[go: up one dir, main page]

WO2016017368A1 - Feuille contenant de la résine et structure et carte de câblage comprenant chacune cette dernière - Google Patents

Feuille contenant de la résine et structure et carte de câblage comprenant chacune cette dernière Download PDF

Info

Publication number
WO2016017368A1
WO2016017368A1 PCT/JP2015/069171 JP2015069171W WO2016017368A1 WO 2016017368 A1 WO2016017368 A1 WO 2016017368A1 JP 2015069171 W JP2015069171 W JP 2015069171W WO 2016017368 A1 WO2016017368 A1 WO 2016017368A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
fixing agent
bis
elastic modulus
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/069171
Other languages
English (en)
Japanese (ja)
Inventor
武徳 角谷
崇夫 三輪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=55217273&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2016017368(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Priority to CN201580033385.4A priority Critical patent/CN106459453A/zh
Priority to JP2016538237A priority patent/JP6684712B2/ja
Priority to KR1020177000247A priority patent/KR102338789B1/ko
Publication of WO2016017368A1 publication Critical patent/WO2016017368A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/248—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using pre-treated fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers

Definitions

  • the present invention relates to a resin-containing sheet having excellent mechanical strength, elastic modulus and adhesion, and suitable for a wiring board for electronic equipment, and a structure and a wiring board using the same.
  • a wiring board for electronic devices generally, a prepreg (a semi-cured resin insulation layer) obtained by impregnating a substrate made of glass fiber, aramid fiber, cellulose fiber or the like with a resin such as epoxy, A circuit in which a circuit is formed by an etching method in close contact with a metal foil is used.
  • the wiring board is provided with a solder resist in order to prevent the solder from flowing out during component mounting.
  • Wiring board materials such as prepreg and solder resist need to be in close contact with heating and pressurization so that they adhere to the surface of the metal foil or the circuit board on which the circuit is formed, and the adhesion at that time is important. Become.
  • the wiring board is desired to have high strength (high elastic modulus) in order to improve mounting reliability.
  • the prepreg and solder resist which are constituent members thereof, are also expected to have high elastic modulus. It has been.
  • Patent Document 1 As a conventional technique related to a wiring board material, for example, in Patent Document 1, resin layers having different strengths (elastic modulus) are provided on both surfaces of a core layer in order to obtain both functions of insulation reliability and stress relaxation with wiring. A prepreg is described. However, this technique provides different layers of the resin composition on both sides of the core layer, and there is no disclosure that it is useful for adhesion. Patent Document 2 describes a prepreg having a predetermined elastic modulus. This technique is intended to temporarily fix the prepreg sheet and the circuit board, and the elastic modulus is controlled by the composition.
  • Patent Document 3 discloses a technique using two types of resin compositions in a prepreg. In this prepreg, two kinds of resin compositions are unevenly distributed so that the elastic modulus increases toward the surface side. Furthermore, Patent Document 4 describes a technique in which an adhesive layer is provided on the surface of a prepreg in order to improve adhesion with a metal foil.
  • an object of the present invention is to provide a resin-containing sheet that has improved mechanical strength and improved adhesion to a substrate, and a structure and a wiring board using the resin-containing sheet.
  • a resin-containing sheet such as a prepreg made of a woven fabric such as glass cloth or a nonwoven fabric made of aramid fibers and a resin is used for the wiring board, in order to ensure the strength of the wiring board. In the fiber assembly, it is important to prevent slippage between the fibers. On the other hand, as described above, the resin-containing sheet is also required to have good adhesion to the metal foil surface and the wiring board surface.
  • the resin-containing sheet of the present invention has a fiber base material, a fixing agent that fixes fibers in the fiber base material, and a resin that contacts the fiber base material and the fixing agent, and the fixing agent.
  • the storage elastic modulus of the resin is higher than the storage elastic modulus of the resin.
  • the glass transition temperature of the fixing agent is preferably higher than the glass transition temperature or softening temperature of the resin.
  • the resin-containing sheet of the present invention can be obtained by fixing the fibers of the fiber base material with the fixing agent composition and then impregnating the fixed fiber base material with the resin composition.
  • the viscosity of the fixing agent composition is preferably 1 Pa ⁇ s or less.
  • the said fiber base material contains a woven fabric or a nonwoven fabric.
  • the structure of the present invention is obtained by bringing the resin-containing sheet of the present invention into close contact with a substrate.
  • the wiring board of the present invention is characterized by having the structure of the present invention.
  • the present invention it is possible to obtain a resin-containing sheet having improved mechanical strength and improved adhesion to the substrate. That is, in the present invention, the storage elastic modulus of the fixing agent for fixing the fibers in the fiber base material is higher than the storage elastic modulus of the resin in contact with the fiber base material and the fixing agent.
  • the present inventors have found a material condition for obtaining a resin-containing sheet having improved elasticity and improved adhesion. This is because the resin insulating material for wiring boards is required to have high strength. For example, when a high elastic modulus material such as polyimide is used, the adhesion to a metal foil or the like deteriorates. This solves the problem of adhesion while realizing a high elastic modulus.
  • FIG. 1 explanatory drawing which shows the structure of the resin containing sheet
  • the resin-containing sheet of the present invention is a sheet-like body mainly formed from a fiber component and a resin component.
  • the fiber base material 11 and the fixing agent 2 for fixing the fibers 1 in the fiber base material 11 to each other.
  • a resin 3 in contact with the fiber base 11 and the fixing agent 2.
  • symbol S in a figure shows the space in which neither the fixing agent 2 nor the resin 3 is impregnated in the fiber base material 11.
  • FIG. 1 explanatory drawing which shows the structure of the resin containing sheet
  • the resin-containing sheet of the present invention is a sheet-like body mainly formed from a fiber component and a resin component.
  • the fiber base material 11 and the fixing agent 2 for fixing the fibers 1 in the fiber base material 11 to each other.
  • a resin 3 in contact with the fiber base 11 and the fixing agent 2.
  • symbol S in a figure shows
  • the fibers 1 constituting the fiber base material 11, the fixing agent 2, and the resin 3 form one layer as a whole.
  • the storage elastic modulus of the fixing agent 2 that fixes the fibers 1 is higher than the storage elastic modulus of the resin 3 at any temperature.
  • the present inventors have two roles of the resin component contained in the resin-containing sheet.
  • the resin-containing sheet is made to have high strength and high elasticity by suppressing slippage between fibers. It has been found that it is a role as a sticking agent for increasing the rate, and the other is a role of bringing the insulating resin layer and the surface of the metal foil into close contact with each other. From this point of view, the present inventors have further studied, and as a result, the two roles of the resin component contained in the resin-containing sheet are assigned to the fixing agent for ensuring high strength and to the resin for ensuring adhesion, respectively.
  • the present invention is conceptually explained.
  • a tension T is applied in one direction.
