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WO2015126155A1 - Dispositif d'alimentation en billes de soudure utilisant un rideau d'air - Google Patents

Dispositif d'alimentation en billes de soudure utilisant un rideau d'air Download PDF

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Publication number
WO2015126155A1
WO2015126155A1 PCT/KR2015/001624 KR2015001624W WO2015126155A1 WO 2015126155 A1 WO2015126155 A1 WO 2015126155A1 KR 2015001624 W KR2015001624 W KR 2015001624W WO 2015126155 A1 WO2015126155 A1 WO 2015126155A1
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WO
WIPO (PCT)
Prior art keywords
housing
ball
solder ball
mask
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2015/001624
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English (en)
Korean (ko)
Inventor
이규호
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SSP Inc
Original Assignee
SSP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SSP Inc filed Critical SSP Inc
Publication of WO2015126155A1 publication Critical patent/WO2015126155A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods

Definitions

  • the present invention relates to a solder ball supply device used in ball bumping equipment for attaching solder balls to wafers or similar materials. Specifically, the present invention relates to a solder ball supply device using an air curtain to prevent solder balls from escaping to the outside of the housing, The present invention relates to a solder ball supply device capable of more effectively injecting solder balls into a mask hole by gently pressing a solder ball on an upper surface of a ball mask using a pressing member.
  • a predetermined thin film is deposited on a wafer, and the deposited thin film must be formed through a photolithography and etching process to form a circuit pattern.
  • the wafer is divided into individual dies, and then a packaging process is performed for each die.
  • a wafer bumping method of attaching a plurality of solder balls to the front surface of a wafer at a time by using a mask before cutting the wafer has been widely used.
  • the conventional wafer bumping method of the related art proceeds in the following order.
  • the flux mask 20 is positioned above the wafer W while the wafer W is placed on the chuck 10. Subsequently, when the flux F is squeezed from the upper portion of the flux mask 20 to the blade 22, the flux F passing through the mask hole of the flux mask 20 is dotting to a predetermined position of the wafer W. do.
  • the ball mask 30 is positioned on the wafer W, and then the solder ball B is poured on the ball mask 30. Subsequently, the solder balls B are sufficiently dispersed in the upper portion of the ball mask 30 using the brush 32 so that the solder balls B pass through the mask hole.
  • Japanese Laid-Open Patent Publication No. 2010-177230 introduces a so-called cyclone-type solder ball supply device in which a circular air blowing device is installed around a hopper.
  • This method has the advantage that a smaller number of balls can be used than the conventional ones because the solder balls are not dispersed around the substrate.
  • the solder balls entering the mask hole due to the strong wind pressure of the air ejecting device are pulled out again. There is a risk of coming out.
  • the impact and the amount of impact of the solder ball is increased by the strong wind pressure may damage the solder ball may cause product defects.
  • Korean Patent No. 10-1116937 introduces a solder ball printing apparatus in which a wire rod having a line spacing smaller than the diameter of the solder ball is installed under the solder ball supply unit.
  • the vibration must be generated after supplying the solder ball on the upper part of the wire rod, and therefore, a vibrator must be installed.
  • the agitator not only accelerates the deterioration of the solder ball printing apparatus when used for a long time, but also increases the cost of the product.
  • the vibration is applied while the lower end of the wire is in contact with the mask surface, the service life of the wire is shortened due to contact friction.
  • the line spacing must be constant. Therefore, the solder ball is not uniformly distributed on the mask, there is a problem that the solder ball is not stably injected into the mask hole.
  • Patent Document 1 Japanese Patent Laid-Open No. 2010-177230 (published date: 2010.8.12)
  • Patent Document 2 Korean Registered Patent No. 10-1116937 (Notice Date: 2012.3.12)
  • An object of the present invention is to provide a solder ball supply device which can more stably input the solder ball in the mask hole in the ball bumping process.
  • an object of the present invention is to provide a solder ball supply apparatus that can reduce the cost and increase the productivity by reducing the amount and loss of solder balls and the time that the solder ball is put into the mask hole.
