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WO2014133367A1 - Module d'émission de lumière - Google Patents

Module d'émission de lumière Download PDF

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Publication number
WO2014133367A1
WO2014133367A1 PCT/KR2014/001701 KR2014001701W WO2014133367A1 WO 2014133367 A1 WO2014133367 A1 WO 2014133367A1 KR 2014001701 W KR2014001701 W KR 2014001701W WO 2014133367 A1 WO2014133367 A1 WO 2014133367A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
housing
emitting module
lens
diode chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2014/001701
Other languages
English (en)
Korean (ko)
Inventor
이종민
조양식
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seoul Semiconductor Co Ltd
Original Assignee
Seoul Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seoul Semiconductor Co Ltd filed Critical Seoul Semiconductor Co Ltd
Priority to US14/771,321 priority Critical patent/US9673358B2/en
Priority claimed from KR1020140024132A external-priority patent/KR20140108172A/ko
Publication of WO2014133367A1 publication Critical patent/WO2014133367A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses

Definitions

  • the present invention relates to a light emitting module, and more particularly, to a light emitting module that can not only improve appearance quality but also maximize light efficiency.
  • a portable terminal such as a mobile phone including a camera module as a medium for transmitting video information has been developed. It is becoming popular.
  • the camera module included in the mobile phone includes an image sensor that receives light from the outside and recognizes it as an image, and includes a light emitting module that manually provides light to a subject, for example, to satisfy various needs of consumers.
  • the light emitting module used in the camera module selectively provides light according to a shooting environment. Therefore, the light emitting module is positioned around the camera module and exposed from the outside.
  • the light emitting module used in the camera module according to the related art generally has a problem of deterioration in appearance quality in which the yellow phosphor is visible when the yellow phosphor is not driven because the yellow phosphor is located on a light emitting diode chip that emits blue light.
  • An object of the present invention is to provide a light emitting module that can not only improve appearance quality such as disconnection but also maximize light efficiency.
  • a light emitting module includes a circuit board; A light emitting diode chip flip-bonded on the circuit board; And a housing disposed on the circuit board and surrounding the light emitting diode chip, wherein the housing has a reflecting portion having a curvature structure on an inner wall surface of the recess, thereby improving light efficiency.
  • the reflector may further improve light efficiency by including reflective regions having a curvature structure divided into at least two or more according to the height of the housing.
  • the reflector may be disposed within the first reflector and the first height positioned within a second height defined as the first height or more based on a first height equal to or higher than the height of the light emitting diode chip with respect to the circuit board. And a second reflecting portion positioned, each of the first and second reflecting portions including reflective regions having a curvature structure divided into at least two or more according to the height of the housing.
  • the light emitting module of the first reflecting unit extends horizontally and continuously along the inner wall surface of the housing.
  • the second reflecting part has a protrusion protruding in a lateral direction of the light emitting diode chip, and the protruding portion is formed in plural numbers spaced apart along a side of the light emitting diode chip.
  • the protrusion faces the side of the light emitting diode chip.
  • the reflector includes a stepped portion positioned at an interface between the first reflector and the protrusion.
  • the housing includes a plurality of protrusions protruding upward in the upper direction and a plurality of grooves provided at the outer lower end thereof.
  • An electronic device may be accommodated in at least one of the grooves.
  • a lens is provided on an upper surface of the housing, and the lens is located inside the protrusion.
  • the upper surface of the housing includes a plurality of receiving grooves, a lens is provided on the upper surface of the housing, the lower surface of the lens includes a plurality of projections accommodated in the receiving groove.
  • the light emitting diode chip includes a semiconductor layer, a wavelength conversion layer covering upper and lower surfaces of a substrate on which electrode pads are formed, and a TiO 2 diffusion layer covering the wavelength conversion layer.
  • the housing includes a protrusion located on an upper surface, and the protrusion is positioned adjacent to the reflecting part.
  • a lens is positioned on the housing, and the lens has a stepped structure at an edge of a lower surface thereof, and has a Fresnel lens structure inside the stepped structure.
  • the stepped structure faces the upper surface and the protrusion of the housing.
  • the circuit board includes a recess for receiving the light emitting diode chip, the recess extending from the reflecting portion.
  • the lens located on the housing, further comprising an adhesive member or adhesive layer for fixing the lens and the housing, the lens comprises at least one of silicon, epoxy, glass, PMMA, the adhesive member or adhesive layer Silver epoxy.
  • the circuit board may include a lead frame or a conductive pattern, and may be a PCB board or a ceramic board.
