WO2015115136A1 - Method for manufacturing film formation mask and film formation mask - Google Patents

Abstract

The present invention is a method for manufacturing a film formation mask having a structure in which a resin film layer (1) provided with an opening pattern (4) of a previously determined specified pattern and a magnetic metal material layer (2) provided with spaces (7) of a size that can accommodate the opening pattern (4) are laminated. The opening pattern (4) is formed by irradiating laser light from both surfaces of portions of the film layer (1) corresponding to the spaces (7) to pierce the film layer (2).

Description

Method for manufacturing film formation mask and film formation mask

The present invention relates to a method of manufacturing a film formation mask having a structure in which a resin film layer having an opening pattern formed thereon and a magnetic metal material layer are laminated, and particularly when forming the opening pattern by laser processing, the edge of the opening pattern. The present invention relates to a film forming mask manufacturing method and a film forming mask that can suppress the generation of burrs.

A conventional method of manufacturing this type of mask is to use a patterned mask to irradiate a resin film with, for example, a KrF excimer laser beam having a short wavelength of about 248 nm, and then ablate the resin film. An opening pattern is formed (for example, see Patent Document 1).

JP 2005-517810 Gazette

However, in such a conventional mask manufacturing method, an opening pattern is usually formed by irradiating one surface side of a resin film with a laser beam, so the opening pattern is opposite to the laser beam irradiation side. There is a problem that uncut edges (hereinafter referred to as “burrs”) occur at the opening edge of the side.

Such burrs cause shadows in the film formation and cause a disorder in the shape of the edge of the thin film pattern to be formed, or create a gap between the film formation mask and the film formation substrate. There is a possibility that the material may easily go under the mask and cause the problem that the edge of the thin film pattern is blurred.

Accordingly, the present invention addresses such problems, and a method of manufacturing a film formation mask and film formation that can suppress the occurrence of burrs at the edge of the opening pattern when forming the opening pattern by laser processing. The object is to provide a mask.

In order to achieve the above object, a method of manufacturing a film formation mask according to the present invention includes a resin film layer provided with an opening pattern having a predetermined shape, and a gap having a size capable of containing the opening pattern. A method of manufacturing a film formation mask having a structure in which a magnetic metal material layer provided is laminated, wherein the opening pattern irradiates a portion of the film layer corresponding to the gap with laser light from both sides, It is formed by penetrating.

The film-forming mask according to the present invention includes a resin film layer provided with an opening pattern having a predetermined shape, and a magnetic metal material layer provided with a gap having a size capable of containing the opening pattern. In the film formation mask having the structure described above, the opening pattern is formed by irradiating a part of the film layer corresponding to the gap with laser light from both sides to penetrate the film layer.

According to the present invention, the opening pattern is formed by irradiating the laser beam from both sides of the film layer, so that the side opposite to the magnetic metal material layer of the film layer (the side of the adhesion surface with the deposition substrate) ) Can be prevented from occurring at the edge of the opening pattern. Therefore, the burr in the opening pattern can be prevented from being a shadow of film formation, and a gap can be prevented from being generated between the film layer and the film formation substrate due to the presence of the burr. Thereby, the formation precision of a thin film pattern including a shape and position accuracy can be improved.

1A and 1B are views showing an embodiment of a film-forming mask according to the present invention, in which FIG. 1A is a plan view, FIG. 1B is a cross-sectional view taken along the line OO in FIG. P line sectional arrow view, (d) is a partially enlarged sectional view of (c). It is a top view which shows the modification of the magnetic metal material layer of the film-forming mask by this invention. It is a figure explaining the formation example of an opening pattern with the manufacturing method of the film-forming mask by this invention, It is sectional drawing which shows the formation process of the 1st recessed part, (a) shows the laser processing start, (b) The end of laser processing is shown, (c) is an enlarged cross-sectional view of the first recess. It is a figure explaining the formation example of an opening pattern with the manufacturing method of the film-forming mask by this invention, It is sectional drawing which shows the formation process of a 2nd recessed part, (a) shows a laser processing start, (b) is The end of laser processing is shown, (c) is an enlarged cross-sectional view of the second recess. It is a figure explaining the modification of formation of an opening pattern with the manufacturing method of the film-forming mask by this invention, It is sectional drawing which shows the formation process of a through-hole, (a) shows the laser processing start, (b) The end of laser processing is shown, (c) is an enlarged cross-sectional view of the through hole. It is a figure explaining the modification of formation of an opening pattern with the manufacturing method of the film-forming mask by this invention, It is sectional drawing which shows the formation process of a recessed part, (a) shows a laser processing start, (b) is a laser The end of processing is shown, and (c) is an enlarged sectional view of the recess.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1A and 1B are diagrams showing an embodiment of a film-forming mask according to the present invention, where FIG. 1A is a plan view, FIG. 1B is a cross-sectional view taken along the line OO in FIG. 1A, and FIG. FIG. 4D is a partially enlarged cross-sectional view of FIG. This film formation mask is for forming a plurality of thin film patterns having a predetermined shape on a film formation substrate, and includes a film layer 1, a magnetic metal material layer 2, and a frame 3. ing.

