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WO2021187735A1 - Scie et système de placement - Google Patents

Scie et système de placement Download PDF

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Publication number
WO2021187735A1
WO2021187735A1 PCT/KR2021/000385 KR2021000385W WO2021187735A1 WO 2021187735 A1 WO2021187735 A1 WO 2021187735A1 KR 2021000385 W KR2021000385 W KR 2021000385W WO 2021187735 A1 WO2021187735 A1 WO 2021187735A1
Authority
WO
WIPO (PCT)
Prior art keywords
unit
package
tray
pusher
lifting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2021/000385
Other languages
English (en)
Korean (ko)
Inventor
양해춘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Tonitec Semiconductor Co Ltd
Tonitec Co Ltd
Original Assignee
Suzhou Tonitec Semiconductor Co Ltd
Tonitec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Tonitec Semiconductor Co Ltd, Tonitec Co Ltd filed Critical Suzhou Tonitec Semiconductor Co Ltd
Publication of WO2021187735A1 publication Critical patent/WO2021187735A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Definitions

  • the present invention relates to a saw-and-placement system for manufacturing a semiconductor package, which improves the efficiency of supplying strip materials, cleaning and loading processes of packages, and improving the loading and unloading speed of strip materials and packages. It is about a saw and placement system that can maximize the UPH of the system.
  • semiconductor packages are packaged in a matrix-type arrangement on a strip material, and packages connected to each other in the strip material are cut and individually separated, and the individually separated packages are loaded on a tray according to a preset quality standard. After going through the saw and placement system, it is moved for the next process.
  • the saw and placement system is a loader that supplies strip materials, a strip picker and unit picker that loads strip materials onto a chuck table or unloads individual packages from the chuck table while moving along a two-axis robot, and
  • the first vision device that performs a vision inspection on the target, the chuck table that moves or rotates the strip material in the horizontal direction by adsorbing it while the strip material is loaded by the picker, and the strip material transferred by the chuck table into each package
  • a sawing device that cuts, a brush device and cleaning device that removes foreign substances generated during cutting, a drying device that dries each package after washing, and a tray for loading individual packages according to preset quality standards through vision inspection. It consists of a handler unit and the like.
  • the chuck table must rotate according to the supply direction of the strip material supplied by the loader, and the safety and safety of the loading of the strip material by the rotation operation of the chuck table There was a problem that the accuracy was lowered.
  • the saw and placement system according to the prior art has a problem in that the size of the entire system is inevitably increased due to the equipment installed for performing each process, and the construction and management cost of the equipment is inevitably increased accordingly.
  • the present invention has been devised by the above-mentioned background art, and improves the efficiency of the supply of strip material, cleaning and loading process of the package, and improving the loading and unloading speed of strip material and package.
  • the purpose of this is to provide a saw and placement system that can maximize the UPH (package processing speed per unit time: Unit Per Hour) of the entire system.
  • an object of the present invention is to provide a saw-and-placement system capable of improving the productivity of a semiconductor package by improving a worker's working environment by simplifying the layout of the entire system.
  • a loader unit for supplying the loaded strip material from the rear to the front, the supplied strip material is supplied to the chuck table by the straight movement of the strip picker;
  • a unit picker for transferring the package cut by the sawing unit is provided, an ultrasonic cleaner for washing the cut package, a washing means for washing and drying the cut package that has been cleaned by the ultrasonic cleaner, and the washing means a cleaner unit comprising: an air blower for further drying by spraying air at a predetermined pressure on the package, which is cleaned and dried by the , and a water leak detection unit configured to the lower portion of the ultrasonic cleaner and the washing means to detect leakage of the washing liquid;
  • a heating means for drying the package that has been cleaned from the cleaner is built-in, and a vision inspection of the dried package is performed by the heating means, and the vision inspection is completed and the package is seated on a seat block.
  • the loader unit, the strip material is stacked and stacked, the magazine unit in which the lifting operation is made in the up and down directions; a strip pusher configured in the rear part of the magazine part and supplying the loaded strip material to the front by pushing; an inlet rail on which the strip material supplied by the strip pusher is seated, and for aligning the seated strip material; a strip picker configured to perform a vision inspection of the strip material positioned on the inlet rail, the strip picker adsorbing the strip material and transferring it to a chuck table; and a picker transfer unit for guiding the straight movement of the strip picker.
