm
  • a metal substrate of 15mm x 80mm After spraying 5680 series UV ink on the surface of the metal substrate, and then baking at 80 degrees Celsius for 25 minutes, ultraviolet exposure (exposure condition: time 2 min, light intensity: 800 mJ/cm 2 ) was formed to form two 5 mm wide substrate strips. Wherein the length of the substrate strip is 75 mm and the spacing between adjacent two substrate strips is 3 mm. Further, the thickness of the formed UV ink layer was 20 ⁇ m.
  • the acidic etching solution is a mixed solution of 550 g of ferric chloride, 30 g of hydrochloric acid and 100 g of water, and the acidic etching solution is etched under the conditions of a temperature of 30 degrees Celsius and a time of 10 minutes;
  • the etching solution is a solution containing 50 g/L sodium hydroxide, 50 g/L sodium carbonate, and 50 g/L sodium nitrate, and the conditions of the alkaline etching solution etching
  • the temperature is 40 degrees Celsius and the time is 24 minutes.
  • a metal substrate having a groove formed on the inner surface of the metal substrate wherein the width of the groove is about 5 mm, the thickness of the metal substrate in the groove region is about 0.15 mm, and the length of the groove is 75mm, the spacing between adjacent grooves is 3mm.
  • the temperature was 30 degrees Celsius and the pH was 7.8.
  • the insulating tape of the outer surface of the metal substrate was removed, and a decorative layer having a thickness of 35 ⁇ m was obtained by porcelain anodization.
  • the condition of porcelain anodization is a voltage of 100V, an oxidation time of 50 minutes, and an oxidation temperature of 40 degrees Celsius.
  • the porcelain anolyte was 15 g/L of potassium oxalate, 9 g/L of oxalic acid, 8 g/L of boric acid, and 1 g/L of citric acid.
  • the alkaline etching solution was a solution containing 50 g/L of sodium hydroxide, 50 g/L of sodium carbonate, and 50 g/L of sodium nitrate, and the alkaline liquid was etched under conditions of a temperature of 40 degrees Celsius and a time of 20 minutes.
  • the groove and the slit of the metal substrate are filled with glue (purchased by Loctite Corporation's Model 3211 UV glue), and then cured under ultraviolet light irradiation intensity of 800 mJ/cm 2 , thereby obtaining Communication equipment metal casing.
  • glue purchased by Loctite Corporation's Model 3211 UV glue
  • the structure of the metal casing of the communication device prepared as described above is as shown in (h) of FIG. 1 : the outer surface of the metal casing of the communication device is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a groove 3, and the metal substrate 1 is The inner surface is formed with a second protective layer 4, and a slit 8 penetrating the metal substrate 1 is formed at the bottom of the groove 3, and the filling member 9 is provided in the groove 3 and the slit 8.
  • the metal casing of the communication device has a slit (ie, an antenna slot) that is invisible in appearance, and the metal casing is neat, smooth, and uniform in appearance.
  • Example 1 The procedure of Example 1 was followed except that in step 5), a decorative layer having a thickness of 20 ⁇ m was obtained by micro-arc oxidation.
  • the conditions of micro-arc oxidation are: oxidation temperature is 30 degrees Celsius, oxidation forward voltage is 600V, and oxidation time is 30 minutes.
  • the composition of the micro-arc oxidation electrolyte is: 0.03 mol / L sodium silicate and 0.05 mol / L hydrogen Sodium oxide.
  • the metal casing of the communication device is similarly obtained.
  • the structure of the metal casing of the communication device prepared as described above is as shown in (h) of FIG. 1 : the outer surface of the metal casing of the communication device is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a groove 3, and the metal substrate 1 is The inner surface is formed with a second protective layer 4, and a slit 8 penetrating the metal substrate 1 is formed at the bottom of the groove 3, and the filling member 9 is provided in the groove 3 and the slit 8.
  • the metal casing of the communication device has a slit (ie, an antenna slot) that is invisible in appearance, and the metal casing is neat, smooth, and uniform in appearance.
  • Example 1 The procedure of Example 1 was followed except that in step 5), a decorative layer having a thickness of 30 ⁇ m was obtained by micro-arc oxidation.