  • the present invention is provided with a reflective portion having a concave curvature structure along an inner surface of a recess of a housing made of a metal material to reflect light emitted from the LED chip in various paths. Therefore, the light emitting module of the present invention has an advantage of maximizing light efficiency by minimizing light lost therein.
  • the housing of the present invention can maximize the light efficiency by reflecting all the light emitted from the LED chip in various directions by the plurality of reflection regions of the curvature structure divided according to the height of the inner surface of the recess.
  • the light emitting module of the present invention further includes a TiO 2 diffusion layer covering the wavelength conversion layer, thereby covering the wavelength conversion layer including the yellow fluorescent layer with a white color, thereby improving appearance quality.
  • the present invention can improve the adhesive force.
  • the present invention can minimize the alignment error because the lens is aligned on the housing by the stepped structure.
  • FIG. 1 is a perspective view illustrating a light emitting module according to a first embodiment of the present invention.
  • FIG. 2 is a plan view illustrating the light emitting module of FIG. 1.
  • FIG. 3 is a cross-sectional view illustrating a light emitting module cut along the line II ′ of FIG. 1.
  • FIG. 4A is a plan view of the lower portion of the LED chip of FIG. 1, and FIG. 4B is a cross-sectional view taken along the line A-A of FIG.
  • FIG. 5 is a plan view illustrating a light emitting module according to a second embodiment of the present invention.
  • FIG. 6 is a cross-sectional view illustrating a light emitting module cut along a line II-II ′ of FIG. 5.
  • FIG. 7 is a plan view illustrating a light emitting module according to a third embodiment of the present invention.
  • FIG. 8 is a cross-sectional view illustrating a light emitting module cut along a line III-III ′ of FIG. 7.
  • FIG. 9 is a perspective view illustrating a light emitting module according to a fourth embodiment of the present invention.
  • FIG. 10 is a cross-sectional view illustrating a light emitting module according to a fifth embodiment of the present invention.
  • FIG. 11 is a cross-sectional view illustrating a light emitting module according to a sixth embodiment of the present invention.
  • FIG. 12 is a cross-sectional view illustrating a light emitting module according to a seventh embodiment of the present invention.
  • FIG. 1 is a perspective view illustrating a light emitting module according to a first embodiment of the present invention
  • FIG. 2 is a plan view illustrating the light emitting module of FIG. 1
  • FIG. 3 is a light emission cut along the line II ′ of FIG. 1.
  • the light emitting module 100 includes a circuit board 110, a housing 120, a light emitting diode chip 10, and a lens 150. do.
  • the circuit board 110 may include a lead frame (not shown) or a conductive pattern (not shown).
  • the circuit board 110 may be a PCB substrate or a ceramic substrate.
  • the housing 120 surrounds the periphery of the light emitting diode chip 10 and is located on the circuit board 110.
  • the housing 120 is made of a metal material, and may be attached onto the circuit board 110 using a soldering process or a silicone resin.
  • the housing 120 has a recess in a central portion thereof, a reflection portion 130 on an inner side surface of the recess, a plurality of protrusions 121 located on an upper surface thereof, and a plurality of groove portions 122 provided on an outer edge thereof. ).
  • the reflector 130 has a seamless curvature structure along the inner surface of the recess.
  • the reflector 130 has a function of improving light efficiency of the light emitting module 100 by reflecting light emitted from the light emitting diode chip 10 in various directions.
  • the reflector 130 may further be formed of a material having a high reflectance.
  • the reflector 130 may be coated with Ag.
  • the Ag may be coated on the entire housing 120, and may be coated on the circuit board 110.
  • the light emitted from the light emitting diode chip 10 is reflected in various directions according to the point reflected by the curvature structure of the reflecting unit 130, thereby the light emitted and lost in the lateral direction of the light emitting diode chip 10. Can be prevented.
  • the plurality of grooves 122 provide a space in which electronic devices that may be included in the light emitting module 100 are mounted, such as a zener diode (not shown).
  • the grooves 122 are spaced apart from each other along the outer lower portion of the housing 120. More specifically, the groove 122 is located at the bottom edge of the housing 120.
  • the groove 122 is limited to the structure formed in the corner region of the housing 120 so that a part of the circuit board 110 is exposed, but not limited thereto, and the lower end portion of the housing 120 is not limited thereto. Accordingly, the circuit board 110 may include a groove structure exposing the circuit board 110.
  • the plurality of grooves 122 are separated from recesses in which the light emitting diode chip 10 is located, and have a function of improving light efficiency.
  • a light emitting module has a problem in that a light emitting diode chip and an electronic device are disposed in a recess to absorb or reflect light emitted from the light emitting diode chip, thereby reducing the light efficiency of the light emitting module.
  • the groove 122 is provided to allow the electronic devices to be separated from the recess and to be mounted on the circuit board 110 to prevent the light efficiency of the electronic devices from being absorbed and reflected.