  • the loader unit further includes a dividing plate in which a supply hole is formed so as to divide a rear portion and a front portion, and to transfer the strip material supplied by the strip pusher to the inlet rail. characterized in that
  • the strip pusher includes a pusher driving means for providing a predetermined rotational force; a pusher transfer plate connected to the pusher driving means and the driving belt and moving straight forward and backward; a pusher member coupled to a lower portion of the pusher transfer plate and for pushing the strip member when the pusher driving means is driven;
  • the pusher transfer plate is coupled, and the pusher transfer rail for supporting the straight movement of the pusher transfer plate when the pusher driving means is driven; characterized in that it further comprises.
  • the cleaner unit includes a discharge line for discharging the cleaning solution and foreign substances separated from the package, and the foreign substances separated from the cut package are discharged to the outside of the cleaner unit.
  • a filter member for preventing the occurrence of contamination an overflow sensor configured in the ultrasonic cleaner and configured to detect the level of the cleaning liquid to achieve a predetermined water level, and configured inside the ultrasonic cleaner and remaining on the surface of the cut package It is characterized in that the brush for removing foreign substances is further configured.
  • the washing means is configured to further wash the cut package with a water jet, and to dry the package cleaned by the water jet with an air jet.
  • the tray unit the empty tray and the loading frame on which the full tray is loaded; first and second lifting motors for driving the empty tray and the full tray to be raised and lowered, respectively; a lifting plate for lifting the empty tray while the lifting operation is performed by the lifting means when the first lifting motor is driven; an elevating unit coupled to the first elevating guide panel, a first saddle member mounted on both upper sides, and a lifting frame including a second elevating guide panel for elevating the full tray; A first saddle member provided in the loading frame, coupled to the second elevating guide panel, and fixing the empty tray and the full tray, and a second saddle coupled to the loading frame and fixing the lifted full tray It characterized in that it comprises a; tray saddle composed of a member.
  • the loading frame is configured in the rear portion, and the door frame to which the empty tray is supplied, and the front side portions of the door frame are configured in shapes corresponding to each other, respectively, and the second lifting and lowering.
  • a support frame configured to support the elevating operation of the guide panel, and the first saddle member being coupled to the second elevating guide panel, and mounted on the lower portion of the support frame, the central portion of which is the elevating operation of the elevating plate It is characterized in that it comprises a support frame that is formed through the support frame, and a seating frame configured to the lower portion of the support frame to seat the loading frame on the upper portion of the lifting unit.
  • the tray unit, the empty tray is supported to be moved to the position of the package picker, and the full tray is supported to return to the inside of the loading frame; further comprises a supply frame characterized in that
  • a gripper for gripping the empty tray and the full tray, a gripper connection block connected to a rear portion of the gripper, and the gripper connection block are detachably coupled to the gripper connection block, and the gripper and the gripper connection a gripper assembly including a belt connecting member for moving the block forward and backward; and a gripper driving motor coupled to a lower front side of the supply frame, and a gripper driving belt connected to the gripper driving motor and coupled to the belt connection member to move the belt connection member in a straight line when the gripper driving motor is driven.
  • a gripper driving unit including a.
  • the efficiency of the strip material supply, package cleaning and loading process is improved, and the UPH (package processing per unit time) of the entire system is improved by improving the loading and unloading speed of the strip material and package.
  • Speed Unit Per Hour
  • FIG. 1 is a view schematically showing a saw and placement system according to an embodiment of the present invention
  • FIGS. 2 to 5 are perspective views showing a loader unit of the saw and placement system according to an embodiment of the present invention
  • Figure 6 is a front view showing the loader of the saw and placement system according to an embodiment of the present invention.
  • FIG. 7 is a view schematically showing a cleaner part of the saw and placement system according to an embodiment of the present invention.
  • FIG. 8 is a diagram schematically showing a flipper block of a saw and placement system according to an embodiment of the present invention.
  • FIG. 9 is a perspective view showing a tray portion of the saw and placement system according to an embodiment of the present invention.