  • the fiber base material 11 can be increased in strength and elasticity.
  • impregnating the resin 3 so as to be in contact with the fiber base material 11 and the fixing agent 2 good adhesiveness as a resin-containing sheet can be obtained.
  • the resin-containing sheet of the present invention it is possible to ensure the adhesiveness to the substrate or the like with the resin 3 while ensuring the high elastic modulus required for the fiber base material 11 with the resin 3, and simply polyimide It became possible to obtain a resin-containing sheet having both high strength and good adhesion, which could not be obtained by using a high elastic modulus material such as.
  • the fiber base material 11 according to the present invention is composed of an assembly of fibers 1.
  • the fiber 1 is not particularly limited as long as an aggregate can be formed and a woven fabric or a nonwoven fabric can be produced, and natural fibers or chemical fibers can be mainly used.
  • natural fibers include glass fibers, cellulose fibers, rock fibers, metal fibers, carbon fibers, rock wool, etc.
  • chemical fibers include aramid, nylon, vinylon, vinylidene, polyester, Polyolefin (polyethylene terephthalate, modified polyethylene terephthalate, polyethylene, polypropylene, etc.), polyurethane, acrylic, polyvinyl chloride, polyetheretherketone, polyamideimide, polyphenylene sulfide, polyetherimide, polytetrafluoroethylene, acetate, triacetate, promix, Examples include rayon, cupra, polynosic rayon, lyocell, and tencel.
  • the fiber substrate 11 is preferably glass fiber, cellulose fiber, or aramid fiber from the viewpoint of affinity with the fixing agent.
  • the fiber base material 11 is not a glass fiber that originally has high strength, but an organic fiber having low strength is used. There is also an advantage that can be made.
  • the fixing agent composition for forming the fixing agent 2 may be any one that can adhere to the fibers 1 and fix the fibers 1 to each other, and fixes only the contact portions where the fibers contact each other. Alternatively, the whole fiber 1 may be covered and fixed.
  • the amount of the fixing agent composition used may be an amount that can fix the fibers 1 to each other and does not adversely affect the adhesion.
  • the volume ratio of the fiber 1 to the fixing agent 2 is in the range of 99: 1 to 50:50, particularly in the range of 99: 1 to 60:40, with the solid content excluding the solvent.
  • the amount of the sticking agent 2 used is preferably such an amount that the film thickness of the fiber base material 11 does not substantially change before and after the application of the sticking agent 2.
  • the film thickness does not substantially change means that the change in the film thickness does not include a case where the fiber base 11 is swollen by the solvent component of the fixing agent composition and apparently increases in thickness. It is.
  • the fixing agent composition is a liquid when adhering to the fiber, and it may be a liquid that can be used by changing temperature and pressure.
  • the viscosity of the fixing agent composition measured at 25 ° C. with a rotor speed of 5 rpm in an E-type viscometer is preferably 1 Pa ⁇ s or less, for example, 1 to 0.0001 Pa ⁇ s.
  • the fixing agent composition can be impregnated to the inside of the aggregate of the fibers 1, and the fibers can be more reliably fixed.
  • the fixing agent composition that is cured by heat or light is used.
  • the term “curing” as used herein means a chemical change from liquid to solid by heat or light energy.
  • a fixing agent composition a usual component can be used according to the use, 1 type can be used individually or in combination of 2 or more types.
  • conventional components used in the fixing agent composition include a thermosetting resin, a curing agent, a thermosetting catalyst, a photocurable resin, a photopolymerization initiator, a photoacid generator, a photobase generator, and an organic solvent. Specifically, the following can be used.
  • the thermosetting resin may be a resin that is cured by heating and exhibits electrical insulation properties.
  • the thermosetting resin may be a resin that is cured by heating and exhibits electrical insulation properties.
  • bisphenol A type epoxy resin bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol E type epoxy resin, bisphenol M Type epoxy resin, bisphenol P type epoxy resin, bisphenol type epoxy resin such as bisphenol Z type epoxy resin, novolac type epoxy resin such as bisphenol A novolac type epoxy resin, phenol novolac type epoxy resin, cresol novolac epoxy resin, biphenyl type epoxy resin , Biphenyl aralkyl type epoxy resin, aryl alkylene type epoxy resin, tetraphenylol ethane type epoxy resin, naphthalene type epoxy resin, anthracene type epoxy resin, Enoxy-type epoxy resin, dicyclopentadiene-type epoxy resin, norbornene-type epoxy resin, adamantane-type epoxy resin, fluorene-type epoxy resin,
  • Phenol resin such as resole phenol resin such as resole phenol resin, Triazine ring-containing resin such as phenoxy resin, urea resin, melamine resin, unsaturated polyester resin, bismaleimide resin, diallyl phthalate resin, silicone resin, benzoxazine Ring-containing resin, norbornene resin, cyanate resin, isocyanate resin, urethane resin, benzocyclobutene resin, maleimide resin, bismaleimide triazine resin, polyazo Chin resins, and polyimide resins.
  • an epoxy resin or a polyimide resin is particularly preferable because of its excellent reliability as an insulating layer.
  • the epoxy resin a known and commonly used polyfunctional epoxy resin having at least two epoxy groups in one molecule can be used.
  • the epoxy resin may be liquid, and may be solid or semi-solid.
  • bisphenol A type epoxy resin, naphthalene type epoxy resin, phenol novolac type epoxy resin or a mixture thereof is particularly preferable.
  • These epoxy resins may be used individually by 1 type, and may be used in combination of 2 or more type.
  • Specific examples of the epoxy resin include jER828 manufactured by Mitsubishi Chemical Corporation, but are not limited thereto.
  • the curing agent When forming a cured product using an epoxy resin, it is preferable to contain a curing agent in addition to the epoxy resin.
  • the curing agent include imidazole-based curing agents such as 2-ethyl-4-methylimidazole (2E4MZ), 2-phenylimidazole (2PZ), 2-phenyl-4-methyl-5-hydroxymethylimidazole (2P4MHZ), diethylenetriamine, Amine-based curing agents such as triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, metaxylenediamine, isophoronediamine, norbornenediamine, 1,3-bisaminomethylcyclohexane, N-aminoethylpiperazine, polyamide, vinylphenol, aralkyl Type phenol resins, phenol phenyl aralkyl resins, phenol biphenyl aralkyl resins, etc., phenolic curing agents, phthalic anhydride,
  • the compounding amount of the curing agent is preferably 0.1 to 150 parts by mass, more preferably 0.5 to 100 parts by mass with respect to 100 parts by mass of the epoxy resin.
  • thermosetting catalyst examples include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, Imidazole derivatives such as 1- (2-cyanoethyl) -2-ethyl-4-methylimidazole; dicyandiamide, benzyldimethylamine, 4- (dimethylamino) -N, N-dimethylbenzylamine, 4-methoxy-N, N- Examples thereof include amine compounds such as dimethylbenzylamine and 4-methyl-N, N-dimethylbenzylamine, hydrazine compounds such as adipic acid dihydrazide and sebacic acid dihydrazide, and phosphorus compounds such as triphenylphosphine.
  • polyimide resin As a polyimide resin, what is obtained via a polyamic acid (polyimide precursor) by a synthetic reaction of a generally known aromatic polyvalent carboxylic acid anhydride or derivative thereof and an aromatic diamine, What is marketed as what is called a polyimide varnish of the state by which the polyamic acid composition was melt
  • dissolved in the organic solvent is mentioned.
  • aromatic polycarboxylic acid anhydride examples include, for example, pyromellitic dianhydride, 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride, 2,2 ′, 3,3 ′.
  • Examples include SE812 manufactured by Sumitomo Bakelite Co., Ltd. and CRC8000 manufactured by Sumitomo Bakelite Co., Ltd.
  • the polyamic acid solution obtained by the synthesis reaction or marketed is treated by heating or the like, whereby cyclization (imidization) from the polyamic acid to the polyimide is performed.
