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WO2016061713A1 - 发声装置的振膜结构 - Google Patents

发声装置的振膜结构 Download PDF

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Publication number
WO2016061713A1
WO2016061713A1 PCT/CN2014/000945 CN2014000945W WO2016061713A1 WO 2016061713 A1 WO2016061713 A1 WO 2016061713A1 CN 2014000945 W CN2014000945 W CN 2014000945W WO 2016061713 A1 WO2016061713 A1 WO 2016061713A1
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WIPO (PCT)
Prior art keywords
film layer
layer
circuit film
circuit
laminated
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PCT/CN2014/000945
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English (en)
French (fr)
Inventor
邓克忠
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Individual
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Individual
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Priority to PCT/CN2014/000945 priority Critical patent/WO2016061713A1/zh
Priority to DE212014000270.2U priority patent/DE212014000270U1/de
Priority to JP2016600161U priority patent/JP3212774U/ja
Priority to US15/503,181 priority patent/US10070227B2/en
Publication of WO2016061713A1 publication Critical patent/WO2016061713A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/06—Plane diaphragms comprising a plurality of sections or layers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
    • H04R2307/027—Diaphragms comprising metallic materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/06—Plane diaphragms comprising a plurality of sections or layers
    • H04R7/10—Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact

Definitions

  • the present invention relates to a diaphragm structure, and more particularly to a diaphragm structure in which a metal coil is fixed to a diaphragm of a diaphragm by electrolytic bonding, thereby greatly reducing the thickness of the sound generating device alone.
  • the types of sounding devices can be divided into many types, such as moving coil speakers, piezoelectric speakers, ceramic piezoelectric speakers and paper speakers.
  • moving coil speakers the most common ones are traditional moving coil speakers.
  • the structure of the moving coil type is mainly to wrap an enamel coil around the outer circumference of the circular tube string to form a voice coil, and then glue one end of the voice coil to one side of a diaphragm and then place it on the magnet. Side to form a single body of the moving coil type horn.
  • the moving coil type horn When the sound is generated by the single element, the corresponding audio current is passed through the lacquer coil, so that the magnetic field of the coil is changed by the electromagnetic induction to drive the diaphragm to vibrate, thereby vibrating the air and generating sound.
  • the moving coil type horn has the advantage of good mid-low frequency sound. However, due to its large size, the moving coil type horn is not suitable for small-sized devices. In addition, due to the single-thickness of the moving coil type horn After that, its high frequency performance is also poor.
  • the voice coil is mostly fixed on the film in a backing manner. Since the adhesives currently available in the industry have a certain thickness, the fixing method makes the thickness of the whole unit thicker, which leads to the inability of the single body of the sounding device such as the earphone and the overall size of the earphone to be small. In addition, when it is necessary to increase the sensitivity of the sounding device, the magnetic flux density of the monomer is generally increased by increasing the number of coils. However, since the conventional fixing method of the adhesive is used, the thickness of the monomer after the number of coils is increased. It becomes too thick, which limits the design of the sounding device and the earphone.
  • an object of the present invention is to provide a diaphragm structure in which a metal coil is fixed to a film by means of electrolytic bonding instead of a backing to form a diaphragm of the sounding device, thereby greatly reducing the thickness of the diaphragm.
  • Another object of the present invention is to provide a diaphragm structure in which a plurality of metal coils and a plurality of thin films are alternately fixed and fixed by means of electrolytic bonding, so that the diaphragm structure can be under the condition of constant thickness. Has a larger magnetic flux.
  • the present invention provides a diaphragm structure comprising: a film layer, a first circuit film layer, a second circuit film layer, and at least one conductive structure.
  • the film layer has a first side and a second side.
  • the first circuit film layer is fixed to the first side of the film layer through a first electrolytic bonding layer, and has a first contact terminal at one end thereof.
  • the second circuit film layer is fixed to the second side of the film layer through a second electrolytic bonding layer, and has a second contact terminal at one end thereof.
  • the at least one conductive structure penetrates the thin film layer to connect the first circuit film layer and the second circuit film layer.