  • the light emitting module 100 of the present invention is provided with a zener diode (not shown) in any one of the plurality of grooves 122.
  • the zener diode has a function of preventing damage to the light emitting diode chip 10 by static electricity from the outside. That is, the zener diode has a function for implementing a stable driving light emitting module 100.
  • the protrusion 121 has an align function for fixing the position of the lens 150.
  • the protrusion 121 may be spaced apart from the upper surface of the housing 120 by a predetermined interval and protrude upward from the upper surface of the housing 121.
  • the inner side surface of the protrusion 121 may face the outer side surface of the lens 150.
  • the lens 150 has a planar structure at an upper surface thereof and a wedge structure at a lower surface thereof.
  • the structure of the lens 150 is not limited, and may be variously changed.
  • the lens 150 may have a Fresnel lens structure.
  • the Fresnel lens may have a plurality of patterns, and the plurality of patterns may correspond to the shape of the recess.
  • the plurality of patterns may be a circular structure corresponding to the recess of the circular structure.
  • the plurality of patterns may have a shape different from the recess shape.
  • the plurality of patterns may have a rectangular structure different from a recess of a circular structure.
  • the lens 150 is aligned with the upper surface of the housing 120 by the protrusion 121.
  • the lens 150 may be coupled on the upper surface of the housing 120 by an adhesive member (not shown) or an adhesive material (not shown).
  • the lens 150 is not particularly limited and may be silicon, epoxy, glass, PMMA, or the like.
  • the adhesive member (not shown) or the adhesive material (not shown) may be an epoxy.
  • the housing 120 of the present invention is made of a metal material and is provided with a reflective portion 130 having a concave curvature structure along the inner surface of the recess to reflect the light emitted from the LED chip 10 in various paths. You can. Therefore, the light emitting module 100 of the present invention has an advantage of maximizing light efficiency by minimizing light lost therein.
  • the light emitting diode chip 10 will be described in detail with reference to FIG. 4.
  • FIG. 4A is a plan view of the lower portion of the LED chip of FIG. 1, and FIG. 4B is a cross-sectional view taken along the line A-A of FIG.
  • the light emitting diode chip 10 of the present invention is flip bonded onto the direct circuit board 110 without using a bonding wire. Since the LED chip does not use a wire when bonding on the circuit board 110, it does not require a molding part to protect the wire, and removes a part of the wavelength conversion layer 50 to expose the bonding pad. No need to do it. Therefore, by adopting the light emitting diode chip 10, color deviation and luminance unevenness can be eliminated, and a module manufacturing process can be simplified as compared with using a light emitting diode chip using a bonding wire.
  • the light emitting diode chip 10 is a flip chip type semiconductor chip formed of a gallium nitride based compound semiconductor and may emit ultraviolet light or blue light.
  • the light emitting diode chip 10 includes a wavelength conversion layer 50.
  • the wavelength conversion layer 50 covers the light emitting diode chip 10.
  • a conformal coated wavelength converting layer 50 such as a phosphor layer, may be formed on the light emitting diode chip 10, and may convert the light emitted from the light emitting diode chip 10 to wavelength convert.
  • the wavelength conversion layer 50 is coated on the LED chip 10 and may cover the upper surface and the side surface of the LED chip 10.
  • the wavelength conversion layer 50 of the present invention is composed of, for example, a yellow fluorescent layer on the light emitting diode chip 10 emitting blue light.
  • the light emitting diode chip 10 further includes a TiO 2 diffusion layer 70 covering the wavelength conversion layer 50.
  • the TiO 2 diffusion layer 70 may cover both the upper surface and the side surface of the wavelength conversion layer 50.
  • the TiO 2 diffusion layer 70 covers the wavelength conversion layer 50 having a yellow color by a yellow fluorescent layer and converts the appearance into a white color, thereby improving appearance quality.
  • the conformal coated wavelength conversion layer 50 and the TiO 2 diffusion layer 70 are formed in advance when the LED chip 10 is manufactured and are formed on the circuit board 110 together with the LED chip 10. Can be mounted on
  • a first conductive semiconductor layer 23 is formed on the growth substrate 21, and a plurality of mesas M spaced apart from each other are formed on the first conductive semiconductor layer 23.
  • the plurality of mesas M may include an active layer 25 and a second conductivity type semiconductor layer 27, respectively.
  • the active layer 25 is positioned between the first conductive semiconductor layer 23 and the second conductive semiconductor layer 27.
  • the reflective electrodes 30 are positioned on the plurality of mesas M, respectively.
  • the plurality of mesas M may be formed on the growth substrate 21 by forming an epitaxial layer including the first conductive semiconductor layer 23, the active layer 25, and the second conductive semiconductor layer 27. After growing using the same, the second conductive semiconductor layer 27 and the active layer 25 may be formed by patterning the first conductive semiconductor layer 23 to expose the first conductive semiconductor layer 23. Sides of the plurality of mesas M may be formed to be inclined by using a technique such as photoresist reflow. The inclined profile of the mesa (M) side improves the extraction efficiency of the light generated in the active layer 25.
