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WO2016052025A1 - Module de del et appareil d'éclairage - Google Patents

Module de del et appareil d'éclairage Download PDF

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Publication number
WO2016052025A1
WO2016052025A1 PCT/JP2015/074266 JP2015074266W WO2016052025A1 WO 2016052025 A1 WO2016052025 A1 WO 2016052025A1 JP 2015074266 W JP2015074266 W JP 2015074266W WO 2016052025 A1 WO2016052025 A1 WO 2016052025A1
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WO
WIPO (PCT)
Prior art keywords
light
led
transparent member
light emitting
light sources
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/074266
Other languages
English (en)
Japanese (ja)
Inventor
弘康 近藤
亮二 津田
大野　博司
光章 加藤
久野　勝美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Materials Co Ltd
Original Assignee
Toshiba Corp
Toshiba Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Materials Co Ltd filed Critical Toshiba Corp
Priority to JP2016551650A priority Critical patent/JP6293914B2/ja
Publication of WO2016052025A1 publication Critical patent/WO2016052025A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B44/00—Circuit arrangements for operating electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • Embodiments of the present invention relate to an LED module and a lighting device.
  • a white LED illumination device including a white LED light source that obtains white light by combining a blue light emitting diode (LED) chip and a phosphor
  • white LED lighting devices have various advantages such as less power consumption than conventional incandescent bulbs, but on the other hand, what is an incandescent bulb that emits light with a high blue light emission peak and shades close to natural light? It has quite different emission characteristics. For example, in an incandescent light bulb, when the brightness of the light bulb is adjusted to be dark, the color temperature decreases due to the light emission characteristics of the tungsten filament, and the light becomes white light with strong redness.
  • the brightness can be freely changed with white light having the same color temperature, but the color temperature cannot be changed according to the change in the brightness of the light.
  • the color temperature hardly changes due to the light emission characteristics of the LED, and the emitted light remains white light with strong bluishness.
  • Incandescent light bulbs are naturally accepted by people around the world unconsciously because they emit light with a brightness and shade similar to natural light due to the light emission characteristics of the filament whose color temperature changes with brightness. Similarly, people in the world have a tendency to shine like incandescent bulbs (brightness of light and color of light) for white LED lighting devices.
  • An object of the embodiment of the present invention is to provide an LED module and a lighting device that emit light like a filament light source of an incandescent bulb.
  • the LED modules according to the embodiments described herein each have a light emitting surface included in the same plane, and a plurality of LED light sources that respectively emit light having different emission spectra in the visible light region from the light emitting surface, Axisymmetric transparent member formed symmetrically about a light distribution symmetry axis substantially orthogonal to the plane, covering the light emitting surface of the plurality of LED light sources, and guiding light emitted from the plurality of LED light sources And axisymmetrically formed around the light distribution symmetry axis, located apart from the plurality of LED light sources, provided inside the axially symmetric transparent member, and scattering light guided by the axially symmetric transparent member And the projected image of the axially symmetric light scattering member projected in parallel on the plane overlaps at least a part of each light emitting surface of the plurality of LED light sources.
  • FIG. 1 is a side view showing an illumination apparatus according to an embodiment.
  • FIG. 2 is a perspective cross-sectional view illustrating the illumination device of the embodiment.
  • FIG. 3 is a perspective view showing the LED module of the embodiment.
  • FIG. 4 is an enlarged schematic side view showing the LED module of the embodiment.
  • FIG. 5 is an enlarged schematic side view showing an outline of an attachment mechanism for attaching the light guide to a chip-on-board (hereinafter referred to as “COB”).
  • COB chip-on-board
  • FIG. 6 is an enlarged side schematic view showing an outline of an attachment mechanism for attaching the light guide to the COB.
  • FIG. 7A is a schematic side view illustrating an example of a trajectory of light in the light guide.
  • FIG. 7B is a schematic side view showing an example of the locus of light in the light guide.
  • FIG. 7C is a schematic side view illustrating an example of a locus of light in the light guide.
  • FIG. 7D is a schematic side view showing an example of the locus of light in the light guide.
  • FIG. 8 is a schematic longitudinal sectional view showing an outline of the LED module.
  • FIG. 9 is a schematic vertical sectional view of a plurality of combination LED light sources.
  • FIG. 10 is a schematic plan view of a plurality of combination LED light sources.
  • FIG. 11 is a parallel projection diagram schematically showing a projection image of a light scattering member projected on the light emitting surface of a plurality of combination LED light sources.
  • FIG. 12A is a plan view showing a projected image of a light scattering member projected on the light emitting surface of another multiple combination LED light source.
  • FIG. 12A is a plan view showing a projected image of a light scattering member projected on the light emitting surface of another multiple combination LED light source.
  • FIG. 12B is a plan view showing a projected image of the light scattering member projected onto the light emitting surface of another multiple combination LED light source.
  • FIG. 12C is a plan view showing a projected image of the light scattering member projected onto the light emitting surface of another multiple combination LED light source.
  • FIG. 12D is a plan view showing a projected image of the light scattering member projected on the light emitting surface of another multiple combination LED light source.
  • FIG. 12E is a plan view showing a projected image of the light scattering member projected onto the light emitting surface of another multiple combination LED light source.
  • FIG. 12F is a plan view showing a projected image of the light scattering member projected onto the light emitting surface of another multiple combination LED light source.
  • FIG. 13 is a schematic cross-sectional view showing an enlarged part of a plurality of combination phosphor layers partitioned by high barrier ribs.
  • FIG. 14 is a schematic cross-sectional view showing an enlarged part of a plurality of combination phosphor layers partitioned by low barrier ribs.
  • FIG. 15 is a circuit diagram of a multiple combination LED light source of the embodiment.
  • FIG. 16 is a characteristic diagram showing current-voltage characteristics of a single white LED light source and three types of combination white LED lighting devices.
  • FIG. 17 is a characteristic diagram showing the relationship between total luminous flux and input current in three types of combination white LED lighting devices.
  • FIG. 18 is a characteristic diagram showing the relationship between color temperature and total luminous flux by comparing three types of combination white LED lighting devices and incandescent bulbs.
  • FIG. 19 is a circuit diagram of various white LED lighting devices having a single color temperature.
  • FIG. 20 is a characteristic diagram showing current-voltage characteristics of various white LED lighting devices having a single color temperature.
  • FIG. 21 is a circuit diagram of a multiple combination white LED lighting device according to another embodiment.
  • FIG. 22 is a characteristic diagram showing current-voltage characteristics of a plurality of combination white LED lighting devices in which different color temperatures are combined.
  • FIG. 23 is a characteristic diagram showing the relationship between the current (partial current) flowing in each area and the input current (total current) in two types of combination white LED light sources.
  • FIG. 24 is a characteristic diagram showing the relationship between total luminous flux and input current in two types of combination white LED light sources.
  • FIG. 25 is a characteristic diagram showing a comparison between two types of combination white LED light sources and incandescent bulbs regarding the relationship between color temperature and total luminous flux.
  • the lighting device 1 of the embodiment is formed in a shape and size that approximates an incandescent bulb.
  • Such an illuminating device 1 is formed by inserting the LED module 10 in a globe 2 made of spherical glass and sealing the opening of the globe 2 with a base 3.
