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WO2011004567A1 - Dispositif d’affichage électroluminescent organique et procédé pour sa fabrication - Google Patents

Dispositif d’affichage électroluminescent organique et procédé pour sa fabrication Download PDF

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Publication number
WO2011004567A1
WO2011004567A1 PCT/JP2010/004306 JP2010004306W WO2011004567A1 WO 2011004567 A1 WO2011004567 A1 WO 2011004567A1 JP 2010004306 W JP2010004306 W JP 2010004306W WO 2011004567 A1 WO2011004567 A1 WO 2011004567A1
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WIPO (PCT)
Prior art keywords
substrate
organic
frit glass
wall
sealing wall
Prior art date
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Ceased
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PCT/JP2010/004306
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English (en)
Japanese (ja)
Inventor
増田裕之
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Panasonic Corp
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Panasonic Corp
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Publication of WO2011004567A1 publication Critical patent/WO2011004567A1/fr
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Definitions

  • the present invention relates to an organic electroluminescence display device and a manufacturing method thereof, and more particularly, to an organic electroluminescence display device including an organic light emitting element sealed using two substrates and a frit glass sealing wall and a manufacturing method thereof.
  • organic EL elements are deteriorated by impurities such as moisture and oxygen. Therefore, in order to prevent the deterioration of the organic EL element, various techniques for protecting the organic EL element from moisture, oxygen and the like are currently proposed.
  • a technique for protecting an organic EL element from moisture and oxygen by forming a passivation film on the organic EL element that is, sealing the organic EL element with a thin film.
  • the condition that the oxygen permeability per day is 10 ⁇ 3 cc / m 2 or less and the moisture permeability is 10 ⁇ 6 g / m 2 or less is satisfied. It is necessary to form a passivation film.
  • a silicon nitride film (SiN) or silicon oxynitride film (SiON) having a thickness of 5 ⁇ m to 10 ⁇ m is laminated on the organic EL element as a passivation film.
  • Patent Document 1 and Patent Document 2 disclose a technique for sealing an organic EL element formed between two substrates using two substrates and frit glass.
  • FIG. 1 is a cross-sectional view showing a configuration of a conventional organic EL display device 100 described in Patent Document 1.
  • a conventional organic EL display device 100 shown in FIG. 1 includes a substrate 110, an organic EL element 120, an electrode 130, a frit glass 140, a sealing substrate 150, and a sealing agent 160.
  • the organic EL element 120 formed on the substrate 110 is provided around the substrate 110, the sealing substrate 150 facing the substrate 110, and the organic EL element 120.
  • the frit glass 140 is sealed.
  • a sealing agent 160 made of resin is filled between the substrate 110 and the sealing substrate 150 so as to cover the organic EL element 120.
  • Patent Document 3 describes a technique for increasing the mechanical strength of the frit glass by forming a seal around the frit glass.
  • the technique of encapsulating an organic EL element with a thin film has a problem of high cost and poor productivity. This is because it takes not only a very long time to form a thick passivation film (for example, it takes 10 minutes to form a 1 ⁇ m passivation film), but also a lot of cost.
  • the technique of sealing an organic EL element using two substrates and frit glass described in Patent Document 1 has a problem that a sufficient sealing effect cannot be obtained. Specifically, it is as follows.
  • a frit glass generally granular glass
  • a solvent solvent
  • a binder viscosity modifier
  • the outgas generated by the vaporization of the solvent and the binder reaches the organic EL element formed on the substrate. Since outgas changes the organic molecules in the light emitting layer in the organic EL element, there arises a problem that the life of the organic EL element is shortened.
  • the frit glass is heated to cure the frit glass, thereby improving the adhesion to the substrate and the strength of the frit glass.
  • heat at the time of heating is transferred to the resin covering the organic EL element, there is a problem that the resin is deteriorated and a sufficient sealing effect cannot be obtained.
  • the resin is thermally decomposed, and the generated gas damages the organic EL element.
  • the present invention has been made to solve the above problems, and provides an organic EL display device having a low cost, high productivity, and a sufficient sealing effect, and a method for manufacturing the same.
  • the purpose is to do.
  • an organic electroluminescence display device includes a first substrate, an organic EL element formed on the first substrate, a second substrate facing the first substrate, The organic EL element is provided between the first substrate and the second substrate so as to surround a light emitting region including the organic EL element, and the first substrate and the second substrate are connected.
