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WO2016195025A1 - Composition de formation de film protecteur isolant par impression offset - Google Patents

Composition de formation de film protecteur isolant par impression offset Download PDF

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Publication number
WO2016195025A1
WO2016195025A1 PCT/JP2016/066433 JP2016066433W WO2016195025A1 WO 2016195025 A1 WO2016195025 A1 WO 2016195025A1 JP 2016066433 W JP2016066433 W JP 2016066433W WO 2016195025 A1 WO2016195025 A1 WO 2016195025A1
Authority
WO
WIPO (PCT)
Prior art keywords
composition
solvent
molecular weight
less
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2016/066433
Other languages
English (en)
Japanese (ja)
Inventor
内田　博
祐司 伊藤
正彦 鳥羽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP2017522251A priority Critical patent/JP6817199B2/ja
Priority to CN201680026475.5A priority patent/CN107614630B/zh
Priority to KR1020177026582A priority patent/KR102056657B1/ko
Publication of WO2016195025A1 publication Critical patent/WO2016195025A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/06—Lithographic printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes

Definitions

  • the present invention relates to a composition for forming an insulating protective film by offset printing.
  • the offset printing method is a printing method in which a plate on which a printing image is formed and a substrate to be printed are not contacted, and the ink paste is transferred to the surface layer of the blanket and re-transferred almost 100% from the blanket to the substrate to be printed. Printing is performed by.
  • Patent Document 1 includes a binder resin and a solvent having a solubility constant of 8.5 to 12.0 in order to suppress absorption of the binder resin into the blanket and absorb the solvent appropriately.
  • the absolute value of the difference between the solubility constants of the two is 2.0 or less
  • the boiling point of the solvent is 50 to 200 ° C.
  • the viscosity of the ink composition is 5 to 50 Pa ⁇ s
  • the ball tack value of the coating film obtained by drying the ink composition is Ink compositions that are 10 to 28 are disclosed.
  • thermosetting resin itself that forms the insulating protective film is the main component, and a curable resin (UV) is used to improve the insulating performance of the protective film.
  • UV curable resin
  • Curable or thermosetting resins include polyfunctional (meth) acrylates, epoxies, and oxetane compounds having a relatively low molecular weight.
  • the ink also contains a thermosetting resin
  • the monomer and oligomer components before curing contained in the thermosetting resin are absorbed by the blanket together with the solvent, and these monomers and oligomers (including reactive diluents) )
  • curing modification starts when the blanket dries, and the blanket is permanently deteriorated. For this reason, there is a problem that a system having a high content of the thermosetting resin component cannot be applied to offset printing.
  • An object of the present invention is a system using a thermosetting resin used as an insulating protective film, and forms an insulating protective film using offset printing, which is a level at which absorption of the curable resin into a blanket does not become a problem.
  • An object of the present invention is to provide a composition for forming an insulating protective film.
  • one embodiment of the present invention is a composition for forming an insulating protective film by offset printing, comprising (A) a crosslinking reactive group and a weight average molecular weight of 2 ⁇ 10 4 A high molecular weight resin having a large value of 40 ⁇ 10 4 or less; (B) a solvent having a solubility parameter greater than 8.7 and a boiling point of 150 ° C. or higher and 350 ° C. or lower; and (C) a solubility parameter of 7.0 or higher and 8.7. And a solvent having a boiling point of 130 ° C. or higher and lower than 250 ° C.
  • the above-mentioned (A) high molecular weight resin having a crosslinking reactive group preferably has an average number of crosslinking reactive groups per molecule of 3 or more obtained by calculation from the number of crosslinking reactive groups per mass and the number average molecular weight.
  • composition for forming an insulating protective film by offset printing further includes (D) a crosslinking agent.
  • the (A) high molecular weight resin having a crosslinking reactive group has a solubility parameter of 11 or more and 15 or less, and is preferably contained in the composition in an amount of 10 to 80% by mass.
  • the solvent having a solubility parameter (B) greater than 8.7 and a boiling point of 150 ° C. or more and 350 ° C. or less is a solvent having a solubility parameter of (A) the solubility parameter of the high molecular weight resin having a crosslinking reactive group + 1 or less.
  • a solubility parameter of (A) the solubility parameter of the high molecular weight resin having a crosslinking reactive group + 1 or less is a solvent having a solubility parameter of (A) the solubility parameter of the high molecular weight resin having a crosslinking reactive group + 1 or less.