  • FIG. 10 is a perspective view showing a bottom surface of the tray unit according to an embodiment of the present invention.
  • 11 and 12 are a front view and a plan view showing a tray unit according to an embodiment of the present invention.
  • FIG 13 and 14 are views showing the internal structure of the tray unit according to an embodiment of the present invention.
  • a loader unit for supplying the loaded strip material from the rear to the front, and for supplying the supplied strip material to the chuck table by the straight movement of the strip picker;
  • a unit picker for transferring the package cut by the sawing unit is provided, an ultrasonic cleaner for washing the cut package, a washing means for washing and drying the cut package that has been cleaned by the ultrasonic cleaner, and the washing means a cleaner unit comprising: an air blower for further drying by spraying air at a predetermined pressure on the package, which is cleaned and dried by the , and a water leak detection unit configured to the lower portion of the ultrasonic cleaner and the washing means to detect leakage of the washing liquid;
  • a heating means for drying the package that has been cleaned from the cleaner is built-in, and a vision inspection of the dried package is performed by the heating means, and the vision inspection is completed and the package is seated on a seat block.
  • the saw and placement system of the present invention is configured so that the supply of the strip material is made while driving in the front and rear directions, and the inlet vision so that the vision inspection for the reverse and overturning of the supplied strip material is made.
  • the loader unit 200 including the unit 110, the cleaner unit 300 for washing the package cut by the sawing unit 170, and drying the package washed by the cleaner unit 300, It is configured to include a flipper block 400 for performing vision inspection of the package, and a tray unit 500 for loading the package on which the vision inspection has been performed.
  • the saw and placement system of the present invention is located in the rear portion of the loader unit 200, by moving or rotating the strip material supplied from the loader unit 200 in the horizontal direction to transfer to the sawing unit 170 ,
  • the chuck table 120 is further configured so that the cutting is made to each package by the sawing unit 170 .
  • the chuck table 120 may include a first chuck table serving to transfer the strip material to the sawing unit 170 and a second chuck table on which the package cut from the sawing unit 170 is seated and loaded. .
  • a unit picker for transferring the packages loaded on the second chuck table to the cleaner unit 300 is configured, and the package, which is dried and picked up by the flipper block 400 , is placed on the bottom and
  • the bottom vision unit 130 and the top vision unit 150 each perform a vision inspection on the upper surface.
  • the loader unit 200 of the saw and placement system of the present invention strip materials are stacked and stacked, and the magazine unit 210 in which the elevating operation is made in the up and down directions.
  • a strip pusher 220 configured in the rear part of the magazine part 210 and supplying the stacked strip material to the strip picker 240 configured in the front by pushing it, and the strip pusher 220
  • the inlet rail 230 on which the supplied strip material is seated, the strip picker 240 and the strip picker 240 that absorb the strip material positioned on the inlet rail 230 and transfer it to the chuck table 120 are transported. It is configured to include a picker transfer unit 250 to guide the.
  • the magazine unit 210 is located at the rear of the loader unit 200, and the magazine 211 is configured to be loaded in such a way that a plurality of strip materials are stacked therein, and the magazine 211 is moved in the up and down directions. It is configured to include a magazine transfer unit 215 to move the elevating and lowering operation to the magazine 211 and the strip pusher 220 to be located on the coaxial line.
  • a plurality of magazines 211 are configured to be spaced apart from each other by a predetermined interval from the upper part of the loader part 200 to the lower part, and the elevating operation is made by the magazine transfer part 215 , thereby reducing the space of the loader part 200 . It consists of a structure that occupies less space.
  • the magazine 211 is formed so that the front and rear are penetrated so that the loaded strip material is moved forward by the operation of the strip pusher 220 , and the strip material is transferred to the chuck table 120 only by straight movement. ), it is possible to minimize the space occupied by the loader unit 200 in the saw and placement system because it is not necessary to implement a mechanism for rotational operation for the transfer and supply of strip materials as in the prior art, and the rotation The way it works, it is possible to further improve the accuracy and stability of the feed of the strip material.
  • the magazine 211 is further configured with a magazine support 212 , a magazine cover 216 and a coupling frame 214 for coupling with the magazine transfer unit 215 .