The film layer 1 serves as a main mask for forming a thin film pattern on the deposition substrate, and transmits visible light such as polyimide or polyethylene terephthalate (PET) having a thickness of about 5 μm to 30 μm. As shown in FIG. 1A, an opening pattern 4 having a predetermined shape is provided on a resin film. Preferably, a polyimide whose linear expansion coefficient is about 3 × 10 ⁻⁶ to 5 × 10 ⁻⁶ / ° C., which approximates the linear expansion coefficient of glass as a deposition target substrate (hereinafter simply referred to as “substrate”) is desirable.

Specifically, as shown in FIG. 1A, the opening pattern 4 has the same shape as the thin film pattern, and is arranged in a matrix form corresponding to the thin film pattern, as shown in FIG. As shown, the first concave portion 5 having a depth of, for example, about 4 μm to 5 μm formed on one surface 1a of the film layer 1 and the depth reaching the first concave portion 5 on the other surface 1b of the film layer 1 are formed. And a second recess 6. In this case, the opening area of the second recess 6 is preferably larger than the opening area of the first recess 5. In addition, the 1st recessed part 5 may be the through-hole 13 (refer FIG. 5) which penetrates the film layer 1 so that it may mention later.

A magnetic metal material layer 2 is laminated on the other surface 1 b side of the film layer 1. The magnetic metal material layer 2 is made of a magnetic metal material such as nickel, nickel alloy, invar or invar alloy, for example, having a thickness 7 of about 10 μm to 50 μm, with a gap 7 large enough to contain the opening pattern 4. Thus, the film layer 1 is attracted by a magnet disposed on the back surface of the substrate during film formation, and functions to bring the film layer 1 into close contact with the film formation surface of the substrate.

In this case, the gap 7 is a slit provided through the magnetic metal material layer 2 as shown in FIGS. 1 (a) to 1 (c). Alternatively, as shown in FIG. 2, a plurality of elongated island patterns 8 constituting a part of the magnetic metal material layer 2 may be a portion between the adjacent island patterns 8. When the magnetic metal material layer 2 includes the island pattern 8 as shown in FIG. 2, the magnetic metal material layer 2 is generated in the film layer 1 due to a difference in linear expansion coefficient between the magnetic metal material layer 2 and the film layer 1. The internal stress to be reduced is reduced, and the positional deviation of the opening pattern 4 formed by laser processing after lamination can be suppressed. Therefore, there is an effect that the selection range of the magnetic metal material is expanded. The island pattern 8 may be divided into a plurality of unit island patterns having a short length in the major axis direction. Thereby, the internal stress which generate | occur | produces in the film layer 1 can be made smaller. In FIG. 2, reference numeral 9 denotes a frame-shaped pattern that has an opening having a size that includes the plurality of island patterns 8 and is part of the magnetic metal material layer 2 that is laminated on the peripheral edge of the film layer 1. is there.

A frame 3 is provided on the surface 2 a of the magnetic metal material layer 2 opposite to the film layer 1. The frame 3 fixes and supports the periphery of the magnetic metal material layer 2 and is formed of a magnetic metal material made of, for example, invar or iron-nickel alloy. It forms a frame shape having an opening 10 sized to enclose the gap 7. The frame 3 is not limited to one made of a magnetic metal material, and may be made of a nonmagnetic metal material or a hard resin. In the present embodiment, the frame 3 is made of a magnetic metal material.