  • the conductive structure includes a through hole and a conductive layer.
  • the perforations penetrate from the outer surface of the first circuit film layer through the film layer to an outer surface of the second circuit film layer.
  • the conductive layer is disposed on an inner peripheral wall of the through hole, and the conductive layer is simultaneously in contact with the first circuit film layer and the second circuit film layer.
  • the present invention provides another diaphragm structure comprising: a film layer, a first circuit film layer, at least one laminate layer, a second circuit film layer, and a plurality of conductive structures.
  • the film layer has a first side and a second side.
  • the first circuit film layer is fixed to the first side of the film layer through a first electrolytic bonding layer, and has a first contact terminal at one end thereof.
  • Each of the at least one stacked layer includes a third circuit film layer and a laminated film layer.
  • the laminated film layer is fixed to the third circuit film layer through a laminated electrolytic bonding layer; wherein the outermost third circuit film layer of the at least one laminated layer is fixed to the film through a third electrolytic bonding layer The second side of the layer.
  • the second circuit film layer is fixed to the outermost laminated film layer of the at least one laminated layer through a second electrolytic bonding layer, and has a second contact terminal at one end thereof.
  • Each of the two adjacent circuit film layers in the first circuit film layer, the second circuit film layer, and the at least one third circuit film layer is connected through at least one conductive structure.
  • each of the electrically conductive structures includes a perforation and a conductive layer.
  • the perforation from the one of the two adjacent circuit film layers through the laminated film layer between two adjacent circuit film layers or the film layer penetrates to two adjacent circuit films The latter in the layer.
  • the conductive layer is disposed on an inner peripheral wall of the through hole, and the conductive layer is in contact with the two adjacent circuit film layers.
  • the diaphragm structure further includes a plurality of covering portions disposed around the respective perforations on an outer surface of the first circuit film layer and an outer surface of the second circuit film layer, And the covering portion is respectively connected to each conductive layer in the through hole touch.
  • the diaphragm structure comprises a plurality of laminated layers, and each of the two stacked layers is fixed to each other by a laminated electrolytic bonding layer.
  • FIG. 1 is an exploded perspective view showing a structure of a diaphragm according to a first embodiment of the present invention
  • Figure 2 is a side sectional view showing the structure of a diaphragm according to a first embodiment of the present invention
  • Figure 3 is an exploded perspective view showing the structure of a diaphragm according to a second embodiment of the present invention.
  • Figure 4 is a side sectional view showing the structure of a diaphragm according to a second embodiment of the present invention.
  • Fig. 5 is an exploded perspective view showing the structure of a diaphragm according to a third embodiment of the present invention.
  • FIG. 1 is an exploded perspective view showing a structure of a diaphragm according to a first embodiment of the present invention
  • FIG. 2 is a side sectional view showing a structure of a diaphragm according to a second embodiment of the present invention.
  • the diaphragm structure according to the first embodiment of the present invention mainly includes a film layer 11, a first circuit film layer 21, a second circuit film layer 22, and a conductive structure. .
  • the film layer 11 has a first side 111 and a second side 112.
  • the second circuit film layer 21 and the second circuit film layer 22 are used as the first circuit film layer 21 and the second circuit film layer 22, and the first circuit film layer 21 and the second circuit film layer 22 are respectively fixed by electrolytic bonding.
  • a diaphragm of a sounding device such as an earphone is formed on both sides of the film layer 11.
  • the first circuit film layer 21 and the second circuit film layer 22 respectively have a first contact terminal 211 and a second contact terminal 221, and the first circuit film layer 21 is electrically connected.
  • An electrolytic bonding layer 41 is fixed to the first side 111 of the film layer 11, and the second circuit film layer 22 is fixed to the second side 112 of the film layer 11 through the second electrolytic bonding layer 42 by electrolytic bonding. It is worth mentioning here that, for convenience of identification, the thickness of each electrolytic bonding layer is not shown in actual scale, and the thickness of the actual electrolytic bonding layer is thinner than the ratio shown in the figure.