  • a frit glass sealing wall to be sealed, and between the first substrate and the second substrate, and between the organic EL element and the frit glass sealing wall so as to surround the organic EL element.
  • An inner peripheral sealing wall made of a resin material, and a space surrounded by the first substrate, the second substrate, the frit glass sealing wall and the inner peripheral sealing wall is a sealed space,
  • the pressure in the enclosed space is lower than atmospheric pressure
  • An inner peripheral seal wall, the said enclosed space than atmospheric pressure is low atmospheric pressure which is formed between the organic EL element and the frit glass sealant wall, confining outgas generated from the frit glass sealing wall.
  • the organic light emitting device can be sufficiently sealed, so that the organic light emitting device can be prevented from being deteriorated and the life of the organic EL display device can be extended. Furthermore, such an organic EL display device having a sufficient sealing effect can be manufactured at low cost and with high productivity.
  • FIG. 1 is a cross-sectional view showing a configuration of a conventional organic EL display device.
  • FIG. 2A is a cross-sectional view showing an example of the configuration of the organic EL display device of the present embodiment.
  • FIG. 2B is a cross-sectional view showing another example of the configuration of the organic EL display device of the present embodiment.
  • FIG. 2C is a diagram for explaining one of the effects of the organic EL display device of the present embodiment.
  • FIG. 2D is a diagram for explaining another effect of the organic EL display device of the present embodiment.
  • FIG. 2E is a diagram for explaining another effect of the organic EL display device of the present embodiment.
  • FIG. 1 is a cross-sectional view showing a configuration of a conventional organic EL display device.
  • FIG. 2A is a cross-sectional view showing an example of the configuration of the organic EL display device of the present embodiment.
  • FIG. 2B is a cross-sectional view showing another example of the configuration of the organic EL display
  • FIG. 3 is a perspective view and a cross-sectional view showing an example of a manufacturing process of the organic EL display device of the present embodiment.
  • FIG. 4 is a cross-sectional view showing an example of a process for forming the frit glass of the present embodiment.
  • FIG. 5A is a plan view showing an example of the positional relationship between the frit glass and the sealing substrate of the present embodiment.
  • FIG. 5B is a plan view showing another example of the positional relationship between the frit glass and the sealing substrate of the present embodiment.
  • FIG. 6 is a cross-sectional view of the sealing agent application process for constituting the double seal structure of the present embodiment.
  • FIG. 7A is a plan view illustrating an example of a positional relationship among the frit glass, the sealant, and the sealing substrate of the present embodiment.
  • FIG. 7B is a plan view showing another example of the positional relationship among the frit glass, the sealant, and the sealing substrate of the present embodiment.
  • FIG. 7C is a plan view showing another example of the positional relationship among the frit glass, the sealant, and the sealing substrate of the present embodiment.
  • FIG. 8 is a cross-sectional view of an example of the filler dropping step of the present embodiment.
  • FIG. 9A is a plan view illustrating an example of a positional relationship among the frit glass, the sealant, the filler, and the sealing substrate of the present embodiment.
  • FIG. 9B is a plan view showing another example of the positional relationship among the frit glass, the sealant, the filler, and the sealing substrate of the present embodiment.
  • FIG. 10 is a cross-sectional view in the organic EL element sealing step of the present embodiment.
  • FIG. 11 is a cross-sectional view in the laser annealing step of the present embodiment.
  • FIG. 12 is a cross-sectional view in the substrate cutting process of the present embodiment.
  • FIG. 13 is a cross-sectional view showing a different example of the frit glass sealing wall of the present embodiment.
  • FIG. 14 is a cross-sectional view showing an example of another configuration of the organic EL display device of the present embodiment.
  • FIG. 15 is a cross-sectional view of an organic EL element sealing process included in an organic EL display device having another configuration according to the present embodiment.
  • an organic electroluminescence display device (hereinafter referred to as an organic EL display device) and a manufacturing method thereof will be described in detail based on embodiments.
  • An organic EL display device includes a first substrate, an organic EL element formed on the first substrate, a second substrate facing the first substrate, the first substrate, and the second substrate. And a frit glass sealing wall for sealing the organic EL element by connecting the first substrate and the second substrate, so as to surround a light emitting region including the organic EL element.