Next, the manufacturing method of the film-forming mask comprised in this way is demonstrated.
First, a metal sheet of a magnetic metal material having a thickness of about 10 μm to 50 μm made of, for example, nickel, nickel alloy, invar or invar alloy is cut out according to the surface area of the substrate to be deposited, A polyimide resin solution is applied and dried at a temperature of about 200 ° C. to 300 ° C. to form a film layer 1 that transmits visible light having a thickness of about 5 μm to 30 μm.

Next, after the resist is applied to the other surface of the metal sheet by, for example, spray coating, the resist film is dried to form a resist film. Next, the resist film is exposed using a photomask, and then developed to develop a plurality of rows. A resist mask having a plurality of elongated openings is formed corresponding to the slit formation position.

Subsequently, after the metal sheet is wet-etched using the resist mask, the metal sheet corresponding to the opening of the resist mask is removed, and a slit penetrating the metal sheet is provided to form the magnetic metal material layer 2 The resist mask is removed by dissolving it in an organic solvent, for example. Thus, a mask member 11 (see FIG. 3) in which the film layer 1 and the magnetic metal material layer 2 are laminated is formed. In addition, the etching liquid for etching a metal sheet is suitably selected according to the material of the metal sheet to be used, and a well-known technique can be applied.

Further, when the slit is formed by etching the metal sheet, the mask side alignment for aligning with a substrate side alignment mark previously provided on the substrate at a predetermined position outside the formation region of the plurality of slits. The mark 12 (see FIGS. 1 and 2) may be formed simultaneously. In this case, when the resist mask is formed, an alignment mark opening may be provided at a position corresponding to the mask side alignment mark 12.

The mask member 11 may be formed by other methods without depending on the above method. For example, a seed layer is formed on one surface of the film by, for example, electroless plating, a photoresist is applied thereon, exposed and developed, and a plurality of rows of island-shaped resins corresponding to the positions where the plurality of rows of slits are formed. After the pattern is formed, a magnetic metal material such as nickel, nickel alloy, invar or invar alloy is plated on the outer region of the island-shaped resin pattern. Then, after removing the island-shaped resin pattern, the mask member 11 may be formed by etching and removing the seed layer at the formation position of the island-shaped resin pattern.

Thereby, the mask member 11 including the magnetic metal material layer 2 in which a plurality of slits as shown in FIG.

Further, as shown in FIG. 2, the mask member 11 including the frame-shaped pattern 9 and the magnetic metal material layer 2 provided with a plurality of island patterns 8 inside the frame-shaped pattern 9 is formed as follows. It can be carried out. For example, a seed layer is formed on one surface of the film by, for example, electroless plating, a photoresist is applied thereon, and this is exposed and developed, so that the frame-shaped pattern 9 and the plurality of island patterns 8 are formed. After forming the resin pattern covering the outer seed layer, a magnetic metal material such as nickel, nickel alloy, invar or invar alloy is formed by plating at the position where the frame pattern 9 and the plurality of island patterns 8 are to be formed. Then, after removing the resin pattern, the seed layer at the position where the resin pattern is formed is removed by etching.

Alternatively, in the same manner as described above, the resin layer is applied to one surface of the metal sheet to form the film layer 1, the resist is applied to the other surface of the metal sheet and dried, and then the photomask is applied. The resist is exposed to light and developed to form a resist mask having an opening outside the position where the frame-like pattern 9 and the plurality of island patterns 8 are to be formed, and the magnetic metal sheet is formed using the resist mask. The mask member 11 including the magnetic metal material layer 2 having the frame pattern 9 and the plurality of island patterns 8 may be formed by etching.

Next, the mask member 11 is arranged with the frame 3 made of a magnetic metal material facing the magnetic metal material layer 2 of the mask member 11 and the mask member 11 stretched on the frame 3. 11 is irradiated with laser light to spot weld the magnetic metal material layer 2 to the end face of the frame 3.