  • the material of the circuit film layer is not limited to copper-free copper, and any other material that is electrically conductive and can be fixed to the film layer by electrolytic bonding is a suitable material.
  • a plurality of holes 110, 210, 220 are formed on the film layer 11, the first circuit film layer 21, and the second circuit film layer 22, respectively, so that the first circuit film layer 21 and the second circuit film layer 22 are fixed to the film.
  • the perforations 5 penetrating the diaphragm are formed on both sides of the layer 11. As shown in FIG. 1, since the film layer 11, the first circuit film layer 21, and the second circuit film layer 22 are respectively formed with four holes, the diaphragm of the present invention has a total of four perforations 5.
  • a conductive layer 51 is plated on the plating layer to electrically connect the first circuit film layer 21 and the second circuit film layer 22 to each other.
  • a cover portion 52 is formed on the outer surface of the first circuit film layer 21 and the outer surface of the second circuit film layer 22, and the cover portion 52 is electrically conductive.
  • the layers 51 are in contact to further ensure the first circuit film layer 21 and Electrical connection between the second circuit film layers 22.
  • the first circuit film layer 21 and the second circuit film layer 22 composed of the non-adhesive copper are fixed on both sides of the film layer 11 by means of electrolytic bonding, and the selection is performed.
  • the plating method forms the conductive layer 51 in the through hole 5, whereby the thickness of the entire diaphragm structure is greatly thinned; more precisely, the diaphragm which fixes the metal coil to the film in comparison with the conventional backing method
  • the diaphragm structure provided by the present invention can reduce the thickness of the diaphragm from 8.75 ⁇ m to 4 ⁇ m. In this way, the size of the single body of the sounding device and the sounding device itself can be greatly reduced, and therefore, the diaphragm structure provided by the present invention is very suitable for application to a small-sized sounding device such as an earphone.
  • the magnetic flux of the earphone has a great influence on the sensitivity of the earphone, and the earphone with a high magnetic flux can emit a large sound with a small power.
  • the magnetic flux of the diaphragm is generally increased by the number of metal coils. If the existing adhesive is used, the thickness of the diaphragm will be excessive. Thick; therefore, the second and third embodiments of the present invention propose another diaphragm structure for the above problems.
  • FIG. 3 is an exploded perspective view showing a structure of a diaphragm according to a second embodiment of the present invention
  • FIG. 4 is a side sectional view showing a structure of a diaphragm according to a second embodiment of the present invention.
  • the diaphragm structure according to the second embodiment of the present invention is similar to the diaphragm structure in the first embodiment, and also includes a film layer 11, a first circuit film layer 21, and a first
  • the difference between the two circuit film layers 22 is mainly that the diaphragm structure in the second embodiment is further provided with a laminated layer 23.
  • the film layer 11 of the second embodiment has a first side 111 and a second side 112, and the first circuit film layer 21 and the second circuit film layer 22 respectively have a first
  • the contact terminal 211 and the second contact terminal 221 are also made of glueless copper, and the first circuit film layer 21 is fixed to the first side 111 of the film layer 11 through the first electrolytic bonding layer 41 by electrolytic bonding.
  • the laminated layer 23 in the second embodiment is composed of a third circuit film layer 3 and a laminated film layer 12, and the third circuit film layer 3 is fixed by electrolytic bonding through the laminated electrolytic bonding layer 44. On the laminated film layer 12.
  • the third circuit film layer 3 of the laminated layer 23 is fixed to the second side 112 of the film layer 11 through the third electrolytic bonding layer 43 by electrolytic bonding, and the second circuit film layer 22 is transparently bonded.
  • the second electrolytic bonding layer 42 is fixed to the laminated layer 23 to laminate the film layer 12 as shown in FIG.
  • each two adjacent circuit film layers transmit at least one guide
  • the electrical structures are connected. More specifically, as shown in FIG. 3, the first circuit film layer 21, the film layer 11 and the third circuit film layer 3 are respectively provided with corresponding holes 210, 110 and 30a, and the third circuit film layer 3, Corresponding holes 30b, 120, and 220 are respectively disposed on the laminated film layer 12 and the second circuit film layer 22.