  • the polyamic acid can be imidized by a method only by heating or a chemical method. In the case of the method using only heating, the polyamic acid is imidized by heat treatment at 200 to 350 ° C., for example.
  • the chemical method is a method in which the polyamic acid is heat-treated and completely imidized while using a basic catalyst in order to rapidly advance imidization.
  • the basic catalyst is not particularly limited, and a conventionally known basic catalyst is used.
  • Examples thereof include pyridine, diazabicycloundecene (DBU), diazabicyclononene (DBN), various tertiary amines, and the like. It is done. These basic catalysts may be used alone or in combination of two or more.
  • the photocurable resin may be any resin that is cured by irradiation with active energy rays and exhibits electrical insulation, and in particular, a compound having one or more ethylenically unsaturated bonds in the molecule is preferably used.
  • a compound having one or more ethylenically unsaturated bonds in the molecule is preferably used.
  • the compound having an ethylenically unsaturated bond known and commonly used photopolymerizable oligomers and photopolymerizable vinyl monomers are used.
  • Examples of the photopolymerizable oligomer include unsaturated polyester oligomers and (meth) acrylate oligomers.
  • Examples of (meth) acrylate oligomers include phenol novolac epoxy (meth) acrylate, cresol novolac epoxy (meth) acrylate, epoxy (meth) acrylates such as bisphenol type epoxy (meth) acrylate, urethane (meth) acrylate, epoxy urethane (meta ) Acrylate, polyester (meth) acrylate, polyether (meth) acrylate, polybutadiene-modified (meth) acrylate, and the like.
  • (meth) acrylate is a term which generically refers to acrylate, methacrylate and a mixture thereof, and the same applies to other similar expressions.
  • photopolymerizable vinyl monomer known and commonly used monomers, for example, styrene derivatives such as styrene, chlorostyrene and ⁇ -methylstyrene; vinyl esters such as vinyl acetate, vinyl butyrate or vinyl benzoate; vinyl isobutyl ether, vinyl- vinyl ethers such as n-butyl ether, vinyl-t-butyl ether, vinyl-n-amyl ether, vinyl isoamyl ether, vinyl-n-octadecyl ether, vinyl cyclohexyl ether, ethylene glycol monobutyl vinyl ether, triethylene glycol monomethyl vinyl ether; acrylamide, Methacrylamide, N-hydroxymethylacrylamide, N-hydroxymethylmethacrylamide, N-methoxymethylacrylamide, N-ethoxymethylacrylamide (Meth) acrylamides such as rilamide and N-butoxymethylacrylamide; allyl compounds such as triallyl isocyan
  • an alicyclic epoxy compound As the photocurable resin, an alicyclic epoxy compound, an oxetane compound, a vinyl ether compound, or the like can also be suitably used.
  • alicyclic epoxy compounds include 3,4,3 ′, 4′-diepoxybicyclohexyl, 2,2-bis (3,4-epoxycyclohexyl) propane, and 2,2-bis (3,4-epoxy).
  • oxetane compound examples include bis [(3-methyl-3-oxetanylmethoxy) methyl] ether, bis [(3-ethyl-3-oxetanylmethoxy) methyl] ether, 1,4-bis [(3-methyl-3- Oxetanylmethoxy) methyl] benzene, 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, (3-methyl-3-oxetanyl) methyl acrylate, (3-ethyl-3-oxetanyl) methyl acrylate
  • polyfunctional oxetanes such as (3-methyl-3-oxetanyl) methyl methacrylate, (3-ethyl-3-oxetanyl) methyl methacrylate and oligomers or copolymers thereof, oxetane alcohol and novolak resin, poly (p -Hydroxystyrene
  • vinyl ether compounds include cyclic ether type vinyl ethers such as isosorbite divinyl ether and oxanorbornene divinyl ether (vinyl ethers having a cyclic ether group such as oxirane ring, oxetane ring and oxolane ring); aryl vinyl ethers such as phenyl vinyl ether; n-butyl vinyl ether Alkyl vinyl ethers such as octyl vinyl ether; cycloalkyl vinyl ethers such as cyclohexyl vinyl ether; polyfunctional vinyl ethers such as hydroquinone divinyl ether, 1,4-butanediol divinyl ether, cyclohexane divinyl ether, cyclohexanedimethanol divinyl ether, ⁇ and / or ⁇ position And vinyl ether compounds having a substituent such as an alkyl group and an allyl group.
  • HEVE 2-hydroxyethyl vinyl ether
  • DEGV diethylene glycol monovinyl ether
  • HBVE 2-hydroxybutyl vinyl ether
  • triethylene glycol divinyl ether manufactured by Maruzen Petrochemical Co., Ltd.
  • a photocurable resin in addition to the above-described photocurable resin, a photopolymerization initiator, a photoacid generator, a photobase generator, or the like is used, and one of these is used alone or Two or more kinds can be used in combination.
  • photopolymerization initiator examples include benzoin and benzoin alkyl ethers such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy- Acetophenones such as 2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone; 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1- ON, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- ( 4-morpholinyl) phenyl] -1-butano Aminoalkylphenones such as 2-methylanthraquino
  • These photopolymerization initiators can be used alone or in combination of two or more.
  • photoacid generator examples include diazonium salts, iodonium salts, bromonium salts, chloronium salts, sulfonium salts, selenonium salts, pyrylium salts, thiapyrylium salts, onium salts such as pyridinium salts; tris (trihalomethyl) -s-triazine ( For example, 2,4,6-tris (trichloromethyl) -s-triazine), 2- [2- (5-methylfuran-2-yl) ethenyl] -4,6-bis (trichloromethyl) -s-triazine 2- [2- (furan-2-yl) ethenyl] -4,6-bis (trichloromethyl) -s-triazine, 2- (4-methoxyphenyl) -4,6-bis (trichloromethyl) -s -Halogenated compounds such as triazine, 2-methyl-4,6-bis (
  • a photobase generator is a compound that generates one or more basic substances that can function as a catalyst for a polymerization reaction by changing the molecular structure upon irradiation with light such as ultraviolet rays or visible light, or by cleaving the molecules. It is.
  • basic substances include secondary amines and tertiary amines.
  • photobase generators include ⁇ -aminoacetophenone compounds, oxime ester compounds, acyloxyimino groups, N-formylated aromatic amino groups, N-acylated aromatic amino groups, nitrobenzyl carbamate groups, Examples thereof include compounds having a substituent such as an alkoxybenzyl carbamate group.
  • Organic solvents include ketones such as acetone, methyl ethyl ketone, and cyclohexanone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether , Glycol ethers such as diethylene glycol monoethyl ether, dipropylene glycol monoethyl ether, triethylene glycol monoethyl ether; esters such as ethyl acetate, butyl acetate, cellosolve acetate, diethylene glycol monoethyl ether acetate and esterified products of the above glycol ethers Alcohol such as ethanol, propanol, ethylene glycol, propylene glycol 1-methyl-2-pyrrolidinone, 1,3-dimethyl-2-imidazolid
  • the resin 3 is in contact with the fixing agent 2 and the fiber substrate 11.
  • the resin 3 may cover the outside of the fiber base material 11 as long as it can play the role of ensuring adhesion.
  • the impregnation ratio of the resin composition is not particularly limited as long as the resin-containing sheet can be adhered to the metal foil or the like, but the concentration of the resin in the resin-containing sheet is 10 to 99% by volume, particularly It is preferably 10 to 70% by volume.
  • the resin composition that forms the resin 3 can include at least one selected from a thermosetting resin, a photocurable resin, and a thermoplastic resin. , Or a combination of two or more. Among these, from the viewpoint of physical properties of the cured product or molded product, a thermosetting resin is preferable, and an epoxy resin is more preferable. When a thermosetting resin or a photocurable resin is used as the resin composition, the same thermosetting resin, photocurable resin, organic solvent, etc. as those mentioned for the fixing agent composition should be used as appropriate. In the present invention, the resin composition and the fixing agent composition may be different from each other. Moreover, as a thermoplastic resin, what is shown below can be used.
  • Thermoplastic resins include acrylic, modified acrylic, low density polyethylene, high density polyethylene, ethylene-vinyl acetate copolymer, polyethylene terephthalate, polypropylene, modified polypropylene, polystyrene, acrylonitrile-butadiene-styrene copolymer, acrylonitrile-styrene copolymer.