Subsequently, the process proceeds to an opening pattern forming process which is a feature of the present invention. Hereinafter, the opening pattern forming process will be described with reference to FIGS.
First, as shown in FIG. 3A, on the surface of the film layer 1 opposite to the magnetic metal material layer 2 (hereinafter referred to as “one surface 1a”), for example, a third harmonic of an excimer laser of KrF 248 nm or a YAG laser. Using a wave or a fourth harmonic, a laser beam L having a wavelength of 400 nm or less is irradiated, the film layer 1 is ablated, and a first recess 5 having a constant depth is provided as shown in FIG. .

Specifically, for example, the film layer 1 is moved by moving a laser beam by a predetermined distance in a two-dimensional direction in a plane parallel to the surface of the mask member 11 with reference to a mask alignment mark 12 formed in advance. A portion corresponding to the gap 7 of the magnetic metal material layer 2 is irradiated with the laser beam L on the one surface 1a to form the first recess 5.

Alternatively, the mask member 11 is positioned and placed on a reference substrate provided with a reference pattern that is an irradiation target of the laser light L at a position corresponding to the opening pattern 4 to be formed, and transmitted through the film layer 1. After observing the reference pattern with a two-dimensional camera and detecting the position coordinates of the reference pattern, the irradiation target of the laser beam L is set to the position coordinates of the reference pattern, and the laser beam is applied to one surface 1a of the film layer 1 L may be irradiated to form the first recess 5.

In any of the above cases, a projection type laser processing apparatus using a shadow mask in which a plurality of openings having similar shapes are provided in the first recess 5 is used, and the openings are reduced on one surface 1a of the film layer 1. It is good to project and form the some 1st recessed part 5 collectively. Note that FIG. 3 shows a case where a plurality of first recesses 5 shown in FIG.

Thereafter, as shown in FIG. 3 (a), the laser beam L is ablated on one surface 1a of the film layer 1 while stepping the laser beam L on the one surface 1a of the film layer 1 by a predetermined distance in the two-dimensional direction indicated by the arrow. As shown in FIG. 2B, a plurality of first recesses 5 are formed in one surface 1a of the film layer 1 in a vertical and horizontal matrix form.

Subsequently, the mask member 11 is turned upside down, and the surface from the magnetic metal material layer 2 side to the magnetic metal material layer 2 side of the film layer 1 (hereinafter referred to as “other surface 1b”) as shown in FIG. ) Is irradiated with the laser beam L, and the second recess 6 reaching the first recess 5 is formed in the portion of the film layer 1 corresponding to the gap 7 of the magnetic metal material layer 2. As a result, as shown in FIG. 3C, the first recess 5 and the second recess 6 are connected to form an opening pattern 4 penetrating the film layer 1. Preferably, the opening area of the second recess 6 is larger than the opening area of the first recess 5.

In this case, similarly to the above, a projection type laser processing apparatus using a shadow mask provided with a plurality of similar openings in the second recess 6 is used, and the plurality of openings are formed in the other surface 1b of the film layer 1. The plurality of second recesses 6 may be formed collectively by projecting a reduced portion.

Alternatively, the second recess 6 may be formed by using the laser light L corresponding to the area of the region including the plurality of first recesses 5 with the irradiation area. In this case, the magnetic metal material layer 2 functions as a mask, and the portion of the film layer 1 corresponding to the gap 7 of the magnetic metal material layer 2 is ablated to form the second recess 6.

Thereafter, as shown in FIG. 4A, the laser beam L is moved stepwise on the other surface 1b of the film layer 1 by a predetermined distance in the two-dimensional direction indicated by the arrow, and the other surface 1b of the film layer 1 is moved. Ablation is performed to form a plurality of second recesses 6 on the other surface 1b of the film layer 1 as shown in FIG. Thereby, the film-forming mask shown in FIG. 1 or FIG. 2 is formed.

As described above, according to the present invention, the laser beam L is irradiated from both sides of the film layer 1 to form the opening pattern 4, so one side of the film layer 1 (contact surface with the substrate) 1 a side The occurrence of burrs at the edge of the opening pattern 4 can be suppressed. Therefore, it is possible to prevent the burr of the opening pattern 4 from being a shadow of film formation, and to prevent a gap from being generated between the film layer 1 and the substrate due to the presence of the burr. Thereby, the formation precision of a thin film pattern including a shape and position accuracy can be improved.