  • the magazine support 212 is configured in each of the plurality of magazines 211 , and the lower surface of the magazines 211 is fixed so that the rear end of the magazine support 212 is coupled to the coupling frame 214 . configured to be done.
  • the magazine cover 216 is extended to the rear portion of the magazine 211 and is configured to be coupled to the coupling frame 214 , and the pusher member 224 and the magazine transfer unit when the strip pusher 220 is operated It is a component that prevents the occurrence of interference between the 215 , and blocks foreign substances from entering the inside of the magazine 211 .
  • the magazine cover 216 is configured to form a predetermined slope so that the rear portion of the magazine 211 is coupled at a position eccentric from the center of the magazine transfer unit 215 to one side, so that the open rear portion of the magazine 211 is formed. One side of the magazine transfer unit 215 is exposed so that the pusher member 224 is easily drawn into the open rear portion of the magazine 211 .
  • the coupling frame 214 is coupled to the magazine support unit 212 and the magazine cover 216 in the front, and the rear part is coupled to enable the elevating operation with the magazine conveying unit 215 to enable the magazine conveying unit 215 to operate when the magazine 211 is operated. ) plays a role in supporting the ascent and descent.
  • This coupling frame 214 may be configured so that all of the plurality of magazines 211 are coupled, and accordingly, when the magazine transfer unit 215 is operated, the rising/lowering operation of the plurality of magazines 211 may be configured at the same time.
  • a partition plate 213 may be further configured so as to form an independent space by dividing, and only the strip material loaded in the magazine 211 is supplied from the independent rear portion to the front portion.
  • the divider plate 213 is formed on the same axis as the pusher member 224 of the strip pusher 220 , and the strip material formed at the rear end of the inlet rail 230 and loaded in the magazine 211 is the inlet rail. It is preferable that a supply hole (213a) for easy supply to the (230) side is further configured.
  • the strip pusher 220 is configured in the rear part of the magazine part 210 and is a component that supplies the strip material loaded in the magazine 211 to the upper part of the inlet rail 230 while moving straight forward and backward. , a pusher driving means 221 , a driving belt 222 , a pusher transfer plate 223 , a pusher member 224 and a pusher transfer rail 225 .
  • the pusher driving means 221 is made of a conventional motor, and provides a rotational force for the straight movement of the strip pusher 220 to the driving belt 222 side, and the rotational force is converted into a linear movement by the driving belt 222 . do.
  • the pusher transfer plate 223 is coupled to the drive belt 222 , and the pusher member 224 is coupled to the lower end thereof to move together in the straight movement direction of the drive belt 222 , while the front of the pusher member 224 is performed. , to make it move backwards.
  • the pusher conveying plate 223 is coupled to the pusher conveying rail 225 and configured to precisely move forward and backward along the pusher conveying rail 225 when the driving belt 222 is driven, so that the pusher member 224 .
  • the front end of the is configured to accurately and stably push the strip material loaded in the magazine (211).
  • the pusher transfer plate 223 has one side of the pusher transfer in which gear teeth corresponding to the gear teeth of the driving belt 222 are formed inwardly so that the gear teeth and the gear teeth configured in the driving belt 222 are coupled to each other in a gear coupling method.
  • a block 223a is further configured.
  • the loader unit 200 configured in this way is configured so that when the strip material is supplied to the front by the strip pusher 220, the strip material is supplied while passing through the supply hole 213a formed in the dividing plate 213, The strip material supplied through the hole 213a is configured to be seated on the inlet rail 230 .
  • the inlet rail 230 may be configured to align the strip material seated on the upper surface and supply it to the chuck table 120 by the strip picker 240 , and is connected to a servomotor to align the position of the strip material configured to do this.
  • the strip picker 240 is configured on the upper part of the inlet rail 230 , and after adsorbing the strip material whose position has been aligned by the elevating operation and the suction operation, the adsorbed strip material is transferred to the chuck table 120 . so that the supply is made.