  • the holes 210, 110 and 30a form a perforation 5a
  • the holes 30b, 120 and 220 form a perforation 5b
  • the perforations 5a and the perforations 5b are selectively plated.
  • the method is plated with a conductive layer 51 as shown in FIG.
  • the conductive layer 51 in the through hole 5a electrically connects the first circuit film layer 21 and the third circuit film layer 3, and the conductive layer 51 in the through hole 5b electrically connects the third circuit film layer 3 and the second circuit film layer 22. Thereby, an electric circuit is formed between the first contact terminal 211 and the second contact terminal 221.
  • a periphery of each of the perforations 5a on the outer surface of the first circuit film layer 21 and a periphery of each of the perforations 5b on the outer surface of the second circuit film layer 22 are formed with a cover.
  • the portion 52 and the cover portion 52 are in contact with the respective conductive layers 51 to further ensure electrical connection between the first contact terminal 211 and the second contact terminal 221.
  • the metal coil can be superimposed without increasing the overall thickness of the diaphragm to increase the magnetic flux of the diaphragm, thereby maintaining the small size and the small size of the earphone unit and the earphone.
  • the sensitivity of the headphones provides designers with more choices when designing headphones.
  • the number of the laminated layers 23 is not limited to a single layer in the second embodiment.
  • 5 is an exploded perspective view showing a structure of a diaphragm according to a third embodiment of the present invention, and as shown in FIG. 5, the diaphragm structure in the third embodiment is almost the same as the diaphragm structure in the second embodiment, both of which are The only difference is the number of laminated layers 23.