  • a space surrounded by the first substrate, the second substrate, the frit glass sealing wall, and the inner peripheral sealing wall is a sealed space, and a pressure of the sealed space is lower than an atmospheric pressure.
  • the inner peripheral sealing wall is connected to the organic EL element and the flip. The sealed space pressure is lower than the atmospheric pressure which is formed between the glass sealing wall, confining outgas generated from the frit glass sealing wall.
  • the periphery of the organic EL element between the first substrate and the second substrate is surrounded by a frit glass sealing wall, the upper surface of the frit glass sealing wall is one substrate, and the lower surface is the other substrate. It is closely attached to. Further, an inner peripheral sealing wall made of resin is provided on the inner periphery of the frit glass sealing wall, and the upper surface and the lower surface are in close contact with both substrates in the same manner as the frit glass sealing wall.
  • the sealed space surrounded by the frit glass sealing wall, the inner peripheral sealing wall, and both substrates is in a state where the atmospheric pressure is lower than the atmospheric pressure.
  • the sealed space surrounded by the frit glass sealing wall, the inner peripheral sealing wall, and both substrates is in a low pressure state, when the frit glass paste forming the frit glass sealing wall is baked, it is removed from the frit glass paste.
  • the generated outgas can be kept in the sealed space.
  • invasion of outgas from the outside to the inside of the inner peripheral seal wall can be prevented, so damage to the organic light emitting layer in the organic EL element due to outgas can be prevented, and the life of the organic EL element can be extended. .
  • the outside air that permeates from the outside of the frit glass sealing wall to the sealed space side can be kept in the sealed space surrounded by the frit glass sealing wall, the inner peripheral sealing wall, and both substrates,
  • the organic EL element can be protected from moisture and oxygen contained therein.
  • the frit glass sealing wall and the inner peripheral sealing wall are formed between the first substrate and the second substrate, and adhere to both substrates while maintaining a gap between the two substrates. That is, both substrates are supported by two walls, a frit glass sealing wall and an inner peripheral sealing wall. Thereby, the physical strength as a support body of a frit glass sealing wall and an inner peripheral seal wall with respect to the force applied from the outside can be increased.
  • the sealed space formed between the organic EL element and the frit glass sealing wall and having a pressure lower than the atmospheric pressure further includes heat transmitted from the frit glass sealing wall made of the resin material. Transmission to the peripheral seal wall may be reduced.
  • the sealed space surrounded by the frit glass sealing wall, the inner peripheral sealing wall, and both substrates can be reduced and heated.
  • Heat transfer from the existing frit glass to the inner peripheral seal wall is difficult to occur. That is, the amount of heat transferred through the sealed space is reduced.
  • the thermal deterioration of the resin which is the material of the inner peripheral seal wall can be prevented, and the sealing performance of the inner peripheral seal wall can be maintained.
  • fever of an inner peripheral seal wall can be prevented, and the adhesiveness of an inner peripheral seal wall, a 1st board
  • substrate can be maintained.
  • the inner peripheral sealing wall is between the organic EL element and the frit glass sealing wall, and further blocks outgas generated from the frit glass sealing wall from entering the organic EL element. Also good.
  • the inner peripheral seal wall between the organic EL element and the frit glass sealing wall by providing the inner peripheral seal wall between the organic EL element and the frit glass sealing wall, outgas and outside air generated from the frit glass paste can be blocked by the inner peripheral seal wall. Also, when the organic EL display device of this embodiment is used, even if the adhesion between the frit glass sealing wall and the substrate becomes weak due to deformation or the like in the organic EL display device, the inner periphery Outside air can be blocked by the sealing wall.
  • the organic EL display device is further formed between the first substrate and the second substrate so as to surround the frit glass sealing wall along the periphery of the frit glass sealing wall.
  • An outer peripheral seal wall made of a resin material is provided, and the space surrounded by the first substrate, the second substrate, the inner peripheral seal wall, and the outer peripheral seal wall is a sealed space, and the pressure of the sealed space is atmospheric pressure Further, the frit glass sealing wall may be disposed between the inner peripheral seal and the outer peripheral seal wall in the sealed space.
