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WO2016111035A1 - Agent de traitement de surface pour supports métalliques - Google Patents

Agent de traitement de surface pour supports métalliques Download PDF

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Publication number
WO2016111035A1
WO2016111035A1 PCT/JP2015/073422 JP2015073422W WO2016111035A1 WO 2016111035 A1 WO2016111035 A1 WO 2016111035A1 JP 2015073422 W JP2015073422 W JP 2015073422W WO 2016111035 A1 WO2016111035 A1 WO 2016111035A1
Authority
WO
WIPO (PCT)
Prior art keywords
ink
surface treatment
metal substrate
treatment agent
coating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/073422
Other languages
English (en)
Japanese (ja)
Inventor
米元　護
賢一 白川
米田　直樹
宇敷　滋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Priority to JP2016568267A priority Critical patent/JP6779136B2/ja
Publication of WO2016111035A1 publication Critical patent/WO2016111035A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Definitions

  • the present invention relates to a surface treatment agent for metal substrates (hereinafter, also simply referred to as “surface treatment agent”). Specifically, ink is applied on a metal substrate by an ink jet method to form a high-definition pattern coating film.
  • the present invention relates to a surface treatment agent for a metal substrate used for the purpose and a method for forming a pattern coating film using the same.
  • a metal pattern is obtained by forming an etching resist pattern on a metal substrate such as a copper plate and removing unnecessary portions by etching.
  • a copper circuit of a printed wiring board can be obtained by forming an etching resist having a desired pattern on a copper-clad base material and etching it.
  • the solder resist of the printed wiring board is formed on the copper circuit for circuit protection and solder bridge prevention.
  • Etching resists and solder resists are generally formed by a printing method using a screen plate or the like, or a photolithography method in which exposure and development processes are performed.
  • a method of drawing an etching resist or a solder resist by an ink jet method has been proposed because it can cope with a small lot production and omits a plate or a photomask.
  • Patent Document 1 proposes a method of drawing an etching resist by an ink jet method
  • Patent Document 2 proposes a method of drawing a solder resist by an ink jet method.
  • the viscosity of resist ink that can be applied to the ink jet system is very low, and bleeding occurs when applied to a non-absorbing substrate such as a copper surface.
  • Patent Document 3 the method of heating or cooling the base material to increase the viscosity of the ink after printing with ink is used.
  • Each method of injecting ink has been proposed.
  • Patent Document 5 an apparatus in which an ultraviolet irradiation means is provided in the vicinity of a jet nozzle using an ultraviolet curable ink has been proposed. This technique can reduce bleeding by curing the ink after application in a short time, and is used for printed wiring boards.
  • JP-A-56-263845 JP-A-7-263845 JP-A-5-309831 JP 2011-171453 A Japanese Patent Laid-Open No. 2-283452
  • an object of the present invention is to provide a surface treatment agent used for pretreatment of a metal substrate, capable of drawing a high-definition pattern coating film without bleeding when forming a pattern coating film using an inkjet method. And it is providing the formation method of a pattern coating film.
  • the present inventors have used a surface treatment agent comprising a composition containing phosphoric acid, a surfactant excluding a metal salt of a fatty acid, and water, The inventors have found that the above problems can be solved, and have completed the present invention.
  • the surface treatment agent for a metal substrate of the present invention is a surface treatment agent for a metal substrate that is used prior to forming a pattern coating film by coating ink on a metal substrate by an ink jet method. And a composition containing phosphoric acid, a surfactant excluding a metal salt of a fatty acid, and water.
  • the formation method of the pattern coating film of this invention forms the pattern coating film by coating ink with the inkjet system on the metal base material surface-treated with the surface treating agent for metal base materials of the said invention. It is characterized by.
  • the surface treatment agent for a metal substrate of the present invention it is possible to draw a high-definition pattern coating without bleeding when forming a pattern coating using an inkjet method.
  • the surface treatment agent for a metal substrate of the present invention There is an effect that the peeling time can be shortened.
  • the surface treatment agent for a metal substrate of the present invention is used for pretreatment prior to forming a pattern coating film on a metal substrate by applying ink by an inkjet method, and phosphoric acid,
  • the point which consists of a composition containing surfactant other than the metal salt of a fatty acid and water is important.
  • the conventional method when ink is applied to a metal substrate such as copper having no absorbability by the ink jet method, the conventional method sufficiently suppresses bleeding and produces a high-quality high-definition pattern.
  • the cause is that the surface energy of the metal substrate is too large compared to the surface energy of the ink.
