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WO2016123996A1 - Caloduc fritté et réfrigérateur à refroidissement à semi-conducteur le comprenant - Google Patents

Caloduc fritté et réfrigérateur à refroidissement à semi-conducteur le comprenant Download PDF

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Publication number
WO2016123996A1
WO2016123996A1 PCT/CN2015/091095 CN2015091095W WO2016123996A1 WO 2016123996 A1 WO2016123996 A1 WO 2016123996A1 CN 2015091095 W CN2015091095 W CN 2015091095W WO 2016123996 A1 WO2016123996 A1 WO 2016123996A1
Authority
WO
WIPO (PCT)
Prior art keywords
pipe
section
main
furcation
sintered heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/091095
Other languages
English (en)
Chinese (zh)
Inventor
陶海波
张奎
刘建如
李鹏
李春阳
戚斐斐
姬立胜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao Haier Co Ltd
Original Assignee
Qingdao Haier Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingdao Haier Co Ltd filed Critical Qingdao Haier Co Ltd
Publication of WO2016123996A1 publication Critical patent/WO2016123996A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators

Definitions

  • the present invention relates to a sintered heat pipe, and more particularly to a sintered heat pipe and a semiconductor refrigeration refrigerator having the same.
  • the sintered heat pipe is a high-efficiency heat transfer element that transfers heat by a phase change process of evaporation and condensation of a liquid in a fully enclosed vacuum tube, and has extremely high thermal conductivity and excellent isothermality.
  • the sintering heat pipe is composed of a casing, a liquid absorbing core and an end cover, and the inside of the pipe is drawn into a negative pressure of 1.3 ⁇ (10 minus 1-10 minus 4) Pa, and then filled with an appropriate amount of working liquid to make the wick closely adhere to the inner wall of the pipe.
  • the capillary porous material is filled with liquid and sealed.
  • One end of the sintering heat pipe is an evaporation section (heating section), and the other end is a condensation section (cooling section), and an adiabatic section can be arranged in the middle of the two sections according to the application.
  • the liquid in the wicking core evaporates and vaporizes, and the steam flows to the other end under a slight pressure difference to release heat to condense into a liquid, and the liquid flows back to the evaporation section along the porous material by the capillary force. This cycle does not allow heat to pass from one end of the sintered heat pipe to the other end.
  • the existing sintered heat pipe extends from one end thereof along a single path to the other end thereof, and the extended path may be a straight line, an L shape, or a U shape.
  • the existing sintered heat pipe may not achieve the desired effect.
  • a further object of the first aspect of the invention is to maximize the heat dissipation or cooling efficiency of the sintered heat pipe.
  • Another further object of the first aspect of the invention is to make the structure of the sintered heat pipe compact.
  • An object of the second aspect of the present invention is to provide a semiconductor refrigeration refrigerator having the above-described sintered heat pipe.
  • a sintered heat pipe comprising a main pipe section which is closed at both ends.
  • a branching pipe section is respectively extended at one or more portions on opposite sides of the main pipe section; the working cavity of each of the branching pipe sections is in communication with the working cavity of the main pipe section.
  • a wick in each of the furcation segments is coupled to a wick in the main section.
  • the axis of the main section is a spatial curve; or the axis of the main section is a straight line, an L-shaped line or a U-shaped line.
  • each of the furcation segments extends outwardly from a respective portion of the main segment in a direction perpendicular to the main segment.
  • At least three furcation pipe segments on each side of the main pipe segment, the starting end of the furcation pipe segment on each side of the main pipe segment is along the extending direction of the main pipe segment on the main pipe segment, etc. Arranged at intervals.
  • the number of the branch pipe segments on one side of the main pipe segment is equal to the number of the branch pipe segments on the other side of the main pipe segment; and each of the branch pipe segments on one side of the main pipe segment is A corresponding one of the furcation pipe segments on the other side of the main pipe section is on the same straight line.
  • the main pipe section comprises a straight pipe portion closed at one end thereof; and a starting end of each of the furcation pipe segments is located at a straight pipe portion of the main pipe segment.
  • the main pipe section further includes: another straight pipe portion closed at one end and disposed in parallel with the straight pipe portion; and a connecting straight pipe portion connected to the straight pipe portion and the other straight pipe portion Between the straight pipe portion and the other straight pipe portion, the angle is set at an angle of 100° to 170°.
  • the diameter of each of the furcation pipe segments is equal to the diameter of the main pipe segment.
  • a semiconductor refrigerating refrigerator comprising a liner, a semiconductor refrigerating sheet, and a heat exchange device.
  • the heat exchange device includes a plurality of any one of the above-described sintered heat pipes; and a part or all of the main sections of each of the sintered heat pipes are thermally connected to the hot or cold ends of the semiconductor cooling fins;
  • the bifurcated tube section of the sintered heat pipe is used to dissipate heat into the ambient air or to cool the storage compartment of the liner.
  • the sintered heat pipe of the present invention since the sintered heat pipe has a branch pipe section, the structure thereof is significantly different from the conventional conventional heat pipe extending along the only path, and the sintered heat pipe of the present invention is remarkably improved. Its heat dissipation or cooling efficiency.
  • the sintered heat pipe of the present invention and the sintered heat pipe of the novel structure in the semiconductor refrigeration refrigerator having the same are particularly suitable for heat dissipation of a heat source having a high heat flux such as a semiconductor refrigeration chip.
  • FIG. 1 is a schematic front view of a sintered heat pipe in accordance with one embodiment of the present invention
  • Figure 2 is a schematic partial cross-sectional view taken at A in Figure 1;
  • Figure 3 is a schematic left side view of the sintered heat pipe of Figure 1;
  • FIG. 4 is a schematic right side view of a semiconductor refrigerating refrigerator in accordance with one embodiment of the present invention.
  • Figure 5 is a schematic rear view of a semiconductor refrigeration refrigerator in accordance with one embodiment of the present invention.
