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WO2014020673A1 - Procédé permettant de produire un module de cellule solaire et module de cellule solaire - Google Patents

Procédé permettant de produire un module de cellule solaire et module de cellule solaire Download PDF

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Publication number
WO2014020673A1
WO2014020673A1 PCT/JP2012/069388 JP2012069388W WO2014020673A1 WO 2014020673 A1 WO2014020673 A1 WO 2014020673A1 JP 2012069388 W JP2012069388 W JP 2012069388W WO 2014020673 A1 WO2014020673 A1 WO 2014020673A1
Authority
WO
WIPO (PCT)
Prior art keywords
solar cell
cell module
connection electrode
crimping
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2012/069388
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English (en)
Japanese (ja)
Inventor
翔士 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to PCT/JP2012/069388 priority Critical patent/WO2014020673A1/fr
Priority to JP2014527846A priority patent/JP5934985B2/ja
Publication of WO2014020673A1 publication Critical patent/WO2014020673A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to a method for manufacturing a solar cell module and a solar cell module manufactured thereby.
  • thermosetting conductive paste As one of the conductor formation methods for solar cells, a method using a thermosetting conductive paste is known.
  • the thermosetting conductive paste is applied to a substrate or the like by screen printing or the like, and is heat-treated at a temperature of about 100 ° C. to 300 ° C., so that the resin is cured and a conductive electrode is formed.
  • thermosetting conductive paste containing conductive particles and a resin two or more kinds of conductive particles may be mixed and used, and the shape of the conductive particles may be spherical, flaky, or dendritic.
  • limiting such as a shape and a fibrous form, it is said that powder particles are easy to contact each other and it is advantageous at an electroconductive point.
  • connection between the solar cell and the connection electrode it is to secure the connection between the solar cell and the connection electrode by balancing the adhesive strength between the solar cell and the connection electrode and the strength of the connection electrode itself.
  • the method for manufacturing a solar cell module according to the present invention includes arranging a wiring material via an adhesive on a connection electrode of a solar cell, and pressing a crimping tool against the solar cell on which the wiring material is arranged with a predetermined pressure.
  • the adhesive is heated to a curing temperature or higher and cured, and the predetermined crimping pressure of the crimping tool is such that the crimping pressure at the end of the solar cell along the longitudinal direction of the wiring material is greater than the crimping pressure at the center of the solar cell. Is also low.
  • a solar cell module includes a solar cell having a connection electrode and a wiring material connected to the connection electrode via an adhesive, and the strength of the connection electrode itself is the length of the wiring material.
  • the edge of the solar cell along the direction is weaker than the center of the solar cell.
  • connection between the solar cell and the connection electrode can be secured at the end of the solar cell, which is an important part for the connection between the solar cell and the wiring member.
  • FIG. 1 it is a figure which shows the process which forms the electrode for a connection of a solar cell with the electrically conductive paste which becomes a network structure by heating.
  • FIG. 1 it is a figure which shows the process which arrange
  • FIG. 1 it is a figure which shows the process which sets a crimping
  • FIG. 4 it is a figure which shows distribution of pressure bonding pressure.
  • FIG. 1 is a flowchart showing a procedure of a method for manufacturing a solar cell module.
  • 2 to 4 are diagrams for explaining each procedure in this flowchart.
  • the solar cell module is formed by connecting a plurality of solar cells with a wiring material, a solar cell is prepared in order to manufacture the solar cell module.
  • the photoelectric conversion unit 11 is formed (S10).
  • FIG. 2 is a diagram showing the solar cell 10, FIG. 2 (a) is a plan view, and FIG. 2 (b) is a side view.
  • the solar cell 10 includes a photoelectric conversion unit 11 that generates light-generated carriers of holes and electrons by receiving light such as sunlight.
  • the solar cell 10 has, as main surfaces, a light receiving surface that is a surface on which light from the outside of the solar cell 10 is mainly incident and a back surface that is a surface opposite to the light receiving surface, but in the plan view of FIG. The light receiving surface is shown.