  • the solvent (C) having a solubility parameter of 7.0 or more and 8.7 or less and a boiling point of 130 ° C. or more and less than 250 ° C. is contained in an amount of 10 to 50% by mass in the composition.
  • the solvent (C) having a solubility parameter of 7.0 or more and 8.7 or less and a boiling point of 130 ° C. or more and less than 250 ° C. is contained in the composition in an amount of 20 to 50% by mass.
  • solubility parameter between the polymer resin having the (A) crosslinking reactive group and the solvent (C) having a solubility parameter of 7.0 or more and 8.7 or less and a boiling point of 130 ° C. or more and less than 250 ° C. is It is preferred that it be greater than 2.
  • the solvent having a solubility parameter (B) greater than 8.7 and a boiling point of 150 ° C. or higher and 350 ° C. or lower is diethylene glycol monoethyl ether acetate, triethylene glycol monobutyl ether, ⁇ -butyrolactone, 1,3-dimethyl- It is preferably one of the group consisting of 2-imidazolidinone.
  • the solvent having a solubility parameter (C) of 7.0 or more and 8.7 or less and a boiling point of 130 ° C. or more and less than 250 ° C. is one of the group consisting of propylene glycol monomethyl ether acetate and diethylene glycol dimethyl ether. Is preferred.
  • an insulating protective film forming composition by offset printing in which a curable resin is hardly absorbed by a blanket.
  • the composition for forming an insulating protective film by offset printing according to the embodiment (hereinafter sometimes referred to as an ink composition) has (A) a crosslinking reactive group and has a weight average molecular weight of more than 2 ⁇ 10 4 and 40 X10 4 or less high molecular weight resin, (B) a solvent having a solubility parameter greater than 8.7, a boiling point of 150 ° C. or more and 350 ° C. or less, preferably a boiling point of more than 200 ° C. and 300 ° C. or less, and (C) solubility.
  • a parameter is 7.0 or more and 8.7 or less, and the boiling point is 130 degreeC or more and less than 250 degreeC, Preferably it contains the solvent whose boiling point is 130 degreeC or more and less than 200 degreeC.
  • the (A) high molecular weight resin having a crosslinking reactive group is a high molecular weight resin having a weight average molecular weight of more than 2 ⁇ 10 4 and not more than 40 ⁇ 10 4 .
  • a high molecular weight material having a weight average molecular weight within this range as the binder resin, absorption to a transfer body (blanket) for offset printing can be reduced. Absorption to the blanket tends to increase as the weight average molecular weight becomes smaller than this range, and solubility in the solvent tends to decrease when the weight average molecular weight becomes larger than this range.
  • a more preferred weight average molecular weight is more than 3 ⁇ 10 4 and not more than 35 ⁇ 10 4 .
  • crosslinking reactive group means a functional group capable of forming a bridging bond between the same molecule and / or other molecules.
  • the crosslinking reactive group can be selected from known functional groups. For example, it means a functional group that forms a cross-linked structure by reacting with a cross-linking agent (D) described later, or a functional group that reacts between cross-linking reactive groups.
  • groups having active hydrogen such as carboxyl group, hydroxyl group, mercapto group, amino group, vinyl group, group having unsaturated bond such as (meth) allyl group, (meth) acryloyl group, glycidyl group, oxetane group, etc.
  • a cyclic ether group, an isocyanate group, etc. are mentioned.
  • (meth) allyl group means an allyl group or methallyl group
  • “(meth) acryloyl group” means an acryloyl group or methacryloyl group.
  • the (A) high molecular weight resin having a crosslinking reactive group preferably has a plurality of crosslinking reactive groups.
  • the crosslinking density can be increased, and the insulating performance and heat resistance of the formed insulating protective film can be further improved. It is preferable that the number of crosslinking reactive groups per molecule calculated from the number average molecular weight is at least 3, more preferably 7 or more.
  • the number of cross-linking reactive groups per molecule is the average number of functional groups per molecule determined by calculation from the number of cross-linking reactive groups per mass of the high molecular weight resin and the number average molecular weight.
  • the calculation method of the number of cross-linking reactive groups per mass is not particularly specified, a known method can be used.
  • an epoxy equivalent can be used for a glycidyl group, an acid value for a carboxyl group, a hydroxyl value for a hydroxyl group, and an iodine value for an unsaturated bond group such as a vinyl group or a (meth) allyl group.
  • the number of crosslinking reactive groups per mass of the high molecular weight resin can be calculated.
  • the method for measuring the number average molecular weight is not particularly defined, but a known method can be used.
  • a GPC gel permeation chromatography