  • the diaphragm structure has N lamination layers 23, and between each two adjacent lamination layers 23, the adjacent layers are passed through the electrolytic bonding layer 44 by electrolytic bonding.
  • the three-circuit film layer 3 and the laminated film layer 12 are fixed to each other (not shown in Fig. 5). Further, of the N stacked layers 23, the outermost third circuit film layer 3 is fixed to the second side 112 of the film layer 11 through the electrolytic bonding layer 44 by electrolytic bonding, and the outermost side.
  • the laminated film layer 12 is fixed to the second circuit film layer 22 through the second electrolytic bonding layer 42 by electrolytic bonding.
  • the former one of each of the two adjacent circuit film layers is transparent.
  • the over-conducting structure is connected to the latter of the two adjacent circuit film layers through a laminated film layer or film layer between two adjacent circuit film layers.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Multimedia (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)

Abstract

一种发声装置的振膜结构，其包括：一薄膜层（11）、一第一电路薄膜层（21），透过一第一电解接合层（41）固定于薄膜层（11）的第一侧（111）；一第二电路薄膜层（22），透过一第二电解接合层（42）固定于薄膜层（11）的第二侧（112）；多个穿孔（5），穿透第一电路薄膜层（21）、薄膜层（11）及第二电路薄膜层（22）；以及多个导电层（51），设置在各个所述穿孔（5）的一内周壁上，以与该第一电路薄膜层（21）以及该第二电路薄膜层（22）相接触。该振膜结构藉由电解接合的方式代替传统的背胶将电路薄膜层固定于薄膜层的两侧，藉此使振膜结构的厚度大幅下降。

Description

发声装置的振膜结构 技术领域
本发明关于一种振膜结构，特别关于利用电解接合将金属线圈固定于振膜的薄膜上，藉此大幅降低发声装置单体的厚度的振膜结构。
背景技术
根据结构以及发声的原理不同，发声装置的种类可以分为动圈式喇叭、压电喇叭、陶瓷压电喇叭以及纸喇叭等许多种类，其中，最常见即为传统的动圈式喇叭。动圈式喇叭的结构，主要是将一漆包线圈缠绕于圆型管柱的外周围后构成一音圈后，再将音圈的一端胶合于一振膜的一侧后置放于磁铁的一侧，以形成动圈式喇叭的单体。在利用此种单体发声时，使对应的音频电流通过漆包线圈，使得线圈的磁场透过电磁感应发生变化而带动振膜振动，藉此振动空气而发声。动圈式喇叭单体具有中低频的音效佳的优点，然而，由于其体积较大，动圈式喇叭并不适用于小体积的装置之中，此外，由于动圈式喇叭的单体厚度较后，其高频的性能也较差。
在现有的一些单体结构中，音圈大都是以背胶的方式固定在薄膜上。由于目前业界中可用的背胶都具有一定的厚度，因此，此种固定方式会使得单体整体的厚度变得较厚，进而导致如耳机等发声装置的单体以及耳机整体的尺寸无法变小；此外，当需要增加发声装置的灵敏度时，一般来说会透过增加线圈的数量来增加单体的磁通量密度，然而，由于传统使用背胶的固定方式会使得线圈数量增加后的单体厚度变得过厚，因而对发声装置及耳机的设计造成了限制。
