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WO2017066069A8 - Phospha-adamantanes solubles dans l'eau et stables à l'air en tant que stabilisants pour le dépôt autocatalytique de métal - Google Patents

Phospha-adamantanes solubles dans l'eau et stables à l'air en tant que stabilisants pour le dépôt autocatalytique de métal Download PDF

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Publication number
WO2017066069A8
WO2017066069A8 PCT/US2016/055655 US2016055655W WO2017066069A8 WO 2017066069 A8 WO2017066069 A8 WO 2017066069A8 US 2016055655 W US2016055655 W US 2016055655W WO 2017066069 A8 WO2017066069 A8 WO 2017066069A8
Authority
WO
WIPO (PCT)
Prior art keywords
metal
electroless
phosphaadamantanes
stabilizers
water soluble
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2016/055655
Other languages
English (en)
Other versions
WO2017066069A1 (fr
Inventor
Stefan Schafer
Katrin SÖNTGERATH
Marlies Kleinfeld
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
MacDermid Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Enthone Inc filed Critical MacDermid Enthone Inc
Priority to CN201680059667.6A priority Critical patent/CN108495952A/zh
Priority to US15/765,637 priority patent/US20190085461A1/en
Priority to KR1020187013527A priority patent/KR20180089398A/ko
Publication of WO2017066069A1 publication Critical patent/WO2017066069A1/fr
Anticipated expiration legal-status Critical
Publication of WO2017066069A8 publication Critical patent/WO2017066069A8/fr
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

La présente invention concerne l'utilisation de phospha-adamantanes solubles dans l'eau et stables à l'air en tant que stabilisants dans des électrolytes de dépôt autocatalytique de métal. Un électrolyte et un procédé pour le dépôt autocatalytique de métaux sont décrits. Les couches de métal plaquées peuvent comprendre du nickel, du cuivre, du cobalt, du bore, de l'argent, du palladium ou de l'or, ainsi que des alliages comprenant au moins l'un des métaux mentionnés ci-dessus en tant que métal d'alliage. La présente invention concerne en outre un stabilisant organique pour des procédés de placage autocatalytique, et un électrolyte pour le dépôt autocatalytique d'une couche métallique sur un substrat, l'électrolyte comprenant une source d'ions métalliques du métal à déposer, un agent réducteur, un agent complexant, un stabilisant et, de préférence, un accélérateur. L'invention concerne également un procédé pour le dépôt autocatalytique d'une couche métallique sur une surface à partir d'un électrolyte selon l'invention.
PCT/US2016/055655 2015-10-13 2016-10-06 Phospha-adamantanes solubles dans l'eau et stables à l'air en tant que stabilisants pour le dépôt autocatalytique de métal Ceased WO2017066069A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201680059667.6A CN108495952A (zh) 2015-10-13 2016-10-06 作为无电金属沉积用稳定剂的水溶性且空气稳定的磷杂金刚烷
US15/765,637 US20190085461A1 (en) 2015-10-13 2016-10-06 Water soluble and air stable phosphaadamantanes as stabilizers for electroless metal deposition
KR1020187013527A KR20180089398A (ko) 2015-10-13 2016-10-06 무전해 금속 도금용 안정제로서의 수용성이고 공기 안정성인 포스파아다만탄

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB15189465.6 2015-10-13
EP15189465.6 2015-10-13
EP15189465.6A EP3156517B1 (fr) 2015-10-13 2015-10-13 Utilisation de phosphaadamantanes solubles dans l'eau et stables dans l'air en tant qu'agents de stabilisation dans des électrolytes pour dépôt de métal auto-catalytique

Publications (2)

Publication Number Publication Date
WO2017066069A1 WO2017066069A1 (fr) 2017-04-20
WO2017066069A8 true WO2017066069A8 (fr) 2018-07-19

Family

ID=54324851

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2016/055655 Ceased WO2017066069A1 (fr) 2015-10-13 2016-10-06 Phospha-adamantanes solubles dans l'eau et stables à l'air en tant que stabilisants pour le dépôt autocatalytique de métal

Country Status (7)

Country Link
US (1) US20190085461A1 (fr)
EP (1) EP3156517B1 (fr)
KR (1) KR20180089398A (fr)
CN (1) CN108495952A (fr)
ES (1) ES2712858T3 (fr)
TW (1) TW201718938A (fr)
WO (1) WO2017066069A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI646215B (zh) * 2017-11-03 2019-01-01 陳始明 無電極電鍍金屬的裝置及其方法
CN109457238B (zh) * 2018-08-30 2021-01-15 上海昕沐化学科技有限公司 高速稳定的化学镀铜液及其制备方法
JP7228411B2 (ja) * 2019-03-06 2023-02-24 上村工業株式会社 無電解金めっき浴

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0769572A1 (fr) 1995-06-06 1997-04-23 ENTHONE-OMI, Inc. Procédé et bain de dépÔt chimique d'un alliage nickel-cobalt-phosphore
JP3816241B2 (ja) * 1998-07-14 2006-08-30 株式会社大和化成研究所 金属を還元析出させるための水溶液
DE10015214C1 (de) * 2000-03-27 2002-03-21 Infineon Technologies Ag Verfahren zur Metallisierung eines Isolators und/oder eines Dielektrikums
DE10246453A1 (de) 2002-10-04 2004-04-15 Enthone Inc., West Haven Verfahren zur stromlosen Abscheidung von Nickel
JP2005290415A (ja) 2004-03-31 2005-10-20 Okuno Chem Ind Co Ltd 無電解銅めっき液
JP5247142B2 (ja) 2007-12-19 2013-07-24 株式会社大和化成研究所 銀めっき方法
CN101348927B (zh) 2008-09-05 2010-10-06 江南机器（集团）有限公司 无氰预镀铜溶液
GB2467163B (en) * 2009-01-26 2013-11-06 Rhodia Operations Ligands
PL2449148T3 (pl) * 2009-07-03 2019-06-28 Macdermid Enthone Inc. Elektrolit zawierający beta-aminokwas i sposób osadzania warstwy metalu

Also Published As

Publication number Publication date
EP3156517B1 (fr) 2018-12-05
ES2712858T3 (es) 2019-05-16
TW201718938A (zh) 2017-06-01
CN108495952A (zh) 2018-09-04
KR20180089398A (ko) 2018-08-08
WO2017066069A1 (fr) 2017-04-20
EP3156517A8 (fr) 2017-06-07
EP3156517A1 (fr) 2017-04-19
US20190085461A1 (en) 2019-03-21

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