WO2016123996A1 - Sintered heat pipe and semiconductor cooling refrigerator having same - Google Patents

Abstract

Provided are a sintered heat pipe (200) and a semiconductor cooling refrigerator having said sintered heat pipe (200); the sintered heat pipe (200) comprises a main pipe section (210) having both ends closed, and a bifurcated pipe section (220) extends out of each of one or a plurality of parts of the two sides of the main pipe section (210); the working chamber (230) of each of the bifurcated pipe sections (220) is in communication with the working chamber (230) of the main pipe section (210). In the sintered heat pipe (200) and semiconductor cooling refrigerator having said sintered heat pipe (200), the sintered heat pipe (200) has bifurcated pipe sections (220), which significantly increase its heat dissipation or cold transfer efficiency, thus it is particularly suitable for heat dissipation on heat sources having high heat flux density, such as semiconductor cooling chips.

Description

Sintered heat pipe and semiconductor refrigeration refrigerator having the same

The present application claims the priority of the Chinese Patent Application No. 201510056236.1, the entire disclosure of which is hereby incorporated by reference. in.

Technical field

The present invention relates to a sintered heat pipe, and more particularly to a sintered heat pipe and a semiconductor refrigeration refrigerator having the same.

Background technique

The sintered heat pipe is a high-efficiency heat transfer element that transfers heat by a phase change process of evaporation and condensation of a liquid in a fully enclosed vacuum tube, and has extremely high thermal conductivity and excellent isothermality. The sintering heat pipe is composed of a casing, a liquid absorbing core and an end cover, and the inside of the pipe is drawn into a negative pressure of 1.3×(10 minus 1-10 minus 4) Pa, and then filled with an appropriate amount of working liquid to make the wick closely adhere to the inner wall of the pipe. The capillary porous material is filled with liquid and sealed. One end of the sintering heat pipe is an evaporation section (heating section), and the other end is a condensation section (cooling section), and an adiabatic section can be arranged in the middle of the two sections according to the application. When one end of the sintering heat pipe is heated, the liquid in the wicking core evaporates and vaporizes, and the steam flows to the other end under a slight pressure difference to release heat to condense into a liquid, and the liquid flows back to the evaporation section along the porous material by the capillary force. This cycle does not allow heat to pass from one end of the sintered heat pipe to the other end. That is, the existing sintered heat pipe extends from one end thereof along a single path to the other end thereof, and the extended path may be a straight line, an L shape, or a U shape. However, for a heat source having a high heat flux density such as a semiconductor refrigerating sheet, the existing sintered heat pipe may not achieve the desired effect.

Summary of the invention

It is an object of the first aspect of the present invention to overcome at least one of the deficiencies of prior art sintered heat pipes and to provide a sintered heat pipe of novel construction.

A further object of the first aspect of the invention is to maximize the heat dissipation or cooling efficiency of the sintered heat pipe.

Another further object of the first aspect of the invention is to make the structure of the sintered heat pipe compact.

An object of the second aspect of the present invention is to provide a semiconductor refrigeration refrigerator having the above-described sintered heat pipe.

According to a first aspect of the invention, there is provided a sintered heat pipe comprising a main pipe section which is closed at both ends. In particular, a branching pipe section is respectively extended at one or more portions on opposite sides of the main pipe section; the working cavity of each of the branching pipe sections is in communication with the working cavity of the main pipe section.

Optionally, a wick in each of the furcation segments is coupled to a wick in the main section.

Optionally, the axis of the main section is a spatial curve; or the axis of the main section is a straight line, an L-shaped line or a U-shaped line.

Optionally, each of the furcation segments extends outwardly from a respective portion of the main segment in a direction perpendicular to the main segment.

Optionally, at least three furcation pipe segments on each side of the main pipe segment, the starting end of the furcation pipe segment on each side of the main pipe segment is along the extending direction of the main pipe segment on the main pipe segment, etc. Arranged at intervals.

Optionally, the number of the branch pipe segments on one side of the main pipe segment is equal to the number of the branch pipe segments on the other side of the main pipe segment; and each of the branch pipe segments on one side of the main pipe segment is A corresponding one of the furcation pipe segments on the other side of the main pipe section is on the same straight line.

Optionally, the main pipe section comprises a straight pipe portion closed at one end thereof; and a starting end of each of the furcation pipe segments is located at a straight pipe portion of the main pipe segment.

Optionally, the main pipe section further includes: another straight pipe portion closed at one end and disposed in parallel with the straight pipe portion; and a connecting straight pipe portion connected to the straight pipe portion and the other straight pipe portion Between the straight pipe portion and the other straight pipe portion, the angle is set at an angle of 100° to 170°.

Optionally, the diameter of each of the furcation pipe segments is equal to the diameter of the main pipe segment.