  • the photoelectric conversion unit 11 includes a substrate made of a semiconductor material such as crystalline silicon (c-Si), gallium arsenide (GaAs), indium phosphide (InP), for example.
  • the structure of the photoelectric conversion unit 11 is a pn junction in a broad sense.
  • a heterojunction of an n-type single crystal silicon substrate and amorphous silicon can be used.
  • a transparent conductive film (TCO) 12 composed of a conductive oxide is stacked, and an i-type amorphous silicon layer and an n-type amorphous silicon layer doped with phosphorus (P) or the like are formed on the back side of the substrate,
  • the transparent conductive film 13 can be laminated.
  • the photoelectric conversion unit 11 may have a structure other than this as long as it has a function of converting light such as sunlight into electricity.
  • a structure including a p-type polycrystalline silicon substrate, an n-type diffusion layer formed on the light-receiving surface side, and an aluminum metal film formed on the back surface side may be used.
  • connection electrode 20 on the light receiving surface side is formed on the light receiving surface of the solar cell 10.
  • the connection electrode 20 on the light receiving surface side is formed by printing a conductive paste in a predetermined pattern on the surface of the transparent conductive film 12.
  • the conductive paste is obtained by mixing conductive particles into a resin using a solvent.
  • conductive pastes which can be used properly according to the application.
  • a conductive paste in which conductive particles such as silver (Ag) are dispersed in a binder resin can be used.
  • the connection electrode 20 is formed using a sintered conductive paste that becomes a network structure by heating, as an improvement in conductivity (S11).
  • the network structure is a structure in which conductive particles are fused to each other. For example, by heating a conductive paste containing conductive particles, the conductive particles can be fused together to form a network structure.
  • the network structure is a structure in which 50% or more of conductive particles observed under a microscope are fused to each other.
  • the sintered conductive paste that becomes a network structure by heating is obtained by mixing a plurality of spherical powders 21 with a resin such as an epoxy resin using a solvent.
  • the spherical powder 21 is a substantially spherical conductive particle.
  • the conductive paste is heated, the spherical powders 21 are fused together to form a network structure. Due to this network structure, the conductivity of the connection electrode 20 is improved.
  • the connection electrode 20 may contain flakes in addition to the spherical powder 21.
  • Flakes refer to conductive particles having a ratio of major axis to thickness of powder particles (major axis / thickness) ⁇ 10 and an average particle diameter of about 2 to 5 ⁇ m or more.
  • the flakes can be obtained, for example, by crushing the spherical powder 21 into a flat shape. Since the flakes have an action of dividing the network structure, the flakes have a function of relieving stress caused by fusion.
  • the mixing ratio of the spherical powder 21 and the flakes can be determined based on the balance between the improvement of conductivity and stress relaxation.
  • a finger electrode is disposed in addition to the bus bar electrode serving as the connection electrode 20. In FIG. 2, the finger electrode is not shown.
  • the finger electrode is a thin wire electrode that collects electricity from the entire light receiving surface but is thinned so as to reduce the light shielding property.
  • the finger electrode and the bus bar electrode are arranged orthogonally to each other and electrically connected.
  • the width of the finger electrode is preferably about 30 ⁇ m to 150 ⁇ m, and the thickness is preferably about 10 ⁇ m to 80 ⁇ m.
  • the interval between adjacent finger electrodes is preferably about 0.5 mm to 3 mm.
  • the width of the bus bar electrode as the connection electrode 20 is preferably about 50 ⁇ m to 3 mm, and the thickness is preferably about 10 ⁇ m to 160 ⁇ m.
  • connection electrode 23 on the back surface side is formed on the surface of the transparent conductive film 13 on the back surface side of the photoelectric conversion unit 11.
  • the connection electrode 23 on the back surface side is also formed using a sintered conductive paste containing the spherical powder 21 and having a network structure by heating.
  • the connection electrode 23 on the back surface side may further contain flakes in addition to the spherical powder 21.
  • the wiring material is arranged.
  • the wiring material 25 is arranged on the connection electrode 20 on the light receiving surface side of the solar cell 10 via the adhesive 24, and similarly, the adhesive 26 is applied on the connection electrode 23 on the back surface side of the solar cell 10.