  • the plurality of mesas M may have an elongated shape extending in parallel to each other in one direction as shown. This shape simplifies forming a plurality of mesas M of the same shape in the plurality of chip regions on the growth substrate 21.
  • the reflective electrodes 30 may be formed on each mesa M after the plurality of mesas M are formed, but is not limited thereto.
  • the second conductive semiconductor layer 27 may be grown and mesas. It may be formed in advance on the second conductivity-type semiconductor layer 27 before forming (M).
  • the reflective electrode 30 covers most of the upper surface of the mesa M, and has a shape substantially the same as the planar shape of the mesa M.
  • the reflective electrodes 30 may include a reflective layer 28 and may further include a barrier layer 29.
  • the barrier layer 29 may cover the top and side surfaces of the reflective layer 28.
  • an edge of the first conductivity type semiconductor layer 23 may also be etched. Accordingly, the upper surface of the substrate 21 may be exposed. Side surfaces of the first conductivity-type semiconductor layer 23 may also be formed to be inclined.
  • a lower insulating layer 31 is formed to cover the plurality of mesas M and the first conductive semiconductor layer 23.
  • the lower insulating layer 31 has openings to allow electrical connection to the first conductive semiconductor layer 23 and the second conductive semiconductor layer 27 in a specific region.
  • the lower insulating layer 31 may have openings exposing the first conductivity type semiconductor layer 23 and openings exposing the reflective electrodes 30.
  • the current spreading layer 33 is formed on the lower insulating layer 31.
  • the current spreading layer 33 covers the plurality of mesas M and the first conductive semiconductor layer 23.
  • the current spreading layer 33 has openings located in the upper region of each mesa M to expose the reflective electrodes.
  • the current spreading layer 33 may be in ohmic contact with the first conductive semiconductor layer 23 through the openings of the lower insulating layer 31.
  • the current spreading layer 33 is insulated from the plurality of mesas M and the reflective electrodes 30 by the lower insulating layer 31.
  • An upper insulating layer 35 is formed on the current spreading layer 33.
  • the upper insulating layer 35 has openings that expose the reflective electrodes 30, with openings that expose the current spreading layer 33.
  • the first pad 37a and the second pad 37b are formed on the upper insulating layer 35.
  • the first pad 37a is connected to the current spreading layer 33 through the opening of the upper insulating layer 35
  • the second pad 37b is connected to the reflective electrodes 30 through the openings of the upper insulating layer 35.
  • Connect to The first pad 37a and the second pad 37b may be connected to bumps or used as pads for SMT to mount the light emitting diode to a submount, package, or printed circuit board.
  • the light emitting diode chip 10 includes a wavelength conversion layer 50 covering all of regions except for one surface of the first and second pads 37a and 37b which are grounded with a package or a printed circuit board.
  • a TiO 2 diffusion layer 70 is formed to cover the wavelength conversion layer 50.
  • FIG. 5 is a plan view illustrating a light emitting module according to a second exemplary embodiment of the present invention
  • FIG. 6 is a cross-sectional view illustrating a light emitting module cut along a line II-II ′ of FIG. 5.
  • the light emitting module 200 according to the second embodiment of the present invention may include the light emitting module 100 according to the first embodiment except for the housing 220. Since they are the same, the same reference numerals are used and detailed description thereof will be omitted.
  • the housing 220 surrounds the periphery of the light emitting diode chip 10 and is located on the circuit board 110.
  • the housing 220 is made of a metal material and may be attached onto the circuit board 110 using a soldering process or a silicone resin.
  • the housing 220 has a recess in a central portion thereof, a reflecting portion 230 on an inner side surface of the recess, a plurality of protrusions 221 located on an upper surface thereof, and a plurality of groove portions 222 disposed on an outer edge thereof. ).
  • the reflector 230 has a seamless curvature structure along the inner surface of the recess.
  • the reflector 230 may be further formed of a material having a high reflectance.
  • the reflector 230 may be coated with Ag.
  • the Ag may be coated on the entire housing 220, and may be coated on the circuit board 110.
  • the reflector 230 has first to fourth reflective regions 231 to 234 divided in an upward direction based on the circuit board 110.
  • the first to fourth reflective regions 231 to 234 may be divided according to the heights h1 to h4 of the housing 230.
  • Each of the first to fourth reflective regions 231 to 234 has a curvature structure that is seamless in the horizontal direction. More specifically, the first to fourth reflective regions 231 to 234 have a curvature structure surrounding the light emitting diode chip 10.
  • Light emitted from the light emitting diode chip 10 is reflected in various directions by the curvature structure of the first to fourth reflective regions 231 to 234 divided according to the heights h1 to h4 of the housing 220.
  • the reflector 230 includes a plurality of first to fourth reflective regions 231 to 234 divided according to the heights h1 to h4 of the housing 220.
  • the light emitted from the chip 10 may be reflected in various directions to improve light efficiency of the light emitting module 200.