  • the inventors of the present invention can adjust the surface energy, that is, the surface tension, by pre-treating a metal base material with a specific composition, and thereby the ink can be ink-jetted. The present inventors have found that it is possible to draw a high-definition pattern coating film that does not bleed when the coating is applied.
  • the etching resist can be easily peeled off from the metal substrate, and the effect of shortening the peeling time can be obtained.
  • the reason why the surface treatment agent of the present invention requires water is that phosphoric acid is an unstable crystal by itself, so that it is difficult to mix with a surfactant unless it contains water. is there.
  • surfactant As the surfactant used in the surface treatment agent of the present invention, known and conventional surfactants can be used as long as they exclude the fatty acid metal salt. For example, anionic surfactants, nonionic surfactants, cations System surfactants and amphoteric surfactants.
  • Anionic surfactants include sodium lauryl sulfate, sodium alkyl sulfate, sodium polyoxyethylene lauryl ether sulfate, sodium polyoxyethylene alkyl ether sulfate, polyoxyethylene alkyl ether phosphate, polyoxyethylene alkyl phenyl ether Phosphate, alkyl sulfate triethanolamine, polyoxyethylene alkyl ether sulfate triethanolamine, sodium 2-ethylhexyl sulfate, sodium di-2-ethylhexylsulfosuccinate, sodium linear alkylbenzene sulfonate, linear alkylbenzene sulfone Acid, fatty acid sodium methyl taurate, palm oil fatty acid methyl taurate sodium N-decanoyl-N-methyltaurate sodium, ⁇ -sulfo fatty acid methyl ester sodium, fatty acid amide ether sulfate sodium salt, N-oleyl-N
  • Nonionic surfactants include polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene oleyl ether, polyoxyethylene stearyl ether, polyoxyethylene isodecyl ether, polyoxyethylene-2-ethylhexyl ether, polyoxy Ethylene branched alkyl ether, polyoxyethylene polyoxypropylene alkyl ether, polyoxypropylene stearyl ether, polyoxyethylene monolaurate, polyoxyethylene monostearate, polyoxyethylene monooleate, sorbitan monocaprylate, sorbitan monolaurate, Sorbitan monomyristate, sorbitan monopalmitate, sorbitan monostearate, sorbitan monooleate, sol Tansesquiolate, sorbitan trioleate, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan monooleate, ethylene glycol distearate, poly
  • Cationic surfactants include tetradecylamine acetate, octadecylamine acetate, lauryltrimethylammonium chloride, cetyltrimethylammonium chloride, dioctyldimethylammonium chloride, dodecyltrimethylammonium chloride, cocoalkyltrimethylammonium chloride, hexadecyltrimethylammonium chloride.
  • Amphoteric surfactants include palm oil dimethyl betaine, palm oil fatty acid amidopropyl dimethylaminoacetic acid betaine, palm kernel fatty acid amidopropyl dimethylaminoacetic acid betaine, lauryl dimethylaminoacetic acid betaine, stearyl dimethylaminoacetic acid betaine, lauric acid amidopropyldimethyl Betaine aminoacetate, dodecylaminomethyldimethylsulfopropylbetaine, octadecylaminomethyldimethylsulfopropylbetaine, cocamidopropylhydroxysultain, 2-alkyl-N-carboxymethyl-N-hydroxyethyl-imidazolium betaine, laurylaminodiacetic acid mono Sodium, sodium lauryldiaminoethylglycine, sodium lauroylmethylalanine, sodium lauroylglutamate, Potassium acryloyloxy glutamate,
  • the metal salt of a fatty acid means one in which the fatty acid forms a salt with the metal. This is because if a metal salt of a fatty acid is used as a surfactant, a solid content is precipitated when the metal salt of a fatty acid and phosphoric acid are mixed, and the function as a surfactant cannot be achieved.
  • the mass ratio of phosphoric acid to the surfactant can be preferably 100: 0.1 to 100: 50, and more preferably 100: 0. .2 to 100: 20.
  • the blending amount of water may be the minimum amount as long as phosphoric acid can be dissolved, and the maximum amount can be an amount such that the concentration of the surfactant does not become 0.0001% by mass or less.
  • the amount of the surfactant is 0.001 to 0.1% by mass.
  • the surface treatment agent is applied to the surface of the metal substrate as it is or diluted with water or various water-soluble solvents at an arbitrary concentration. Or it can carry out by immersing, washing
  • Metal base material examples of the metal substrate include metal foils such as copper, iron, tin, aluminum, silver, stainless steel, brass, nickel, titanium, and alloys thereof that are usually used for printed wiring boards.
  • the present invention is particularly suitable for forming a coating film of a resist ink for printed wiring board by applying ink by an ink jet method on a copper foil as a metal substrate disposed on the printed wiring board. Useful. Among these, it is particularly useful when forming a coating film of etching resist ink or solder resist ink.
  • the base material to which the etching resist ink is applied is obtained by forming a metal foil such as copper as a metal base material on an insulating sheet.
  • the insulating sheet is generally a glass cloth, non-woven fabric, paper, or the like impregnated with an epoxy resin or a phenol resin and cured, but a sheet that is not impregnated can be selected depending on the application.