According to a second aspect of the present invention, there is provided a semiconductor refrigerating refrigerator comprising a liner, a semiconductor refrigerating sheet, and a heat exchange device. Specifically, the heat exchange device includes a plurality of any one of the above-described sintered heat pipes; and a part or all of the main sections of each of the sintered heat pipes are thermally connected to the hot or cold ends of the semiconductor cooling fins; The bifurcated tube section of the sintered heat pipe is used to dissipate heat into the ambient air or to cool the storage compartment of the liner.

In the sintered heat pipe of the present invention and the semiconductor refrigerating refrigerator having the same, since the sintered heat pipe has a branch pipe section, the structure thereof is significantly different from the conventional conventional heat pipe extending along the only path, and the sintered heat pipe of the present invention is remarkably improved. Its heat dissipation or cooling efficiency.

Further, the sintered heat pipe of the present invention and the sintered heat pipe of the novel structure in the semiconductor refrigeration refrigerator having the same are particularly suitable for heat dissipation of a heat source having a high heat flux such as a semiconductor refrigeration chip.

The above as well as other objects, advantages and features of the present invention will become apparent to those skilled in the <

DRAWINGS

Some specific embodiments of the present invention are described in detail below by way of example, and not limitation. The same reference numbers in the drawings identify the same or similar parts. Those skilled in the art should understand that the drawings are not necessarily drawn to scale. In the figure:

1 is a schematic front view of a sintered heat pipe in accordance with one embodiment of the present invention;

Figure 2 is a schematic partial cross-sectional view taken at A in Figure 1;

Figure 3 is a schematic left side view of the sintered heat pipe of Figure 1;

4 is a schematic right side view of a semiconductor refrigerating refrigerator in accordance with one embodiment of the present invention;

Figure 5 is a schematic rear view of a semiconductor refrigeration refrigerator in accordance with one embodiment of the present invention.

detailed description

1 is a schematic front view of a sintered heat pipe in accordance with one embodiment of the present invention. As shown in FIG. 1 and referring to FIG. 2, an embodiment of the present invention provides a novel sintered heat pipe 200 having high heat dissipation or cooling efficiency, which can be applied to various heat exchange devices, and is particularly suitable for use in A heat source having a high heat flux density such as the semiconductor refrigerating sheet 150 dissipates heat. Specifically, the sintered heat pipe 200 may include a main pipe section 210 that is closed at both ends. In particular, a bifurcated pipe section 220 is respectively extended at one or more portions on opposite sides of the main pipe section 210 to improve the heat dissipation or cooling efficiency of the sintering heat pipe 200. The working chamber 230 of each furcation section 220 can be in communication with the working chamber 230 of the main section 210 to facilitate vapor flow within the sintered heat pipe 200. The plurality of furcation pipe segments 220 of the sintered heat pipe 200 are located on opposite sides of the main pipe section 210, and the structure of the sintering heat pipe 200 can also be made compact.

In some further embodiments of the invention, as shown in FIG. 2, the wick 240 in each furcation section 220 can be coupled to the wick 240 in the main section 210. The wick 240 in each furcation section 220 and the wick 240 in the main section 210 are in close contact with the inner wall of the corresponding tube to facilitate the flow of the working fluid. Further, the diameter of each furcation pipe segment 220 can be equal to the diameter of the main pipe segment 210. In some alternative embodiments of the invention, the diameter of each furcation pipe segment 220 may also be less than the diameter of the main pipe segment 210.

The axis of the main section 210 can be a spatial curve to facilitate the arrangement of the sintered heat pipe 200. As is known to those skilled in the art, the axis of the main section 210 can also be a planar curve, such as a straight line, an L-shaped line, or a U-shaped line. Each furcation pipe section 220 extends outwardly from a corresponding portion of the main pipe section 210 in a direction perpendicular to the main pipe section 210. The bifurcated pipe sections 220 on each side of the main section 210 are at least three, and the starting ends of the furcation pipe sections 220 on each side of the main pipe section 210 are equally spaced on the main pipe section 210 in the extending direction of the main pipe section 210.

In some embodiments of the invention, the number of furcation pipe segments 220 on one side of the main pipe segment 210 is equal to the number of furcation pipe segments 220 on the other side of the main pipe segment 210; and each furcation pipe segment 220 on one side of the main pipe segment 210 It is in line with a corresponding furcation pipe segment 220 on the other side of the main pipe section 210. In some alternative embodiments of the invention, the furcation pipe section 220 on one side of the main pipe section 210 and the furcation pipe section 220 on the other side of the main pipe section 210 are spaced apart from each other.