  • the light emitted from the light emitting diode chip 10 is reflected in various directions according to the point reflected by the curvature structure of the reflecting unit 230, thereby the light emitted and lost in the lateral direction of the light emitting diode chip 10. Can be prevented.
  • the reflector 230 defines a curvature structure of the first to fourth reflective regions 231 to 234 divided into four according to the height h1 to h4 of the housing 220 in the second embodiment of the present invention. Although not limited thereto, the reflector 230 may include all of the structures divided into at least two or more according to the height of the housing 220.
  • the light emitting module 200 according to the second embodiment of the present invention described above has a plurality of curvatures divided in the recess inner surface of the metal housing 220 according to the height h1 to h4 of the housing 220.
  • a reflector 230 including first to fourth reflective regions 231 to 234 having a structure may be provided to reflect light emitted from the LED chip 10 through various paths. Therefore, the light emitting module 200 of the present invention has an advantage of maximizing light efficiency by minimizing light lost therein.
  • FIG. 7 is a plan view illustrating a light emitting module according to a third embodiment of the present invention
  • FIG. 8 is a cross-sectional view illustrating a light emitting module cut along a line III-III ′ of FIG. 7.
  • the light emitting module 300 according to the third embodiment of the present invention is the light emitting module (100 of FIG. 1) according to the first embodiment except for the housing 320. Since they are the same, the same reference numerals are used and detailed description thereof will be omitted.
  • the housing 320 surrounds the periphery of the light emitting diode chip 10 and is located on the circuit board 110.
  • the housing 320 is made of a metal material, and may be attached onto the circuit board 110 using a soldering process or a silicone resin.
  • the housing 320 has a recess in a central portion thereof, and includes first and second reflectors 330 and 340 on the inner side of the recess, a plurality of protrusions 321 located on the upper surface, and an outer edge thereof. It includes a plurality of grooves 322 provided.
  • the second reflector 340 is positioned within the first height h1 based on the circuit board 110, and the first reflector 330 is the overall height of the housing 320 except for the first height h1. It is located within the fifth height h5 defined by.
  • the first and second reflectors 330 and 340 may further be formed of a material having high reflectance.
  • the first and second reflectors 330 and 340 may be coated with Ag.
  • the Ag may be coated on the entire housing 320 and may be coated on the circuit board 110.
  • the first reflector 330 has a seamless curvature structure along the inner surface of the recess.
  • the first reflector 330 has first to fourth reflective regions 331 to 334 divided in an upper direction above the first height h1 based on the circuit board 110.
  • the first to fourth reflective regions 331 to 334 may be divided according to the height of the housing 320. That is, the first to fourth reflective regions 331 to 334 may be divided above the first height h1 of the housing 320.
  • Each of the first to fourth reflective regions 331 to 334 has a curvature structure that is seamless in the horizontal direction. More specifically, the first to fourth reflective regions 331 to 334 have a curvature structure surrounding the light emitting diode chip 10.
  • the light emitted from the light emitting diode chip 10 has a curvature structure of the first to fourth reflective regions 331 to 334 divided within the fifth height h5 except for the first height h1 of the housing 320. Are reflected in various directions.
  • the second reflector 340 may be formed to be spaced apart at a predetermined interval in the horizontal direction within the first height h1.
  • the second reflector 340 has a function of compensating for a gap between both side surfaces of the light emitting diode chip 10 and the housing 320. More specifically, the side surface of the light emitting diode chip 10 and the lower end of the inner surface of the housing 320 have different intervals according to the structure of the light emitting diode chip 10. For example, an interval between an edge of the LED chip 10 and an inner surface of the housing 320 is smaller than an interval between a side region of the LED chip 10 and an inner surface of the housing 320. Therefore, the light reflected from the housing 320 may be minutely uneven in the corner region and the side region of the light emitting diode chip 10.
  • the second reflecting unit 340 of the present invention has a function of compensating for non-uniform light due to the difference in distance between the side surface of the LED chip 10 and the lower end of the inner surface of the housing 320.
  • the second reflector 340 is formed in plural along the inner surface of the recess so as to correspond to four side surfaces of the LED chip 10.
  • the second reflector 340 has a linear structure symmetrical with four sides of the light emitting diode chip 10 based on the plan view of FIG. 7.
  • the second reflector 340 faces the side surface of the light emitting diode chip 10 within the first height h1 of the housing 320 to protrude toward the inner surface of the light emitting diode chip 10.
  • a protrusion 341 and a stepped portion 343 formed by the protrusion 341 are included.
  • the protrusion 341 includes fifth and sixth reflective regions 341a and 341b divided in an upper direction of the housing 320.
  • the fifth and sixth reflective regions 341a and 341b may be divided according to the height of the housing 320 within the first height h1.
  • the fifth and sixth reflecting regions 341a and 341b have a curvature structure divided in the second reflecting portion 340.