  • a solder ball supply apparatus for performing a ball bumping process while supplying a solder ball to the upper portion of the ball mask, the lower housing is open; A rotating shaft coupled to the center of the housing; A pressing member fixed to the inside of the housing to evenly distribute the solder balls on the ball mask and to lightly press the solder balls located on the ball mask into the ball holes of the ball mask; An air curtain portion for injecting gas into the housing to prevent the solder ball from escaping out of the housing; It provides a solder ball supply device including a rotation drive means for rotating the housing and the pressing member by rotating the rotary shaft.
  • Solder ball supply apparatus may include at least one of the horizontal driving means for moving the housing in the horizontal direction and the vertical driving means for moving in the vertical direction.
  • the pressing member may be characterized in that the shape seen from the bottom surface is straight or cross-shaped, the shape of the side cross-section is circular, arc or straight.
  • the air curtain portion, the flow path formed in the ceiling and the side wall of the housing Gas supply means for supplying gas to the flow path; It may be characterized in that it comprises a spray nozzle formed on the side wall of the housing to inject gas toward the interior of the housing, symmetrical with respect to the center of rotation of the housing and in communication with the flow path.
  • the through-hole is formed in the center
  • the bottom surface includes a ring-shaped guide means formed with a plurality of guide flow paths for the gas injected from the outlet of the injection nozzle portion
  • the guide flow passage may be formed in a direction crossing the direction toward the center of rotation of the housing.
  • a solder ball supply apparatus for performing a ball bumping process while supplying a solder ball to an upper portion of a ball mask, the lower opening of a housing;
  • a rotating shaft coupled to the center of the housing;
  • a pressing member fixed to the inside of the housing to evenly distribute the solder balls on the ball mask and to lightly press the solder balls located on the ball mask into the ball holes of the ball mask;
  • a first injection nozzle part which forms an air flow by injecting gas into the inside of the housing so that the solder ball does not escape out of the housing;
  • An air curtain portion for forming an air curtain on the outside of the first injection nozzle portion, the air curtain portion including a second injection nozzle portion having an outlet formed at a lower end of the side wall of the housing at a position surrounding the outside of the first injection nozzle portion; It provides a solder ball supply device including a rotation drive means for rotating the housing and the pressing member by rotating the rotary shaft.
  • the through portion is formed in the center
  • the bottom surface includes a ring-shaped guide means formed with a plurality of guide flow paths for the gas injected from the outlet of the first injection nozzle portion,
  • the guide flow path may be formed in a direction crossing the direction toward the center of rotation of the housing.
  • the inner wall of the guide means is a first inclined surface is smaller diameter as the upper side, and the second is located on the upper side of the first inclined surface and the larger diameter It may be characterized by including an inclined surface.
  • the first injection nozzle portion may be formed to inject gas in a direction intersecting with the direction toward the center of rotation of the housing.
  • the inner wall of the housing is a gas flow guide protruding inward
  • the gas flow guide may include an inclined surface lowered toward the outside inward.
  • At least one of the side wall and the ceiling of the housing may be characterized in that the gas outlet for discharging the gas supplied to the outside to the outside.
  • the solder ball injected into the upper portion of the mask is not only distributed evenly by the pressing member, but also pushed into the pressing member or slightly pressed into the mask hole.
  • solder ball is continuously maintained in the ball holding area at the center of the housing by the gas injected from the outside of the housing, it is possible to proceed with a more efficient ball bumping process using a smaller amount of solder balls than in the prior art.
  • Figure 2 is a perspective view of a ball bumping equipment equipped with a solder ball supply apparatus according to a first embodiment of the present invention
  • 3 and 4 are a perspective view and a bottom perspective view of a solder ball supply device according to a first embodiment of the present invention, respectively