In some embodiments of the present invention, as shown in FIG. 3, the main pipe section 210 may include a straight pipe portion 211 whose one end is closed; and the starting end of each furcation pipe segment 220 is located at the straight pipe portion 211 of the main pipe section 210. . Further, in the embodiment of the present invention, the main pipe section 210 of the sintering heat pipe 200 may further include another straight pipe portion 212 and a joint closed at one end. A connecting straight pipe portion 213 is connected between the straight pipe portion 211 and the other straight pipe portion 212. The other straight pipe portion 212 may be disposed in parallel with the straight pipe portion 211, and the connecting straight pipe portion 213 is disposed at an angle of 100 to 170 with both the straight pipe portion 211 and the other straight pipe portion 212. The other straight tube portion 212 can be used for thermal connection with a heat source or a cold source, and the straight tube portion 211 and the branch tube portion 220 can be used for heat dissipation or cooling.

4 is a schematic left side view of a semiconductor refrigerator in accordance with one embodiment of the present invention. As shown in FIG. 4, and referring to FIG. 5, an embodiment of the present invention further provides a semiconductor refrigerating refrigerator including a liner 100, a semiconductor refrigerating sheet 150, and a heat exchange device. The heat exchange device is for dissipating heat from the hot end of the semiconductor refrigerating sheet 150 to the ambient air, or transferring the cold amount from the cold end of the semiconductor refrigerating sheet 150 to the storage compartment of the inner liner 100. In particular, the heat exchange device may have a plurality of the sintered heat pipes 200 of any of the above embodiments. Moreover, part or all of the main section 210 of each of the sintering heat pipes 200 is thermally connected to the hot or cold end of the semiconductor refrigerating sheet 150; the bifurcated tube section 220 of each of the sintering heat pipes 200 is used for dissipating heat to the ambient air or to the storage. The room is cold.

In order to further improve the heat dissipation or cooling efficiency, the plate fins 300 may be mounted on the branch pipe section 220 of each of the sintering heat pipes 200. The heat exchange device can also include a fan 400 that can be disposed on the same side of the plurality of furcation tube segments 220, such as disposed above the fins 300, configured to: draw airflow from its inlet region and toward each two adjacent wings The gap between the sheets 300 is blown, or the airflow is taken in from the gap between each two adjacent fins 300 and blown to the air supply area thereof. In some alternative embodiments of the invention, a spiral fin is spirally nested over the furcation tube section 220 of each of the sintered heat pipes 200.

In this regard, it will be appreciated by those skilled in the <RTIgt;the</RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The content directly determines or derives many other variations or modifications consistent with the principles of the invention. Therefore, the scope of the invention should be understood and construed as covering all such other modifications or modifications.

Claims (10)

A sintered heat pipe characterized by comprising a main pipe section closed at both ends; Extending a branch pipe section respectively at one or more portions on opposite sides of the main pipe section; A working chamber of each of the furcation segments is in communication with a working chamber of the main section. The sintered heat pipe according to claim 1, wherein A wick in each of the furcation segments is coupled to a wick in the main section. The sintered heat pipe according to claim 1, wherein The axis of the main section is a spatial curve; or The axis of the main section is a straight line, an L-shaped line or a U-shaped line. The sintered heat pipe according to claim 1, wherein Each of the furcation pipe segments extends outwardly from a corresponding portion of the main pipe section in a direction perpendicular to the main pipe section. The sintered heat pipe according to claim 1, wherein The branching pipe sections on each side of the main pipe section are at least three, and the starting ends of the branching pipe sections on each side of the main pipe section are equally spaced on the main pipe section along the extending direction of the main pipe section. The sintered heat pipe according to claim 1, wherein The number of furcation pipe segments on one side of the main pipe segment is equal to the number of furcation pipe segments on the other side of the main pipe segment; Each of the furcation pipe segments on one side of the main pipe section is in line with a corresponding one of the furcation pipe segments on the other side of the main pipe section. The sintered heat pipe according to claim 1, wherein The main section includes a straight tube portion that is closed at one end; The starting end of each of the furcation pipe segments is located in the straight pipe portion of the main pipe section. The sintered heat pipe according to claim 7, wherein said main pipe section further comprises: Another tube portion, one end of which is closed and arranged in parallel with the straight tube portion; A straight pipe portion is connected between the straight pipe portion and the other straight pipe portion, and is disposed at an angle of 100 to 170 with both the straight pipe portion and the other straight pipe portion. The sintered heat pipe according to claim 1, wherein The diameter of each of the furcation pipe segments is equal to the diameter of the main pipe segment. A semiconductor refrigeration refrigerator comprising a liner, a semiconductor refrigeration sheet and a heat exchange device, wherein The heat exchange device includes the plurality of sintered heat pipes according to any one of claims 1 to 9; Part or all of the main section of each of the sintered heat pipes is thermally connected to the hot or cold end of the semiconductor cooling fin; The furcation section of each of the sintered heat pipes is used to dissipate heat into the ambient air or to cool the storage compartment of the liner.

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