In this case, if the second concave portion 6 having a larger area than the opening area of the first concave portion 5 is formed after the first concave portion 5 is formed, the generation of the burr can be further suppressed. Moreover, since the opening area of the 2nd recessed part 6 is larger than that of the 1st recessed part 5, the process positioning accuracy of the 2nd recessed part 6 can be made unnecessary.

Next, another example of forming the opening pattern 4 will be described.
FIG. 5 is a view for explaining a modified example of the formation of the opening pattern in the method for manufacturing a film forming mask according to the present invention. FIG. 5 is a cross-sectional view showing a through hole forming process, (a) shows the start of laser processing, b) shows the end of laser processing, and (c) is an enlarged sectional view of the through hole. FIG. 6 is a view for explaining a modified example of the formation of the opening pattern in the method for manufacturing a film formation mask according to the present invention. FIG. 6 is a cross-sectional view showing the step of forming the recesses. ) Indicates the end of laser processing, and (c) is an enlarged cross-sectional view of the recess.
First, as shown in FIG. 5 (a), one surface 1a of the film layer 1 is irradiated with a laser beam L to ablate the film layer 1, and a through-hole penetrating the film layer 1 as shown in FIG. 5 (c). 13 is provided.

Specifically, in the same manner as described above, for example, the laser beam is moved by a predetermined distance in a two-dimensional direction in a plane parallel to the surface of the mask member 11 with reference to the mask-side alignment mark 12 formed in advance. And the laser beam L is irradiated to the part corresponding to the clearance gap 7 of the magnetic metal material layer 2 in the one surface 1a of the film layer 1, and the through-hole 13 of the same shape as a thin film pattern is formed.

Alternatively, the mask member 11 is positioned and placed on a reference substrate provided with a reference pattern that is an irradiation target of the laser light L at a position corresponding to the opening pattern 4 to be formed, and transmitted through the film layer 1. After observing the reference pattern with a two-dimensional camera and detecting the position coordinates of the reference pattern, the irradiation target of the laser beam L is set to the position coordinates of the reference pattern, and the laser beam is applied to one surface 1a of the film layer 1 L may be irradiated to form the through hole 13.

Thereafter, as shown in FIG. 5 (a), the laser beam L is ablated on one surface 1a of the film layer 1 while stepping the laser beam L on the one surface 1a of the film layer 1 by a predetermined distance in the two-dimensional direction indicated by the arrow. As shown in FIG. 2B, a plurality of through holes 13 are formed in one surface 1a of the film layer 1 in a vertical and horizontal matrix form.

Subsequently, the mask member 11 is turned upside down, and the other surface 1b of the film layer 1 is irradiated with the laser light L from the magnetic metal material layer 2 side as shown in FIG. A recess 14 having an opening larger than the opening area of the through hole 13 is formed in the portion of the film layer 1 corresponding to the gap 7 of the film layer 1 while leaving a thin layer of about 1 μm to 4 μm on the one surface 1a side of the film layer 1. To do. Thereby, as shown in the figure (c), the opening pattern 4 comprised by the through-hole 13 and the recessed part 14 is formed in the film layer 1. FIG.

Thereafter, as shown in FIG. 6A, the laser beam L is moved stepwise on the other surface 1b of the film layer 1 by a predetermined distance in the two-dimensional direction indicated by the arrow, and the other surface 1b of the film layer 1 is moved. Ablation is performed to form a plurality of recesses 14 on the other surface 1b of the film layer 1 as shown in FIG. Thereby, the film-forming mask shown in FIG. 1 or FIG. 2 is formed.

Also in this case, since the opening pattern 4 is formed by irradiating the laser beam L from both sides of the film layer 1, the edge of the opening pattern 4 on the one side (contact surface with the substrate) 1a side of the film layer 1 Generation of burrs can be suppressed.

Therefore, the film formation mask according to the present invention can improve the adhesion to the substrate, and is suitable for vapor deposition formation of an organic EL layer including a light emitting layer of an organic EL display substrate, for example.

In the above description, the case where the film formation mask is provided with the frame 3 has been described. However, the present invention is not limited to this, and the frame 3 may be omitted.