  • FIG. 5 is a cross-sectional view of a solder ball supply device according to a first embodiment of the present invention.
  • FIG. 6 is a view showing several types of injection nozzles
  • FIG 7 and 8 are process cross-sectional views sequentially showing the operation of the solder ball supply apparatus according to the first embodiment of the present invention, respectively.
  • FIG 9 is a view illustrating a movement path of the housing in the upper part of the ball mask.
  • FIG. 10 is a perspective view of a solder ball supply device according to a second embodiment of the present invention.
  • FIG. 11 is a cross-sectional view of a solder ball supply apparatus according to a second embodiment of the present invention.
  • FIG. 12 is a bottom view of a solder ball supply device according to a second embodiment of the present invention.
  • FIG. 13 is a process cross-sectional view showing the operation of the solder ball supply apparatus according to a second embodiment of the present invention.
  • 14 to 16 is a bottom perspective view, a cross-sectional view and a process cross-sectional view showing a modification of the solder ball supply apparatus according to an embodiment of the present invention, respectively
  • the present invention relates to a solder ball supply apparatus, and the scope of the present invention is not limited to wafer bumping.
  • wafer bumping all materials including solder wafer bumping will be referred to as 'substrates'.
  • the solder ball supply device 100 constitutes a part of the ball bumping equipment 200 as illustrated in FIG. 2, and is lifted by a vertical driving means provided in the ball bumping equipment 200. And descending and supplying solder balls to the upper portion of the ball mask 30 while moving in the horizontal direction by the horizontal driving means.
  • solder ball supply apparatus 100 according to a first embodiment of the present invention will be described with reference to the drawings.
  • Solder ball supply apparatus 100 according to the first embodiment of the present invention, as shown in a perspective view of Figure 3, a bottom perspective view of Figure 4 and a cross-sectional view of Figure 5, the fixing bracket 102, the lower end of the fixing bracket 102 A support frame 120 fixed to the housing, a housing 110 rotatably coupled to the lower portion of the support frame 120, and installed in the inner center of the housing 110 to press the evenly distributed solder balls to the upper part of the ball mask.
  • the member 150 is included.
  • the fixing bracket 102 serves to mount the solder ball supplying device 100 to the vertical driving means or the horizontal driving means of the ball bumping equipment (200 of FIG. 2), and the support frame 120 can rotate the housing 110. To support them.
  • the upper portion of the support frame 120 is provided with a rotation driving means 104 such as a motor for rotating the housing 110.
  • the rotating shaft 130 is rotatably coupled to the center of the support frame 120, the rotating shaft 130 may be directly connected to the rotary driving means 104, using a power transmission means such as a belt, gear, wire, chain It may also be indirectly connected.
  • a power transmission means such as a belt, gear, wire, chain It may also be indirectly connected.
  • a gas supply passage 132 is formed inside the rotation shaft 130, and the gas supply passage 132 communicates with a flow path 111 formed on the ceiling of the housing 110 to be described later.
  • a gas supply port (not shown) may be mounted at an upper end of the gas supply passage 132, and the gas supply port may be installed inside the through part 122 formed at the center of the support frame 120. .
  • the housing 110 has an inverted cylindrical shape with an open bottom, and is coupled to a lower end of the rotation shaft 130 protruding from the lower portion of the support frame 120 at the center of the ceiling.
  • the housing 110 is provided with a means for preventing the solder ball from escaping the outside of the housing by forming an air curtain by injecting gas into the interior of the housing.
  • the flow path 111 communicating with the gas supply passage 132 of the rotation shaft 130 is formed in the ceiling and the sidewall of the housing 110.
  • the flow path 111 formed on the ceiling of the housing 110 is shown in the horizontal direction, and the flow path 111 formed in the sidewall is shown in the vertical direction, but is not necessarily limited thereto.
  • the flow paths 111 formed on the ceiling and the sidewalls of the housing 110 may include various paths for uniform gas injection. If necessary, the flow paths of a specific position may be formed without forming the flow paths 111 to a constant diameter. 111 may be formed to be different from the diameter of other portions.