  • the inlet vision unit 110 is configured in the strip picker 240 to detect whether the strip material aligned on the inlet rail 230 is reversed and overturned, and a primary vision inspection to check whether the 2D code is marked on the strip material. make it happen
  • the strip picker 240 is configured to be lifted and lowered and adsorbed by the picker driving unit 242, and a picker transfer panel 244 coupled to the picker transfer unit 250 and the picker transfer unit 250 to move in a straight line on the upper surface is configured. .
  • the pusher transfer rail 225 , the picker transfer unit 250 , etc. configured in the loader unit 200 of the present invention may be formed of a general LM guide, but is not limited thereto.
  • the cleaner unit 300 is a component that removes foreign substances remaining in the package by supplying the package cut by the sawing unit 170 and cleaning the cut surface of the supplied package, as shown in FIG. As described above, it is configured to include a cleaner frame 310 , an ultrasonic cleaner 320 , an air blower 330 , a brush 340 , a washing means 350 , a filter member 360 , and a leak detection unit 370 . .
  • the cleaner frame 310 is provided with a unit picker 302 that transfers the package cut by the sawing unit 170 and transfers the package washed by the cleaner unit 300 to the flipper block 400 , and this unit picker
  • the ultrasonic cleaner 320, the air blower 330 and the brush 340 for cleaning the package cut to the lower part of the 302 are mounted.
  • the cleaner frame 310 includes a bottom frame 314 for fixing the cleaner unit 300 to the ground at a lower portion, and a connection frame 312 for connecting the bottom frame 314 and the cleaner frame 310 , and the bottom
  • the upper portion of the frame 314 is further configured with a leak detection unit 370 that detects leakage of the cleaning liquid from the ultrasonic cleaner 320 and the cleaning means 350 and prevents a short circuit due to leakage.
  • the water leak detection unit 370 may be formed of a water leakage sensor, but is not limited thereto.
  • the cleaner frame 310 is further configured with a discharge line connected to the ultrasonic cleaner 320 to discharge the cleaning solution accommodated in the ultrasonic cleaner 320 and foreign substances separated from the package, and this discharge line is separated from the package.
  • a filter member 360 is further configured to prevent foreign substances from being discharged to the outside of the cleaner unit 300 .
  • This cleaner frame 310 is configured so that ultrasonic cleaning of the cut package transferred from the sawing unit 170 by the unit picker 302 by configuring the ultrasonic cleaner 320 to one side of the upper portion.
  • the ultrasonic cleaner 320 may be made of a housing in which the cleaning liquid is accommodated, and an ultrasonic vibrator 322 for generating bubbles in the cleaning liquid by providing ultrasonic waves to the cleaning liquid as a bottom surface is configured, and the level of the received cleaning liquid
  • An overflow sensor 324 that detects and adjusts to achieve a predetermined water level is configured.
  • the ultrasonic cleaner 320 includes a brush 340 for removing foreign substances remaining on the surface of the package cut therein.
  • the second cleaning of the package cut by the brush 340 may be performed, thereby providing a high-performance decontamination function.
  • the cleaner unit 300 is configured such that the package that has been cleaned by the ultrasonic cleaner 320 and the brush 340 is transferred to the washing means 350 side by the unit picker 302 for the third washing.
  • the washing means 350 is mounted on the other side of the cleaner frame 310 , that is, at a position opposite to the ultrasonic cleaner 320 , and may be made of a water jet or the like, and the package transported by the unit picker 302 . It is configured so that the third washing with water is made.
  • the cleaning means 350 is configured to remove the remaining water on the surface by spraying air at a predetermined pressure to the package in which the third cleaning is made by further configuring an air jet.
  • the air blower 330 configured on the upper surface of the cleaner frame 310 is to enable the secondary water removal of the package in which the third washing and the primary water removal are completed by the washing means 350, and the air jet In the same way, air at a certain pressure is sprayed toward the package to remove moisture.
  • the air blower 330 may spray air toward the package to remove the tertiary moisture.
  • the flipper block 400 allows the package that has been cleaned from the cleaner unit 300 to be subjected to a secondary vision inspection by the bottom vision unit 130, and the package on which the vision inspection has been completed is seated on the seat block 140
  • the rotation means 460 consisting of a flipper rotating cylinder on the upper surface to enable rotation (flip) and pick-and-place operation, and whether the flipper body 410 is rotated
  • it is configured to include a rotation sensor 440 made of a limit sensor for detecting the amount of rotation, and a pickup means 450 for seating the package on the seat block 140 while driving in the Z-axis direction.