DESCRIPTION OF SYMBOLS 1 ... Film layer 2 ... Magnetic metal material layer 4 ... Opening pattern 5 ... 1st recessed part 6 ... 2nd recessed part 7 ... Gap 8 ... Island pattern 13 ... Through-hole 14 ... Recessed part

Claims (20)

A method of manufacturing a film-forming mask having a structure in which a resin film layer provided with a predetermined opening pattern of a predetermined shape and a magnetic metal material layer provided with a gap having a size that can contain the opening pattern are laminated. There,
The method of manufacturing a film formation mask, wherein the opening pattern is formed by irradiating a portion of the film layer corresponding to the gap from both sides with laser light and penetrating the film layer. 2. The method of manufacturing a film formation mask according to claim 1, wherein the opening pattern has an opening area on the magnetic metal material layer side wider than an opening area on the opposite side to the magnetic metal material layer. The opening pattern is formed by irradiating a surface of the film layer opposite to the magnetic metal material layer with a laser beam to form a first recess having a certain depth, and then the film layer on the magnetic metal material layer side. 3. The method of manufacturing a film forming mask according to claim 1, wherein a second concave portion having a depth reaching the first concave portion is provided by irradiating the surface with laser light. 4. The opening pattern has a through-hole penetrating the film layer by irradiating a laser beam on the surface of the film layer opposite to the magnetic metal material layer, and then the magnetic metal material layer side of the film layer. The method of manufacturing a film forming mask according to claim 1, wherein the surface is formed by irradiating a laser beam on the surface to provide a concave portion having a certain depth. 3. The method of manufacturing a film forming mask according to claim 1, wherein the gap is a slit provided through the magnetic metal material layer. 4. The method of manufacturing a film forming mask according to claim 3, wherein the gap is a slit provided through the magnetic metal material layer. 5. The method of manufacturing a film forming mask according to claim 4, wherein the gap is a slit provided through the magnetic metal material layer. 3. The film formation mask according to claim 1, wherein the gap is a portion between the adjacent island patterns in a plurality of elongated island patterns forming a part of the magnetic metal material layer. Manufacturing method. 4. The film formation mask manufacturing method according to claim 3, wherein the gap is a portion between the adjacent island patterns in a plurality of elongated island patterns forming a part of the magnetic metal material layer. Method. 5. The film forming mask manufacturing method according to claim 4, wherein the gap is a portion between the adjacent island patterns in a plurality of elongated island patterns forming a part of the magnetic metal material layer. Method. A film-forming mask having a structure in which a resin film layer provided with a predetermined opening pattern of a predetermined shape and a magnetic metal material layer provided with a gap having a size capable of including the opening pattern are laminated,
The film formation mask, wherein the opening pattern is formed by irradiating a portion of the film layer corresponding to the gap from both sides with laser light and penetrating the film layer. 12. The deposition mask according to claim 11, wherein the opening pattern has an opening area on the magnetic metal material layer side wider than an opening area on the side opposite to the magnetic metal material layer. The opening pattern includes a first concave portion having a certain depth formed on a surface of the film layer opposite to the magnetic metal material layer, and a first recess formed on the surface of the film layer on the magnetic metal material layer side. The film-forming mask according to claim 11 or 12, comprising a second recess formed at a depth reaching the recess. The opening pattern includes a through hole formed by irradiating a laser beam on the surface of the film layer opposite to the magnetic metal material layer and penetrating the film layer, and the magnetic metal material layer of the film layer. The film-forming mask according to claim 11 or 12, comprising a concave portion having a constant depth formed by irradiating the side surface with laser light. 13. The film formation mask according to claim 11, wherein the gap is a slit provided through the magnetic metal material layer. 14. The film forming mask according to claim 13, wherein the gap is a slit provided through the magnetic metal material layer. 15. The film forming mask according to claim 14, wherein the gap is a slit provided through the magnetic metal material layer. The film formation mask according to claim 11 or 12, wherein the gap is a portion between adjacent island patterns in a plurality of elongated island patterns forming a part of the magnetic metal material layer. . 14. The film formation mask according to claim 13, wherein the gap is a portion between the adjacent island patterns in a plurality of elongated island patterns forming a part of the magnetic metal material layer. The film formation mask according to claim 14, wherein the gap is a portion between the adjacent island patterns in a plurality of elongated island patterns forming a part of the magnetic metal material layer.

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