  • the light emitted from the outside of the light emitting diode chip 10 is diverted in various directions by the curvature structures of the fifth and sixth reflective regions 341a and 341b divided within the first height h1 of the housing 320. Reflected.
  • the first height h1 has a height higher than or equal to that of the LED chip 10.
  • the second reflector 340 of the present invention has been described with a limited curvature structure of the fifth and sixth reflective regions 341a and 341b divided into two, but is not limited thereto, and the curvature structure divided into at least three or more. It may include.
  • the step part 343 may be formed at a boundary area between the protrusion part 341 and the first reflecting part 330.
  • the first and second reflective parts 330 and 340 according to the third exemplary embodiment of the present invention may include a plurality of first to sixth reflective areas 331 to 334, 341a and 341b divided according to the height of the housing 320. Including the light reflected from the light emitting diode chip 10 in a variety of directions for all the light emitted from the light emitting module 300 can be improved.
  • the light emitting module 300 reflects the light emitted from the side surface of the light emitting diode chip 10 by the second reflecting unit 340, thereby providing the light emitting diode chip 10. Compensating for the minute difference of the reflected light due to the difference between the gap between the lower end of the inner surface of the housing 320 to prevent light loss and at the same time have an overall uniform light.
  • FIG. 9 is a perspective view illustrating a light emitting module according to a fourth embodiment of the present invention.
  • the light emitting module 400 includes a circuit board 110, a housing 420, a light emitting diode chip (not shown), and a lens 450.
  • the housing 420 surrounds a periphery of a light emitting diode chip (not shown) and is located on the circuit board 110.
  • the housing 420 is made of a metal material and may be attached onto the circuit board 110 using a soldering process or a silicone resin.
  • the housing 420 has a recess in a central portion thereof, a reflection portion (not shown) on an inner side surface of the recess, a plurality of receiving grooves 421 located on an upper surface thereof, and a plurality of groove portions provided on an outer edge thereof. 422.
  • the plurality of receiving grooves 421 may be formed around the upper edge region of the housing 420.
  • the plurality of receiving grooves 421 accommodate a plurality of protrusions 451 formed on the lower surface of the lens 450.
  • the protrusion 451 may be formed around a lower edge region of the lens 450, and may have a structure protruding downward of the lens 450.
  • the protrusion 451 and the receiving groove 421 may be formed in the same shape.
  • the lens 450 has the plurality of protrusions 451 accommodated in the plurality of accommodation grooves 421 of the housing 420 and is aligned on the upper surface of the housing 420.
  • the lens 450 may be coupled on the upper surface of the housing 420 by an adhesive member (not shown) or an adhesive material (not shown).
  • the plurality of grooves 422 provide a space in which electronic devices that may be included in the light emitting module 400 are mounted, such as a zener diode (not shown).
  • the groove 422 is spaced apart from each other along an outer lower portion of the housing 420. More specifically, the groove 422 is located at the bottom edge of the housing 420.
  • the groove 422 is limited to the structure formed in the corner region of the housing 420 so that a part of the circuit board 110 is exposed, but not limited to this, the lower end of the housing 420 Accordingly, the circuit board 110 may include a groove structure exposing the circuit board 110.
  • the light emitting module 400 of the present invention is provided with a zener diode (not shown) in any one of the plurality of grooves 422.
  • the inner surface structure of the housing 420 of the light emitting module 400 according to the fourth embodiment of the present invention may be any one of the inner surface structures of the housings according to the first to third embodiments of the present invention.
  • FIG. 10 is a cross-sectional view illustrating a light emitting module according to a fifth embodiment of the present invention.
  • the light emitting module 500 has all configurations except the housing 520 and the lens 550. 3 and the same as 100), the same reference numerals are written together, and detailed description thereof will be omitted.
  • the housing 520 is disposed on the circuit board 110 and surrounds the LED chip 10 mounted on the circuit board 110.
  • the circuit board 110 may include a lead frame (not shown) or a conductive pattern (not shown), and may be a PCB substrate or a ceramic substrate.
  • the housing 520 has a recess in a central portion thereof, and includes a protrusion 521 disposed on an upper surface thereof, and a reflecting portion 530 positioned on an inner surface thereof.
  • the reflector 530 has a function of improving light efficiency of the light emitting module 500 by reflecting light emitted from the LED chip 10 in various directions.
  • the reflector 530 has a seamless curvature structure along the inner surface of the recess.
  • the reflective part 530 is limited to one curvature structure, but the present invention is not limited thereto, and the reflective part 530 may include a plurality of reflective areas divided in the vertical direction.
  • the reflector 530 may be further formed of a material having a high reflectance.
  • the reflector 530 may be coated with Ag.
  • the Ag may be coated on the entire housing 520, and may be coated on the circuit board 110.