  • the LED module 10 has a plurality of LED light sources 13a, 13b, 13c having a light emitting surface 18 included on the same plane.
  • the plurality of LED light sources 13a, 13b, and 13c are mounted on the same substrate 11 using COB technology, and are supported by the substrate 11 by a cylindrical heat sink 4 having a hollow portion 4c.
  • the heat sink 4 is made of a metal material having excellent thermal conductivity such as aluminum or aluminum alloy.
  • An annular protrusion is formed on the base end portion 4 b of the heat sink 4.
  • the heat sink 4 is fixed to the base 3 by caulking the base 3 to the annular protrusion.
  • the front end portion 4a of the heat sink 4 supports the axially symmetric transparent member 14 via the lens presser 6 having a perforated cap shape.
  • a reduced diameter portion slightly smaller than the diameter of the heat sink body is formed at the heat sink tip 4a.
  • the substrate 11 is fastened with a plurality of screws 5 to the upper end of the reduced diameter portion 4a.
  • the lens retainer 6 is put on the outer periphery of the heat sink diameter-reduced portion 4a.
  • the transparent member 14 is inserted into the opening of the lens holder 6 and joined to the light emitting surface 18 of the LED light source 13.
  • the support structure for supporting the transparent member 14 by the lens presser 6 is reinforced.
  • a lighting circuit 42 is provided in the hollow portion 4 c of the heat sink 4.
  • the lighting circuit 42 is connected to both poles of the base 3 by internal wiring.
  • the lighting circuit 42 is connected to the light emitting circuits of the light sources 13a, 13b, and 13c on the substrate 11, respectively, as shown in FIGS.
  • the lighting circuit 42 has an AC / DC conversion function for converting alternating current into direct current and a lighting function for supplying power to the light emitting circuit and causing the light sources 13a, 13b, and 13c to emit light.
  • the LED module 10 of the embodiment is a combination of three LED light sources 13a, 13b, 13c, an axially symmetric transparent member 14, and an axially symmetric light scattering member 15.
  • Each LED light source 13a, 13b, 13c includes a plurality of LED chips (not shown) and a phosphor layer 12 covering the plurality of LED chips.
  • the LED chip is incorporated in a circuit board 11C in which an LED light emitting circuit is formed on an alumina substrate by a chip-on-board technique, for example.
  • a light emitting circuit including three LED chip groups 13a, 13b, and 13c shown in FIG. 15 is mounted on the circuit board 11C. Further, the LED chip group circuit board 11C is mounted on a common circuit board 11B as shown in FIG.
  • the phosphor layer 12 on the substrate 11C provides a light emitting surface 18 that emits white light.
  • the phosphor layer 12 is formed by applying phosphor materials having different color temperatures for each divided area as shown in FIGS. 9 to 14, for example.
  • the axisymmetric light transparent member 14 is attached to the common substrate 11B so as to cover all of the light emitting surfaces 18 of the plurality of light sources.
  • the axially symmetric light transparent member 14 has a cylindrical shape as a whole, and is substantially axially symmetric with respect to the light distribution symmetry axis ax.
  • the axially symmetric light scattering member 15 is also substantially axially symmetric with respect to the light distribution symmetry axis ax.
  • the transparent member 14 is solid at the proximal end side and is hollow at the distal end side.
  • a coating film containing the light scattering particles 17 is formed on the inner surface of the hollow portion 14h of the transparent member.
  • the coating film containing the light scattering particles 17 constitutes the light scattering member 15.
  • the axially symmetric transparent member 14 has an outer diameter that gradually decreases from the proximal end side toward the distal end side along the Z axis. That is, in the axisymmetric transparent member 14, the frustoconical first intermediate portion 14b has a smaller outer diameter than the cylindrical base end portion 14a, and the second intermediate portion 14c has a smaller outer diameter than the first intermediate portion 14b. The outer diameter is even smaller, and the outer diameter of the tip portion 14d is smaller than that of the second intermediate portion 14c.
  • the diameter of the hollow portion 14h of the transparent member gradually increases from the proximal end side to the distal end side of the transparent member 14, and therefore the inner diameter of the light scattering member 15 also increases. That is, in the axially symmetric transparent member 14, the inner diameter of the first intermediate portion 14m is larger than the bottom surface 14n on the base end side, and the inner diameter of the second intermediate portion 14l is larger than that of the first intermediate portion 14m.
  • the inner diameter of the third intermediate portion 14k is larger than that of the second intermediate portion 14l, and the inner diameter of the distal end portion 14j is further increased than that of the third intermediate portion 14k.
  • the taper angles of these portions 14a, 14b, 14c, 14d, 14j, 14k, 14l, 14m, and 14n can be determined using the optical characteristics and analysis method of the entire LED module. Specifically, the thickness of the transparent member 14 surrounding the light scattering member 15 gradually decreases as it moves from the proximal end side to the distal end side of the transparent member 14, and as a result, a thickness changing portion 16 is formed. ing.
  • a thickness changing portion 16 has a lens function or a light collecting function for collecting a plurality of lights in a specific focal region (hereinafter referred to as a virtual light source region). As shown in FIGS.
  • the light is guided by the transparent member 14, and the light reaching the light scattering member 15 is repeatedly reflected and scattered in the light scattering member 15, so that the entire surface of the light scattering member 15 emits light.
  • the light traveling from the light scattering member 15 toward the tip side is emitted from the module 10 to the outside as it is.
  • the light traveling from the light scattering member 15 toward the side surface 14s or the base end side is condensed by the thickness changing portion 16 onto the bottom surface 14n of the hollow portion as the virtual light source region.
  • the light concentration toward the bottom surface 14n of the hollow portion it looks to the external observer as if light is emitted from the bottom surface 14n of the hollow portion.
  • the lighting device 1 of the present embodiment is designed so that the bottom surface 14n of the hollow portion serving as the virtual light source region is positioned at the substantially center of the globe 2, so that the lighting device 1 emits light in the same manner as a filament light-emitting incandescent bulb. Become.
  • the base end surface of the transparent member 14 is bonded and fixed to the circuit board 11C of the light source with an adhesive.
  • the lens holder 6 is put on the fixed transparent member 14, the lower protrusion 14p of the transparent member is fitted into the lens holder groove 6g, and the lens holder 6 is positioned with respect to the substrate 11B.
  • the screw hole 6a for the lens retainer and the screw hole 11a for the substrate communicate with each other.
  • the LED light source 13 is firmly fastened to the reduced diameter portion of the heat sink 4 together with the lens holder 6 with the screw 5.
  • the LED light source 13 includes a plurality of light emitting elements that emit light in the visible light region, and has a flat light emitting surface 18.
  • the light emitting element for example, an LED chip that emits monochromatic light having a peak wavelength in the range of 350 to 470 nm can be used. Specifically, for example, a purple LED chip that emits light having a peak wavelength of 410 nm can be used.
  • a phosphor layer 12 is applied and formed so as to cover such an LED chip. The phosphor layer 12 absorbs primary light from the LED chip, converts the wavelength of light, and emits secondary light. The area where the phosphor layer 12 is applied provides the light emitting surface 18 of the light source.
  • the light distribution from the LED chip has a light distribution symmetry axis ax, and is a distribution close to symmetry with respect to the light distribution symmetry axis ax.