  • an injection nozzle part 116 is formed at the lower end of the inner wall of the housing 110 to inject the gas supplied through the flow path 111 into the housing 110.
  • the outlet of the injection nozzle unit 116 may be formed at the bottom of the inner wall of the housing 110, or may be formed at the corner between the inner wall and the bottom surface.
  • a plurality of gas outlets 117 are formed symmetrically on the ceiling of the housing 110 to discharge the gas supplied into the outside.
  • a plurality of gas outlets 114 are symmetrically formed on the sidewall of the housing 110, but the gas outlet 114 of the sidewall may be omitted.
  • the gas outlet 117 When the gas outlet 117 is formed in this way, the gas injected into the interior of the housing 110 through the injection nozzle unit 116 rises while rotating in the internal space 113 of the housing, and a part of the gas outlet 114 of the side wall.
  • the outside may be discharged to the outside through the gas outlet 117 of the ceiling and the rest may be discharged to the outside.
  • a plurality of through holes 124 may be formed in the support frame 120 at a position corresponding to the gas outlet 117 of the ceiling of the housing 110 for smoother gas discharge.
  • a ball supply pipe (not shown) may be installed at one of the gas outlets 117 of the gas outlets 117 formed on the ceiling of the housing 110.
  • the present invention is not limited thereto, and the ball supply pipe may be installed at another position.
  • the upper end of the pressing member 150 is fixed to the center of the ceiling of the housing 110 through the fixing member 118, and thus rotates together when the housing 110 rotates.
  • the pressing member 150 is fixed to the housing 110 such that the lower end contacts the upper portion of the ball mask or is spaced apart by a small distance when the housing 110 is lowered for the ball bumping process.
  • the pressing member 150 serves to push and disperse the solder ball supplied to the upper portion of the ball mask while gently pushing the upper end of the solder ball into the mask hole of the ball mask.
  • the pressing member 150 when the pressing member 150 is rotated by placing the circular tubular pressing member 150 having both ends open in the horizontal direction in the housing 110, the solder ball is pushed against the outer wall of the circular tube. To move.
  • the shape of the pressing member 150 is not necessarily limited thereto, which will be described later.
  • the pressing member 150 may be made of various materials such as metal, plastic, vinyl, paper.
  • the pressing member 150 may be made of various materials such as metal, plastic, vinyl, paper.
  • a SUS plate having a thickness of 0.03 to 0.05 mm is processed into a predetermined shape and used as a pressing member, since the thickness is thin, almost no damage occurs even when contacting the solder ball (B).
  • the pressing member 150 serves to evenly distribute the solder ball to the upper part of the ball mask 30, press or push near the upper end of the solder ball flowing in the upper portion of the ball mask 30 solder ball mask hole of the ball mask (30) To be effective in
  • the injection nozzle unit 116 is preferably formed symmetrically with respect to the center of rotation of the housing 110.
  • the injection nozzle unit 116 may be formed of a plurality of holes as illustrated in FIG. 6A, or may be formed in a slit form as shown in FIG. 6B.
  • the diameter is preferably 0.3 mm or less and is formed at intervals of about 10 degrees.
  • the width of the outlet is preferably 0.05 mm or less, but is not necessarily limited thereto.
  • the injection nozzle unit 116 may be symmetrically disposed with respect to the center of the housing 110.
  • the injection nozzle unit 116 is preferably formed to be slightly inclined downward rather than in a horizontal direction, and particularly preferably formed to have an angle of 5 to 45 degrees with respect to the surface of the ball mask 30.
  • the present invention is not necessarily limited thereto, and may be formed in a horizontal direction as necessary.
  • the injection nozzle unit 116 may be formed such that the injection direction is toward the center of the housing 110, or may be formed to be inclined in the circumferential direction with respect to the center of the housing 110.
  • Gas such as nitrogen and air, supplied through the gas supply passage 132 of the rotary shaft 130, passes through the housing 110 through the injection nozzle part 116 formed at the lower side of the side wall through the ceiling and the flow path 111 of the side wall. It is sprayed into the interior of the 110, and as the housing 110 rotates, as the vortex flow occurs inside the housing 110, the solder balls therein are collected into the ball holding area.