  • the protrusion 521 is positioned in an area adjacent to the reflector 530.
  • the protrusion 521 protrudes in a ring type along the edge of the recess on the upper surface.
  • the protrusion 521 is limited to a ring type, but is not limited thereto, and may be variously changed according to the shape of the recess.
  • the upper surface and the protrusion 521 are in contact with the lens 550.
  • the lens 550 includes a top surface of a flat planar structure and a bottom surface having a stepped structure 551 at an edge thereof.
  • the lens 550 may be changed according to the shape of the recess.
  • the stepped structure 551 faces the upper surface and the protrusion 521 of the housing.
  • the stepped structure 551 may be in surface contact with the top surface and the protrusion 521 of the housing 520.
  • the lens 550 is not particularly limited, and may be silicon, epoxy, glass, PMMA, or the like.
  • an adhesive layer (not shown) is positioned between the stepped structure 551 and the upper surface of the housing 520 and the protrusion 521.
  • the adhesive layer (not shown) may be epoxy.
  • the lower surface of the lens 550 may be changed according to the shape of the recess.
  • the lower surface of the lens 550 may be a Fresnel lens type.
  • the Fresnel lens may have a plurality of patterns, and the plurality of patterns may correspond to the shape of the recess.
  • the plurality of patterns may be a circular structure corresponding to the recess of the circular structure.
  • the plurality of patterns may have a shape different from the recess shape.
  • the plurality of patterns may have a rectangular structure different from a recess of a circular structure.
  • the present invention may include a reflector 530 having a curvature structure along the inner surface of the recess to reflect light emitted from the LED chip 10 through various paths. Therefore, the light emitting module 500 of the present invention has an advantage of maximizing light efficiency by minimizing light lost therein.
  • the contact area with the housing 520 is widened by the lens 550 having the stepped structure 551, thereby improving adhesion.
  • the present invention can minimize the alignment error because the lens 550 is aligned on the housing 520 by the stepped structure 551.
  • FIG. 11 is a cross-sectional view illustrating a light emitting module according to a sixth embodiment of the present invention.
  • the circuit board 610 has a concave portion 611 that accommodates the light emitting diode chip 10 on an upper surface thereof.
  • the concave portion 611 includes an inclined inner surface, and the inclined surface reflects light emitted from the light emitting diode chip 10.
  • the inner side surface of the concave portion 611 may extend from the reflecting portion 530 of the curvature structure.
  • the circuit board 610 may include a lead frame (not shown) or a conductive pattern (not shown), and may be a PCB substrate or a ceramic substrate.
  • the concave portion 611 and the reflecting portion 530 are limited to the structure in which they are described. However, the concave portion 611 may be spaced at a predetermined interval in the inward direction of the reflecting portion 530. .
  • the present invention includes a housing 520 having a curvature reflecting portion 530 along the inner surface of the recess and a circuit board 610 having a recess 611 for receiving the light emitting diode chip 100.
  • Light emitted from the diode chip 10 may be reflected by various paths. Therefore, the light emitting module 600 of the present invention has an advantage of maximizing light efficiency by minimizing light lost therein.
  • the adhesive force may be improved.
  • the present invention can minimize the alignment error because the lens 550 is aligned on the housing 520 by the stepped structure 551.
  • FIG. 12 is a cross-sectional view illustrating a light emitting module according to a seventh embodiment of the present invention.
  • the light emitting module 700 includes a circuit board 110, a light emitting diode package 710, and a housing 620.
  • the LED package 710 includes a LED chip and a lens mounted on a substrate.
  • the light emitting diode package 710 may be a top light emitting type.
  • the light emitting diode chip is not particularly limited and may be a vertical type or a horizontal type.
  • the light emitting diode package 710 is mounted on the circuit board 110.
  • the housing 620 is disposed on the circuit board 110 and has a recess 625 in the center thereof to accommodate the LED package 710.
  • the circuit board 110 may include a lead frame (not shown) or a conductive pattern (not shown), and may be a PCB substrate or a ceramic substrate.
  • the housing 620 includes a reflector 630 on an inner side surface.
  • the reflector 630 has a function of improving light efficiency of the light emitting module 700 by reflecting light emitted from the light emitting diode package 710 in various directions.
  • the reflector 630 has a seamless curvature structure along the inner surface of the recess 625.
  • the reflective part 630 is described with a limited curvature structure, but is not limited thereto and may be divided into a plurality of reflective areas in the vertical direction.
  • the reflector 630 may further be formed of a material having a high reflectance.
  • the reflector 630 may be coated with Ag.
  • the Ag may be coated on the entire housing 620 and may be coated on the circuit board 110.
  • the present invention may include a housing 620 having a reflective portion 630 having a curvature structure along an inner surface of the recess to reflect light emitted from the LED package 710 in various paths. Therefore, the light emitting module 700 of the present invention has an advantage of maximizing light efficiency by minimizing light lost therein.