  • the light distribution for example, Lambertian can be used, but is not limited to this, and other distributions may be used.
  • the light distribution symmetry axis ax can pass, for example, near the center in the light emitting surface of the LED chip, but is not limited to this, and other points in the same plane as the light emitting surface 18 of the LED chip are not limited thereto. You can pass.
  • the LED light source 13 may be placed on the substrate 11 as necessary.
  • the substrate 11 is not particularly limited, but the substrate mounting surface can be made of a material that diffusely reflects visible light. In this case, the light distribution can be increased. Or the mounting surface of a board
  • substrate may be comprised with the transparent material which can permeate
  • the axially symmetric transparent member 14 can be made of a transparent material that absorbs little visible light.
  • the transparent material may be either an inorganic material or an organic material.
  • the inorganic material for example, glass and transparent ceramics can be used.
  • the organic material for example, a transparent resin selected from the group consisting of acrylic resin, silicone resin, epoxy resin, polycarbonate, polyethylene terephthalate (PET) resin, and polymethyl methacrylate (PMMA) resin can be used.
  • the transparent means that visible light can be transmitted.
  • the refractive index n of the transparent member and the total reflection angle ⁇ c have the relationship of the following formula (A).
  • the axially symmetric light scattering member 15 is disposed inside the axially symmetric transparent member 14 and contains light scattering particles 17 that scatter white light from the LED light source 13.
  • the light scattering particles 17 are preferably white particles such as a white pigment that totally reflects light.
  • a transparent resin is injection molded by an injection molding machine to form a cylindrical axisymmetric transparent member 14.
  • the white particles 17 are mixed and stirred in the transparent binder to prepare a mixture slurry in which the white particles 17 are uniformly dispersed in the transparent binder.
  • the mixture slurry is thinly applied to the peripheral wall of the hollow portion 14h of the axisymmetric transparent member by an application device.
  • the average thickness of the coating layer is preferably in the range of 50 to 100 ⁇ m.
  • the coating layer constitutes the axially symmetric light scattering member 15.
  • the coating layer 15 covers the peripheral wall of the hollow portion 14h of the transparent member and scatters the light guided by the transparent member 14.
  • grains it is not limited to what was mentioned above, It is transparent with respect to visible light, and if it is transparent resin which can hold
  • the absorption coefficient ⁇ (1 / mm) of the light scattering member is obtained when a parallel light beam collimated in a direction orthogonal to the flat plate is irradiated to a flat light scattering member having a thickness h (mm). It can be defined using the amount of transmission.
  • the absorption coefficient ⁇ is given by the following equation (B).
  • the symmetry axis of the axially symmetric transparent member 14 substantially coincides with the light distribution symmetry axis ax of the LED light source 13, and the symmetry axis of the axially symmetric light scattering member 15 also substantially coincides with the light distribution symmetry axis ax. Yes.
  • the light distribution symmetry axis ax of the LED light source is within the range of product variation, it can be considered that the symmetry axes substantially coincide.
  • the closest distance L 2 and the area C of the light emitting surface 18 satisfy the relationship of the following formula (1).
  • the length L 1 of the light scattering member and the absorption coefficient ⁇ (1 / mm) of the light scattering member satisfy the relationship of the following formula (2).
  • the diameter d 1 of the bottom surface of the light scattering member, the closest distance L 2, and the refractive index n of the transparent member satisfy the relationship of the following formula (3).
  • the light 8 emitted from the LED light source does not pass through the light scattering member 15 and leaks out from the lighting device 1 to the outside. Disappear.
  • the light 8 from the LED light source 13 is totally reflected by the side surface 14s of the transparent member except for part of the light scattered by the bottom surface 15e of the light scattering member, and is scattered by the respective portions 15a to 15d of the light scattering member. . In this way, since light is repeatedly reflected and scattered and then released to the outside, it appears to the external observer that the entire surface of the light scattering member 15 is emitting light.
  • the cross section orthogonal to the symmetry axis of the light scattering member 15 is included in the cross section of the transparent member 14 in the plane including the cross section. That is, the periphery of the light scattering member 15 is reliably covered with the transparent member 14 on a plane orthogonal to the symmetry axis. Further, the surface obtained by projecting the transparent member 14 in parallel to the light emitting surface 18 of the light source covers the entire light emitting surface 18. In other words, the cross section of the maximum diameter of the transparent member 14 is larger than the light emitting surface 18 of the light source.
  • a compact white LED lighting device can be obtained in addition to low loss and low heat generation.
  • the LED light source 13 is disposed on the alumina substrate 11 and is covered with a transparent member 14.
  • the transparent member 14 has a cylindrical shape with the light distribution symmetry axis ax as the symmetry axis, and the bottom surface thereof is in contact with the substrate 11.
  • the light scattering member 15 is a coating film having a light distribution symmetry axis ax as a symmetry axis, and is formed of a transparent resin including white particles 17 disposed inside the transparent member 14.
  • the white particles 17 are uniformly dispersed in the transparent resin layer.
  • the white particles 17 scatter the light 8 from the light source, and generate scattered light 9 directed in various directions with almost no light absorption.
  • An absorption coefficient ⁇ (1 / mm) of the light scattering member 15 including such white particles 17 is set to 0.1.
  • the area C of the light emitting surface 18 of the light source is, for example, 1 mm 2 .
  • the value on the right side is about 0.28 mm.
  • the LED module of this embodiment is set to the shortest distance L 2 for example 3.0mm between the light source 13 and the light scattering member 15. Since the calculated value is smaller than 3.0 mm, the relationship of Expression (1) is satisfied.
  • the absorption coefficient ⁇ (1 / mm) of the light scattering member 15 is set to 0.1. If this value is substituted into the right side of Equation (2) and calculated, the value on the right side is 3.0.
  • the length L 1 of the light scattering member 15 is set to 10.6 mm, for example. Since this is larger than the calculated value of 3.0 mm, the relationship of Expression (2) is satisfied.
  • the diameter d 1 and the closest distance L 2 of the light scattering member 15 satisfy the relationship of the following formula (4).
  • the diameter d 0 of the transparent member 14 is 10.2 mm, for example.
  • the value on the left side is about 0.745.
  • the lengths L 1 and L 2 are substituted into the right side of the equation (4) and calculated, the value on the right side is about 0.736.
  • the light 8 emitted from the LED light source 13 When the light 8 emitted from the LED light source 13 reaches the light scattering member 15, it hits the white particles 17 and is scattered. Part of the light from the LED light source 11 is scattered by the light scattering member 15 after repeating total reflection at the axially symmetric transparent member 12.
  • the ratio is a solid angle in which the LED light source 13 is expected with respect to all solid angles with the light scattering member 15 as the center, and an approximate value can be obtained using the following equation (5).
  • Equation (5) The smaller the value of Equation (5), the less the return light from the light scattering member 15 to the light source 13.
  • the value of formula (5) is preferably at least smaller than 1. Therefore, it is preferable to satisfy the relationship of the above formula (1).
  • FIGS. 7A to 7D Each of FIGS. 7A to 7D has substantially the same configuration as that of FIG. 4 except for the travel of light 8 and 9. Note that the process of the linear light 8 and 9 entered in the drawing is convenient, and the actual light is emitted from the flat light source 13 in a planar shape.