  • General-purpose plastics such as polymers, cellulose acetate, polyvinyl alcohol, polyvinyl chloride, polyvinylidene chloride, polylactic acid, polyamide, thermoplastic polyurethane, polyacetal, polycarbonate, ultrahigh molecular weight polyethylene, polybutylene terephthalate, modified polyphenylene ether, polysulfone ( PSF), polyphenylene sulfide (PPS), polyethersulfone (PES), polyetheretherketone, polyarylene , Polyetherimide, Polyamideimide, Liquid crystal polymer, Polyamide 6T, Polyamide 9T, Polytetrafluoroethylene, Polyvinylidene fluoride, Polyesterimide, Thermoplastic polyimide and other engineering plastics, Olefin, Styrene, Polyester, Urethane, Examples include amide-based, vinyl chloride-based, and hydrogenated thermoplastic elastomers.
  • a resin composite can be used.
  • a colorant can be blended as another component.
  • a known and conventional one represented by a color index as a color pigment or dye can be used.
  • the anti-foaming / leveling agent, thixotropy imparting agent / thickening agent, coupling agent, dispersant, flame retardant and the like are added to the fixing agent composition and the resin composition according to the present invention as necessary.
  • An agent can be included.
  • antifoaming agent / leveling agent compounds such as mineral oil, vegetable oil, aliphatic alcohol, fatty acid, metal soap, fatty acid amide, polyoxyalkylene glycol, polyoxyalkylene alkyl ether, polyoxyalkylene fatty acid ester, and the like can be used.
  • Thixotropic agents and thickeners include clay minerals such as kaolinite, smectite, montmorillonite, bentonite, talc, mica, zeolite, amorphous inorganic particles, polyamide additives, modified urea additives, wax additives Etc. can be used.
  • alkoxy group is methoxy group, ethoxy group, acetyl, etc.
  • reactive functional group is vinyl, methacryl, acrylic, epoxy, cyclic epoxy, mercapto, amino, diamino, acid anhydride, ureido, sulfide, Isocyanates and the like, for example, vinyl silane compounds such as vinyl ethoxylane, vinyl trimethoxysilane, vinyl tris ( ⁇ -methoxyethoxy) silane, ⁇ -methacryloxypropyltrimethoxylane, ⁇ -aminopropyltrimethoxylane, ⁇ - ⁇ - (aminoethyl) ⁇ -aminopropyltrimethoxysilane, N- ⁇ - (aminoethyl) ⁇ -aminopropylmethyldimethoxysilane, amino-based silane compounds such as ⁇ -ureidopropyltriethoxysilane, ⁇ -glycid
  • Dispersants include polycarboxylic acid-based, naphthalene sulfonic acid formalin condensation-based, polyethylene glycol, polycarboxylic acid partial alkyl ester-based, polyether-based, polyalkylene polyamine-based polymeric dispersants, alkyl sulfonic acid-based, four Low molecular weight dispersants such as secondary ammonium series, higher alcohol alkylene oxide series, polyhydric alcohol ester series and alkylpolyamine series can be used.
  • Flame retardants include hydrated metal such as aluminum hydroxide and magnesium hydroxide, red phosphorus, ammonium phosphate, ammonium carbonate, zinc borate, zinc stannate, molybdenum compound, bromine compound, chlorine compound, phosphate ester Phosphorus-containing polyol, phosphorus-containing amine, melamine cyanurate, melamine compound, triazine compound, guanidine compound, silicone polymer and the like can be used.
  • hydrated metal such as aluminum hydroxide and magnesium hydroxide, red phosphorus, ammonium phosphate, ammonium carbonate, zinc borate, zinc stannate, molybdenum compound, bromine compound, chlorine compound, phosphate ester Phosphorus-containing polyol, phosphorus-containing amine, melamine cyanurate, melamine compound, triazine compound, guanidine compound, silicone polymer and the like can be used.
  • the fixing agent composition and the resin composition according to the present invention include other inorganic fillers such as barium sulfate, silica and hydrotalcite, organic fillers such as nylon powder and fluorine powder, radical scavengers, ultraviolet absorbers, and peroxides.
  • Product decomposition agents thermal polymerization inhibitors, adhesion promoters, rust inhibitors, surface treatment agents, surfactants, lubricants, antistatic agents, pH adjusters, antioxidants, dyes, pigments, fluorescent agents, etc. It may be included as long as the object of the invention is not impaired.
  • the storage elastic modulus of the fixing agent 2 needs to be higher than the storage elastic modulus of the resin 3.
  • the storage elastic modulus of the fixing agent 2 means the storage elastic modulus of a cured film obtained by curing a composition containing only the components of the fixing agent composition by heat or light after film formation without including the fiber 1.
  • the storage elastic modulus of the resin 3 also means the storage elastic modulus of a cured film cured by heat or light after film formation in the case of a curable resin, and in the case of a thermoplastic resin, it is a melt film formation.
  • the storage elastic modulus of the coating film obtained by removing the solvent later is meant.
  • the storage elastic modulus is an index value of the hardness of the sample, and an evaluation called dynamic viscoelasticity measurement that detects strain by applying a periodic load to the sample while applying a constant temperature change. This is a value calculated from the detected strain. The higher this value, the better the mechanical strength.
  • the storage elastic modulus of the fixing agent 2 is higher than the storage elastic modulus of the resin 3 at any temperature. 0.1 GPa, more preferably 20 to 0.5 GPa, and the storage modulus of the resin 3 is 10 to 0.001 GPa, more preferably 5 to 0.01 GPa. It is preferable that the storage elastic modulus of the fixing agent 2 is 0.1 GPa or more larger than the storage elastic modulus of the resin 3.
  • the storage elastic modulus of the fixing agent 2 is preferably higher than the storage elastic modulus of the resin 3 at any temperature within the range of 150 to 250 ° C., and the fixing agent 2 is fixed at the entire temperature range of 150 to 250 ° C. It is more preferable that the storage elastic modulus of the agent 2 is higher than the storage elastic modulus of the resin 3. Accordingly, the resin-containing sheet of the present invention can be used even in a high temperature region of 150 to 250 ° C., and therefore, the use is widened.
  • the glass transition temperature of the fixing agent 2 is preferably higher than the glass transition temperature or softening temperature of the resin 3.
  • the glass transition temperature of the fixing agent 2 means the glass transition temperature of a cured film obtained by curing a composition containing only the components of the fixing agent composition by heat or light after film formation without including the fiber 1.
  • the glass transition temperature or softening temperature of the resin 3 also means the glass transition temperature of a cured film cured by heat or light after film formation in the case of a curable resin, and in the case of a thermoplastic resin, It means the softening temperature of the coating film obtained by removing the solvent after the melt film formation.
  • the glass transition temperature is a value (loss) calculated from the ratio (E ′′ / E ′) of the storage elastic modulus (E ′) and loss elastic modulus (E ′′) obtained from the dynamic viscoelasticity measurement described above. This is the temperature when the tangent) is maximum, and the higher the temperature, the better the heat resistance.
  • the upper limit of the glass transition temperature is not particularly limited, but a preferable range thereof is 130 ° C. or higher, more preferably 140 ° C. or higher, particularly preferably 250, for the glass transition temperature of the fixing agent 2. It is above °C. The higher the glass transition temperature of the fixing agent 2, the higher the storage elastic modulus of the resin-containing sheet of the present invention, which is preferable.
  • the glass transition temperature or softening temperature of the resin 3 is 70 ° C. or higher, more preferably 80 ° C. or higher.
  • the glass transition temperature of the fixing agent 2 is preferably 5 ° C. or more higher than the glass transition temperature or softening temperature of the resin 3.
  • the resin-containing sheet of the present invention can be obtained by treating the fiber substrate 11 with the fixing agent composition to fix the fibers 1 to each other and then impregnating the fixed fiber substrate 11 with the resin composition.