  • a plurality of gas outlets 117 and 114 are formed on the ceiling and the sidewall of the housing 110, respectively, so that the gas inside the housing is naturally exhausted.
  • a mechanical configuration can be added to elevate the gas supplied therein.
  • a gas flow guide 119 having an inclined surface that is lowered toward the center may be formed near the lower end of the inner wall of the housing 110.
  • the gas flow guide 119 serves to push up the air inside when the housing 110 rotates, so that the air inside the air flows more smoothly through the gas outlets 117 and 114 of the ceiling and sidewalls. It becomes possible.
  • the inclined surface of the gas flow guide 119 may be flat or curved.
  • the flux is doped into the bumping area of the substrate W, and then the ball mask 30 is positioned on the substrate W for the ball bumping process.
  • the ball mask 30 is fixed to the mask support, and the substrate W is positioned below the ball mask 30.
  • the ball mask 30 includes a hole pattern in which a plurality of mask holes 35 are formed in the center, and the hole pattern corresponds to the bumping area of the substrate W. As shown in FIG. 7, the ball mask 30 includes a hole pattern in which a plurality of mask holes 35 are formed in the center, and the hole pattern corresponds to the bumping area of the substrate W. As shown in FIG. 7, the hole pattern corresponds to the bumping area of the substrate W.
  • the horizontal drive means and the vertical drive means are selectively driven to move the solder ball supply device 100 to the process start position on the upper side of the ball mask 30.
  • the distance between the lower sidewall of the housing 110 and the ball mask 30 should be smaller than the diameter of the solder ball (B).
  • the spacing between the lowest point of the pressing member 150 installed in the housing 110 and the ball mask 30 is not particularly limited, but the pressing member 150 slightly presses the upper portion of the solder ball B to close the ball mask 30. Maintain a gap that can be pushed into the mask hole 35 of) or by pressing the solder balls (B) stacked on the upper portion of the ball mask (30) from the top to the lower solder ball (B) is pushed into the mask hole (35) Leave enough space to enter.
  • solder ball B is supplied into the housing 110 through a ball supply pipe (not shown).
  • gas eg, nitrogen
  • the supplied gas opens the flow path 111 formed on the ceiling and the sidewall of the housing 110.
  • injection nozzle unit 116 of the lower end is injected into the housing 110.
  • the pressing member 150 fixed to the housing 110 is also rotated together, and the solder balls B placed on the ball mask 30 are pressed into the empty mask holes 35, and the solder balls B stuck together.
  • the ball mask 30 is evenly distributed over the top.
  • the dispersed solder ball B is continuously pushed toward the inner center of the housing 110 by being pushed by the injected gas, and is then introduced into the mask hole 35 by the pressing member 150 or dispersed again.
  • the solder ball B injected into the mask hole 35 is attached to the flux F doped on the substrate W.
  • the gas injected into the interior of the housing 110 is rotated and rotates through the internal space 113 of the housing 110 and then rises through the gas outlets 114 and 117 formed on the side wall and the ceiling of the housing 110. It is discharged to the outside.
  • the solder ball supply device 100 may perform a ball bumping process while rotating in a stopped state on the upper portion of the ball mask 30.
  • the ball bumping process should be performed while moving the solder ball supply apparatus 100 on the upper portion of the substrate (W).
  • the solder ball supply device 100 it is preferable to perform the ball bumping process while moving the solder ball supply device 100 so that the housing 110 covers all of the hole patterns of the ball mask 30. More preferably, the solder ball supply device 100 is moved so that the ball holding area formed inside the housing 110 covers all of the hole patterns of the ball mask 30, thereby moving the solder ball to the hole pattern of the ball mask 30. This should be supplied without exception.
  • the solder ball supply device 100 After moving as described above, the solder ball supply device 100 completely removes the hole pattern of the ball mask 30, and then the residual solder ball B should be removed.
  • the remaining solder ball may be removed by a separate suction means, and the suction means may be lifted on the outer wall of the housing 110 of the solder ball supply device 100 to remove the residual solder ball more conveniently. It can also be installed.
  • the suction means In the case of installing in the housing 110, after the solder ball supply device 100 which has been processed is slightly raised, the suction means is lowered to the surface of the ball mask 30, and the solder ball supply device 100 is moved in the horizontal direction. Vacuum suction.