  • the light 8 from the LED light source 13 is guided by the transparent member 14 and collected on the light scattering member 15 by the thickness changing portion 16 of the transparent member 14.
  • the light 8 directed from the light scattering member 15 toward the distal direction is collected by the light scattering member 15 as shown in FIGS. 7B, 7C, and 7D, respectively.
  • the directed light 8 is guided toward the bottom surface 15e of the light scattering member by the thickness changing portion 16 of the transparent member while being reflected by the transparent member 14.
  • the concentration of the light 8 toward the bottom surface 15e of the light scattering member in this way, the external observer looks as if light is emitted from the bottom surface 15e of the light scattering member.
  • the light 8 is totally reflected by the side surface 14s of the transparent member, passes through the vicinity of the edge of the bottom surface 15e of the light scattering member, and is totally reflected again by the side surface of the transparent member 14.
  • the light scattering member 15 is reached.
  • the LED module 10 is designed so that the light 8 incident at various incident angles is substantially totally reflected by the side surface 14s of the transparent member. There is no direct leakage outside.
  • the light 8 emitted from the light source is transmitted without being totally reflected by the side surface 14s of the transparent member, the light 8 from the light source is emitted in this direction as it is without being scattered. Further, the LED light 8 that is not scattered has a strong directivity, so the irradiation range is narrow, and the surroundings are not illuminated in a wide range and evenly.
  • the LED module 10 of the present embodiment is designed to totally reflect the light 8 emitted from the light source 13 on the side surface 14s of the transmissive member.
  • the maximum diameter d 0 of the axisymmetric transparent member is 10.2 mm
  • the diameter d 1 of the bottom surface of the axisymmetric light scattering member is 7.6 mm
  • the length L 1 is 10.6 mm
  • the length The length L 2 is set to 14.8 mm so that at least the expressions (1), (2), (3), and (4) are satisfied.
  • the light 8 When the light 8 reaches the light scattering member 15, it hits the white particles 17 in the light scattering member 15, is scattered by the white particles 17, becomes scattered light 9, and goes out of the module. That is, since the peripheral wall surrounding the hollow portion 14h is covered with the light scattering member 15, scattering and reflection are repeated in the light scattering member 15, and the entire light scattering member 15 appears to emit light to the external observer. . In this case, the higher the concentration of the white particles 17 in the light scattering member 15, the more light 8 is scattered by the white particles 17, and when the white particle concentration exceeds a certain threshold, substantially all Light 8 becomes scattered light 9.
  • ZEMAX ray tracing was performed on the illumination device of the present embodiment.
  • ZEMAX is described in detail, for example, on the homepage of Zemax (Radiant Zemax homepage; “http://www.radiantzemax.com/en/rz/”).
  • Zemax Random Zemax homepage; “http://www.radiantzemax.com/en/rz/”.
  • a plurality of LED light sources are arranged in combination so that the light emitting surfaces are included on the same plane, and white light having an emission spectrum with different color temperatures is emitted from each LED light source.
  • the primary light emitted from a certain light source is not absorbed only by the phosphor layer, but is easily absorbed by the phosphor layers of other light sources in the surroundings, and a predetermined color temperature
  • the total luminous flux of the secondary light becomes lower than the target value of the total luminous flux.
  • the adjacent phosphor layers are in direct contact with each other, the primary light is easily absorbed by the adjacent phosphor layer, so that the total luminous flux of the obtained secondary light is significantly below the target specified value. There is.
  • a high-reflectance barrier rib 20 is provided between adjacent phosphor layers, and one phosphor layer is separated by the barrier rib 20.
  • the other phosphor layer is shielded from physical contact.
  • the partition walls 20 that bring the adjacent phosphor layers into non-contact with each other prevent the primary light from one light source from being absorbed by the phosphor layer of the other light source, so that all of the target specified values can be obtained. Secondary light having a luminous flux is obtained.
  • the projected image 30 of the axially symmetric light scattering member 15 projected in parallel on the XY plane is at least one of the light emitting surfaces of the LED light sources 13a, 13b, 13c. It overlaps with each part.
  • the relative positional relationship between the LED light sources 13a, 13b, and 13c and the axially symmetric light scattering member 15 is such that white light having different color temperatures emitted separately from the light sources 13a, 13b, and 13c is efficient in the light scattering member 15. It comes to be mixed well, resulting in white light with a hue and brightness close to natural light.
  • each LED light source 13a, 13b, 13c in the light emitting circuit of each LED light source 13a, 13b, 13c, a series circuit in which a plurality of LED chips 24, 25, 26 are connected in series is formed, and a plurality of these series circuits are connected in parallel.
  • LED chip groups 21, 22, and 23 connected to are configured.
  • Such LED chip groups 21, 22, and 23 are circuits in which a plurality of LED chip series circuits are connected in parallel.
  • resistors R1 and R2 are inserted on the negative electrode side in the light emitting circuit of the light source having a low color temperature.
  • these insertion resistors R1 and R2 cause an inflection point in the current-voltage characteristic line of the light emitting circuit of the light source 13a having a high color temperature, and the input current is lowered to a point lower than the inflection point of the characteristic line,
  • the LED module 10 of the first embodiment includes three white LED light sources 13a, 13b, and 13c. These three white LED light sources 13a, 13b, and 13c are configured to emit white light having different emission spectra, that is, white light having different color temperatures.
  • the first light source 13a is arranged in the central area of the light emitting surface 18, and the light emitting circuit having the first LED chip group 21 and the phosphor layer 12a so as to emit white light having the highest color temperature.
  • the second light source 13b is disposed in the right area of the light emitting surface 18 in the drawing, and the light emitting circuit and the phosphor having the second LED chip group 22 so as to emit white light having an intermediate color temperature.
  • the third light source 13c is arranged in the left area of the light emitting surface 18 in the drawing, and the light emitting circuit and the phosphor having the third LED chip group 23 so as to emit white light having the lowest color temperature.
  • Layer 12c is combined.
  • the LED light emitting circuits of the first to third light sources 13a, 13b, and 13c have three circuit boards 11C using chip-on-board technology, as shown in FIGS. 9, 10, 13, and 14. It is mounted on a common circuit board 11B. Further, LED chip groups 21, 22, and 23 are mounted on the three circuit boards 11C using chip-on-board technology.
  • the three types of phosphor layers 12a, 12b, and 12c having different color temperatures are formed as follows.
  • a phosphor mixture four phosphor materials of a blue phosphor, a green phosphor, a yellow phosphor, and a red phosphor are mixed with a transparent resin so that the color temperature becomes the first temperature (the highest temperature).
  • This phosphor mixture slurry is applied to the surface of the substrate 11C corresponding to the first LED chip group 21.
  • the first phosphor layer 12a (average thickness t1) for absorbing the primary light emitted from the first LED chip group 21 is formed.
  • the phosphor mixture four phosphor materials of a blue phosphor, a green phosphor, a yellow phosphor, and a red phosphor are transparent resin so that the color temperature becomes the second temperature (intermediate temperature). And a slurry mixed at a predetermined ratio. This phosphor mixture slurry is applied to the surface of the substrate 11C corresponding to the second LED chip group 22. As a result, the second phosphor layer 12b (average thickness t1) for absorbing the primary light emitted from the second LED chip group 22 is formed.