发明内容
基于上述理由，本发明的目的在于提供一种振膜结构，其利用电解接合代替背胶的方式将金属线圈固定于薄膜上以构成发声装置的振膜，藉此大幅降低振膜的厚度。
本发明的另一目的在于提供一种振膜结构，其利用电解接合方式将多个金属线圈与多个薄膜交替迭加固定，使得振膜结构在厚度不变的条件下可以 具有更大的磁通量。
为达成前述目的，本发明提供一种振膜结构，其包括：一薄膜层、一第一电路薄膜层、一第二电路薄膜层以及至少一导电结构。所述薄膜层具有一第一侧以及一第二侧。所述第一电路薄膜层透过一第一电解接合层固定于薄膜层的第一侧，且其一端具有一第一接触端子。所述第二电路薄膜层透过一第二电解接合层固定于薄膜层的第二侧，且其一端具有一第二接触端子。所述至少一导电结构穿透薄膜层连接第一电路薄膜层以及第二电路薄膜层。
根据本发明的一实施例，所述导电结构包括一穿孔以及一导电层。所述穿孔自第一电路薄膜层的一外表面穿过薄膜层穿透至第二电路薄膜层的一外表面。所述导电层设置在穿孔的一内周壁上，且导电层同时与第一电路薄膜层以及第二电路薄膜层相接触。
此外，本发明提供另一种振膜结构，其包括：一薄膜层、一第一电路薄膜层、至少一迭合层、一第二电路薄膜层以及多个导电结构。所述薄膜层具有一第一侧以及一第二侧。所述第一电路薄膜层透过一第一电解接合层固定于薄膜层的第一侧，且其一端具有一第一接触端子。所述至少一迭合层的每一者包括：一第三电路薄膜层以及一迭合薄膜层。所述迭合薄膜层透过一迭合电解接合层固定于第三电路薄膜层；其中，该至少一迭合层中最外侧的第三电路薄膜层透过一第三电解接合层固定于薄膜层的第二侧。所述第二电路薄膜层透过一第二电解接合层固定于至少一迭合层中最外侧的迭合薄膜层，且其一端具有一第二接触端子。其中，在第一电路薄膜层、第二电路薄膜层以及至少一第三电路薄膜层中每两个相邻的电路薄膜层透过至少一导电结构相连接。
根据本发明的一实施例，所述导电结构的每一者包括一穿孔以及一导电层。所述穿孔自该两个相邻的电路薄膜层中的前一者穿过两个相邻的电路薄膜层之间的该迭合薄膜层或该薄膜层穿透至两个相邻的电路薄膜层中的后一者。所述导电层设置在穿孔的一内周壁上，且导电层与该两个相邻的电路薄膜层相接触。
根据本发明的一实施例，所述振膜结构进一步包括多个覆盖部分，所述覆盖部分在第一电路薄膜层的外表面以及第二电路薄膜层的外表面上围绕各个所述穿孔设置，且所述覆盖部分分别与所述穿孔中的各个导电层相接 触。
根据本发明的一实施例，所述振膜结构包括多个迭合层，且每两个迭合层之间透过迭合电解接合层相互固定。
附图说明
图1为显示根据本发明第一实施例的振膜结构的立体分解图；
图2为显示根据本发明第一实施例的振膜结构的侧视剖面图；
图3为显示根据本发明第二实施例的振膜结构的立体分解图；
图4为显示根据本发明第二实施例的振膜结构的侧视剖面图；
图5为显示根据本发明第三实施例的振膜结构的立体分解图。
其中，附图标记说明如下：
11    薄膜层
111   第一侧
112   第二侧
12    迭合薄膜层
21    第一电路薄膜层
211   第一接触端子
22    第二电路薄膜层
221   第二接触端子
23    迭合层
3     第三电路薄膜层
41    第一电解接合层
42    第二电解接合层
43    第三电解接合层
44    迭合电解接合层
5、5a、5b穿孔
51    导电层
52    覆盖部分
110、210、220、30a、30b    孔洞
具体实施方式
以下配合图式及附图标记对本发明的实施方式做更详细的说明，使熟悉本领域的技术人员在研读本说明书后能据以实施。
图1为显示根据本发明第一实施例的振膜结构的立体分解图；图2为显示根据本发明第二实施例的振膜结构的侧视剖面图。如图1以及图2所示，根据本发明第一实施例所提供的振膜结构，主要包括了一薄膜层11、一第一电路薄膜层21、一第二电路薄膜层22以及一导电结构。
所述薄膜层11具有一第一侧111以及一第二侧112。在本发明中，采用无胶铜作为所述的第一电路薄膜层21以及第二电路薄膜层22，且透过电解接合的方式将第一电路薄膜层21以及第二电路薄膜层22分别固定于薄膜层11的两侧，以形成例如耳机等发声装置的振膜。如图2所示，第一电路薄膜层21与第二电路薄膜层22分别具有一第一接触端子211以及一第二接触端子221，第一电路薄膜层21藉由电解接合的方式透过第一电解接合层41固定于薄膜层11的第一侧111，而第二电路薄膜层22藉由电解接合的方式透过第二电解接合层42固定于薄膜层11的第二侧112。在此值得一提的是，为了方便辨识，各个电解接合层的厚度并未依照实际的比例绘示，实际的电解接合层的厚度比图中所示的比例更薄。此外电路薄膜层的材质不限于无胶铜，任何其他可导电并且可透过电解接合的方式固定于薄膜层上的材质皆为合适的材质。