  • FIGS. 10 to 12 are respectively a perspective view, a cross-sectional view and a bottom view of a solder ball supply device 100a according to a second embodiment of the present invention
  • Figure 13 is a cross-sectional view showing a solder ball bumping process using the same.
  • the solder ball supply device 100a also has the fixing bracket 102, the support frame 120 fixed to the lower end of the fixing bracket 102, and the support frame 120, like the first embodiment.
  • the housing 110 is rotatably coupled to the bottom of the) and the pressing member 150 is installed in the inner center of the housing 110 to evenly distribute the solder ball to the upper portion of the ball mask.
  • a second injection nozzle formed at an outer side of the first injection nozzle unit 116a and the first injection nozzle unit 116a at the lower end of the side wall of the housing 110 to inject gas toward the inside of the housing 110.
  • the guide means 160 for guiding the movement of the gas injected from the first and second injection nozzle unit 116a is formed in the housing 110 is different from the first embodiment.
  • the first injection nozzle unit 116a may be formed at the lower end of the inner wall of the housing 110 like the injection nozzle unit 116 of the first embodiment, or may be formed at the edge between the inner wall and the bottom surface. It may be.
  • the second injection nozzle part 116b is formed on the bottom surface of the side wall of the housing 110 at the outside of the first injection nozzle part 116a, so that the second injection nozzle part 116b is formed of the first injection nozzle part 116a. It surrounds the outside.
  • the outlets of the first and second injection nozzle parts 116a and 116b may be formed in the form of a plurality of holes arranged in a ring shape, like the injection nozzle part 116 of the first embodiment, respectively, or in the form of a slit. It may be formed.
  • first and second injection nozzle parts 116a and 116b are preferably formed symmetrically with respect to the center of rotation of the housing 110, respectively.
  • first and second injection nozzles 116a and 116b are preferably formed to be slightly inclined downward, but are not necessarily limited thereto.
  • the gas injected from the first injection nozzle unit 116a passes through the guide channel 162 formed on the bottom surface of the guide means 160, and the traveling direction is changed to generate a vortex flow inside the housing 110. It serves to keep the solder ball inside the ball holding area.
  • the gas injected from the second injection nozzle part 116b proceeds to the center of the housing 110 through the lower part of the side wall of the housing 110 and the lower part of the guide means 160, and the solder ball flows out of the housing 110. It acts as an air curtain to prevent it from being prevented.
  • the second injection nozzle unit 116b may generate a significant vortex by injecting the gas obliquely toward the upper surface of the mask, the injected gas passes through the sidewall of the housing 110 and the lower portion of the guide means 160. Because the eddy current can be extinguished or minimized, it is possible to maintain a stable vortex flow inside the housing 110.
  • the first injection nozzle part 116a and the second injection nozzle part 116a and 116b which are formed in the same manner as the second embodiment of the present invention, have the injection nozzle part 116 as a single line. Compared to the case formed, it is possible to reduce the vortex inside the housing 110 and thereby to maintain the solder ball more stably in the ball holding area.
  • the first injection nozzle part 116a and the second injection nozzle part 116b are formed at the lower ends of the first flow path 111a and the second flow path 111b formed independently of each other. This is to independently control the gas injection pressure of the first injection nozzle unit 116a and the second injection nozzle unit 116b.
  • the present invention is not limited thereto, and one flow path may be branched to connect to the first injection nozzle unit 116a and the second injection nozzle unit 116b.
  • the gas injection pressure of the first injection nozzle unit 116a and the second injection nozzle unit 116b may be the same or may be different from each other.
  • two gas supply passages 132 may be formed in the rotation shaft 130 to communicate with the first flow passage 111a and the second flow passage 111b, respectively, and one gas supply passage 132 may include the first flow passage (132). It is also possible to communicate with both the 111a) and the second flow path 111b.
  • the guide means 160 formed in the solder ball supply device 100a according to the second embodiment of the present invention guides the movement of the gas injected from the first and second injection nozzle parts 116a and 116b. Play a role.