  • a phosphor mixture four phosphor materials of a blue phosphor, a green phosphor, a yellow phosphor, and a red phosphor are transparent resin so that the color temperature becomes the third temperature (the lowest temperature). And a slurry mixed at a predetermined ratio. This phosphor mixture slurry is applied to the surface of the substrate 11C corresponding to the third LED chip group 23. As a result, a third phosphor layer 12c (average thickness t1) for absorbing primary light emitted from the third LED chip group 23 is formed.
  • these three phosphor layers 12a, 12b, and 12c are surrounded by an annular partition 20a and two linear partitions 20b and 20c, and are partitioned from other phosphor layers.
  • the barrier ribs 20a, 20b, and 20c shield light provided between the adjacent phosphor layers 12a, 12b, and 12c in order to reduce absorption of primary light between the three LED light source barrier ribs 13a, 13b, and 13c. It is a thing.
  • Partition walls 20a, 20b, and 20c are provided between the adjacent phosphor layers 12a, 12b, and 12c, and the phosphor layers 12a, 12b, and 12c are separated from each other by the partition walls 20a, 20b, and 20c.
  • the partition walls 20a, 20b, and 20c preferably include high-reflectivity inorganic fine particles that can reflect light having a wavelength of 450 to 780 nm up to 98%. It is preferable to form a partition wall by a slurry coating method using such highly reflective inorganic fine particles and a resin material.
  • a resin material for example, one or a mixture of two or more selected from the group consisting of acrylic, silicone, phenol, urea, melamine, epoxy, polyurethane, polyolefin, and polyimide can be used.
  • the inorganic fine particles one or more selected from the group consisting of titanium oxide, boron nitride, barium sulfate, alumina, and zinc oxide can be used. In particular, white pigments such as titania are preferable as the inorganic fine particles.
  • a white pigment and a resin solution are mixed and stirred at a predetermined ratio to produce a slurry, and this slurry is applied in a linear or strip form on the substrate 11C by a slurry application device.
  • the partition walls 20a, 20b, and 20c thus formed have a high reflectance with a light reflectance of up to 98%.
  • the phosphor mixture and the resin solution are mixed and stirred at a predetermined ratio to produce a slurry, and this slurry is applied to a predetermined area on the substrate 11C by a slurry application device.
  • the phosphor layers 12a, 12b, and 12c thus formed by coating have different color temperatures.
  • a virtual area surrounded by a two-dot chain line in FIG. 11 schematically shows a projection image 30 of the light scattering member when the axially symmetric light scattering member 15 is projected in parallel on the light emitting surface 18 of a plurality of light sources included on the same plane. It is shown in.
  • the projected image 30 does not cover the entire coating area of the phosphor layers 12a, 12b, and 12c, but overlaps each light emitting surface area of the plurality of light sources.
  • the light emitting surface area of the light source refers to a region occupied by the LED chip of the light emitting circuit in the XY plane.
  • all the first LED chip 24 groups overlap the projected image 30 in the center of the figure.
  • the second LED chip 25 group all overlaps the projected image 30.
  • all the third LED chips 26 overlap the projected image 30 on the left side of the figure.
  • the embodiment of the multiple combination light source can be variously changed.
  • the phosphor layers 12a and 12c of the two LED light sources 13a and 13c are partitioned by an annular partition wall 20a and a linear partition wall 20b.
  • One phosphor layer 12a contains a phosphor mixture having a first color temperature.
  • the other phosphor layer 12c contains a phosphor mixture having the second color temperature.
  • the phosphor layers 12a, 12b, and 12c of the three LED light sources 13a, 13b, and 13c are partitioned by the annular partition wall 20a and the three-pronged partition walls 20b, 20c, and 20d.
  • the first phosphor layer 12a contains a phosphor mixture having a first color temperature.
  • the second phosphor layer 12b contains a phosphor mixture having the second color temperature.
  • the third phosphor layer 12c contains a phosphor material having a third color temperature.
  • the phosphor layers 12a and 12c of the two LED light sources 13a and 13c are partitioned by concentric partition walls 20a and 20e.
  • the inner circular phosphor layer 12a contains a phosphor mixture having the first color temperature.
  • the outer circular phosphor layer 12c contains the phosphor mixture having the third color temperature.
  • the phosphor layers 12a, 12b, 12c of the three LED light sources 13a, 13b, 13c are partitioned by concentric partition walls 20a, 20e and linear partition walls 20b, 20c.
  • the inner circular phosphor layer 12a contains a phosphor mixture having the first color temperature.
  • One outer semicircular phosphor layer 12b contains a phosphor mixture having the second color temperature.
  • the other outer semicircular phosphor layer 12c contains a phosphor mixture having a third color temperature.
  • phosphor layers 12a, 12b, 12c and 12d of four LED light sources 13a, 13b, 13c and 13d are formed by concentric partition walls 20a and 20e and linear partition walls 20b, 20c and 20d. It is partitioned.
  • the first phosphor layer 12a contains a phosphor mixture having a first color temperature.
  • the second phosphor layer 12b contains a phosphor mixture having the second color temperature.
  • the third phosphor layer 12c contains a phosphor mixture having a third color temperature.
  • the fourth phosphor layer 12d contains a phosphor mixture having a fourth color temperature.
  • three types of phosphor layers 12a, 12b, and 12c are formed for five LED light sources 13a, 13b, 13c, 13b, and 13c by an annular partition 20a and four L-shaped partitions 20f. It is partitioned.
  • three types of phosphor layers 12a, 12b, and 12c are separately applied to the five LED light sources 13a, 13b, 13c, 13b, and 13c. That is, the phosphor layer 12b containing the same phosphor mixture is applied to the second and fourth light sources, respectively, and the phosphor layer 12c containing the same phosphor mixture is applied to the third and fifth light sources, respectively. Yes.
  • the phosphor layer 12a of the first light source contains a phosphor mixture of the first color temperature
  • the phosphor layer 12b of the second and fourth light sources contains the phosphor of the second color temperature.
  • Mixtures are respectively included
  • the phosphor layers 12c of the third and fifth light sources respectively include phosphor mixtures having a third color temperature.
  • the present invention is not limited to this, and in addition to this, two or four types or More white light sources can be used in combination.
  • the more white light sources to be combined the more delicate white light is reproduced, so that a good effect can be expected.
  • excessively increasing the number of types of white light source is not preferable because it complicates light adjustment and color adjustment. Therefore, it is preferable to combine two to four types of white light sources, and it is most preferable to combine three types of white light sources.
  • the average height h1 of the partition walls be in the range of 0.5 to 2 times the average thickness t1 of the phosphor layer. This is because when the average height h1 of the partition wall is in such an appropriate range, the light emission efficiency of the primary light from the plurality of LED chip groups increases. If the average height h1 of the barrier ribs is 0.5 times or more of the average thickness t1 of the phosphor layer, it is adjacent due to the wettability of the phosphor mixture-containing slurry (mixture of phosphors of each color and transparent resin solution) with respect to the barrier ribs. Contact between the matching phosphors does not occur.