  • the conditions of micro-arc oxidation are: oxidation temperature is 30 degrees Celsius, oxidation forward voltage is 600V, and oxidation time is 40 minutes.
  • the composition of the micro-arc oxidation electrolyte was: 0.03 mol/L sodium silicate and 0.05 mol/L sodium hydroxide. The metal casing of the communication device is similarly obtained.
  • the structure of the metal casing of the communication device prepared as described above is as shown in (h) of FIG. 1 : the outer surface of the metal casing of the communication device is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a groove 3, and the metal substrate 1 is The inner surface is formed with a second protective layer 4, and a slit 8 penetrating the metal substrate 1 is formed at the bottom of the groove 3, and the filling member 9 is provided in the groove 3 and the slit 8.
  • the metal casing of the communication device has a slit (ie, an antenna slot) that is invisible in appearance, and the metal casing is neat, smooth, and uniform in appearance.
  • Example 1 The procedure of Example 1 was followed except that in step 5), a decorative layer having a thickness of 25 ⁇ m was obtained by micro-arc oxidation.
  • the conditions of micro-arc oxidation are: oxidation temperature is 30 degrees Celsius, oxidation forward voltage is 600V, and oxidation time is 35 minutes.
  • the composition of the micro-arc oxidation electrolyte was: 0.03 mol/L sodium silicate and 0.05 mol/L sodium hydroxide. The metal casing of the communication device is similarly obtained.
  • the structure of the metal casing of the communication device prepared as described above is as shown in (h) of FIG. 1 : the outer surface of the metal casing of the communication device is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a groove 3, and the metal substrate 1 is The inner surface is formed with a second protective layer 4, and a slit 8 penetrating the metal substrate 1 is formed at the bottom of the groove 3, and the filling member 9 is provided in the groove 3 and the slit 8.
  • the metal casing of the communication device has a slit (ie, an antenna slot) that is invisible in appearance, and the metal casing is neat, smooth, and uniform in appearance.
  • the metal casing of the communication device obtained by the method of the present invention has a slit (ie, an antenna slot) that is invisible in appearance, and the metal casing is neat, smooth, and uniform.
  • a decorative layer is formed on the surface of the metal substrate by one or more of electrophoresis, general anodizing, porcelain anodizing, micro-arc oxidation, and spraying, and a filler is filled in the slit to significantly increase the hardness thereof. , wear resistance, shock resistance and corrosion resistance.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • ing And Chemical Polishing (AREA)
  • Telephone Set Structure (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention porte sur un boîtier métallique de dispositif de communication et sur son procédé de fabrication. Le boîtier métallique de dispositif de communication comprend : un substrat métallique (1), une rainure (3) ménagée sur la surface interne du substrat métallique (1), une fente (8) ménagée au fond de la rainure (3) et s'étendant à travers le substrat métallique (1) et une couche décorative (6), la couche décorative (6) recouvrant la surface externe du substrat métallique (1).
PCT/CN2015/098292 2015-07-15 2015-12-22 Boîtier métallique de dispositif de communication et son procédé de fabrication Ceased WO2017008443A1 (fr)

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CN201510416993.5 2015-07-15

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WO2019085866A1 (fr) * 2017-11-02 2019-05-09 比亚迪股份有限公司 Boîtier extérieur, méthode de fabrication associée et produit électronique
TWI746195B (zh) * 2020-05-28 2021-11-11 宏達國際電子股份有限公司 殼體總成及電子裝置

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CN114107904B (zh) * 2020-08-25 2024-03-12 荣耀终端有限公司 一种结构件的制备方法、结构件及电子设备
EP4329443A4 (fr) 2021-10-06 2025-04-23 Samsung Electronics Co., Ltd. Boîtier de dispositif électronique et son procédé de fabrication

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CN106358409B (zh) 2019-11-22

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