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WO2014073534A1 - Dispositif d'affichage électroluminescent organique et procédé de fabrication de celui-ci - Google Patents

Dispositif d'affichage électroluminescent organique et procédé de fabrication de celui-ci Download PDF

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Publication number
WO2014073534A1
WO2014073534A1 PCT/JP2013/079905 JP2013079905W WO2014073534A1 WO 2014073534 A1 WO2014073534 A1 WO 2014073534A1 JP 2013079905 W JP2013079905 W JP 2013079905W WO 2014073534 A1 WO2014073534 A1 WO 2014073534A1
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WO
WIPO (PCT)
Prior art keywords
layer
organic electroluminescent
substrate
resin
liquid repellent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/079905
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English (en)
Japanese (ja)
Inventor
剛 平瀬
通 園田
岡本　哲也
亨 妹尾
有希 安田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of WO2014073534A1 publication Critical patent/WO2014073534A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • the present invention relates to an organic electroluminescent display device and a method for manufacturing the same, and more particularly to a technique for imparting moisture resistance to an organic electroluminescent display device.
  • Organic electroluminescence device is a self-luminous element, excellent in viewing angle, contrast, etc., and does not require a backlight, so it can be reduced in weight and thickness, and is advantageous from the viewpoint of power consumption. .
  • it since it has a high response speed and consists entirely of individuals, it is strong against external impact, has a wide operating temperature range, and has a merit that the manufacturing method is simple and inexpensive.
  • the organic light emitting element used in the organic electroluminescence device is made of an organic material and is vulnerable to moisture resistance.
  • the frit sealing is a technique in which a frit material is disposed as a sealing material around the upper and lower substrates constituting the organic electroluminescent device, and the frit material is locally heated and solidified by a laser to be sealed.
  • a configuration using an epoxy resin with low hygroscopicity as a sealing material is employed.
  • the gas barrier property is considerably inferior to that of the inorganic material only by the resin.
  • a desiccant is arranged between the upper and lower substrates constituting the organic electroluminescent device to improve the moisture resistance.
  • ODF Open Drop Fill
  • ODF was developed as a liquid crystal panel manufacturing technology, specifically, a method in which liquid crystal is dropped on a substrate before laminating the glass substrate, and another glass is laminated and bonded.
  • the ODF resin method is a sealing technique for an organic electroluminescence device, and is a method similar to ODF.
  • FIG. 4 is a cross-sectional view of a conventional organic electroluminescent device filled with resin by the ODF resin method.
  • the manufacturing process of the organic electroluminescent device 100 shown in FIG. 4 is roughly as follows. First, the light emitting layer 15 including the organic light emitting element is provided on the first substrate 12. Next, the sealing material 13 is disposed around the first substrate 12 and the second substrate 14. Thereafter, the resin material 16 is dropped, the second substrate 14 is overlaid on the first substrate 12, the sealing material 13 and the resin material 16 are cured by UV or thermosetting, and the substrates 12 and 14 are bonded together.
  • Patent Document 1 listed below describes a structure for forming a protective film (inorganic film or organic protective film, or a double layer thereof) for protecting an organic light emitting element in an organic electroluminescent device.
  • Patent Document 2 listed below discloses a frit sealing technique in which a glass frit for sealing a substrate is applied to the outer periphery and irradiated with a laser when sealing the substrate of an organic electroluminescence device.
  • Japanese Patent Publication Japanese Patent Laid-Open No. 2006-12785 (published on January 12, 2006)” Japanese Patent Publication “Japanese Patent Laid-Open No. 2007-200890 (published on August 9, 2007)”
  • none of the above conventional techniques can sufficiently improve the moisture resistance of the organic electroluminescent device with a simple configuration.
  • FIG. 5 is a cross-sectional view of a conventional organic electroluminescent device 101 in which an inorganic film 19 is formed on the light emitting layer 15 that is a layer of an organic light emitting element.
  • the inorganic film 19 may be damaged (element degradation) 17 to the internal elements due to the occurrence of film stress due to temperature changes and the occurrence of cracks 20 or the like.
  • moisture penetrates from pinholes, cracks, or bulk of the seal portion generated in the inorganic film, thereby reducing the performance.
  • the desiccant 18 is disposed between the upper and lower substrates constituting the organic electroluminescent device, a process for disposing the desiccant 18 is required, and it is difficult to reduce the thickness of the device.
  • an object of the present invention is to provide a technique capable of improving the moisture resistance of an organic electroluminescent device with a simple configuration.