  • the wiring material 27 is placed through the wire, and it is pressed lightly so as not to separate from each other and heated to an appropriate temperature (S12).
  • FIG. 3 is a diagram showing the solar cell module in a state where the wiring members 25 and 27 are arranged on the connection electrodes 20 and 23 via the adhesives 24 and 26, and FIG. (B) is a side view.
  • the wiring members 25 and 27 are thin plates made of a metal conductive material such as copper. Instead of a thin plate, a stranded wire can be used. As the conductive material, in addition to copper, silver, aluminum, nickel, tin, gold, or an alloy thereof can be used.
  • the wiring member 25 is preferably arranged so as to cover the connection electrode 20 along the arrangement direction of the connection electrode 20 on the light receiving surface side of the solar cell 10, and the width of the wiring member 25 is set to be the connection electrode 20. It is better to set it to be the same as or slightly thicker. Similarly, the width of the wiring member 27 on the back surface side may be set to be the same as or slightly thicker than the width of the connection electrode 23 on the back surface side.
  • the adhesive 24 is disposed between the connection electrode 20 and the wiring member 25 on the light receiving surface side, electrically connects the connection electrode 20 and the wiring member 25, and the light receiving surface side of the solar cell 10 and the wiring member. 25 is used for mechanically fixing.
  • the adhesive 26 is disposed between the connection electrode 23 on the back surface side and the wiring material 27, electrically connects the connection electrode 23 and the wiring material 27, and connects the back surface side of the solar cell 10 and the wiring. Used to mechanically fix the material 27.
  • thermosetting resin adhesives such as acrylic, highly flexible polyurethane, or epoxy can be used.
  • the curing temperature ⁇ H of the adhesives 24 and 26 is selected between about 130 ° C. and 300 ° C. from the heat resistance of the solar cell 10 and the like.
  • the adhesives 24 and 26 include conductive particles.
  • conductive particles nickel, silver, nickel with gold coating, copper with tin plating, or the like can be used.
  • insulating resin adhesives that do not contain conductive particles can also be used. In this case, one or both of the facing surfaces of the wiring members 25 and 27 or the connecting electrodes 20 and 23 are made uneven so that the wiring member 27 and the connecting electrode 20 are connected. Resin is appropriately removed from between the electrodes 23 to establish electrical connection.
  • the light receiving surface side is bonded by an adhesive force between the facing surfaces of the wiring member 25 and the connection electrode 20 and an adhesive force by a resin fillet formed on the light receiving surface of the solar cell 10 and the side surface of the wiring member 25.
  • adhesion is caused by the adhesive force between the facing surfaces of the wiring member 27 and the connection electrode 23 and the adhesive force by the resin fillet formed on the light receiving surface of the solar cell 10 and the side surface of the wiring member 27. Is done.
  • the crimping process is performed.
  • a crimping tool designed so that a low crimping pressure is applied to the end of the solar cell 10 on which the wiring members 25 and 27 are arranged is set (S13), and the crimping tool is pressed to a predetermined pressing pressure. This is a process of curing the adhesive by pressing at a predetermined temperature (S14).
  • FIG. 3 shows the positional relationship between the end portion and the center portion, but the end portion is a region on the end face side of the solar cell 10 in the longitudinal direction of the wiring members 25 and 27.
  • the end region can be determined in consideration of the contribution of the photogenerated carriers of the solar cell 10 to the current collection. For example, with respect to the total number of finger electrodes, a region having a predetermined number counted from the end face of the solar cell 10 can be set as the end. Or it can be set as the area
  • FIG. 4 is a diagram illustrating a state in which a crimping process is performed using a crimping tool.
  • the crimping tool includes a lower tool 30 and an upper tool 31 that moves up and down relatively with respect to the lower tool 30.
  • the solar cell on which the wiring material is arranged is placed on the lower tool 30, and the upper tool 31 is moved upward with respect to the lower tool 30.
  • This is a device that lowers the tool 31 and applies a predetermined pressing force F to the upper tool 31 against the lower tool 30.