  • the outer peripheral seal wall outside the frit glass sealing wall, outgas and outside air generated from the frit glass paste are retained in the sealed space between the outer peripheral seal wall and the frit glass sealing wall. Can do. Also, when the organic EL display device of this aspect is used, even if the adhesion between the frit glass sealing wall and the substrate becomes weak due to deformation or the like in the organic EL display device, the outer peripheral seal Outside walls can be blocked by walls.
  • the volume of the space surrounded by the first substrate, the second substrate, the frit glass sealing wall, and the outer peripheral seal wall is determined by the first substrate, the second substrate, the frit glass sealing wall, and the inner wall. It may be larger than the volume of the space surrounded by the peripheral seal wall.
  • the first substrate, the second substrate, and the frit glass seal rather than the space surrounded by the first substrate, the second substrate, the frit glass sealing wall, and the inner peripheral sealing wall (that is, the inner sealed space).
  • the space surrounded by the stop wall and the outer peripheral seal wall (that is, the outer sealed space) has a larger capacity. Both of these spaces are in a low pressure state and can confine outgas generated by laser irradiation of the frit glass sealing wall.
  • the lower pressure state is the outer sealing. It is space. Therefore, when outgas is further generated from the inside of the frit glass sealing wall, the outgas is attracted to the outer sealed space. Therefore, outgas generated from the frit glass sealing wall can be guided to the outside of the frit glass sealing wall, and can be kept away from the organic EL element inside the frit glass. Therefore, since the outgas can be kept away from the organic EL element, the influence of the outgas on the organic EL element can be prevented. As a result, the lifetime of the organic EL element can be extended.
  • cross-sectional shape in the short axis direction of the frit glass sealing wall on the surface perpendicular to the first substrate and the second substrate may be substantially trapezoidal.
  • the surface of the frit glass corresponding to the upper side of the trapezoid is made flat, and the surface of the frit glass corresponding to the upper side of the trapezoid and the first substrate are made parallel to each other.
  • the area where the frit glass and the first substrate are in contact with each other can be increased.
  • the area where the frit glass sealing wall and the first substrate are in contact with each other can be increased.
  • the frit glass sealing wall may contain at least one kind of transition metal.
  • the frit glass in the frit glass paste efficiently absorbs laser light by including at least one transition metal that efficiently absorbs light having a wavelength in the infrared region in the material of the frit glass. Can be converted into thermal energy.
  • the frit glass can be efficiently melted, the time for irradiating the frit glass paste with the laser can be shortened. As a result, the total amount of thermal energy given by the laser beam is reduced, so that damage to the peripheral members due to residual heat from the laser beam can be reduced.
  • the frit glass sealing wall may be porous.
  • the frit glass sealing wall can adsorb a lot of moisture contained in the outside air.
  • inflow of moisture contained in the outside air into the organic EL element can be prevented, damage to the organic EL element due to moisture can be reduced, and the life of the organic EL element can be extended.
  • the second substrate may be made of a material having oxygen and moisture permeability lower than predetermined values.
  • the material of the substrate a material with low moisture and oxygen permeability, it is possible to prevent the inflow of moisture and oxygen from the substrate, reducing damage to the organic light emitting layer due to moisture and oxygen, The lifetime of the organic EL element can be extended.
  • the organic EL display device may further include a filling portion filled with a sealing resin in a space formed by the first substrate, the second substrate, and the inner peripheral sealing wall. .
  • the filling portion filled with the sealing resin is filled in the space surrounded by the first substrate and the second substrate, the organic EL element formed on the first substrate, and the inner peripheral sealing wall.
  • the refractive index of the sealing resin filled in the filling portion may be equal to or higher than the refractive index of the second substrate and equal to or lower than the refractive index of the passivation film that protects the organic EL element.
  • the refractive index of the sealing resin filled in the filling portion is adjusted to be equal to or higher than the refractive index of the second substrate and equal to or lower than the refractive index of the passivation film. Since the refractive index at the interface between the sealing resin and the substrate can be reduced by setting the refractive index stepwise, the light extraction efficiency to the outside can be increased. As a result, the drive current of the organic EL element can be reduced, and the load on the organic EL element is reduced, so that the life of the organic EL element can be extended.
  • sealing resin filled in the filling portion may be a UV curable or thermosetting resin, and may be the same curable resin as the inner peripheral seal wall and the outer peripheral seal wall.