  • the resin-containing sheet of the present invention is obtained by sequentially applying and impregnating a fixing agent composition and a resin composition in a state in which fibers are arranged on an object to be applied such as a carrier film, thereby fixing the fixing agent composition and the resin composition.
  • a dry film can also be produced by volatile drying of the organic solvent contained therein, and a cover film may be further bonded thereon if desired.
  • the application process of the resin composition may be performed either before or after drying the fixing agent. But you can.
  • the fixing agent composition and the resin composition of the present invention can be applied by adjusting the viscosity suitable for the application method by blending, dispersing, and diluting each component as necessary.
  • the fixing agent composition only needs to be able to permeate the fiber base material 11 and fix the fibers 1 to each other, and the resin composition includes at least one of the fiber base material 11. Any surface may be used as long as both surfaces, particularly both surfaces, can be adhered to a metal foil or the like.
  • a carrier film for a dry film is preferable, but it may be directly coated on the surface of a metal foil or a circuit board on which a circuit is formed.
  • the coating method include a dropping method using a pipette, a dip coating method, a bar coater method, a spin coating method, a curtain coating method, a spray coating method, a roll coating method, a slit coating method, a blade coating method, a lip coating.
  • various coating methods such as screen printing, spray printing, ink jet printing, letterpress printing, intaglio printing, and planographic printing.
  • the carrier film and the cover film may be any known materials used for the dry film, and examples thereof include a polyethylene film and a polypropylene film.
  • the carrier film and the cover film may use the same film material or different film materials, but the cover film preferably has a smaller adhesiveness to the resin 3 than the carrier film.
  • a structure can be obtained by bringing the resin-containing sheet of the present invention into close contact with a substrate.
  • the substrate include a metal foil substrate and a circuit board (circuit board on which a circuit is formed).
  • the resin insulating layer can be formed by thermally adhering the resin-containing sheet of the present invention to the substrate surface, and the metal foil layer and the resin insulating layer can be laminated in a plurality of layers by repetition thereof.
  • the fixing agent composition and the resin composition are a combination of a thermosetting resin or a photocurable resin, only a method of heat curing, activity
  • the structure can be manufactured by using a method only with energy ray irradiation, a method in which heat curing is performed after irradiation with active energy rays, or a method in which active energy rays are irradiated after heat curing.
  • a dry film if there is a cover film, the cover film is peeled off, the resin-containing sheet is thermally adhered to the substrate surface, and then the carrier film is peeled off and cured by the above-described curing method.
  • the body can be manufactured.
  • thermosetting resin when using a thermosetting resin as both the fixing agent composition and the resin composition, both heat curing processes of fixing fibers and impregnating the resin may be performed simultaneously.
  • the heating temperature at the time of heating is not particularly limited as long as the fiber and the fixing agent contained in the target base material are not decomposed by high heat, and there is no particular limitation on the lower limit and the upper limit.
  • the exposure amount there is no particular lower limit and upper limit as long as the exposure amount is too low to produce an uncured portion.
  • the resin-containing sheet of the present invention when the resin composition is a thermoplastic resin, a method of heating, heating, or press-bonding a pellet-shaped or sheet-shaped thermoplastic resin can also be used.
  • a method of heating, heating, or press-bonding a pellet-shaped or sheet-shaped thermoplastic resin can also be used.
  • the thermoplastic resin in order to impregnate the thermoplastic resin into the fiber base material fixed by the fixing agent, it is not an essential requirement to pressurize using a device, but the fiber base of the thermoplastic resin by performing the pressurization is not necessary. Penetration into the material becomes easier.
  • the structure can be formed by thermally adhering the resin-containing sheet to the substrate surface.
  • forming a structure using a dry film it can produce similarly.
  • examples of the apparatus used at the time of drying, heat-curing or heat-pressing include a hot-air circulating drying furnace, an IR furnace, a hot plate, a convection oven, a heating / pressurizing roll, and a press machine.
  • Examples of the light source for active energy ray irradiation include a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a xenon lamp, and a metal halide lamp.
  • laser beams and the like can also be used as active energy rays.
  • the thickness of the fiber base material which is a constituent member of the resin-containing sheet of the present invention, one in which fibers are fixed to each other with a fixing agent (hereinafter also referred to as “intermediate body”), and the purpose of the dry film.
  • the intermediate can be selected as appropriate depending on the thickness of the fiber base material, particularly if the fibers are fixed to each other by a fixing agent.
  • the film thickness is preferably not more than twice the thickness of the substrate. Specifically, it is more preferably within a range of 1 to 1.5 times the thickness of the fiber base material. If the thickness of the intermediate exceeds twice the thickness of the fiber base material, the physical properties of the fixing agent itself are affected, which is not preferable.
  • the structure obtained by forming the resin-containing sheet of the present invention on the substrate surface and curing or molding can be used as a core material for a wiring board, and an interlayer for wiring boards can be obtained by performing an etching process or the like. It can also be used as an insulating material.
  • a resin-containing sheet is formed on the surface of a circuit board on which a circuit is formed, patterning and curing or molding so as to cover only the circuit wiring, it is used as a solder resist that is the outermost layer of the circuit board. You can also
  • the resin-containing sheet of the present invention having the configuration as described above can be applied to a wiring board for an electronic device, and is preferably applied to, for example, an interlayer insulating material for a wiring board, a solder resist, a core material, or the like.
  • the intended effect of the present invention can be obtained.
  • the fibers are fixed with a fixing agent composition, the resin is infiltrated and dried, a semi-cured (B stage) resin insulating layer is formed, and the resin insulating layer and the metal foil are laminated and pressed.
  • a multilayer board can also be produced.
  • BPDA 4,4′-biphenyltetracarboxylic anhydride
  • Table 1 below shows the contents of the compositions 1 to 4 used as the fixing agent composition or the resin composition.
  • Each composition was prepared according to the description of compositions 1 to 4 in Table 1 below.
  • each component was blended and then stirred using a rotation / revolution mixer to prepare.
  • compositions 1 to 4 were applied to a copper foil having a thickness of 18 ⁇ m using an applicator to obtain a coating film.
  • Composition 1 was dried in a hot air circulation drying oven at 80 ° C. for 30 minutes and then heated at 150 ° C. for 60 minutes to obtain a cured epoxy resin. When the copper foil was removed, the thickness was 50 ⁇ m.
  • a test piece for evaluation such as storage elastic modulus having a width of 5 mm and a length of 50 mm was produced using this cured product.
  • composition 2 After application
  • Composition 3 an evaluation test piece was prepared in the same manner as Composition 2 except that the heating operation was performed at 300 ° C. for 60 minutes under nitrogen conditions.