  • the heating parts 32 and 33 are arrange
  • a resistance wire heater, a heating lamp, a heating air supply device, or the like can be used.
  • the crimping tool is a pressure heating device.
  • the lower tool 30 and the upper tool 31 have a convex shape in which the central portion protrudes from the end portion on the crimping surface.
  • a gap is generated between the end of the lower tool 30 and the wiring member 27 in a part surrounded by a broken-line circle, and a gap is generated between the end of the upper tool 31 and the wiring member 25. Showed this. Note that the size of the gap in FIG. 4 is exaggerated for explanation.
  • the shape of the central portion protruding from the end portion is such that the central portion is flat and the gap gradually increases from the flat portion toward the end surface.
  • the degree of increase in the gap is preferably determined experimentally. Depending on the experimental result, for example, the gap may be increased linearly toward the end face, or may be increased in a curved manner.
  • FIG. 4 one lower tool 30 and one upper tool 31 are shown, but as shown in FIGS. 2 and 3, there are three wiring members 25 and 27 in parallel. Accordingly, three lower tools 30 can be provided in parallel, and three upper tools 31 can be provided in parallel. In this case, one lower tool and one upper tool that face each other with one wiring member interposed therebetween form a pair. For example, three pairs may be integrated and moved up and down relatively.
  • the heating temperature ⁇ in the crimping process is set to be equal to or higher than the curing temperature of the adhesives 24 and 26.
  • ⁇ is set to a higher temperature as the heating time determined by the cycle time of the crimping process is shorter. For example, when the heating time can be taken sufficiently long, ⁇ can be set as the curing temperature, but when the heating time is several seconds, ⁇ is set to a temperature higher than the curing temperature.
  • the pressing force F is set so that the pressure P is 0.1 MPa to 0.2 MPa.
  • the pressing force F is a load force applied from the upper tool 31 to the lower tool 30, and has a dimension of N (Newton).
  • the pressure P is a force per unit area having a dimension of N / m 2 and applied to the surface where the lower tool 30 and the wiring member 27 are in contact and the surface where the upper tool 31 and the wiring member 27 are in contact.
  • the amount of deformation in the thickness direction is large at the center of the solar cell, and the amount of deformation in the thickness direction is small at the end.
  • the amount of deformation is the total thickness from the wiring material 25 on the light receiving surface side to the wiring material 27 on the back surface side. In the central portion where the amount of deformation is large, a large compressive stress is applied in the thickness direction, but the compressive stress received at the end portion where the amount of deformation is small is small. This compressive stress corresponds to the pressure P.
  • FIG. 5 shows the distribution of the pressure P.
  • the horizontal axis is the position of the solar cell along the longitudinal direction of the wiring material, and the vertical axis is the pressure P.
  • P P 0 is a constant value, and the pressure P is gradually reduced from P 0 toward the end face of the solar cell from the boundary between the central part and the end part.
  • the remaining process for obtaining the solar cell module is performed (S15).
  • the solar cell module subjected to the crimping process is positioned between the light-receiving surface side protection member and the back-surface side protection member, and the filler is provided between the light-receiving surface-side protection member and the back surface-side protection member.
  • Place. Frames are arranged at the ends of the light receiving surface side protective member and the back surface side protective member.
  • a transparent plate or film is used as the protective member on the light receiving surface side.
  • a translucent member such as a glass plate, a resin plate, or a resin film can be used.
  • the protective member on the back surface side the same protective member as that on the light receiving surface side can be used.
  • an opaque plate or film can be used as the protective member on the back side.
  • a laminated film such as a resin film having an aluminum foil inside can be used.
  • EVA, EEA, PVB, silicone resin, urethane resin, acrylic resin, epoxy resin, or the like can be used.
  • connection electrodes 34 and 35 may be made thinner than the thickness of the central portion.
  • the connection electrodes 34 and 35 can be crimped using the lower tool 36 and the upper tool 37 whose entire crimping surface is flat. Thereby, the crimping surfaces of the lower tool 36 and the upper tool 37 can be flattened from the center to the end, and a crimping tool common to the prior art can be used.