薄膜层11、第一电路薄膜层21以及第二电路薄膜层22上分别形成有相对应的多个孔洞110、210、220，使得第一电路薄膜层21及第二电路薄膜层22固定于薄膜层11的两侧时会形成穿透振膜的穿孔5。如图1所示，由于薄膜层11、第一电路薄膜层21以及第二电路薄膜层22上分别形成有四个孔洞，因此，本发明中的振膜总共具有四个穿孔5。由于在发声时，需透过电流将第一电路薄膜层21及第二电路薄膜层22导电，藉此使得其磁场发生变化并带动薄膜层11振动空气发声，因此，所述穿孔5的内周壁上分别以选镀的方式镀有一层导电层51，以将第一电路薄膜层21及第二电路薄膜层22彼此电性连接。如图2所示，在第一电路薄膜层21的外表面以及第二电路薄膜层22的外表面上每个穿孔5的周缘皆形成有一覆盖部分52，且所述覆盖部分52皆与各个导电层51相接触，以进一步确保第一电路薄膜层21及 第二电路薄膜层22之间的电性连接。
本发明第一实施例中所提供的振膜结构，利用电解接合的方式将无胶铜构成的第一电路薄膜层21及第二电路薄膜层22固定于薄膜层11的两侧，并且利用选镀的方式在穿孔5中形成导电层51，藉此使得振膜结构整体的厚度得以大幅变薄；更准确地来说，相较于现有用背胶方式将金属线圈固定于薄膜上的振膜，本发明所提供的振膜结构可以将振膜的厚度从8.75μm降到4μm。如此一来，可以使得发声装置的单体以及发声装置本身的尺存大幅缩小，也因此，本发明所提供的振膜结构非常适合应用于如耳机等小尺寸的发声装置中。
耳机的磁通量对耳机的灵敏度有很大的影响，具有较高磁通量的耳机，可以透过较小的功率发出较大的声音。在不增加耳机振膜的平面面积的条件下，一般来说透过迭加金属线圈数量的方式来增加振膜的磁通量，若采用现有背胶的固定方式，会导致振膜整体的厚度过厚；因此，本发明的第二及第三实施例便针对上述问题提出另一种振膜结构。
图3为显示根据本发明第二实施例的振膜结构的立体分解图，而图4为显示根据本发明第二实施例的振膜结构的侧视剖面图。如图3及图4所示，根据本发明第二实施例的振膜结构与第一实施例中的振膜结构类似，同样包括了一薄膜层11、一第一电路薄膜层21以及一第二电路薄膜层22，两者的差异处主要在于，第二实施例中的振膜结构进一步设置了一迭合层23。
与第一实施例类似，第二实施例中的薄膜层11具有一第一侧111以及一第二侧112，所述的第一电路薄膜层21以及第二电路薄膜层22分别具有一第一接触端子211及第二接触端子221且同样由无胶铜所构成，第一电路薄膜层21由电解接合的方式透过第一电解接合层41被固定在薄膜层11的第一侧111。第二实施例中的迭合层23，由一第三电路薄膜层3以及一迭合薄膜层12所构成，且第三电路薄膜层3由电解接合的方式透过迭合电解接合层44固定于迭合薄膜层12上。迭合层23的第三电路薄膜层3由电解接合的方式透过第三电解接合层43固定于薄膜层11的第二侧112，而第二电路薄膜层22则是由电解接合的方式透过第二电解接合层42固定于迭合层23迭合薄膜层12，如图4所示。
在本发明所提供的振膜结构中，每两个相邻的电路薄膜层透过至少一导 电结构相连接。更详而言，如图3所示，第一电路薄膜层21、薄膜层11及第三电路薄膜层3上分别设置有相对应的孔洞210、110及30a，而第三电路薄膜层3、迭合薄膜层12及第二电路薄膜层22上分别设置有相对应的孔洞30b、120及220。当振膜结构透过上述的方式固定之后，孔洞210、110及30a会形成穿孔5a，孔洞30b、120及220会形成穿孔5b，且所述穿孔5a及所述穿孔5b中皆以选镀的方式镀有一层导电层51，如图4所示。穿孔5a中的导电层51将第一电路薄膜层21与第三电路薄膜层3电性连接，而穿孔5b中的导电层51将第三电路薄膜层3与第二电路薄膜层22电性连接，藉此在第一接触端子211及第二接触端子221之间形成一电路。
此外，与第一实施例中类似，在第一电路薄膜层21的外表面上的每个穿孔5a的周缘以及第二电路薄膜层22的外表面上的每个穿孔5b的周缘皆形成有一覆盖部分52，且所述覆盖部分52皆与各个导电层51相接触，以进一步确保第一接触端子211与第二接触端子221之间的电性连接。