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  • Led Device Packages (AREA)

Abstract

L'invention concerne un module d'émission de lumière pouvant non seulement améliorer la qualité d'aspect, mais également maximiser le rendement lumineux. Le module d'émission de lumière de l'invention comprend : une carte de circuit ; une puce de diodes électroluminescentes qui est connectée par billes sur la carte de circuit ; et un logement qui est positionné sur la carte de circuit et enveloppe la puce de diodes électroluminescentes, le logement présentant une partie réfléchissante pourvue d'une structure à courbure sur sa surface de paroi interne évidée, ce qui lui permet d'améliorer le rendement lumineux.
PCT/KR2014/001701 2013-02-28 2014-02-28 Module d'émission de lumière Ceased WO2014133367A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/771,321 US9673358B2 (en) 2013-02-28 2014-02-28 Light emitting module

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20130021941 2013-02-28
KR10-2013-0021941 2013-02-28
KR10-2014-0024132 2014-02-28
KR1020140024132A KR20140108172A (ko) 2013-02-28 2014-02-28 발광 모듈

Publications (1)

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WO2014133367A1 true WO2014133367A1 (fr) 2014-09-04

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Country Link
WO (1) WO2014133367A1 (fr)

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CN105355761A (zh) * 2014-09-18 2016-02-24 中山大学 一种光色均匀的led荧光粉封装结构及其透明模具
US10816230B2 (en) 2018-10-10 2020-10-27 Ademco Inc. Temperature sensing strategy with multiple temperature sensors
US10859281B2 (en) 2018-10-10 2020-12-08 Ademco Inc. Thermostat assembly with removable trim ring
US10895397B2 (en) 2018-10-10 2021-01-19 Ademco Inc. Wire detection for an HVAC controller
US10908001B2 (en) 2018-10-10 2021-02-02 Ademco Inc. Wireless sensor with mounting plate
US10907854B2 (en) 2018-10-10 2021-02-02 Ademco Inc. Automatic changeover mode in an HVAC controller with reversible deadband enforcement
US10907852B2 (en) 2018-10-10 2021-02-02 Ademco Inc. Remote sensor with improved occupancy sensing
US11067307B2 (en) 2018-10-10 2021-07-20 Ademco Inc. Thermostat user interface with smart menu structure
US11095469B2 (en) 2018-10-10 2021-08-17 Ademco Inc. Wireless occupancy sensor with controllable light indicator
CN113299813A (zh) * 2021-05-13 2021-08-24 Tcl华星光电技术有限公司 Led封装结构、led封装结构制作方法及显示模组
US11236923B2 (en) 2018-10-10 2022-02-01 Ademco Inc. Thermostat with sensor priority screen

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JP2009087596A (ja) * 2007-09-28 2009-04-23 Puratekku:Kk リフレクタ及び照明器具並びに照明モジュール
KR20090119505A (ko) * 2008-05-16 2009-11-19 (주) 아모엘이디 전자부품 패키지
US20100327302A1 (en) * 2009-06-30 2010-12-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led module
JP2011249855A (ja) * 2007-08-02 2011-12-08 Lextar Electronics Corp 発光ダイオードパッケージ
JP2013012529A (ja) * 2011-06-28 2013-01-17 Citizen Electronics Co Ltd Ｌｅｄパッケージ

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JP2011249855A (ja) * 2007-08-02 2011-12-08 Lextar Electronics Corp 発光ダイオードパッケージ
JP2009087596A (ja) * 2007-09-28 2009-04-23 Puratekku:Kk リフレクタ及び照明器具並びに照明モジュール
KR20090119505A (ko) * 2008-05-16 2009-11-19 (주) 아모엘이디 전자부품 패키지
US20100327302A1 (en) * 2009-06-30 2010-12-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led module
JP2013012529A (ja) * 2011-06-28 2013-01-17 Citizen Electronics Co Ltd Ｌｅｄパッケージ

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105355761A (zh) * 2014-09-18 2016-02-24 中山大学 一种光色均匀的led荧光粉封装结构及其透明模具
CN105355761B (zh) * 2014-09-18 2018-08-28 中山大学 一种光色均匀的led荧光粉封装结构及其透明模具
US10907854B2 (en) 2018-10-10 2021-02-02 Ademco Inc. Automatic changeover mode in an HVAC controller with reversible deadband enforcement
US10859281B2 (en) 2018-10-10 2020-12-08 Ademco Inc. Thermostat assembly with removable trim ring
US10895397B2 (en) 2018-10-10 2021-01-19 Ademco Inc. Wire detection for an HVAC controller
US10908001B2 (en) 2018-10-10 2021-02-02 Ademco Inc. Wireless sensor with mounting plate
US10816230B2 (en) 2018-10-10 2020-10-27 Ademco Inc. Temperature sensing strategy with multiple temperature sensors
US10907852B2 (en) 2018-10-10 2021-02-02 Ademco Inc. Remote sensor with improved occupancy sensing
US11067307B2 (en) 2018-10-10 2021-07-20 Ademco Inc. Thermostat user interface with smart menu structure
US11095469B2 (en) 2018-10-10 2021-08-17 Ademco Inc. Wireless occupancy sensor with controllable light indicator
US11236923B2 (en) 2018-10-10 2022-02-01 Ademco Inc. Thermostat with sensor priority screen
US11708991B2 (en) 2018-10-10 2023-07-25 Ademco Inc. Automatic changeover mode in an HVAC controller with reversible deadband enforcement
CN113299813A (zh) * 2021-05-13 2021-08-24 Tcl华星光电技术有限公司 Led封装结构、led封装结构制作方法及显示模组
CN113299813B (zh) * 2021-05-13 2022-11-08 Tcl华星光电技术有限公司 Led封装结构、led封装结构制作方法及显示模组

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