  • the flipper block 400 is a heating means ( The flipper body 410 of which 420 is included, and a thermocouple that is formed in the lower center of the flipper body 410 and senses the heat of the heating means 420 and the surface temperature of the package heated by the heating means 420 . 430 is included.
  • the third vision inspection is performed by the top vision unit 150 on the top of the package seated on the seat block 140 and arranged, and the package on which the third vision inspection is completed is selected by the package picker. It is supplied to the empty tray loaded on the tray unit 500 by 160 and is configured to be loaded.
  • a plurality of empty trays 501 are loaded in the tray unit 500, and the loaded empty trays 501 are transferred to the package picker 160 so that the packages supplied by the package picker 160 are seated,
  • the package picker 160 As configured so that the loading of the full tray 503 on which the package is seated is made, it may be composed of a plurality, and as shown in FIGS. 506 ) and a gripper part 508 .
  • the loading unit 502 is configured such that the empty tray 501 and the full tray 503 are stacked in separate spaces, respectively, and is connected to the lifting unit 504 to operate the empty tray according to the driving of the lifting unit 504 . It serves to supply the 501 to the supply unit 506 , or to load the full tray 503 on which the package is seated to the upper part of the empty tray 501 .
  • the loading unit 502 provides a loading space for the empty tray 501 and the full tray 503 , and a loading frame 510 that supports the elevation operation of the elevation part 504 is configured.
  • the loading frame 510 is configured in the rear part, and the door frame 512 on which the opening/closing door 518 is mounted so as to open and close the receiving space of the empty tray 501, and the front both sides of the door frame 512
  • the loading frame 510 is configured to include a seating frame 516 for seating the upper part of the lifting unit 504 .
  • the tray saddle 520 for fixing the empty tray 501 and the full tray 503 to be loaded is configured on both sides of the front and rear sides of the support frame 514 , preferably the second of the tray saddle 520 .
  • the saddle member 524 is mounted so as to be fixed to the pool tray 503 .
  • the support frame 514 has through holes 514a formed on both sides so that the first saddle member 522 of the tray saddle 520 is coupled with the second lifting guide panel 536 of the lifting unit 504 . It is configured such that the first saddle member 522 elevates and lowers when the second elevating guide panel 536 is lifted and lowered at the same time.
  • the support frame 514 is configured to be equipped with a lifting rail 538 for guiding the lifting operation of the second lifting guide panel 536 to both sides of the through hole (514a).
  • the tray saddle 520 fixes the empty tray 501 and the full tray 503 to the loading frame 510 so that the empty tray 501 is loaded in the lower space of the accommodating space of the loading frame 510 .
  • the pull tray 503 is fixed It is composed of a plurality of second saddle members 522 so that the loading is made.
  • the first saddle member 522 may be configured in both the lower space and the upper space of the receiving space of the loading frame 510, and the empty tray 501 and It is configured to fix all of the pool tray 503, and the second saddle member 524 is configured only in the upper portion of the accommodation space, and is fixedly coupled to the support frame 514 to fix only the pool tray 503 that is raised and lowered.
  • the lifting unit 504 raises and lowers the empty tray 501 supplied through the door frame 512 so that it is fixed by the first saddle member 522 while the empty tray 501 is inside the loading frame 510 .
  • the full tray 503 in which the package is seated by the package picker 160 is supplied to the inside of the loading frame 510, the full tray 503 is loaded into the loading frame 510. It is a component that lifts up and down within the accommodation space so that loading is accomplished.
  • This lifting unit 504 is configured in the lower portion of the loading frame 510, preferably mounted on the lifting frame 530 and the lifting frame 530 to support the lifting operation to be made in the lower portion of the seating frame (516). and a first lifting motor 542 for driving the empty tray 501 to be raised and lowered and a second lifting motor 544 for driving the full tray 503 to be raised and lowered.