  • an organic electroluminescent device includes: (1) a first substrate; (2) In an organic electroluminescent device comprising: a light emitting element layer including at least one organic electroluminescent element located on the first substrate; and (3) a protective layer formed on the light emitting element layer. , (4) a liquid repellent layer formed so as to cover the protective layer; (5) a second substrate for sealing the first substrate; It is characterized by including.
  • FIGS. 1 to 3 An embodiment of the organic electroluminescent device of the present invention will be described with reference to FIGS. 1 to 3 as follows.
  • FIG. 1 is a cross-sectional view showing an example of an organic electroluminescent device according to the present invention.
  • the organic electroluminescent device 1 includes a first substrate 2 and a second substrate 4, a light emitting element layer 5 provided on the upper surface of the first substrate 2, and a position on the light emitting element layer 5.
  • a sealing material 3 for sealing the substrate 4 is included.
  • the light emitting element layer 5 includes at least one organic electroluminescent element (for example, an organic EL element).
  • the protective layer 6 may be an inorganic film or an organic film (parylene layer) and then an inorganic film.
  • the protective layer 6 has a role of protecting the light emitting element layer 5 so as not to be damaged by a plurality of steps performed after the light emitting element layer 5 is provided on the first substrate 2.
  • the inorganic film can be made of a combination of substances using materials such as SiN, SiON, and Al 2 O 3 . By using the above material, an effect of easily forming an inorganic film can be obtained.
  • the organic film can be a parylene film. Since the organic film is formed of a parylene film, the upper and side portions of the light emitting element layer 5 are also protected, and thus the effect of protecting the light emitting element layer 5 with high hydrophobicity, solvent resistance, and chemical resistance. Will improve. In addition, it is a material that is evenly coated on fine pinholes and cracks regardless of the shape of the object to be coated and has excellent insulation properties, so that the organic light emitting device can be protected more stably in the subsequent process. be able to.
  • the liquid repellent layer 7 may be a double layer of a resin layer formed so as to cover the protective layer 6 and a water repellent layer (liquid repellent film) formed so as to cover the resin layer.
  • the liquid repellent film may be a liquid repellent film formed by laminating a liquid repellent material on a resin layer, or the resin layer is subjected to plasma wave treatment or microwave treatment with fluorine gas or the like to impart liquid repellency.
  • a liquid film may be used.
  • the resin layer may be a combination of one or more substances selected from the group consisting of epoxy resin, acrylic resin, and silicon resin.
  • An epoxy resin is a very excellent resin, and is a resin that is easy to handle because it emits less volatile organic compounds (VOC) and has low toxicity and flammability. Further, since almost no volatile substances are produced, the curing shrinkage rate is small, and the heat resistance, moisture resistance, water resistance, chemical resistance and weather resistance are excellent. Moreover, in terms of curability, the composition can be cured at room temperature while being one-component, and can be cured in a short time because the usable energy level of ultraviolet rays is extremely high.
  • VOC volatile organic compounds
  • acrylic Since acrylic has excellent fluidity, it has an effect that it can be formed flat on the entire substrate.
  • Silicone resin is a resin excellent in water repellency and heat resistance.
  • a layer of an inorganic film such as SiN / SiON / Al 2 O 3 is formed by sputtering or CVD.
  • the entire surface of the inorganic film is filled with an epoxy resin, acrylic, or silicon material to form a resin layer, and the surface of the resin layer is subjected to a liquid repellent treatment.
  • the resin material for forming the resin layer covering the upper part of the inorganic layer By using the resin material for forming the resin layer covering the upper part of the inorganic layer, cracks in the inorganic film due to thermal expansion can be prevented. As a result, it is possible to block the slight residual moisture inside the apparatus or the intrusion of moisture attached to the glass surface, and the moisture-proof property is improved.
  • the water repellency can be further increased by using a resin layer covering the top of the inorganic layer as a resin layer having liquid repellency.
  • the barrier property is dramatically improved, damage to the organic light emitting device is reduced, and the life of the organic light emitting device is increased. Eventually, non-light emitting portions called dark spots are reduced, and as a result, dark defects are also reduced.
  • the organic electroluminescent device 1 can be divided into a pixel region I and a non-pixel region II provided around the pixel region I.
  • a pixel region I a plurality of pixels are arranged in a matrix, and each pixel is provided with an organic film layer 31 that emits light according to an image signal.
  • the organic film layer 31 is sandwiched between a first electrode 32 as an anode and a second electrode 33 as a cathode.
  • the first electrode 32 is electrically connected to the thin film transistor 34.