  • high-density polyethylene pellets (specific gravity 0.95) are put into a press machine, and after heating and pressing at 140 ° C., 3 MPa, 3 minutes, and cooled to room temperature, a molded product is obtained. As a result, the thickness was 50 ⁇ m. Thereafter, an evaluation test piece was prepared in the same manner as described above.
  • Tables 2 and 3 below show the structures of the resin-containing sheets or sheets of the examples and comparative examples.
  • Example 1-A Preparation of intermediate of Example 1-A
  • a glass cloth type 1035 (IPC standard), thickness 30 ⁇ m
  • the composition 1 viscosity 0.0005 Pa ⁇ s
  • Example 2-A Preparation of intermediate of Example 2-A
  • Example 2-A in Table 2 below the same glass cloth as in Example 1-A was impregnated with the above composition 2 (viscosity 0.001 Pa ⁇ s), and then heated in a hot-air circulating drying furnace. After drying under atmospheric conditions of 30 ° C. for 30 minutes, the mixture was heated and imidized at 250 ° C. for 60 minutes to produce an intermediate composed of glass cloth and a fixing agent (polyimide).
  • a fixing agent polyimide
  • Example 3-A Preparation of intermediate of Example 3-A
  • the same glass cloth as in Example 1-A was impregnated with the above composition 3 (viscosity 0.001 Pa ⁇ s), and then heated in a hot air circulating drying furnace. After drying under atmospheric conditions of 30 ° C. for 30 minutes, the mixture was imidized by heating at 300 ° C. for 60 minutes to prepare an intermediate made of glass cloth and a fixing agent (polyimide).
  • a fixing agent polyimide
  • the thicknesses of the intermediates of Examples 1-A to 3-A and Comparative Example 4-A were 33 to 35 ⁇ m, and the increase from the thickness of the glass cloth was 3 to 5 ⁇ m.
  • Example 1-B Preparation of intermediate of Example 1-B
  • an aramid nonwoven fabric was treated in the same manner as in the preparation of the intermediate of Example 1-A, except that an aramid nonwoven fabric (Nomex 410, thickness 50 ⁇ m) was used as the fiber.
  • the intermediate body which consists of fixing agent (hardened
  • Example 2-B Preparation of intermediate of Example 2-B
  • the aramid was treated in the same manner as in the preparation of the intermediate of Example 2-A, except that the same aramid nonwoven fabric as in Example 1-B was used as the fiber.
  • the intermediate body which consists of a nonwoven fabric and fixing agent (polyimide) was produced.
  • Example 3-B Preparation of intermediate of Example 3-B
  • Example 3-B in Table 3 below an aramid was treated in the same manner as in the preparation of the intermediate of Example 3-A, except that the same aramid nonwoven fabric as in Example 1-B was used as the fiber.
  • the intermediate body which consists of a nonwoven fabric and fixing agent (polyimide) was produced.
  • the thicknesses of the intermediates of Examples 1-B to 3-B and Comparative Example 4-B were 53 to 56 ⁇ m, and the increase in thickness from the thickness of the aramid nonwoven fabric was only 3 to 6 ⁇ m.
  • Example 1-A and Example 1-B the composition 4 was charged into a press machine and melted at 140 ° C., and then impregnated into each of the intermediates obtained above. After heating and pressurizing for 3 minutes, the resin-containing sheet was prepared by impregnating a glass cloth or an aramid nonwoven fabric fixed with a fixing agent (epoxy) with a resin (high-density polyethylene resin) by cooling to room temperature.
  • a fixing agent epoxy
  • a resin high-density polyethylene resin
  • the glass cloth or aramid nonwoven fabric fixed with the fixing agent is cured by heating and curing under the same conditions as in the preparation of the test piece for evaluation of the fixing agent or resin.
  • a resin-containing sheet impregnated with a cured product was prepared.
  • the thicknesses of the resin-containing sheets in Examples 1-A to 3-A and Examples 1-B to 3-B were 5 to 10 ⁇ m thicker than the thickness of the intermediate. Then, about each resin containing sheet, the test piece for evaluation was produced on the conditions similar to the above.
  • the composition 1 was applied to a glass cloth or an aramid nonwoven fabric in an appropriate amount so as to reach the entire fiber, impregnated, and used for evaluation of the fixing agent or resin.
  • a sheet in which a glass cloth or an aramid non-woven fabric containing no fixing agent was impregnated with a resin (cured epoxy resin) was produced by heating and curing under the same conditions as in the production of the test piece.
  • the composition 2 was coated and impregnated on a glass cloth or an aramid nonwoven fabric in the same manner as in Comparative Example 1-A, and then heated at 80 ° C. in a hot air circulating drying oven.
  • the resin content concentrations were similar for Examples 1-A to 3-A and Comparative Examples 1-A to 4-A. The same was true for B to 3-B and Comparative Examples 1-B to 4-B.
  • the resin-containing sheet of Example 1-A has a storage elasticity higher than that of the sheet of Comparative Example 3-A in which no fixing agent was used at any temperature of 50 ° C., 150 ° C., and 250 ° C. Since the value of the rate E [GPa] is large, it was set as “ ⁇ ”. Also in Example 1-B, since the value of the storage elastic modulus E [GPa] was larger than that of the sheet of Comparative Example 3-B in which no sticking agent was used, “ ⁇ ” was given. Also in the resin-containing sheets of Examples 2-A, 2-B, 3-A, and 3-B, the storage elastic modulus was compared with the sheets of Comparative Examples 1-A and 1-B in which no fixing agent was used.
  • the value of the storage elastic modulus could not be obtained because the knitted fiber was unwound at the start of the measurement by pulling in the bias direction.
  • Each intermediate was prepared by applying and impregnating the fixing agent composition in the same manner as described above except that a glass cloth or an aramid nonwoven fabric as a fiber base material was disposed on the carrier film. Thereafter, the resin composition was molded or coated on the surface of the adhesive after drying and dried, and then a cover film was bonded to obtain a dry film. A surface untreated copper foil having a thickness of 18 ⁇ m was superposed on both surfaces of this dry film (the carrier film and the cover film were peeled off when they were brought into close contact with each other). 150 ° C. ⁇ 10 minutes for 1-A and 1-B, 250 ° C.
  • the storage elastic moduli of the fixing agents of Examples 1-A to 3-A and Examples 1-B to 3-B are both larger than the storage elastic modulus of the resin.
  • Comparative Examples 4-A and 4-B the storage elastic modulus of the fixing agent is smaller than the storage elastic modulus of the resin.
  • Comparative Examples 1-A to 3-A and 1-B to 3-B only the resin is used and no fixing agent is used.
  • the glass cloth or the aramid nonwoven fabric is fixed, and the resin contained in the example impregnated with the resin. It can be seen that the sheet is excellent in adhesion and has a large storage elastic modulus as compared with the sheet of the comparative example impregnated only with the resin.
  • the glass cloth fibers were fixed to each other with the fixing composition, and the fiber base material was impregnated with the resin composition.
  • the resin-containing sheet has high mechanical strength because it has a higher storage elastic modulus at any temperature than Comparative Example 3-A in which the fibers of the glass cloth are not fixed to each other by the fixing composition.
  • the resin-containing sheets of Examples 2-A and 3-A and Examples 2-B and 3-B have a storage elastic modulus at 250 ° C. exceeding 1 GPa and excellent mechanical strength at high temperatures. I understand that.
  • Comparative Example 4-A and Comparative Example 4-B in which the storage elastic modulus of the fixing agent is lower than the storage elastic modulus of the resin, the storage elastic modulus as the resin-containing sheet was low and the adhesion was inferior.
  • a resin-containing sheet having a fixing agent for fixing fibers in a fiber base and a resin in contact with the fixed fiber and having a storage elastic modulus of the fixing agent higher than a storage elastic modulus of the resin.
  • a resin-containing sheet of the present invention can be applied to a wiring board for an electronic device, and can be suitably applied to, for example, an interlayer insulating material for a wiring board, a solder resist, a core material, or the like.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