  • the guide means 160 may be manufactured separately and mounted on the inner wall of the housing 110, or the sidewall of the housing 110 may be manufactured in the shape of the guide means 160.
  • a ring-shaped guide means 160 having a penetrating portion formed in the center thereof was manufactured and fixed to the inner wall of the housing 110.
  • the outer wall of the guide means 160 may be detachably coupled to the inner wall of the housing 110, or may be integrally coupled.
  • the pressing member 150 is installed to be located inside the through portion of the guide means 160.
  • a plurality of guide passages 162 having a groove shape are formed at the bottom of the guide means 160, and each guide passage 162 extends from the outer wall to the inner wall of the guide means 160.
  • Each guide flow path 162 is preferably formed in a horizontal direction, but is not limited thereto.
  • the plurality of guide flow passages 162 correspond one-to-one with the plurality of first injection nozzle portions 116a formed in the housing 110, and specifically, one end of each guide flow passage 162 may be the first injection nozzle portion 116a. Is located in front of the exit.
  • the plurality of guide passages 162 are not formed to face the center of the housing 110, but are formed in a direction intersecting at a predetermined angle with a direction toward the center of rotation of the housing 110 as shown in the bottom view of FIG. 12. It is desirable to be.
  • the gas injected from the first injection nozzle unit 116a enters the interior of each of the guide flow paths 162, and then the traveling direction is changed to be injected into the interior of the housing 110.
  • the circumferential vortex flow is generated inside the.
  • the guide passage 162 preferably has an inlet adjacent to the first injection nozzle part 116a relatively wider than the outlet. This is because even if the speed of the gas is lowered in the process of entering the guide flow path 162 can be increased to some extent the speed injected into the housing 110.
  • the inner wall of the guide means 160 includes a first inclined surface 164 that decreases in diameter toward the top and a second inclined surface 166 that is positioned in an upper portion of the first inclined surface 164 and increases in diameter upward. Therefore, when viewed from above, the boundary between the first inclined surface 164 and the second inclined surface 166 surrounds the through part.
  • the diameter of the penetrating portion is preferably larger than the length of the pressing member 150 located below, but is not necessarily limited thereto.
  • the first inclined surface 164 serves to suppress the gas injected into the guide means 160 does not immediately rise, thereby vortex flow forming a ball holding area in the center of the housing 110 more stably Can be maintained.
  • the second inclined surface 164 serves to smoothly discharge the gas by raising the gas rising through the through portion more quickly.
  • the guide passage 162 is formed at the lower end of the side wall of the housing 110, and the first inclined surface 164 and the second inclined surface on the inner wall. 166 may be formed to implement the guide means 160.
  • the pressing member 150 used in the solder ball supply apparatuses 100 and 100a according to the embodiment of the present invention is shown in a circular tube shape, it is not necessarily limited thereto.
  • the plate body having a straight cross-sectional shape may be used as the pressing member 150.
  • the lower end of the plate-shaped pressing member is formed to be slightly bent to one side, the solder ball (B) in contact with the lower side can be pushed into the mask hole more effectively.
  • FIGS. 14 to 16 two or more plate-shaped pressing members 150 may be crossed to form a cross or pinwheel shape when viewed from the bottom.
  • the pressing member 150 having an arc-shaped side cross section may be provided in a straight or cross shape with respect to the bottom surface.
  • a brush pressing member 150 having a plurality of brushes 152 may be used.
  • the guide means in which the guide flow path 162 is formed so that the gas injected from the first injection nozzle unit 161a can move in a direction crossing with the direction toward the center of rotation of the housing 1110.
  • the guide means 160 may be omitted, and the injection direction of the first injection nozzle unit 161a may be formed in a direction crossing the direction toward the rotation center.
  • the second injection nozzle part 161b may be omitted. have.
  • solder ball supply device 102 fixed bracket
  • Second flow passage 113 internal space
  • first injection nozzle part 116b second injection nozzle part
  • Gas flow guide 120 Support frame