  • the thin film transistor 34 includes a source electrode 34a connected to a source wiring for supplying an image signal, a drain electrode 34b connected to the first electrode 32, and a gate electrode 34c to which a gate signal for controlling on / off of the thin film transistor 34 is supplied.
  • a semiconductor layer 34d connected to the source electrode 34a and the drain electrode 34b.
  • the thin film transistor 34 is covered with a planarizing film 41 such as an acrylic resin or a polyimide resin.
  • the first electrode 32, the organic film layer 31, and the second electrode 33 are formed on the planarizing film 41.
  • a pixel definition film 42 is stacked on the planarization film 41, and the second electrode 33 covers the pixel definition film 42.
  • a first metal wiring 51 is provided on the substrate 2 via a buffer layer 43 and a gate insulating film 44, and an insulating film 45 is provided on the first metal wiring 51.
  • Second metal wiring 52 is provided.
  • the first metal wiring 51 is used as a common power supply line
  • the second metal wiring 52 is electrically connected to the second electrode 33 and used as a power supply line for the second electrode 33.
  • the light emitting element layer 5 is formed on the upper surface of the first substrate 2.
  • the first substrate 2 can use glass.
  • a protective layer 6 is formed on the upper surface of the light emitting element layer 5.
  • the protective layer 6 may form an inorganic film after providing an inorganic film or an organic film (parylene layer).
  • the inorganic film may be made of a combination of substances using materials such as SiN / SiON / Al 2 O 3 .
  • the layer of the inorganic film such as SiN / SiON / Al 2 O 3 is provided by sputtering or CVD.
  • the CVD method refers to a method of obtaining at least one kind of solid reactive organism by supplying a raw material in a gas state and reacting it on the solid surface.
  • a mixed gas of a gas (which may be a plurality) containing a product element and a carrier gas (which may not be used) is used.
  • the organic film can be a parylene film.
  • the parylene can easily form a thin film on a normal temperature substrate by vapor deposition.
  • a liquid repellent layer 7 is formed on the protective layer 6.
  • the liquid repellent layer 7 is formed from a resin layer having liquid repellency so as to cover the protective layer 6.
  • the resin layer is provided with liquid repellency by laminating a liquid repellent material on the resin layer or by subjecting the resin layer to plasma wave treatment or microwave treatment with fluorine gas or the like.
  • the resin layer is preferably formed with a thickness of 1 ⁇ m to 50 ⁇ m.
  • liquid repellent layer 7 made of a resin layer on the protective layer 6
  • film stress due to thermal expansion does not occur, cracks can be prevented, and internal elements are not damaged and sealed.
  • the sealing material 3 is applied to the peripheral portion of the first substrate 2, and the first substrate 2 and the second substrate 4 are opposed to each other and bonded.
  • the second substrate 4 is irradiated with ultraviolet rays (UV) or the organic electroluminescent device 1 is heated to form the sealing material 3 and the liquid repellent layer 7 and / or the liquid repellent layer 8. Is cured. Thereby, the first substrate 2 is sealed by the second substrate 4 through the sealing material 3.
  • UV ultraviolet rays
  • the UV curing is performed at 0.5 to 10 J, preferably 1 to 6 J, particularly for the resin area.
  • baking is performed in the air in the range of 60 ° C. to 120 ° C. or 70 ° C. to 120 ° C. for 10 minutes to 2 hours and cured.
  • the bonding process of the first substrate 2 and the second substrate 4 is desirably performed in a dry atmosphere (dew point temperature of ⁇ 30 ° C. or lower, preferably ⁇ 70 ° C. or lower) or a vacuum atmosphere. It is because there exists an effect of degassing contained in antioxidant and a resin agent.
  • the liquid repellent layer 7 is formed by forming, for example, a Teflon (registered trademark) coating film as a fluororesin coating film on the surface of the resin layer.
  • the liquid repellent layer 7 may be formed by an adhesive layer having excellent liquid repellency.
  • the adhesive layer may be provided on the first substrate 2 by dropping a liquid adhesive onto the first substrate 2 by the ODF resin method described above, and the second substrate 4 may be bonded thereon.
  • the first substrate 2 on which the light emitting element layer 5 and the protective layer 6 have been formed may be bonded to the second substrate 4 by dropping a liquid adhesive onto the second substrate 4.
  • FIG. 1 shows a state in which there is a gap around the liquid repellent layer 7, but when the liquid repellent layer 7 is formed of an adhesive layer having excellent liquid repellency, the gap is eliminated.
  • the adhesive may be filled between the first substrate 2 and the second substrate 4. At that time, the first substrate 2 and the second substrate 4 are bonded together in a vacuum atmosphere (100 Pa or less), and pressure is applied in a vacuum environment while uniformly spreading the adhesive (or resin) to be filled.
  • an organic electroluminescent device (1) includes: (1) the first substrate (2); (2) a light emitting element layer (5) located on the first substrate (2) and including at least one organic electroluminescent element; (3) In an organic electroluminescent device (1) comprising a protective layer (6) formed on the light emitting element layer (5), (4) a liquid repellent layer (7) formed so as to cover the protective layer (6); (5) a second substrate (4) for sealing the first substrate (2); It is characterized by including.