  • the lifting frame 530 is provided to be spaced apart from the lower portion of the seating frame 516 by a predetermined interval, and is coupled to the seating frame 516 by a circular fixing bar, and the first lifting motor 542 is configured on one upper side. and a second lifting motor 544 is configured on the other side of the lower portion, and a fixed panel 532 supporting the driving of the first and second lifting motors 542 and 544 is configured.
  • first and second elevating motors 542 and 544 are made of a conventional motor that provides a predetermined rotational force, and the first and second lifting motors 542 and 544 receive the rotational force of each of the first and second elevating motors 542 and 544 to move in a straight line.
  • Elevating means 545 for converting the rotational force into a straight motion is configured.
  • the elevating means 545 connected to the first elevating motor 542 is connected to the elevating plate 550 in which elevating and lowering operations are performed at the center of the support frame 515 and the seating frame 516 , and the first elevating motor 542 . ) so that the lifting plate 550 is lifted from the central portion through which the support frame 515 and the seating frame 516 are penetrated to the receiving space formed in the loading frame 510 according to whether or not it is driven. That is, the elevating means 545 connected to the first elevating motor 542 allows the elevating operation of the elevating plate 550 to be performed, thereby elevating the empty tray 501 and fixing it by the first saddle member 522 . let it go
  • the elevating means 545 connected to the second elevating motor 544 is connected to the first elevating guide panel 532 and connected to the first elevating guide panel 532 and the first elevating guide panel 532 .
  • the pull tray 503 is elevated and fixed by the second saddle member 524 at the same time.
  • the lifting frame 530 includes a first elevating guide panel 534 for which elevating operation is performed when the second elevating motor 544 is driven to the upper center of the fixed panel 532 , and an extension plate extending at the lower end of the first elevating guide panel 534 . 1 is coupled to the elevating guide panel 534 and is configured to include a second elevating guide panel 536 on which the first saddle members 522 are mounted on both upper sides.
  • the elevating frame 530 is mounted on the support frame 514, the second elevating guide panel 536 is connected to the elevating rail 538 for guiding the lifting operation of the second elevating guide panel 536 is further can be configured.
  • the empty tray 501 fixed by the first saddle member 522 is supplied by the gripper unit 508 , the empty tray 501 is moved to the position of the package picker 160 . This is supported so that the full tray 503 on which the package is seated by the package picker 160 is supported to return to the inside of the loading frame 510 again, and the empty tray 501 and the full tray 503
  • a supply frame 560 for supporting the movement of the supply frame 560 is configured, and a gripper part 508 for gripping and transporting the empty tray 501 and the full tray 503 is mounted on one surface of the supply frame 560 .
  • the gripper unit 508 supplies the empty tray 501 loaded on the loading frame 510 to the supply frame 560 of the supply unit 506 and simultaneously transfers the supplied empty tray 501 to the package picker 160 side.
  • the gripper assembly is configured so that the package is seated and the full tray 503 on which the package has been seated is re-transferred to the loading frame 510 to be loaded. It is configured to include a 570 and a gripper driving unit 580 .
  • the gripper assembly 570 includes a gripper 571 for gripping the empty tray 501 and the full tray 503 , a gripper connection block 574 connected to the rear portion of the gripper 572 , and a gripper connection block 574 . and a belt connection member 576 coupled to the gripper driving belt 584 of the gripper driving unit 580 so that the position of the gripper 572 and the gripper connection block 574 is moved. .
  • the gripper assembly 570 further includes a gripper transfer rail 577 that supports the loading frame 510 to the package picker 160 to easily move in a straight line, and the gripper transfer rail 577 and A connection bracket 578 for connecting the gripper connection block 574 may be further configured.
  • the gripper transport rail 577 of the present invention may be formed of a general LM guide, but is not limited thereto.
  • the gripper driving unit 580 is configured at the lower front side of the supply frame 560 and includes a gripper driving motor 582 that provides a predetermined rotational force for linear movement of the gripper assembly 570 , and the gripper driving motor 582 . and a gripper driving belt 584 that is connected to the rotational force to make a straight movement, and a driving guide roller 586 that prevents the gripper driving belt 584 from sagging.