  • thermosetting resin such as polyimide, polyethylene, polypropylene, polystyrene, ABS resin, vinyl chloride resin, methyl methacrylate resin, nylon, polyester resin, fluorine Resin, polycarbonate, polyacetal, polyamide, polyphenylene ether, amorphous polyarylate, polysulfone, polyethersulfone, polyphenylene sulfide, polyetheretherketone, thermoplastic polyimide, polyetherimide, liquid crystal polymer and other thermoplastic resins, silicon nitride Ceramics such as a sintered body, a sialon sintered body, a silicon carbide sintered body, an alumina sintered body, and an aluminum nitride sintered body can be suitably used.
  • a method of forming a metal foil on such a sheet a method of attaching a single metal foil using heat fusion or an adhesive, a method of forming a seed layer by plating, and a vapor deposition method There are methods for forming them, and they may be formed in combination.
  • the same base material as that used for the etching resist ink can be used as the base material to which the solder resist ink is applied, and the etching resist is formed by forming a metal foil such as copper on the insulating sheet as a metal base material.
  • a circuit pattern formed by applying an ink and an etching method or a circuit pattern printed directly with a metal paste or the like can be used.
  • a pattern coating film is formed by applying ink by an ink jet method on a metal substrate surface-treated with the surface treatment agent.
  • the surface tension of the metal substrate can be adjusted by subjecting the metal substrate to a surface treatment using the surface treatment agent. Specifically, in the present invention, the surface tension can be reduced by performing a surface treatment on the metal substrate.
  • a metal substrate that is an object to be coated must have a higher surface energy (surface tension) than the ink to be coated. This is because if the metal base material to be coated has a surface energy (surface tension) lower than that of the ink to be coated, repelling and non-sticking occur vigorously and the coating film cannot be formed.
  • the quick-curing type ink jet it has been found that good results are obtained even if the surface energy of the metal substrate is somewhat lower than that of the applied ink.
  • the difference between the wetting index of the metal substrate and the surface tension of the ink can be +2 or less, preferably ⁇ 13 or more and +2 or less, more preferably ⁇ 12.
  • the difference between the wetting index of the metal substrate and the surface tension of the ink is the surface tension of the ink (the same value as the surface tension (unit: mN / m)) of the metal substrate. (Unit: mN / m). It is preferable that the difference between the wetting index of the metal substrate and the surface tension of the ink is +2 or less because both the line and the characters become clearer.
  • the surface tension of the metal substrate is generally adjusted because the surface tension of the metal substrate is too large compared to the ink, so it is difficult to adjust the surface tension of the ink and bring it closer to the metal substrate. Because.
  • a specific method of the surface treatment for the metal substrate in addition to using the surface treatment agent of the present invention, for example, a method of applying a metal surface conditioner to the surface of the metal substrate can be mentioned.
  • solder resist ink As the ink used in the present invention, at least one of solder resist ink and etching resist ink can be used.
  • any composition can be used as long as it has a low viscosity that can be applied by an ink jet method and can be peeled off after etching. Is desirable.
  • Such a composition can be produced by a combination of a carboxyl group-containing monomer, a monofunctional monomer, a polyfunctional monomer, a photopolymerization initiator, and other optional components.
  • carboxyl group-containing monomer examples include acid-modified epoxy (meth) acrylate, (meth) acrylic acid, (meth) acrylic acid dimer, crotonic acid, ⁇ -chloroacrylic acid, cinnamic acid, maleic acid, fumaric acid, itaconic acid, Citraconic acid, mesaconic acid, ⁇ -carboxyethyl (meth) acrylate, ⁇ -carboxypolycaprolactone mono (meth) acrylate, succinic acid mono [2- (meth) acryloyloxyethyl], mono [2- (meth) acryloyl maleate Oxyethyl], 2-acryloyloxyethyl succinate, a reaction product of phthalic anhydride and hydroxyethyl (meth) acrylate, a reaction product of hexahydrophthalic anhydride and hydroxyethyl (meth) acrylate, and the like.
  • Monofunctional monomers include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate And (meth) acrylates such as hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate, glycidyl methacrylate, ⁇ -butyrolactone acrylate and ⁇ -butyrolactone methacrylate, and acryloylmorpholine.
  • Polyfunctional monomers include polyethylene glycol diacrylates such as diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, polyurethane diacrylates and corresponding methacrylates, pentaerythritol triacrylate, triethylene glycol Methylolpropane triacrylate, trimethylolmethane triacrylate, ethylene oxide modified trimethylolpropane triacrylate, propylene oxide modified trimethylolpropane triacrylate, epichlorohydrin modified trimethylolpropane triacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, tetramethylolmethane methacrylate La acrylate, ethylene oxide-modified phosphoric acid triacrylate, epichlorohydrin-modified glycerol triacrylate, dipentaerythritol hexaacrylate, dipentaerythri
  • photopolymerization initiators include benzoin and benzoin alkyl ethers such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2- Acetophenones such as phenylacetophenone and 1,1-dichloroacetophenone; 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- ( Aminoacetophenones such as 4-morpholinophenyl) -butan-1-one, N, N-dimethylaminoacetophenone; 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone, 1-chloroanthraquinone, etc.