  • the liquid repellent layer that covers the protective layer on the light emitting element layer
  • the liquid repellent layer improves the barrier property to block the ingress of moisture.
  • the protective layer is covered with the liquid repellent layer, the protective layer is less susceptible to the influence of the temperature change as compared with the case where the protective layer is not covered with the liquid repellent layer. Therefore, the generation of cracks in the protective layer is suppressed. As a result, since the intrusion of moisture through the crack as in the conventional case is prevented, the barrier property due to the provision of the liquid repellent layer is further improved.
  • the liquid repellent layer (7) is preferably composed of a resin layer and a liquid repellent film (liquid repellent layer 8) formed so as to cover the resin layer.
  • the “liquid-repellent film formed so as to cover the resin layer” may be a liquid-repellent film formed by laminating a liquid-repellent material on the resin layer, or the resin layer is subjected to plasma treatment with fluorine gas etc. It may be a liquid-repellent film having properties.
  • the liquid repellent layer is composed of a resin layer and a liquid repellent film formed so as to cover the resin layer, so that the intrusion of moisture is blocked and acid and alkali that adversely affect the organic light emitting element can be blocked.
  • the damage given to the organic light emitting device is reduced, which contributes to the extension of the lifetime of the organic light emitting device.
  • non-light emitting portions called dark spots are reduced, and as a result, dark defects are also reduced.
  • the liquid repellent layer is preferably composed of a resin layer having liquid repellency.
  • the liquid repellent layer is made of a resin layer having liquid repellency, so that the manufacturing process is simplified as compared with the configuration in which the liquid repellent material is laminated on the resin layer.
  • the intrusion of moisture is blocked, and it is possible to block acids and alkalis that adversely affect the organic light emitting device.
  • the damage given to the organic light emitting device is reduced, which contributes to the extension of the lifetime of the organic light emitting device.
  • non-light emitting portions called dark spots are reduced, and as a result, dark defects are also reduced.
  • the liquid repellent layer is composed of a resin layer and a liquid repellent film
  • the resin layer covered with the liquid repellent film is a resin layer having liquid repellency
  • the liquid repellent resin layer and the liquid repellent film are repelled. Since the protective layer can be double protected by the liquid film, the moisture resistance of the organic electroluminescent device can be further enhanced.
  • the resin layer is preferably made of one substance selected from the group consisting of epoxy resin, acrylic resin, and silicon resin, or a combination of these substances.
  • the resin layer is made of one substance selected from the group consisting of epoxy / acrylic / silicon materials or a combination of these substances, the resin layer is excellent in heat resistance, fluidity, etc., so that the resin layer can be easily formed. There is a further effect.
  • the epoxy resin is a resin excellent in heat resistance, moisture resistance, adhesiveness, and ease of handling. Moreover, in terms of curability, the composition can be cured at room temperature while being one-component, and can be cured in a short time because the usable energy level of ultraviolet rays is extremely high. Since the acrylic resin is excellent in fluidity, the entire substrate can be formed flat. Silicon resin is a resin excellent in water repellency and heat resistance.
  • the resin layer is preferably formed with a thickness of 1 ⁇ m to 50 ⁇ m.
  • the thickness of the resin layer is desirably set to 1 ⁇ m or more and 50 ⁇ m or less in consideration of the above points.
  • the particle suppression effect is about 1 ⁇ m or more and about 5 ⁇ m, it is considered that there is a sufficient effect.
  • the manufacturing method of the organic electroluminescent device (1) includes: (1) Organic electroluminescence comprising a first substrate, a light emitting element layer located on the first substrate and including at least one organic electroluminescent element, and a protective layer formed on the light emitting element layer In the device manufacturing method, (2) forming a liquid repellent layer so as to cover the protective layer; (3) sealing the first substrate with a second substrate; It is characterized by including.
  • the step of forming the liquid repellent layer (7) (2) forming a resin layer so as to cover the protective layer; (3) performing a plasma wave treatment or a microwave treatment on the resin layer in an atmosphere of a liquid repellent treatment gas; May be included.
  • liquid repellency can be obtained by performing liquid repellency treatment with plasma waves. Further excellent liquid repellency can be obtained by applying liquid repellency treatment with microwaves. No damage is observed in the OLED material by any liquid repellent treatment.
  • the present invention can be applied to all organic electroluminescent devices.