  • the gripper drive belt 584 is coupled to the belt connection block 576 , and preferably, similarly to the pusher conveying plate 223 and the drive belt 222 , the gripper drive belt 584 may be configured to be coupled in a gear coupling method.
  • the lifting unit 504 of the present invention configured as described above, when the empty tray 501 is supplied after the opening/closing door 518 is opened, the first lifting motor 542 and the first lifting motor 542 are connected. As the lifting means 544 is driven, the lifting plate 550 is raised, and the empty tray 501 supplied with the ascending and descending plate 550 is raised and lowered while being fixed by the first saddle member 522 . .
  • the empty tray 501 loaded while being fixed by the first saddle member 522 is gripped by the gripper assembly 570 of the gripper part 508 , and the gripper assembly 570 is used as the gripper driving part.
  • the empty tray 501 gripped while moving toward the package picker 160 by 580 is transferred to the package picker 160 so that the package is seated on the empty tray 501 .
  • the full tray 503 on which the package is seated is fixed to the first saddle member 522 while being re-transferred to the loading unit 510 by the driving of the gripper assembly 570 and the gripper driving unit 580 .
  • the first and second elevating guide panels 534 and 536 are raised and lowered by the driving of the second elevating motor 524 and elevating means 545 to the first saddle member 522.
  • the fixed pool tray 503 is raised to be loaded while being fixed to the second saddle member 524 .
  • the tray unit 500 of the present invention even without a separate tray picker for supply and transport of the empty tray 501 and the full tray 503, the seating and loading of packages can be made, so that the saw and placement Not only can the UPH of the system be improved, but both the empty tray 501 and the full tray 503 can be loaded even in a minimum space, which simplifies the layout of the entire system and improves the working environment of the operator. can improve productivity.
  • inlet vision unit 120 chuck table
  • top vision unit 160 package picker
  • sawing unit 200 loader unit
  • magazine unit 220 strip pusher
  • inlet rail 240 strip picker
  • unit picker 310 cleaner frame
  • elevating frame 542 first elevating motor
  • lift plate 560 supply frame
  • gripper assembly 580 gripper drive unit

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)

Abstract

La présente invention est caractérisée en ce qu'elle comprend : une unité de chargement pour fournir un matériau en bande chargé à une table à mandrin ; une unité de nettoyage qui est pourvue d'un dispositif de ramassage d'unité pour transporter des boîtiers découpés par une partie de sciage et, qui comprend un dispositif de nettoyage à ultrasons pour nettoyer les boîtiers découpés, un moyen de nettoyage pour nettoyer et sécher les boîtiers découpés, une soufflante d'air pour pulvériser de l'air d'une certaine pression sur les boîtiers nettoyés et séchés pour sécher davantage les boîtiers, et une partie de détection de fuite disposée au-dessous de l'appareil de nettoyage à ultrasons et du moyen de nettoyage et détectant une fuite d'une solution de nettoyage ; un bloc de retournement qui a un moyen de chauffage intégré à l'intérieur de celui-ci, qui permet une inspection visuelle des boîtiers séchés par le moyen de chauffage et qui place les boîtiers inspectés visuellement sur un bloc de siège ; et une unité plateau qui comporte plusieurs plateaux vides chargés sur celle-ci, qui transporte les plateaux vides vers un dispositif de ramassage de boîtiers pour placer les boîtiers dessus et qui charge les plateaux pleins, sur lesquels les boîtiers ont été placés, au-dessus des plateaux vides.
PCT/KR2021/000385 2020-03-20 2021-01-12 Scie et système de placement Ceased WO2021187735A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2020-0034302 2020-03-20
KR1020200034302A KR102274543B1 (ko) 2020-03-20 2020-03-20 쏘 앤 플레이스먼트 시스템

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Publication Number Publication Date
WO2021187735A1 true WO2021187735A1 (fr) 2021-09-23

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PCT/KR2021/000385 Ceased WO2021187735A1 (fr) 2020-03-20 2021-01-12 Scie et système de placement

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KR (1) KR102274543B1 (fr)
WO (1) WO2021187735A1 (fr)

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CN119419146A (zh) * 2025-01-07 2025-02-11 山东才聚电子科技有限公司 一种半导体器件切筋测试包装一体机

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