  • thioxanthones such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-diisopropylthioxanthone; ketals such as acetophenone dimethyl ketal and benzyldimethyl ketal; 2,4,5 -Triarylimidazole dimer; riboflavin tetrabutyrate; thiol compounds such as 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 2-mercaptobenzothiazole; 2,4,6-tris-s-triazine, 2,2 Organic halogen compounds such as 1,2-tribromoethanol and tribromomethylphenylsulfone; benzophenones such as benzophenone and 4,4′-bisdiethylaminobenzophenone or xanthones; Such as trimethyl benzoyl diphenyl
  • the solder resist ink can be used as long as it has a low viscosity enough to be applied by an ink jet method and can be cured by heat or ultraviolet rays and has heat resistance after curing. Then, a composition that is further cured by heat is desirable.
  • a composition can be produced by combining various optional components with a curing agent such as an epoxy compound or an isocyanate compound, in addition to a combination of various monomers used in the etching resist ink.
  • Example 1 to 10 and Comparative Examples 1 to 13 were prepared with the blending amounts (parts by mass) shown in Tables 1 to 3 below, diluted 50 times with water, and the surface treatment agent and did.
  • a base material an FR-4 copper-clad laminate (copper thickness: 18 ⁇ m) having a size of 150 ⁇ 90 mm was used to roughen the surface by scrubbing, and this was immersed in each surface treatment agent at 23 ° C. for 60 seconds. Thereafter, the substrate was washed with running water and dried to obtain each coating substrate.
  • the wet index of the untreated substrate is considered to be about several hundred to 1,000. Tables 4 to 7 below show the wetting indices of the substrates after the surface treatment.
  • the measurement of the wetting index is performed in accordance with the method described in JIS K6768.
  • a wetting tension test mixed solution manufactured by Wako Pure Chemical Industries, Ltd. is used for the wetting index 30 to 42.
  • a mixed solution to which pure water and ethanol, and in some cases, a fluorosurfactant was added was used, and the surface tension was measured with a dynometer manufactured by BYK-GARDNER and used after adjustment.
  • the value of the wetting index is the same as the surface tension (unit: mN / m).
  • Nonionic surfactant 1 Polyoxyethylene lauryl ether * 2)
  • Nonionic surfactant 2 Sorbitan monooleate * 3)
  • Cationic surfactant 1 Lauryltrimethylammonium chloride * 4)
  • Cationic surfactant 2 Dioctyldimethylammonium chloride * 5)
  • Anionic surfactant 1 Polyoxyethylene alkylphenyl ether phosphate * 6)
  • Amphoteric surfactant 2 Lauryldimethylamine N-oxide * 9)
  • Metal salt of fatty acid 1 Potassium stearate * 10)
  • Metal salt of fatty acid 2 Sodium myristate
  • etching resist ink 4-hydroxybutyl acrylate 20 g, isobornyl acrylate 20 g, 2-acryloyloxyethyl succinate 30 g, ⁇ -butyrolactone methacrylate 15 g, pentaerythritol triacrylate 5 g, 2,4,6-trimethylbenzoyldiphenylphosphine oxide 5 g, phenylbis ( 2,4,6-trimethylbenzoyl) phosphine oxide 3g and acrylic polymerization leveling agent 0.3g were mixed, stirred and homogenized, filtered with accuracy of 1 ⁇ m, and measured with BYK-GARDNER dynometer. Thus, an etching resist ink having a surface tension of 38 mN / m was obtained.
  • solder resist ink 30 g of trimethylolpropane triacrylate, 30 g of 1,6-hexanediol diacrylate, 10 g of butyl acrylate, 5 g of 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 3 g of phenylbis (2,4,6-trimethylbenzoyl) phosphine oxide , 1,2-hexamethylene diisocyanate trimer blocked with 20g of dimethylpyrazole and 0.01g of silicone leveling agent, blended and homogenized, filtered with accuracy of 1 ⁇ m, manufactured by BYK-GARDNER As a result, a solder resist ink having a surface tension of 27 mN / m was obtained.
  • the difference in line width from the design value is about 20 to 30 ⁇ m, It can be seen that a high-definition pattern without bleeding is obtained, and that the peelability of the etching resist is improved. Further, in the examples, the difference between the wetting index of the copper substrate and the surface tension of the ink is ⁇ 10 to +2, and it can be seen that the lines are clear and no bleeding is confirmed.
  • Comparative Examples 1 to 8 where the pretreatment was performed using a composition containing a surfactant and no phosphoric acid, or a composition containing a metal salt of phosphoric acid and a fatty acid was used. Comparative Examples 9 and 10, Comparative Examples 11 and 12 subjected to pretreatment using a composition containing a surfactant and concentrated sulfuric acid or concentrated hydrochloric acid instead of phosphoric acid, and containing a surfactant containing phosphoric acid In Comparative Example 13 in which pretreatment was performed using a composition having no difference, the difference in the line width from the design value exceeded 100 ⁇ m, bleeding was observed visually, and further, it took time to remove the etching resist. It was. In all of the comparative examples, the difference between the wetting index of the copper substrate and the surface tension of the ink was +3 or more, and bleeding was observed visually.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Ink Jet (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