  • a gap is formed between the end portion of the connection electrode 35 on the back surface side and the wiring member 27 in a portion surrounded by a broken-line circle, and the end portion of the connection electrode 34 on the light receiving surface side and the wiring member 25. This was shown by the gap between the two. As in FIG. 4, the size of the gap is exaggerated for the sake of explanation. In the shape in which the thickness of the end portion is thinner than the thickness of the central portion, the thickness of the central portion is constant, and the thickness gradually decreases from the central portion toward the end surface. The degree of thickness reduction should be determined experimentally. Depending on the experimental result, for example, the thickness may be decreased linearly toward the end face, or may be decreased in a curved manner.
  • the pressure at the end of the solar cell 10 is lower than the pressure at the center so that the end of the solar cell 10 is an important part for the connection between the solar cell 10 and the wiring members 25 and 27. This is because the connection between the solar cell 10 and the connection electrodes 20 and 23 is suppressed and the connection is secured.
  • FIG. 7 shows a cross-sectional view of the light receiving surface side of the solar cell 10 in order to explain the separation regarding the connection between the solar cell 10 and the wiring members 25 and 27.
  • the first is peeling of the first junction between the transparent conductive film 12 on the photoelectric conversion unit 11 and the connection electrode 20.
  • the first junction is shown as (12-20).
  • the second is peeling between electrodes between the connection electrodes 20 itself. In FIG. 7, this portion is shown as (20-20).
  • the third is peeling of the second joint between the connection electrode 20 and the wiring member 25 via the adhesive 24.
  • the second junction is shown as (20-25).
  • the boundary between the photoelectric conversion unit 11 and the transparent conductive film 12 and the separation between the wiring materials between the wiring material 25 itself can be considered, but these hardly cause the separation.
  • the crimping pressure of the central portion and the end portion of the solar cell 10 is the same.
  • peeling tends to occur at the first bonding portion.
  • the strength of the connection electrode 20 itself is increased because the bonding strength of the network structure is strong. Therefore, if the adhesive strength of the first joint is relatively weak and the pressure bonding stress is too high, the possibility that peeling may occur in the first joint increases.
  • the first junction is an electrical junction for taking out current from the solar cell 10, if peeling occurs, it is a problem even if the connection electrode 20 itself and the second junction are strong. Therefore, prevention of peeling of the first joint is important.
  • the wiring member 25 is bent between the adjacent solar cells 10, and is generated in the wiring member 25 at an adhesive portion with the wiring member 25 near the end of the solar cell 10 near the bent portion. Stress is often concentrated. Therefore, it is highly necessary to suppress peeling at the first junction at the end of the solar cell 10.
  • FIG. 8 is a diagram showing the rate of occurrence of peeling in the first bonding when the pressure bonding pressure distribution is shown in FIG.
  • the horizontal axis is the same as in FIG. 5, the solar cell position along the longitudinal direction of the wiring members 25 and 27, and the vertical axis is the (12-20) mode peeling rate.
  • the (12-20) mode peeling rate refers to the location where peeling occurred in the peeling test of the solar cell module, and peeling occurred at the location (12-20) which is the first bonding described in FIG. It is a value obtained by dividing the number by the total number of peeling.
  • the (12-20) mode peeling rate is lower than the central portion at the end of the solar cell 10.
  • the strength of the fusion aggregation of the conductive particles at the connection electrodes 20 and 23 is at the center at the end. Become weaker. Therefore, at the end portion of the solar cell 10, the adhesive strength of the first bonding is relatively stronger than the strength of the fusion aggregation of the conductive particles in the connection electrodes 20 and 23.
  • peeling at the connection electrodes 20 and 23 is more likely to occur at the end portion of the solar cell 10 than at the first junction, and the (12-20) mode peeling rate at the end portion of the solar cell 10 is the central portion.
  • the (12-20) mode peeling rate at the end portion of the solar cell 10 is the central portion.