  • the (A) high molecular weight resin having a crosslinking reactive group preferably has a solubility parameter (SP value, unit: (cal / cm 3 ) 1/2 ) of 11 or more and 15 or less, more preferably 11. 5 to 15 and preferably 10 to 80% by mass, more preferably 15 to 70% by mass in the composition. If it is less than 10% by mass, the amount of the low molecular weight compound increases, and the amount of the substance absorbed into the blanket may increase. If it exceeds 80% by mass, the composition viscosity becomes too high and transfer from the plate to the blanket may be poor. For this reason, the concentration of the high molecular weight resin is preferably within the above range.
  • SP value solubility parameter
  • the SP value of the high molecular weight resin is preferably in the above range.
  • the SP value can be calculated with reference to RFFedors: Polym.Eng.Sci., 14 [2], 147-154 (1974).
  • the (A) high molecular weight resin having a crosslinking reactive group can be used as long as it contains a crosslinking reactive group and can be dissolved or dispersed in the composition.
  • a high molecular weight resin having active hydrogen such as a carboxyl group-containing polyurethane (SP value 11.5 to 12) or a prepolymer of diallyl phthalate (for example, Daiso Dup (SP value 11.7, diallyl phthalate 1 manufactured by Daiso Corporation)
  • diallyl isophthalate prepolymers for example, Daiso Isodap (SP value 11.7) manufactured by Daiso Corporation
  • diallyl A terephthalate prepolymer (SP value 11.7)
  • a prepolymer of triallyl isocyanurate for example, Tyke prepolymer manufactured by Nippon Kasei Co., Ltd.
  • a solvent having a solubility parameter (SP value) larger than 8.7 and a boiling point of 150 ° C. or higher and 350 ° C. or lower is a solvent having a low affinity with a transfer body (blanket) for offset printing, that is, a transfer body (blanket).
  • SP value solubility parameter
  • a solvent or reactive diluent having an SP value of greater than 8.7 and an SP value of +1 or less of the above-mentioned (A) high molecular weight resin having a crosslinking reactive group is preferred.
  • the SP value When the SP value is 8.7 or less, the difference from the SP value of the blanket becomes small and is easily absorbed by the blanket, so that the solvent concentration in the ink composition transferred from the plate onto the blanket becomes low, and It is difficult to re-transfer to the printed body (work).
  • the SP value when the SP value is larger than the SP value + 1 of the polymer resin having (A) a crosslinking reactive group, the affinity between the solvent and the high molecular weight resin is lowered, and the high molecular weight resin is dissolved in the solvent. Since it becomes difficult and a uniform ink composition cannot be formed, retransfer to a workpiece may be hindered.
  • the boiling point of the solvent having low affinity with the transfer body (blanket) for offset printing is low, the solvent is dried before further transfer from the transfer body to the substrate, which makes it difficult to retransfer. It becomes easy to get up.
  • the boiling point is 150 ° C. or higher and 350 ° C. or lower, preferably 200 ° C. or higher and 300 ° C. or lower.
  • the content in the ink composition of the solvent (B) having a solubility parameter (SP value) greater than 8.7 and a low boiling point with a boiling point of 150 ° C. or higher and 350 ° C. or lower is other than (B).
  • SP value solubility parameter
  • Examples of the solvent (B) having a solubility parameter (SP value) larger than 8.7 and a low affinity with a blanket having a boiling point of 150 ° C. or higher and 350 ° C. or lower include diethylene glycol monoethyl ether acetate (SP value 9.0). Triethylene glycol monobutyl ether (SP value 10.3), ⁇ -butyrolactone (SP value 9.9), 1,3-dimethyl-2-imidazolidinone (SP value 11.5), and the like.
  • the solvent having a solubility parameter (SP value) of 7.0 or more and 8.7 or less and a boiling point of 130 ° C. or more and less than 250 ° C. is a solvent having a high affinity for a transfer body (blanket) for offset printing. That is, it is a solvent that is easily absorbed by the transfer body (blanket). If the SP value is less than 7.0 or exceeds 8.7, the difference from the SP value of the blanket increases, and the absorbability to the blanket decreases. For this reason, the ink composition is difficult to peel off from the blanket, and retransfer to the workpiece is difficult.
  • SP value solubility parameter
  • the boiling point of the solvent having a high affinity with the transfer material (blanket) for offset printing is high, it takes a long time to heat the blanket after it is adsorbed to the blanket. However, if the boiling point is too low, drying tends to occur before transfer to the transfer body, and there is a problem that the initial transfer is not successful. Therefore, the boiling point is 130 ° C. or higher and lower than 250 ° C., and 130 ° C. or higher and lower than 200 ° C. It is preferable.
  • the solvent (C) having a solubility parameter (SP value) of 7.0 or more and 8.7 or less and having a high affinity with a blanket having a boiling point of 130 ° C. or more and less than 250 ° C. is 10 in the ink composition. It is preferably contained in an amount of ⁇ 50 mass%, more preferably 20-50 mass%.