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

La présente invention concerne un dispositif d'alimentation en billes de soudure pour réaliser un procédé d'amortissement de billes en fournissant des billes de soudure au côté supérieur d'un masque à billes afin de réaliser un amortissement de billes. Le dispositif d'alimentation en billes de soudure selon la présente invention, comprend : un boîtier dont la partie inférieure est ouverte ; un arbre rotatif accouplé au centre du boîtier ; un élément presse qui est fixé à l'intérieur du boîtier afin de disperser uniformément les billes de soudure sur le côté supérieur du masque à billes et de presser légèrement les billes de soudure positionnées sur le côté supérieur du masque à billes de sorte que les billes de soudure soient insérées dans des trous de masque du masque à billes ; une partie à rideau d'air pour pulvériser un gaz dans le boîtier afin d'empêcher les billes de soudure de sortir du boîtier ; et un moyen d'entraînement de rotation pour faire tourner le boîtier et l'élément presse en faisant tourner l'arbre rotatif. Selon la présente invention, les billes de soudure placées sur le côté supérieur du masque sont distribuées uniformément, et sont poussées ou légèrement pressées par l'élément presse afin d'être plus insérées de façon plus stable dans les trous de masque. En outre, les billes de soudure sont maintenues en continue dans une région de retenue de billes au centre de l'intérieur du boîtier par le gaz pulvérisé à partir des bords extérieurs de celui-ci, et ainsi le procédé d'amortissement de billes peut être réalisé plus efficacement en utilisant une quantité réduite des billes de soudure par rapport à des procédés d'amortissement de billes classiques.
PCT/KR2015/001624 2014-02-18 2015-02-17 Dispositif d'alimentation en billes de soudure utilisant un rideau d'air Ceased WO2015126155A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020140018709A KR101550688B1 (ko) 2014-02-18 2014-02-18 에어커텐을 이용한 솔더볼 공급장치
KR10-2014-0018709 2014-02-18

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WO2015126155A1 true WO2015126155A1 (fr) 2015-08-27

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112259478A (zh) * 2020-10-23 2021-01-22 技感半导体设备(南通)有限公司 一种刮球铺球装置及方法
US20240009747A1 (en) * 2022-07-05 2024-01-11 Protec Co., Ltd. Head assembly for mounting conductive ball

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101647660B1 (ko) * 2015-02-12 2016-08-11 (주) 에스에스피 에어커텐을 이용한 솔더볼 공급장치
KR101868907B1 (ko) 2017-03-15 2018-07-20 (주)에스에스피 경사 및 높이 조절이 가능한 웨이퍼 스테이지 장치

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US6011629A (en) * 1998-03-02 2000-01-04 Matsushita Electric Industrial Co., Ltd. Method of positional alignment of substrate and screen mask in electrical paste screen printing
US20090307899A1 (en) * 2004-06-30 2009-12-17 Athlete Fa Corporation Method and apparatus for mounting conductive balls
JP2010177230A (ja) * 2009-01-27 2010-08-12 Minami Kk ボール供給装置
US8038050B2 (en) * 2009-04-23 2011-10-18 Hitachi Plant Technologies, Ltd. Solder ball printing apparatus
KR20130054161A (ko) * 2011-11-14 2013-05-24 가부시키가이샤 히타치플랜트테크놀로지 땜납 볼 인쇄기

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6011629A (en) * 1998-03-02 2000-01-04 Matsushita Electric Industrial Co., Ltd. Method of positional alignment of substrate and screen mask in electrical paste screen printing
US20090307899A1 (en) * 2004-06-30 2009-12-17 Athlete Fa Corporation Method and apparatus for mounting conductive balls
JP2010177230A (ja) * 2009-01-27 2010-08-12 Minami Kk ボール供給装置
US8038050B2 (en) * 2009-04-23 2011-10-18 Hitachi Plant Technologies, Ltd. Solder ball printing apparatus
KR20130054161A (ko) * 2011-11-14 2013-05-24 가부시키가이샤 히타치플랜트테크놀로지 땜납 볼 인쇄기

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112259478A (zh) * 2020-10-23 2021-01-22 技感半导体设备(南通)有限公司 一种刮球铺球装置及方法
US20240009747A1 (en) * 2022-07-05 2024-01-11 Protec Co., Ltd. Head assembly for mounting conductive ball
US12325088B2 (en) * 2022-07-05 2025-06-10 Protec Co., Ltd. Head assembly for mounting conductive ball

Also Published As

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KR20140030293A (ko) 2014-03-11
KR101550688B1 (ko) 2015-09-07

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