  • the average height h1 of the partition 20L is lower than the thickness t1 of each phosphor layer 12a, 12b, but if the average thickness t1 is 0.5 times or more, the phosphor layers 12a, 12b They do not touch each other. In this case, the phosphor slurry is raised in a convex shape. Incidentally, it is sufficient that the average height h1 of the partition walls is several tens of ⁇ m or more. However, if the average height h1 of the barrier ribs is less than 0.5 times the average thickness t1 of the phosphor layers, the adjacent phosphor layers may come into contact with each other.
  • the average height h1 of the barrier ribs exceeds twice the average thickness t1 of the phosphor layer, the non-light emitting area becomes excessive and the total luminous flux is reduced, so that the illumination becomes dark.
  • the average height h1 of the barrier ribs is less than twice the average thickness t1 of the phosphor layer, the decrease in the luminous efficiency of the secondary light is substantially negligible.
  • the average height h1 of the partition wall 20H is higher than the average thickness t1 of the phosphor layers 12a and 12b in each area, but if it is less than twice the average thickness t1, emission of secondary light The efficiency is not substantially reduced and the lighting does not go dark.
  • the average thickness of the phosphor layer refers to the average thickness of the phosphor material after the phosphor mixture-containing slurry is applied and the volatile components of the slurry are volatilized and lost.
  • the average thickness t1 of the phosphor layer is generally in the range of 400 to 2000 ⁇ m (0.4 to 2.0 mm).
  • the light emitting circuit of the LED module of this embodiment will be described with reference to FIG.
  • the LED module of this embodiment includes three light sources 13a, 13b, and 13c. These three light sources 13a, 13b, and 13c are respectively provided with LED chip groups 21, 22, and 23 that include a plurality of LED chips 24, 25, and 26.
  • the light emitting circuit of the first light source 13a is configured by connecting four LED chips 24 in series in the forward direction to form a series connection circuit, and connecting the four series connection circuits in parallel.
  • the light emitting circuit of the first light source 13a has an LED chip group 21 including a total of 16 LED chips 24.
  • the light emitting circuit of the second light source 13b is configured by connecting three LED chips 25 in series in the forward direction to form a series connection circuit, and connecting the two series connection circuits in parallel.
  • the light emitting circuit of the second light source 13b has an LED chip group 22 including a total of six LED chips 25. Further, a resistor R1 is inserted on the negative electrode side of the light emitting circuit of the second light source 13b. The resistor R1 is connected in series to the two parallel LED chip groups 22.
  • the light emitting circuit of the third light source 13c is configured by connecting two LED chips 26 in series in the forward direction to form a series connection circuit, and connecting the two series connection circuits in parallel.
  • the LED chip group 23 of the third light source has an LED chip group 23 including a total of four LED chips 26. Further, a resistor R2 is inserted on the negative electrode side of the light emitting circuit of the third light source 13c. The resistor R2 is connected in series to the two parallel LED chip groups 23.
  • each of the insertion resistors R1 and R2 is a variable resistance element in order to investigate a change in the light emission characteristics due to a change in the resistance value of the light emitting circuit.
  • the emission characteristics can be adjusted to a desired one. Specifically, the position CP2 of the intersection of the current-voltage characteristic line A of the light emitting circuit of the first light source and the current-voltage characteristic line B of the light emitting circuit of the second light source is adjusted by changing the value of the insertion resistor R1. Further, by changing the value of the insertion resistance R2, the current-voltage characteristic line A of the light emitting circuit of the first light source and the current-voltage characteristic line C of the light emitting circuit of the third light source are changed as shown in FIG. The position of the intersection CP1 can be adjusted. Thereby, the light emission characteristic line E of the white LED illumination device can be approximated to the light emission characteristic line F of the incandescent lamp as shown in FIG.
  • the insertion resistors R1 and R2 are mounted on the circuit board 11C as the LED package by chip-on-board technology, but these insertion resistors R1 and R2 are mounted on other members other than the circuit board 11C. You may make it mount.
  • the light emitting circuits of the first to third light sources 13a, 13b, and 13c are connected together at the positive electrode side to the common electrode 27d.
  • the positive common electrode 27d is connected to the positive terminal 42a of the lighting circuit 42.
  • the negative electrode side is connected to the individual electrode 27a.
  • the light emitting circuit of the second light source 13b is connected to the individual electrode 27b on the negative electrode side.
  • the light emitting circuit of the third light source 13c is connected to the individual electrode 27c on the negative electrode side.
  • These negative electrodes 27a, 27b, and 27c are connected to the negative terminal 42b of the lighting circuit 42, respectively.
  • the bulb-type lighting device 1 When the bulb-type lighting device 1 is attached to a commercial AC power socket serving as the external power source 40, a current flows from the external power source 40 (commercial AC power source) to the lighting circuit 42 in the lighting device, and the lighting circuit 42 is activated. Electric power is supplied to the light emitting circuits of the three light sources 13a, 13b, and 13c, and the LED chip groups 21, 22, and 23 of each light source emit light.
  • White light emitted from each of the three light sources 13a, 13b, and 13c has different emission spectra (that is, different color temperatures). These three types of white light having different color temperatures are guided by the transparent member 14 to the lens-shaped thickness changing portion 16 and collected by the thickness changing portion 16 toward the light scattering member 15. In this way, the light 8 traveling from the light scattering member 15 toward the distal end is collected by the light scattering member 15.
  • the light directed toward the side and the base end is guided toward the bottom surface 15e of the light scattering member by the thickness changing portion 16 of the transparent member 14 while being reflected by the transparent member 14.
  • the light 8 concentrating toward the bottom surface 15e of the light scattering member of the transparent member, it looks from the outside as if light is emitted from the bottom surface 15e of the light scattering member.
  • the lighting method of the illumination device of the present embodiment is close to that of the incandescent bulb.
  • FIG. 16 is a characteristic diagram showing current-voltage characteristics for a single white LED light source and a three-type combined white LED light source, respectively.
  • the characteristic line A is the current-voltage characteristic of the light emitting circuit (no insertion resistor) of the first light source 13a
  • the characteristic line B is the variable resistor R1 inserted in the light emitting circuit of the second light source 13b is set to 50 ⁇
  • the characteristic line C shows the current-voltage characteristic when the variable resistor R2 inserted in the light emitting circuit of the third light source 13c is set to 300 ⁇ .
  • Characteristic line D shows the current-voltage characteristics of the light emitting circuit of the three-type combination light source.
  • the characteristic line D has two inflection points IP1 and IP2.
  • the first inflection point IP1 corresponds to the intersection point CP1 between the characteristic line A and the characteristic line C
  • the second inflection point IP2 corresponds to the intersection point CP2 between the characteristic line A and the characteristic line B.
  • the slope of the current-voltage characteristic line is the largest up to the first inflection point IP1 (about 20 mA). This indicates that a current is actively flowing through the first light source 13a.
  • the slope of the current-voltage characteristic line changes from the slope of the characteristic line C to the slope of the characteristic line B at the first inflection point IP1. This is because when the input current exceeds the first inflection point IP1, the current flowing through the third light source 13c becomes saturated, and the current flows positively with priority given to the second light source 13b. Show.