  • the sealing resin filled in the filling portion is a UV curable or thermosetting resin and has the same curability as the inner peripheral seal wall and the outer peripheral seal wall.
  • the sealing resin filled in the filling portion can also be cured at the same time. As a result, the step of curing only the sealing resin filled in the filling portion can be omitted, and the number of steps can be reduced and the productivity can be increased.
  • the organic EL display device may further include banks having substantially the same height as the frit glass sealing wall at at least both ends of the organic light emitting layer of the organic EL element.
  • the first substrate and the second substrate are attached to each other with a pressure due to a pressure difference by providing banks having substantially the same height as the frit glass sealing wall at least at both ends of the organic light emitting layer of the organic EL element.
  • the bank serves as a support that maintains the distance between the first substrate and the second substrate. Therefore, the first substrate and the second substrate can be bonded together without bending. Thereby, gap unevenness between the substrates can be suppressed.
  • the provided bank can also be used as a bank used to partition the light emitting area of each light emitting color when the organic light emitting layer of the organic EL element is formed.
  • the provided bank In order for the provided bank to also serve as a partition for the support and the light emitting area, it is only necessary to adjust the height of the bank, and a new process is not required, so that the manufacturing process is not burdened.
  • the organic EL display device is further formed on the first substrate and the organic EL element, and protects the organic EL element by covering the organic EL element formed on the first substrate.
  • Comprising a passivation film wherein the passivation film is interposed between the first substrate and the frit glass sealing wall and between the first substrate and the inner peripheral sealing wall, and the passivation film,
  • the space surrounded by the second substrate, the frit glass sealing wall, and the inner peripheral sealing wall is a sealed space, and the pressure of the sealed space may be lower than the atmospheric pressure.
  • the passivation film on the organic EL element, it is possible to prevent outgas, moisture and oxygen contained in the outside air from reaching the organic EL element. Thereby, damage to the organic light emitting layer in the organic EL element due to outgassing can be prevented, and the life of the organic EL element can be extended.
  • the organic EL display device is further formed on the first substrate and the organic EL element, and protects the organic EL element by covering the organic EL element formed on the first substrate.
  • a passivation film wherein the passivation film is between the first substrate and the frit glass sealing wall, between the first substrate and the inner peripheral seal wall, and between the first substrate and the outer peripheral seal.
  • the space surrounded by the passivation film, the second substrate, the inner peripheral seal wall, and the outer peripheral seal wall is a sealed space, and the pressure of the sealed space is lower than the atmospheric pressure. Also good.
  • the passivation film on the organic EL element, it is possible to prevent outgas, moisture and oxygen contained in the outside air from reaching the organic EL element. Thereby, damage to the organic light emitting layer in the organic EL element due to outgas, moisture and oxygen contained in the outside air can be prevented, and the life of the organic EL element can be extended.
  • the organic EL display device includes a first substrate, an organic EL element formed on the first substrate, a second substrate facing the first substrate, the first substrate, and the first substrate. Frit glass sealing provided between the two substrates so as to surround the light emitting region including the organic EL element, and sealing the organic EL element by connecting the first substrate and the second substrate.
  • a wall is formed between the first substrate and the second substrate and between the organic EL element and the frit glass sealing wall so as to surround the organic EL element and is made of a resin material.
  • a space surrounded by the first substrate, the second substrate, the frit glass sealing wall, and the inner peripheral sealing wall is a sealed space, and a pressure of the sealed space is an atmospheric pressure. It may be lower.
  • the periphery of the organic EL element between the first substrate and the second substrate is surrounded by a frit glass sealing wall, the upper surface of the frit glass sealing wall is one substrate, and the lower surface is the other substrate. It is closely attached to. Further, an inner peripheral sealing wall made of resin is provided between the organic EL element and the frit glass sealing wall, and the upper surface and the lower surface are brought into close contact with both substrates in the same manner as the frit glass sealing wall.
  • the sealed space surrounded by the frit glass sealing wall, the inner peripheral sealing wall, and both substrates is in a state where the atmospheric pressure is lower than the atmospheric pressure.
  • the sealed space surrounded by the frit glass sealing wall, the inner peripheral sealing wall, and both substrates is in a low pressure state, when the frit glass paste forming the frit glass sealing wall is baked, it is removed from the frit glass paste.