L'invention concerne un agent de traitement de surface qui est utilisé pour prétraiter un support métallique, et qui permet de créer un film de revêtement à motifs haute définition sans flou lorsque le film de revêtement à motifs est formé par un procédé à jet d'encre; et un procédé de formation d'un film de revêtement à motifs. L'invention a pour objet un agent de traitement de surface pour supports métalliques, qui est utilisé avant la formation d'un film de revêtement à motifs sur un support métallique par application d'une encre par un procédé à jet d'encre. Cet agent de traitement de surface pour supports métalliques est constitué d'une composition qui contient de l'acide phosphorique, un tensioactif autre qu'un sel métallique d'un acide gras, et de l'eau.
PCT/JP2015/073422 2015-01-07 2015-08-20 Agent de traitement de surface pour supports métalliques Ceased WO2016111035A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016568267A JP6779136B2 (ja) 2015-01-07 2015-08-20 金属基材用表面処理剤

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JP2015-001744 2015-01-07
JP2015001744 2015-01-07
JP2015-068418 2015-03-30
JP2015068418 2015-03-30

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WO2016111035A1 true WO2016111035A1 (fr) 2016-07-14

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018116780A1 (fr) * 2016-12-22 2018-06-28 三洋化成工業株式会社 Composition de prétraitement de substrat de réserve et procédé de fabrication de substrat de réserve
WO2019082681A1 (fr) 2017-10-23 2019-05-02 メック株式会社 Procédé de production d'un substrat de formation de film, substrat de formation de film, et agent de traitement de surface
JP2022014128A (ja) * 2020-07-06 2022-01-19 コニカミノルタ株式会社 インクジェット記録液セットおよび当該インクジェット記録液セットを用いる画像形成方法

Families Citing this family (1)

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