  • the current exceeds the first inflection point IP1 (about 20 mA), and the slope of the current-voltage characteristic line reaches the first inflection point IP1 until the second inflection point IP2 (about 60 mA).
  • the voltage of the second light source 13b is equal to the voltage of the third light source 13c. This indicates that the current flowing through the third light source 13c becomes saturated, and the current flows positively with priority given to the second light source 13b.
  • resistors R1 and R2 are inserted on the negative electrode side in the light emitting circuits of the light sources 13b and 13c having a low color temperature. These insertion resistors R1 and R2 cause an inflection point in the current-voltage characteristic line of the light emitting circuit of the light source 13a having a high color temperature, and if the input current is lowered to a point lower than the inflection point of the characteristic line, Will actively flow toward the light emitting circuit of the light source with a low color temperature. Thereby, as the total luminous flux decreases, the shade of white light becomes reddish, and white illumination light close to natural light can be obtained.
  • FIG. 17 is a characteristic diagram showing the relationship between total luminous flux and input current in the three-type combination white LED lighting device.
  • FIG. 18 is a characteristic diagram showing the relationship between the color temperature and the total luminous flux by comparing the three kinds of combination white LED lighting devices and incandescent bulbs.
  • characteristic line E indicates the light emission characteristics of the three-type combined white LED lighting device (example)
  • characteristic line F indicates the light emission characteristics of the incandescent bulb (comparative example). From both characteristic lines E and F, it was recognized that the light emission characteristics of the white LED lighting device of this embodiment approximate the light emission characteristics of the incandescent bulb in a wide range from about 2000K to about 2800K.
  • the color temperature changes with respect to the total luminous flux.
  • the higher the total luminous flux the closer to the color temperature 2800K of the light from the first light source 13a, and the lower the total luminous flux, the second light source 13b. It was observed that the color temperature of the light from 2400K and the color temperature of the light from the third light source 13c approached 2000K.
  • the LED module 10A of the second embodiment includes two types of combined white light sources 13a and 13c including phosphor layers 12a and 12c partitioned as shown in FIG. 12A.
  • the two-type combined white light sources 13a and 13c have a light emitting circuit shown in FIG.
  • FIG. 19 shows a light-emitting circuit when resistors having various resistance values are inserted into a single white light source.
  • the light emitting circuit of FIG. 19 is shown as a comparative example to the light emitting circuit of the second embodiment shown in FIG.
  • FIG. 20 shows current-voltage characteristics of the light emitting circuits of the various single white light sources shown in FIG.
  • the current-voltage characteristics in FIG. 20 are shown as a comparative example for the current-voltage characteristics of the light emitting circuit of the second embodiment shown in FIG.
  • the two combination white light sources 13a and 13c shown in FIG. 21 have the following configuration.
  • the light-emitting circuit of the first light source 13a is formed by connecting four LED chips 24 in series in the forward direction to form a series circuit, and connecting the four series circuits in parallel. Have.
  • the LED chip group 21 of the first light source includes a total of 16 LED chips 24.
  • the light-emitting circuit of the second light source 13c includes two LED chips 26 connected in series in the forward direction to form a series circuit, and two LED chips 23 formed by connecting the two series circuits in parallel. Have.
  • the LED chip group 23 of the second light source includes a total of four LED chips 26.
  • a variable resistor R2 is inserted on the negative electrode side of the light emitting circuit of the second light source 13c. The resistor R2 is connected to the LED chip group 23 in series.
  • the position of the intersection of both current-voltage characteristic lines can be adjusted by changing the value of the insertion resistance R2. Therefore, the light emission characteristic line of the white LED lighting device can be brought close to the light emission characteristic line of the incandescent bulb.
  • the insertion resistor R2 is a variable resistance element in order to investigate the change in the light emission characteristics due to the change in the resistance value. Further, in this embodiment, the insertion resistor R2 is mounted on the circuit board 11C (LED package) by chip-on-board technology, but the resistor R2 is mounted on a member other than the circuit board 11C. Also good.
  • FIG. 20 is a characteristic diagram showing current-voltage characteristics of various white LED light sources having a single color temperature.
  • the characteristic line A in the figure shows the current-voltage characteristic of the light emitting circuit of the first light source 13a.
  • the characteristic line B1 shows the current-voltage characteristic of the light emitting circuit with a resistance of 100 ⁇ inserted on the negative side of the second light source 13c
  • the characteristic line B2 shows the current of the light emitting circuit with a resistance of 300 ⁇ on the negative side of the second light source 13c ⁇
  • the voltage characteristic, the characteristic line B3 is the current-voltage characteristic of the light emitting circuit in which the resistor 500 ⁇ is inserted on the negative electrode side of the second light source 13c
  • the characteristic line B0 has no insertion resistance of the second light source 13c (resistance 0 ⁇ ).
  • the current-voltage characteristics of the light emitting circuit are shown respectively.
  • the characteristic line B0 generates a lower voltage than the characteristic line A of the first light source 13a for the same current, and is almost parallel to the characteristic line A.
  • the value of the insertion resistance R2 increases, the generated voltage of the light emitting circuit 23R increases, and the slope gradually increases as shown by the characteristic lines B1, B2, B3. Therefore, as shown in FIG. B2 and B3 and characteristic line A have intersections P, Q and R, respectively.
  • the intersections P, Q, and R of two current-voltage characteristic lines having different slopes cause new inflection points in the current-voltage characteristic lines having the smaller slopes.
  • Fig. 22 shows the current-voltage characteristics of a two-type combination white LED lighting device in which two different color temperatures are combined.
  • the characteristic line A shows the current-voltage characteristic of the light emitting circuit of the first light source 13a
  • the characteristic line B2 shows the current-voltage characteristic of the light emitting circuit in which a resistor 300 ⁇ is inserted on the negative electrode side of the second light source 13c.
  • a characteristic line G indicates current-voltage characteristics of the light emitting circuits of the two kinds of combined light sources 13a and 13c.
  • FIG. 23 shows the relationship between the current (partial current) flowing in each area and the input current (total current) in the two-type combination white LED light source.
  • the characteristic line J in the figure shows the current-voltage characteristic of the light emitting circuit of the first light source 13a
  • the characteristic line K shows the current-voltage characteristic of the light emitting circuit of the second light source 13c.
  • FIG. 25 shows the relationship between the color temperature and the total luminous flux by comparing two types of combined white LED lighting devices and incandescent bulbs.
  • the characteristic line M in the figure indicates the light emission characteristic of the two-type combined white LED lighting device
  • the characteristic line F indicates the light emission characteristic of the incandescent bulb. From both characteristic lines M and F, it was confirmed that the light emission characteristics of the white LED lighting device of the present embodiment approximate the light emission characteristics of the incandescent bulb in a wide range from about 2000K to about 2800K. Further, from the characteristic line M, the color temperature changes with respect to the total luminous flux. The higher the total luminous flux, the closer to the color temperature 2800K of the light from the first light source 13a, and the lower the total luminous flux, the second light source 13b. It was observed that the color temperature of the light from was approaching 2000K.
  • Example 1 As Example 1, the LED module 10 having the three types of white LED light sources shown in FIG. 10 was produced, and this was incorporated into a globe to produce the LED bulb shown in FIG.