  • the content of the solvent in the ink composition having a solubility parameter (SP value) of 7.0 or more and 8.7 or less and a high boiling point of 130 ° C. or more and less than 250 ° C. in the ink composition is 10% by mass. If it is above, the transfer of the ink composition from a plate to a blanket can be performed satisfactorily. On the other hand, when the amount is 50% by mass or less, there is no problem that the solvent concentration in the ink composition becomes too high to be completely absorbed by the blanket, and retransfer from the blanket to the work can be performed satisfactorily.
  • Examples of the solvent (C) having a solubility parameter (SP value) of 7.0 or more and 8.7 or less and a boiling point of 130 ° C. or more and less than 250 ° C. include propylene glycol monomethyl ether acetate (SP value 8.7), diethylene glycol, and the like. Dimethyl ether (SP value 8.1) etc. are mentioned.
  • SP value solubility parameter
  • the difference in SP value with a solvent having high properties is 2 or more. More preferably, it is more than 2, more preferably 2.3 or more. If this difference is less than 2, the solubility of the solvent in the high molecular weight resin increases, so that the solvent having high affinity to the blanket cannot be selectively adsorbed to the blanket, and the retransferability to the workpiece is reduced. There are things to do.
  • the ink composition according to the embodiment further includes (A) a crosslinking agent for accelerating the crosslinking reaction of the high molecular weight resin having a crosslinking reaction group (A).
  • A a crosslinking agent for accelerating the crosslinking reaction of the high molecular weight resin having a crosslinking reaction group
  • D the solubility parameter (SP value) is preferably 9 or more and 15 or less, more preferably 10 or more. It is preferable that 10% by mass or less is contained in the composition. If the SP value is less than 9, it will be easily absorbed by the blanket, and the transferability may be deteriorated.
  • the crosslinking agent may include a compound having a plurality of groups reactive with the crosslinking reactive group of (A), and a compound having only one group reactive with the crosslinking reactive group of (A).
  • the crosslinking reaction group is a carboxyl group having active hydrogen
  • a compound having a plurality of groups that react with the carboxyl group for example, a hydroxyl group or a glycidyl group
  • I can do it.
  • the cross-linking reaction is preferably an addition reaction without elimination of a low molecular compound, and in this case, an epoxy compound having a glycidyl group is more preferable (for example, bisphenol-A-diglycidyl ether (SP value 10.4), bisphenol-F -Diglycidyl ether, glycidyl ether of novolak phenol resin, hydrogen peroxide oxide of bisphenol-A-diallyl ether (SP value 10.4), EHPE 3150 (SP value 11.0) manufactured by Daicel Corporation).
  • an epoxy compound having a glycidyl group is more preferable (for example, bisphenol-A-diglycidyl ether (SP value 10.4), bisphenol-F -Diglycidyl ether, glycidyl ether of novolak phenol resin, hydrogen peroxide oxide of bisphenol-A-diallyl ether (SP value 10.4), EHPE 3150 (SP value 11.0) manufactured by Daicel Corporation).
  • the crosslinking reaction group is an allyl group, so that a crosslinking reaction can be carried out without using a crosslinking agent by curing by radical polymerization.
  • a polyfunctional acrylate for example, dipentaerythritol hexaacrylate (SP value 10.4), addition of acrylic acid to an epoxy resin
  • SP value 10.4 dipentaerythritol hexaacrylate
  • allyl compounds such as triallyl isocyanurate (Nippon Kasei Co., Ltd.) (SP value 13.6), and maleimide compounds such as 4,4′-diphenylmethane bismaleimide (SP value 14.3).
  • (E) Curing catalyst A) In order to smoothly perform the crosslinking reaction of the high molecular weight resin having a crosslinking reactive group, (E) a curing catalyst may be added.
  • a curing catalyst a known compound suitable for the curing reaction can be used.
  • melamine and imidazoles can be used in the case of a curing reaction between a carboxyl group and a glycidyl group.
  • a peroxide or the like can be used.
  • a photopolymerization initiator can be used in the case of ultraviolet curing of an acryloyl group or a methacryloyl group.
  • the addition amount may be a known addition amount.
  • the addition amount may be 1 to 5% by mass with respect to the total amount of the resin ((A) high molecular weight resin having a crosslinking reactive group) and (D) a crosslinking agent. Can be added.
  • Reactive Diluent is a low-molecular compound that has very low volatility and contains a crosslinking reactive group, and is a compound that can uniformly dissolve or disperse other components.
  • A The viscosity of the composition can be adjusted by uniformly dissolving or dispersing the high molecular weight resin having a crosslinking reactive group together with a solvent. Moreover, since it has reactivity, it becomes a solid after curing.
  • the SP value is greater than 8.7, and is equal to or less than the SP value + 1 of the high molecular weight resin having the (A) crosslinking reactive group.
  • the SP value is 9 or more, More preferably, it is 10 or more.