L'invention concerne : une feuille contenant de la résine qui comprend une base fibreuse ayant une résistance mécanique améliorée et qui présente une adhérence améliorée à des substrats ; et une structure et une carte de câblage qui comprennent la feuille contenant de la résine. La feuille contenant de la résine comprend une base fibreuse (11), un liant (2) avec lequel les fibres (1) présentes dans la base fibreuse (11) sont collées les unes aux autres et une résine (3) qui est en contact avec la base fibreuse (11) et le liant (2), le liant (2) ayant un module de conservation plus élevé que la résine (3). La structure est obtenue par collage fort de la feuille contenant de la résine à un substrat. La carte de câblage comprend cette structure.
PCT/JP2015/069171 2014-07-29 2015-07-02 Feuille contenant de la résine et structure et carte de câblage comprenant chacune cette dernière Ceased WO2016017368A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201580033385.4A CN106459453A (zh) 2014-07-29 2015-07-02 含树脂片材、以及使用其的结构体和电路板
JP2016538237A JP6684712B2 (ja) 2014-07-29 2015-07-02 樹脂含有シート、並びに、それを用いた構造体および配線板
KR1020177000247A KR102338789B1 (ko) 2014-07-29 2015-07-02 수지 함유 시트, 및 그것을 사용한 구조체 및 배선판