  • Titania fine particles as a white pigment were mixed and stirred in a silicone resin solution at a predetermined ratio, and the obtained slurry was applied linearly to a predetermined area of the LED circuit board by a coating device to form a partition.
  • the partition walls formed had an average height of 0.5 mm and an average width of 1.2 mm.
  • a phosphor mixture slurry having a color temperature of 2840K was applied to the first light emitting area of the substrate to form a phosphor layer for the first light source.
  • the phosphor mixture slurry is obtained by mixing four types of blue phosphor, green phosphor, yellow phosphor, and red phosphor having the following composition with a transparent resin at a predetermined ratio.
  • the formed first phosphor layer had an average thickness of 0.5 mm.
  • the phosphor mixture slurry is obtained by mixing four types of blue phosphor, green phosphor, yellow phosphor, and red phosphor having the following composition with a transparent resin at a predetermined ratio.
  • the formed second phosphor layer had an average thickness of 0.5 mm.
  • the phosphor mixture slurry is obtained by mixing four types of blue phosphor, green phosphor, yellow phosphor, and red phosphor having the following composition with a transparent resin at a predetermined ratio.
  • the formed third phosphor layer had an average thickness of 0.5 mm.
  • Twenty-six blue LED chips were incorporated into the light emitting circuit of FIG. A COB drive voltage of 3.1 V was applied when a current of 300 mA was applied thereto, and primary light was emitted from each blue LED chip at an emission wavelength of 400 to 410 nm.
  • a transparent acrylic resin was injection molded by an injection molding machine to form a cylindrical axisymmetric transparent member having a tapered thickness change portion and a hollow portion.
  • the axially symmetric transparent member had an overall length L 0 of 25.4 mm, a thickness changing portion (hollow portion) length L 1 of 10.2 mm, a distance L 2 of 14.8 mm, and a maximum diameter d 0 of 10.2 mm.
  • a titania pigment as light scattering particles is mixed and stirred in a transparent nitrocellulose solution at a predetermined ratio, and the obtained slurry is thinly applied to the peripheral wall surface of the hollow portion of the axially symmetric transparent member by an application device. Formed.
  • the average thickness of the coating layer constituting the axially symmetric light scattering member was set in the range of 50 to 100 ⁇ m.
  • Example 2 As Example 2, an LED module 10A having two types of white LED light sources shown in FIG. 12A was produced, and this was incorporated into a globe to produce the LED bulb shown in FIG.
  • the formed partition walls had an average height of 0.5 mm and an average width of 1.2 mm.
  • a phosphor mixture slurry having the same composition as in Example 1 and having a color temperature of 2840K was applied to the first light emitting area of the substrate to form a phosphor layer for the first light source.
  • the formed first phosphor layer had an average thickness of 0.4 mm.
  • a phosphor mixture slurry having the same composition as in Example 1 and having a color temperature of 2032K was applied to the second light emitting area of the substrate to form a phosphor layer for the second light source.
  • the formed second phosphor layer had an average thickness of 0.4 mm.
  • LED chip Twenty blue LED chips were incorporated into the light emitting circuit of FIG. A COB drive voltage of 3.1 V was applied when a current of 300 mA was applied thereto, and primary light was emitted from each blue LED chip at an emission wavelength of 400 to 410 nm.
  • Comparative Example 1 As Comparative Example 1, a white LED lighting device having a plurality of LED light sources having the same configuration as that of Example 1 was prepared except that there was no axially symmetric transparent member and no axially symmetric light scattering member.
  • Comparative Example 2 As Comparative Example 2, a white LED lighting device having a plurality of LED light sources having the same configuration as that of Example 2 was prepared except that there was no axially symmetric transparent member and no axially symmetric light scattering member.
  • Example 1 since the light scattering member emits light by mixing three types of light having different color temperatures in the lens-shaped thickness change portion of the transparent member, the entire light bulb appeared to be evenly bright and uniform.
  • Comparative Example 1 since the difference in color temperature of the phosphor layer that emitted light looks as it is, the top of the bulb is bright, the other parts are dark, and the color unevenness appears to be large.
  • Example 2 since the light scattering member emits light by mixing two kinds of light having different color temperatures in the lens-shaped thickness change portion of the transparent member, the entire light bulb looks evenly bright and has no color unevenness. It was.
  • Comparative Example 2 since the difference in color temperature of the phosphor layer that emitted light looks as it is, the top of the bulb is bright, the other parts are dark, and the color unevenness appears large.

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  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

　La présente invention concerne un module de DEL pourvu : d'une pluralité de sources de lumière à DEL, toutes comportant une surface d'émission de lumière comprise dans le même plan, et toutes émettant de la surface d'émission de lumière de la lumière ayant un spectre d'émission de lumière différent dans la région de la lumière visible ; d'éléments transparents axialement symétriques formés avec une symétrie axiale autour d'un axe de symétrie de distribution de lumière qui est sensiblement orthogonal au plan, les éléments transparents recouvrant les surfaces d'émission de lumière de la pluralité de sources de lumière à DEL et guidant la lumière émise par la pluralité de sources de lumière à DEL ; et d'éléments de diffusion de lumière axialement symétriques destinés à diffuser la lumière guidée par les éléments transparents axialement symétriques, lesdits éléments de diffusion de lumière axialement symétriques étant formés avec une symétrie axiale autour de l'axe de symétrie de distribution de lumière, positionnés à distance de la pluralité de sources de lumière à DEL, et disposés sur la partie intérieure des éléments transparents axialement symétriques. Les images de projection des éléments de diffusion de lumière axialement symétriques qui sont projetées parallèlement au plan chevauchent au moins certaines des surfaces d'émission de lumière de la pluralité de sources de lumière à DEL.
PCT/JP2015/074266 2014-09-30 2015-08-27 Module de del et appareil d'éclairage Ceased WO2016052025A1 (fr)

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WO2018168473A1 (fr) * 2017-03-15 2018-09-20 ミツミ電機株式会社 Procédé de fabrication de module optique, et module optique
CN108591851A (zh) * 2018-04-20 2018-09-28 江苏鸿利国泽光电科技有限公司 一种防炫目紫外led照明装置
KR20190026569A (ko) 2017-09-05 2019-03-13 제이에스알 가부시끼가이샤 표시 소자 형성용 감광성 조성물, 경화막 및 표시 소자
JP2019179681A (ja) * 2018-03-30 2019-10-17 株式会社Ｌｉｘｉｌ 照明装置
WO2020182793A1 (fr) * 2019-03-14 2020-09-17 Signify Holding B.V. Dispositif électroluminescent

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KR102290765B1 (ko) * 2019-11-06 2021-08-20 (주)올릭스 적층형 구조의 led 기판

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JP2019179681A (ja) * 2018-03-30 2019-10-17 株式会社Ｌｉｘｉｌ 照明装置
JP7020982B2 (ja) 2018-03-30 2022-02-16 株式会社Lixil 照明装置
CN108591851A (zh) * 2018-04-20 2018-09-28 江苏鸿利国泽光电科技有限公司 一种防炫目紫外led照明装置
WO2020182793A1 (fr) * 2019-03-14 2020-09-17 Signify Holding B.V. Dispositif électroluminescent
US11585502B2 (en) 2019-03-14 2023-02-21 Signify Holding B.V. Light emitting device

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