  • FIG. 1 is a schematic front view of a sintered heat pipe in accordance with one embodiment of the present invention.
  • an embodiment of the present invention provides a novel sintered heat pipe 200 having high heat dissipation or cooling efficiency, which can be applied to various heat exchange devices, and is particularly suitable for use in A heat source having a high heat flux density such as the semiconductor refrigerating sheet 150 dissipates heat.
  • the sintered heat pipe 200 may include a main pipe section 210 that is closed at both ends.
  • a bifurcated pipe section 220 is respectively extended at one or more portions on opposite sides of the main pipe section 210 to improve the heat dissipation or cooling efficiency of the sintering heat pipe 200.
  • each furcation section 220 can be in communication with the working chamber 230 of the main section 210 to facilitate vapor flow within the sintered heat pipe 200.
  • the plurality of furcation pipe segments 220 of the sintered heat pipe 200 are located on opposite sides of the main pipe section 210, and the structure of the sintering heat pipe 200 can also be made compact.
  • the wick 240 in each furcation section 220 can be coupled to the wick 240 in the main section 210.
  • the wick 240 in each furcation section 220 and the wick 240 in the main section 210 are in close contact with the inner wall of the corresponding tube to facilitate the flow of the working fluid.
  • the diameter of each furcation pipe segment 220 can be equal to the diameter of the main pipe segment 210. In some alternative embodiments of the invention, the diameter of each furcation pipe segment 220 may also be less than the diameter of the main pipe segment 210.
  • the axis of the main section 210 can be a spatial curve to facilitate the arrangement of the sintered heat pipe 200. As is known to those skilled in the art, the axis of the main section 210 can also be a planar curve, such as a straight line, an L-shaped line, or a U-shaped line.
  • Each furcation pipe section 220 extends outwardly from a corresponding portion of the main pipe section 210 in a direction perpendicular to the main pipe section 210.
  • the bifurcated pipe sections 220 on each side of the main section 210 are at least three, and the starting ends of the furcation pipe sections 220 on each side of the main pipe section 210 are equally spaced on the main pipe section 210 in the extending direction of the main pipe section 210.
  • the number of furcation pipe segments 220 on one side of the main pipe segment 210 is equal to the number of furcation pipe segments 220 on the other side of the main pipe segment 210; and each furcation pipe segment 220 on one side of the main pipe segment 210 It is in line with a corresponding furcation pipe segment 220 on the other side of the main pipe section 210.
  • the furcation pipe section 220 on one side of the main pipe section 210 and the furcation pipe section 220 on the other side of the main pipe section 210 are spaced apart from each other.
  • the main pipe section 210 may include a straight pipe portion 211 whose one end is closed; and the starting end of each furcation pipe segment 220 is located at the straight pipe portion 211 of the main pipe section 210.
  • the main pipe section 210 of the sintering heat pipe 200 may further include another straight pipe portion 212 and a joint closed at one end.
  • a connecting straight pipe portion 213 is connected between the straight pipe portion 211 and the other straight pipe portion 212.
  • the other straight pipe portion 212 may be disposed in parallel with the straight pipe portion 211, and the connecting straight pipe portion 213 is disposed at an angle of 100 to 170 with both the straight pipe portion 211 and the other straight pipe portion 212.
  • the other straight tube portion 212 can be used for thermal connection with a heat source or a cold source, and the straight tube portion 211 and the branch tube portion 220 can be used for heat dissipation or cooling.
  • FIG. 4 is a schematic left side view of a semiconductor refrigerator in accordance with one embodiment of the present invention.
  • an embodiment of the present invention further provides a semiconductor refrigerating refrigerator including a liner 100, a semiconductor refrigerating sheet 150, and a heat exchange device.
  • the heat exchange device is for dissipating heat from the hot end of the semiconductor refrigerating sheet 150 to the ambient air, or transferring the cold amount from the cold end of the semiconductor refrigerating sheet 150 to the storage compartment of the inner liner 100.
  • the heat exchange device may have a plurality of the sintered heat pipes 200 of any of the above embodiments.
  • each of the sintering heat pipes 200 is thermally connected to the hot or cold end of the semiconductor refrigerating sheet 150; the bifurcated tube section 220 of each of the sintering heat pipes 200 is used for dissipating heat to the ambient air or to the storage.
  • the room is cold.
  • the plate fins 300 may be mounted on the branch pipe section 220 of each of the sintering heat pipes 200.
  • the heat exchange device can also include a fan 400 that can be disposed on the same side of the plurality of furcation tube segments 220, such as disposed above the fins 300, configured to: draw airflow from its inlet region and toward each two adjacent wings The gap between the sheets 300 is blown, or the airflow is taken in from the gap between each two adjacent fins 300 and blown to the air supply area thereof.
  • a spiral fin is spirally nested over the furcation tube section 220 of each of the sintered heat pipes 200.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un caloduc fritté (200) et un réfrigérateur à refroidissement à semi-conducteur comprenant ledit caloduc fritté (200), le caloduc fritté (200) comprenant une section de tuyau principal (210) dont les deux extrémités sont fermées et une section de tuyau bifurqué (220) s'étendant à partir de chaque partie parmi une ou plusieurs parties des deux côtés de la section de tuyau principal (210), la chambre de travail (230) de chacune des sections de tuyau bifurqué (220) étant en communication avec la chambre de travail (230) de la section de tuyau principal (210). Dans le caloduc fritté (200) et le réfrigérateur à refroidissement à semi-conducteur comprenant ledit caloduc fritté (200), le caloduc fritté (200) comprend des sections de tuyau bifurqué (220), qui permettent d'augmenter considérablement son efficacité de dissipation de chaleur ou de transfert de froid, ainsi il est particulièrement approprié pour la dissipation de la chaleur sur des sources de chaleur ayant une haute densité de flux de chaleur, telles que des puces de refroidissement à semi-conducteur.
PCT/CN2015/091095 2015-02-03 2015-09-29 Caloduc fritté et réfrigérateur à refroidissement à semi-conducteur le comprenant Ceased WO2016123996A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510056236.1A CN104676949B (zh) 2015-02-03 2015-02-03 烧结热管及具有其的半导体制冷冰箱
CN201510056236.1 2015-02-03