  • the boiling point of the reactive diluent is preferably above 300 ° C., and the upper limit of the boiling point of the reactive diluent is not particularly limited. It is preferable that the reactive diluent is not substantially distilled off. If the boiling point is 300 ° C. or lower, depending on the curing conditions, there is a possibility that a part of the (F) reactive diluent may be evaporated.
  • 1.6 hexanediol glycidyl ether (SP value 9.5), ethoxylated isocyanuric acid triacrylate (A-93000 Shin-Nakamura Chemical Co., Ltd., SP value 13.3), 1.6 hexanediol glycidyl ether (SP value) 9.5).
  • the addition amount is 100 parts by mass or less, preferably 80 parts by mass or less, with respect to 100 parts by mass of the high molecular weight resin (A) having a crosslinking reactive group.
  • Additives such as surfactants, antioxidants, and fillers may be included as long as the performance of the composition for forming an insulating protective film is not adversely affected.
  • a filler such as fumed silica can be used.
  • a colored filler may be added in order to color, in order to ensure insulation, it is preferable not to contain a conductive filler.
  • the addition amount may be an amount that can express the target function, and is preferably 5% by mass or less of the entire composition, for example.
  • the epoxy equivalent was determined according to JIS-K7236. Weigh 0.1 to 0.2 g of the sample, put it in an Erlenmeyer flask, and add 10 mL of chloroform to dissolve. Next, 20 mL of acetic acid is added, followed by 10 mL of tetraethylammonium bromide solution (100 g of tetraethylammonium bromide dissolved in 400 mL of acetic acid). 4 to 6 drops of crystal violet indicator was added to this solution, and titrated with a 0.1 mol / L perchloric acid acetic acid solution. Based on the titration result, the epoxy equivalent was determined according to the following formula.
  • Epoxy equivalent (g / eq) (1000 ⁇ m) / ⁇ (V1 ⁇ V0) ⁇ c ⁇ m: Mass of the sample (g) V0: Amount of perchloric acid acetic acid solution consumed for titration to the end point in the blank test (mL) V1: Amount of perchloric acid acetic acid solution consumed for titration to the end point (mL) c: Concentration of perchloric acid acetic acid solution (0.1 mol / L)
  • GPC gel permeation chromatography
  • Diol 15: 85, molecular weight 964) 143.6 g, 2,2-dimethylolbutanoic acid (made by Nippon Kasei Co., Ltd.) 27.32 g as a dihydroxyl compound having a carboxyl group, and propylene glycol monomethyl ether acetate (product) (Name: methoxypropyl acetate, manufactured by Daicel Corporation) 259 g was charged, and the 2,2-dimethylolbutanoic acid was dissolved at 90 ° C.
  • the temperature of the reaction solution was lowered to 70 ° C., and 87.5 g of Desmodur (registered trademark) -W (methylenebis (4-cyclohexylisocyanate), manufactured by Sumika Bayer Urethane Co., Ltd.) was added as polyisocyanate over 30 minutes with a dropping funnel. It was dripped. After completion of the dropwise addition, the temperature was raised to 120 ° C., and the reaction was carried out at 120 ° C. for 6 hours. After confirming that the isocyanate almost disappeared by IR, 0.5 g of isobutanol was added, and the reaction was further carried out at 120 ° C. for 6 hours. went.
  • Desmodur registered trademark
  • -W methylenebis (4-cyclohexylisocyanate
  • the obtained carboxyl group-containing polyurethane had a weight average molecular weight of 32,300, a number average molecular weight of 17,900, and an acid value of the resin of 40 mgKOH / g.
  • the number of cross-linking groups calculated from the number average molecular weight and acid value was 12.8 [pieces / one resin].
  • the weight average molecular weight of the obtained carboxyl group-containing polyurethane was 43200, the number average molecular weight was 21,700, and the acid value of the resin was 80 mgKOH / g.
  • the number of crosslinking reactive groups calculated from the number average molecular weight and the acid value was 30.9 [pieces / one resin].
  • Example 1 23 parts by mass of carboxyl group-containing polyurethane (acid value 40 [KOHmg / resin g]) as resin (high molecular weight), hydrogen peroxide oxide of bisphenol-A-diallyl ether (epoxy equivalent 189 [g / eq]) as crosslinking agent 3 parts by mass, 26 parts by mass of triethylene glycol monobutyl ether (manufactured by Tokyo Chemical Industry Co., Ltd.) as a solvent having a low affinity with a blanket, and 28.4 parts by mass of propylene glycol monomethyl ether acetate as a solvent having a high affinity with a blanket Parts (manufactured by Wako Pure Chemical Industries, Ltd.) and 19 parts by mass of diethylene glycol dimethyl ether (manufactured by Wako Pure Chemical Industries, Ltd.) and 0.6 parts by mass of melamine (manufactured by Nissan Chemical Industries, Ltd.) as a curing catalyst were charged in a glass container at
  • etching plate having a linear groove pattern with a line width of 100 ⁇ m and a recess depth of 20 ⁇ m is used.
  • the silicone blanket cylinder is rolled on the recess filled with the ink composition to transfer the ink composition to the silicone blanket cylinder.
  • the silicone blanket cylinder onto which the ink composition has been transferred is rolled on a glass substrate, and the ink composition is retransferred to the glass substrate.