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-153562 2014-07-29
JP2014153562 2014-07-29

Publications (1)

Publication Number Publication Date
WO2016017368A1 true WO2016017368A1 (fr) 2016-02-04

Family

ID=55217273

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/069171 Ceased WO2016017368A1 (fr) 2014-07-29 2015-07-02 Feuille contenant de la résine et structure et carte de câblage comprenant chacune cette dernière

Country Status (5)

Country Link
JP (1) JP6684712B2 (fr)
KR (1) KR102338789B1 (fr)
CN (1) CN106459453A (fr)
TW (1) TWI659986B (fr)
WO (1) WO2016017368A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019010304A1 (fr) * 2017-07-05 2019-01-10 Wisconsin Alumni Research Foundation Microparticules enrobées de minéraux pour l'administration de gènes dans une thérapie de plaie chronique

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7458374B2 (ja) * 2019-03-26 2024-03-29 リンテック株式会社 剥離シート

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07243150A (ja) * 1994-03-07 1995-09-19 Toray Ind Inc 補強用メッシュ織物およびその製造方法
JPH09307203A (ja) * 1996-05-13 1997-11-28 Matsushita Electric Ind Co Ltd プリント配線基板およびその製造方法
JP2007023167A (ja) * 2005-07-15 2007-02-01 Shin Kobe Electric Mach Co Ltd プリプレグ、積層板及びプリント配線板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4075581B2 (ja) 2002-11-21 2008-04-16 日立化成工業株式会社 接着剤層付きプリプレグ、金属張積層板の製造方法及び金属張積層板
JP2006179716A (ja) 2004-12-22 2006-07-06 Hitachi Chem Co Ltd プリプレグシート及びこれを用いた多層基板の製造方法。
JP4983190B2 (ja) 2006-10-02 2012-07-25 住友ベークライト株式会社 プリプレグ、回路基板および半導体装置
JP2010095557A (ja) 2008-10-14 2010-04-30 Toray Ind Inc プリプレグおよび繊維強化複合材料

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07243150A (ja) * 1994-03-07 1995-09-19 Toray Ind Inc 補強用メッシュ織物およびその製造方法
JPH09307203A (ja) * 1996-05-13 1997-11-28 Matsushita Electric Ind Co Ltd プリント配線基板およびその製造方法
JP2007023167A (ja) * 2005-07-15 2007-02-01 Shin Kobe Electric Mach Co Ltd プリプレグ、積層板及びプリント配線板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019010304A1 (fr) * 2017-07-05 2019-01-10 Wisconsin Alumni Research Foundation Microparticules enrobées de minéraux pour l'administration de gènes dans une thérapie de plaie chronique
US11628227B2 (en) 2017-07-05 2023-04-18 Wisconsin Alumni Research Foundation Mineral coated microparticles for gene delivery in chronic wound therapy

Also Published As

Publication number Publication date
KR102338789B1 (ko) 2021-12-14
JP6684712B2 (ja) 2020-04-22
JPWO2016017368A1 (ja) 2017-05-18
CN106459453A (zh) 2017-02-22
KR20170039118A (ko) 2017-04-10
TWI659986B (zh) 2019-05-21
TW201619252A (zh) 2016-06-01

Similar Documents

Publication Publication Date Title
JP6402005B2 (ja) 樹脂含有シート、並びに、それを用いた構造体および配線板
JP7102691B2 (ja) フレキシブルプリント配線板用銅張積層板及びフレキシブルプリント配線板
US9068100B2 (en) Thermosetting resin composition, cured product thereof, and printed wiring board using the same
JP7003795B2 (ja) ポリイミド、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法
US9337019B2 (en) Method for manufacturing electronic component, and electronic component
JP2002194282A (ja) ポリアミド樹脂含有ワニス及びその用途
JP7205335B2 (ja) ポリイミド、接着剤、架橋剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法
CN104981299B (zh) 固化物膜的制造方法、电子部件的制造方法及电子部件
JP6684712B2 (ja) 樹脂含有シート、並びに、それを用いた構造体および配線板
JP5654700B1 (ja) 硬化物膜の製造方法、電子部品の製造方法及び電子部品
WO2022202427A1 (fr) Composition de résine thermodurcissable, film sec, produit durci, circuit imprimé nu et composant électrique/électronique
JP5251763B2 (ja) 両面金属箔張積層板及びフレキシブルプリント配線板
JP2022060296A (ja) コアレス基板用プリプレグ、コアレス基板用プリプレグの製造方法及び製造装置、並びにコアレス基板及びその製造方法
TW202525954A (zh) 印刷配線板用接著片、覆金屬積層板、印刷配線板及電子機器
JP2025065023A (ja) 接着剤組成物、硬化物、接着シート、樹脂付銅箔、銅張積層板及びプリント配線板
JP2024041724A (ja) 樹脂組成物、接着剤、コーティング剤、硬化物、接着シート、樹脂付銅箔、銅張積層板及びプリント配線板
CN116003961A (zh) 环氧树脂组合物及其应用
WO2015068722A1 (fr) Procédé de fabrication d'un film durci, procédé de fabrication d'un composant électronique et composant électronique
KR20210111693A (ko) 프린트 배선판의 제조방법
JP2025012182A (ja) 接着剤組成物、硬化物、接着シート、樹脂付銅箔、銅張積層板及びプリント配線板
KR20160106225A (ko) 절연기능을 갖는 나사
JP2023168087A (ja) ドライフィルムの製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15828287

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2016538237

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20177000247

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15828287

Country of ref document: EP

Kind code of ref document: A1