Publications (1)

Publication Number Publication Date
WO2016123996A1 true WO2016123996A1 (fr) 2016-08-11

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PCT/CN2015/091095 Ceased WO2016123996A1 (fr) 2015-02-03 2015-09-29 Caloduc fritté et réfrigérateur à refroidissement à semi-conducteur le comprenant

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CN (1) CN104676949B (fr)
WO (1) WO2016123996A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018169107A (ja) * 2017-03-30 2018-11-01 マツダ株式会社 ヒートパイプ装置
CN112747521A (zh) * 2019-10-30 2021-05-04 青岛海尔电冰箱有限公司 半导体冰箱

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104676949B (zh) * 2015-02-03 2016-11-23 青岛海尔股份有限公司 烧结热管及具有其的半导体制冷冰箱
CN110793366B (zh) * 2018-04-14 2021-05-14 青岛科技大学 一种热管

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5522455A (en) * 1994-05-05 1996-06-04 Northrop Grumman Corporation Heat pipe manifold with screen-lined insert
JPH11257882A (ja) * 1998-03-12 1999-09-24 Sharp Corp ヒートパイプ及び集熱装置
CN201053839Y (zh) * 2007-04-10 2008-04-30 中山伟强科技有限公司 烧结式热管
CN102510990A (zh) * 2009-07-17 2012-06-20 史泰克公司 热管以及热电冷却装置
US20120186787A1 (en) * 2011-01-25 2012-07-26 Khanh Dinh Heat pipe system having common vapor rail
CN104676949A (zh) * 2015-02-03 2015-06-03 青岛海尔股份有限公司 烧结热管及具有其的半导体制冷冰箱
CN204612225U (zh) * 2015-02-03 2015-09-02 青岛海尔股份有限公司 烧结热管及具有其的半导体制冷冰箱

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130005372A1 (en) * 2011-06-29 2013-01-03 Rosemount Inc. Integral thermoelectric generator for wireless devices

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5522455A (en) * 1994-05-05 1996-06-04 Northrop Grumman Corporation Heat pipe manifold with screen-lined insert
JPH11257882A (ja) * 1998-03-12 1999-09-24 Sharp Corp ヒートパイプ及び集熱装置
CN201053839Y (zh) * 2007-04-10 2008-04-30 中山伟强科技有限公司 烧结式热管
CN102510990A (zh) * 2009-07-17 2012-06-20 史泰克公司 热管以及热电冷却装置
US20120186787A1 (en) * 2011-01-25 2012-07-26 Khanh Dinh Heat pipe system having common vapor rail
CN104676949A (zh) * 2015-02-03 2015-06-03 青岛海尔股份有限公司 烧结热管及具有其的半导体制冷冰箱
CN204612225U (zh) * 2015-02-03 2015-09-02 青岛海尔股份有限公司 烧结热管及具有其的半导体制冷冰箱

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018169107A (ja) * 2017-03-30 2018-11-01 マツダ株式会社 ヒートパイプ装置
CN112747521A (zh) * 2019-10-30 2021-05-04 青岛海尔电冰箱有限公司 半导体冰箱

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CN104676949B (zh) 2016-11-23

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