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  • Chemical & Material Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

L'invention vise à fournir une composition de formation de film protecteur isolant permettant de former un film protecteur isolant à l'aide d'une impression offset ; dans un système dans lequel une résine thermodurcissable est utilisée comme film protecteur isolant, la résine durcissable étant absorbée dans une couverture à un niveau négligeable. La composition de formation d'un film protecteur isolant par impression offset contient (A) une résine de poids moléculaire élevé ayant un groupe réactif de réticulation et ayant un poids moléculaire moyen en poids supérieur à 2 × 104 mais pas supérieur à 40 × 104, (B) un solvant ayant un paramètre de solubilité de plus de 8,7 et ayant un point d'ébullition de 150 à 350 °C, et (C) un solvant ayant un paramètre de solubilité de 7,0 à 8,7 et un point d'ébullition de 130 °C ou plus et inférieur à 250° C.
PCT/JP2016/066433 2015-06-05 2016-06-02 Composition de formation de film protecteur isolant par impression offset Ceased WO2016195025A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017522251A JP6817199B2 (ja) 2015-06-05 2016-06-02 オフセット印刷による絶縁性保護膜形成用組成物
CN201680026475.5A CN107614630B (zh) 2015-06-05 2016-06-02 用于利用胶版印刷形成绝缘性保护膜的绝缘性保护膜形成用组合物
KR1020177026582A KR102056657B1 (ko) 2015-06-05 2016-06-02 오프셋 인쇄에 의한 절연성 보호막 형성용 조성물

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Application Number Priority Date Filing Date Title
JP2015-114722 2015-06-05
JP2015114722 2015-06-05

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WO2016195025A1 true WO2016195025A1 (fr) 2016-12-08

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US12252625B2 (en) * 2018-12-07 2025-03-18 Kansai Paint Co., Ltd. Coating composition
CN119241475A (zh) * 2024-10-15 2025-01-03 中国科学院长春应用化学研究所 一种环氧树脂的制备方法和电子电器用材料

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KR102056657B1 (ko) 2019-12-17
TW201712078A (zh) 2017-04-01
CN107614630A (zh) 2018-01-19
KR20170118877A (ko) 2017-10-25
TWI701299B (zh) 2020-08-11
CN107614630B (zh) 2021-03-30
JP6817199B2 (ja) 2021-01-20

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