  • FIG. 9 and FIG. 10 are diagrams for explaining the effect of the above-described pressure bonding pressure. These figures are diagrams showing the peeling at the end of the solar cell in the result of the peeling test of the solar cell module, and FIG. 9 is a comparative example in which the crimping pressure at the end is the same as the crimping pressure at the center. FIG. 7 shows a case where the crimping stress distribution shown in FIG. 5 is used.
  • the solar cell is connected to the solar cell at the end of the solar cell, which is an important part for the connection between the solar cell and the wiring material. Connection between the electrodes can be secured.

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Abstract

Selon la présente invention, dans la procédure de ce procédé permettant de produire un module de cellule solaire, une unité de conversion photoélectrique est formée (S10), une électrode de raccordement est formée à partir d'une pâte conductrice qui est destinée à former une structure de réseau par chauffage (S11), un matériau de câblage est disposé au niveau de l'électrode de raccordement, un adhésif étant agencé entre ces derniers (S12), on pose un joint serti qui transmet une faible pression de sertissage aux extrémités de la cellule solaire (S13) et le résultat est pressé à une contrainte de sertissage prédéterminée et chauffé à une température prédéterminée (S14). Ensuite, les procédés restants pour former un module de cellule solaire sont effectués (S15). Comme outil de sertissage, il est possible d'utiliser celui qui présente une forme convexe dont la partie centrale de la surface de sertissage fait saillie par comparaison avec les extrémités de cette dernière. En lieu et place de ceci, il est également possible que la surface de sertissage de l'outil de sertissage soit plate, ce qui rend l'épaisseur des extrémités de l'électrode de raccordement plus mince que celle de la partie centrale.
PCT/JP2012/069388 2012-07-31 2012-07-31 Procédé permettant de produire un module de cellule solaire et module de cellule solaire Ceased WO2014020673A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2012/069388 WO2014020673A1 (fr) 2012-07-31 2012-07-31 Procédé permettant de produire un module de cellule solaire et module de cellule solaire
JP2014527846A JP5934985B2 (ja) 2012-07-31 2012-07-31 太陽電池モジュールの製造方法及び太陽電池モジュール

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Application Number Priority Date Filing Date Title
PCT/JP2012/069388 WO2014020673A1 (fr) 2012-07-31 2012-07-31 Procédé permettant de produire un module de cellule solaire et module de cellule solaire

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018107217A (ja) * 2016-12-22 2018-07-05 パナソニックＩｐマネジメント株式会社 太陽電池モジュールの製造方法及び太陽電池モジュール
CN111009596A (zh) * 2019-12-18 2020-04-14 许娟娣 一种可自动投料的太阳能组件覆膜压边装置

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JP2008010857A (ja) * 2006-05-30 2008-01-17 Kyocera Corp 太陽電池モジュール
WO2009090915A1 (fr) * 2008-01-17 2009-07-23 Nichia Corporation Procédé de production d'un matériau conducteur, matériau conducteur obtenu grâce au procédé, dispositif électronique contenant le matériau conducteur, dispositif électroluminescent, et procédé de fabrication d'un dispositif électroluminescent
WO2012057125A1 (fr) * 2010-10-26 2012-05-03 三洋電機株式会社 Procédé de production d'un module de cellules solaires

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102727A (ja) * 1999-09-28 2001-04-13 Seiko Epson Corp 樹脂フィルムの仮圧着ツールの構造
JP2008010857A (ja) * 2006-05-30 2008-01-17 Kyocera Corp 太陽電池モジュール
WO2009090915A1 (fr) * 2008-01-17 2009-07-23 Nichia Corporation Procédé de production d'un matériau conducteur, matériau conducteur obtenu grâce au procédé, dispositif électronique contenant le matériau conducteur, dispositif électroluminescent, et procédé de fabrication d'un dispositif électroluminescent
WO2012057125A1 (fr) * 2010-10-26 2012-05-03 三洋電機株式会社 Procédé de production d'un module de cellules solaires

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018107217A (ja) * 2016-12-22 2018-07-05 パナソニックＩｐマネジメント株式会社 太陽電池モジュールの製造方法及び太陽電池モジュール
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