透过第二实施例所提供的振膜结构，可以在不会大幅增加振膜整体厚度的情形下迭加金属线圈以增加振膜的磁通量，藉此维持耳机单体以及耳机的小尺寸并提高耳机的灵敏度，提供设计者在设计耳机时更多的选择。
本发明所提供的振膜结构，其迭合层23的数量并不限于第二实施例中的单一一层。图5为显示根据本发明第三实施例的振膜结构的立体分解图，如图5所示，第三实施例中的振膜结构与第二实施例中的振膜结构几乎相同，两者之间的差异仅在于迭合层23的数量。
在第三实施例中，振膜结构具有N个迭合层23，且每两个相邻的迭合层23之间，由电解接合的方式透过迭合电解接合层44将相邻的第三电路薄膜层3以及迭合薄膜层12相互固定(未显示于图5中)。此外，相迭的N个迭合层23中，最外侧的第三电路薄膜层3由电解接合的方式透过迭合电解接合层44固定于薄膜层11的第二侧112，而最外侧的迭合薄膜层12由电解接合的方式透过第二电解接合层42固定于第二电路薄膜层22。在第三实施例的振膜结构的第一电路薄膜层21、第二电路薄膜层22及所有的第三电路薄膜层3之中，每两个相邻的电路薄膜层中的前一者透过导电结构穿过两个相邻的电路薄膜层之间的迭合薄膜层或薄膜层连接至两个相邻的电路薄膜层中的后一者。透过上述的配置，设计人员可以根据耳机对于磁通量的需求调 整迭合层的数量23。
由以上实施例可知，本发明所提供的振膜结构确具产业上的利用价值，以上的叙述仅为本发明的较佳实施例说明，熟悉本领域的技术人员可依据上述的说明而作其它种种的改良，这些改变仍属于本发明的精神及以下所界定的专利范围中。

Claims (7)

  1. 一种发声装置的振膜结构，其特征在于，包括：
    一薄膜层，具有一第一侧以及一第二侧；
    一第一电路薄膜层，透过一第一电解接合层固定于该薄膜层的该第一侧，且其一端具有一第一接触端子；
    一第二电路薄膜层，透过一第二电解接合层固定于该薄膜层的该第二侧，且其一端具有一第二接触端子；以及
    至少一导电结构，穿透该薄膜层连接该第一电路薄膜层以及该第二电路薄膜层。
  2. 根据权利要求1所述的振膜结构，其特征在于，该至少一导电结构包括：
    一穿孔，自该第一电路薄膜层的一外表面穿过该薄膜层穿透至该第二电路薄膜层的一外表面；以及
    一导电层，设置在该穿孔的一内周壁上，该导电层同时与该第一电路薄膜层以及该第二电路薄膜层相接触。
  3. 根据权利要求2所述的振膜结构，其特征在于，进一步包括多个覆盖部分，所述覆盖部分在该第一电路薄膜层的一外表面以及该第二电路薄膜层的一外表面上围绕该穿孔设置，且所述覆盖部分与该穿孔中的该导电层相接触。
  4. 一种发声装置的振膜结构，其特征在于，包括：
    一薄膜层，具有一第一侧以及一第二侧；
    一第一电路薄膜层，透过一第一电解接合层固定于该薄膜层的该第一侧，且其一端具有一第一接触端子；
    至少一迭合层，每一个该迭合层包括：
    一第三电路薄膜层；以及
    一迭合薄膜层，透过一迭合电解接合层固定于该第三电路薄膜层；
    其中，该至少一迭合层中最外侧的该第三电路薄膜层透过一第三电解接合层固定于该薄膜层的第二侧；
    一第二电路薄膜层，透过一第二电解接合层固定于该至少一迭合层中最 外侧的该迭合薄膜层，且其一端具有一第二接触端子；以及
    多个导电结构；
    其中，在该第一电路薄膜层、该第二电路薄膜层以及该至少一第三电路薄膜层中每两个相邻的电路薄膜层透过至少一导电结构相连接。
  5. 根据权利要求4所述的振膜结构，其特征在于，该导电结构的每一者包括：
    一穿孔，自该两个相邻的电路薄膜层中的前一者穿过两个相邻的电路薄膜层之间的该迭合薄膜层或该薄膜层穿透至两个相邻的电路薄膜层中的后一者；以及
    一导电层，设置在该穿孔的一内周壁上，该导电层与该两个相邻的电路薄膜层相接触。
  6. 根据权利要求5所述的振膜结构，其特征在于，进一步包括多个覆盖部分，所述覆盖部分在该第一电路薄膜层的该外表面以及该第二电路薄膜层的该外表面上围绕各个所述穿孔设置，且所述覆盖部分分别与所述穿孔中的各个该导电层相接触。
  7. 根据权利要求4所述的振膜结构，其特征在于，包括多个该迭合层，且每两个该迭合层之间透过该迭合电解接合层相互固定。
PCT/CN2014/000945 2014-10-24 2014-10-24 发声装置的振膜结构 Ceased WO2016061713A1 (zh)

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