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Abstract

L'invention concerne un dispositif d'affichage électroluminescent organique qui comprend : un premier substrat (2) ; une couche d'élément électroluminescent (5) qui est positionné sur le premier substrat (2) et contient un premier élément électroluminescent ; une couche protectrice (6) qui est formée sur la couche d'élément électroluminescent (5) ; une couche à répulsion de liquide (7) qui est formée de façon à recouvrir la couche protectrice (6) ; et un second substrat (4) qui scelle le premier substrat (2).
PCT/JP2013/079905 2012-11-12 2013-11-05 Dispositif d'affichage électroluminescent organique et procédé de fabrication de celui-ci Ceased WO2014073534A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-248693 2012-11-12
JP2012248693 2012-11-12

Publications (1)

Publication Number Publication Date
WO2014073534A1 true WO2014073534A1 (fr) 2014-05-15

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019059016A1 (fr) * 2017-09-19 2019-03-28 国立研究開発法人理化学研究所 Dispositif électronique et son procédé de fabrication
CN109888128A (zh) * 2019-03-25 2019-06-14 京东方科技集团股份有限公司 Oled显示面板的封装方法及显示面板的制作方法
WO2019186901A1 (fr) * 2018-03-29 2019-10-03 シャープ株式会社 Procédé de production de dispositif d'affichage
JP2020092265A (ja) * 2018-12-05 2020-06-11 光寶光電（常州）有限公司 発光パッケージ構造及びその製造方法
US11401546B2 (en) 2017-09-29 2022-08-02 Seegene, Inc. Detection of target nucleic acid sequences by PTO cleavage and extension-dependent extension assay

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JP2005209412A (ja) * 2004-01-20 2005-08-04 Sanyo Electric Co Ltd 発光装置
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JP2010013735A (ja) * 2009-09-29 2010-01-21 Konica Minolta Holdings Inc 樹脂フィルムの製造方法及び該樹脂フィルムを用いた有機エレクトロルミネッセンス素子
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JP2001185346A (ja) * 1999-12-24 2001-07-06 Victor Co Of Japan Ltd 自発光式デバイス
JP2004237655A (ja) * 2003-02-07 2004-08-26 Kureha Chem Ind Co Ltd 交互積層防湿膜、その製造方法及び透明電極板付きの交互積層防湿膜
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019059016A1 (fr) * 2017-09-19 2019-03-28 国立研究開発法人理化学研究所 Dispositif électronique et son procédé de fabrication
JPWO2019059016A1 (ja) * 2017-09-19 2020-08-27 国立研究開発法人理化学研究所 電子デバイスおよびその製造方法
US11401546B2 (en) 2017-09-29 2022-08-02 Seegene, Inc. Detection of target nucleic acid sequences by PTO cleavage and extension-dependent extension assay
WO2019186901A1 (fr) * 2018-03-29 2019-10-03 シャープ株式会社 Procédé de production de dispositif d'affichage
JP2020092265A (ja) * 2018-12-05 2020-06-11 光寶光電（常州）有限公司 発光パッケージ構造及びその製造方法
JP7005578B2 (ja) 2018-12-05 2022-01-21 光寶光電（常州）有限公司 発光パッケージ構造及びその製造方法
US11522109B2 (en) 2018-12-05 2022-12-06 Lite-On Opto Technology (Changzhou) Co., Ltd. Light emitting package structure and method of manufacturing the same
CN109888128A (zh) * 2019-03-25 2019-06-14 京东方科技集团股份有限公司 Oled显示面板的封装方法及显示面板的制作方法

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