  • the generated outgas can be kept in the sealed space.
  • invasion of outgas from the outside to the inside of the inner peripheral seal wall can be prevented, so damage to the organic light emitting layer in the organic EL element due to outgas can be prevented, and the life of the organic EL element can be extended. .
  • the outside air that permeates from the outside of the frit glass sealing wall can be kept in the sealed space surrounded by the frit glass sealing wall, the inner peripheral sealing wall, and both substrates, so that moisture contained in the outside air and The organic EL element can be protected from oxygen.
  • the frit glass sealing wall and the inner peripheral sealing wall are formed between the first substrate and the second substrate, and adhere to both substrates while maintaining a gap between the two substrates. That is, both substrates are supported by two walls, a frit glass sealing wall and an inner peripheral sealing wall. Thereby, the physical strength as a support body of a frit glass sealing wall and an inner peripheral seal wall with respect to the force applied from the outside can be increased.
  • the manufacturing method of the organic EL display device includes a first step of forming a light emitting region including an organic EL element on the first substrate, and the organic EL display device when the organic EL display device is disposed opposite to the first substrate.
  • the space surrounded by the seal wall and the outer peripheral seal wall is a sealed space, and the pressure of the sealed space is lower than the atmospheric pressure, and the frit glass paste is melted by the laser irradiation in the eighth step.
  • Outgas generated from the glass paste is confined in the sealed space.
  • the light emitting region including the organic EL element is disposed between the first substrate and the second substrate and between the frit glass paste and the organic EL element.
  • An inner peripheral sealing wall is provided on the first substrate.
  • the sealed space between the frit glass paste and the inner peripheral seal wall is brought into a low pressure state by bonding the first substrate and the second substrate under a low pressure atmosphere lower than the atmospheric pressure.
  • the frit glass paste is irradiated with laser, the outgas generated by the vaporization of the solvent and the binder is between the inner peripheral seal wall and the frit glass sealing wall, and is in a low pressure state. Enclose in an enclosed space. As a result, the outgas generated from the frit glass paste is prevented from reaching the organic EL element, and damage to the organic EL element due to the outgas is reduced, whereby the life of the organic EL element can be extended.
  • the first substrate and the second substrate are brought into close contact with each other using the pressure generated by the atmospheric pressure difference, so that the step of applying the force by physically contacting either one of the substrates is It is unnecessary. Furthermore, the pressure generated by the atmospheric pressure difference applies an equal force to the members forming the sealed space, so that no local force is applied and the substrates can be brought into close contact with each other. As a result, it is possible to prevent occurrence of gap unevenness between the first substrate and the second substrate.
  • a long-life organic EL display device having a sufficient sealing effect can be manufactured at low cost and with high productivity.
  • the method for manufacturing the organic EL display device may further include the first substrate and the second substrate between the frit glass sealing wall and the outer peripheral sealing wall, and the first substrate and the second substrate.
  • a ninth step of cutting perpendicularly to the substrate may be included.
  • the area of the region other than the light emitting region of the organic EL display device can be reduced. That is, the organic EL display device can be a so-called narrow frame display device. Thereby, a display device having a larger display screen (light emitting region) can be installed in a small space, and space saving can be realized.
  • a passivation film for protecting the organic EL element is formed by covering the first substrate and the organic EL element formed on the first substrate,
  • a space surrounded by the passivation film, the second substrate, the frit glass paste, the inner peripheral seal wall and the outer peripheral seal wall is a sealed space, and the pressure of the sealed space is lower than the atmospheric pressure. Also good.
  • the passivation film on the organic EL element, it is possible to prevent outgas, moisture and oxygen contained in the outside air from reaching the organic EL element. That is, the sealing effect of the organic EL element can be further improved. Thereby, damage to the organic EL element can be prevented, and the life of the organic EL element can be extended.
  • the patterned frit glass paste may be further dried and pre-baked.
  • the frit glass paste is dried and temporarily fired before performing the main firing in which the frit glass paste is irradiated with laser, that is, before the first substrate and the second substrate are brought into close contact with each other. That is, by evaporating the solvent and binder mixed in the frit glass paste, most of the solvent and binder can be removed before the main baking.
  • a sealing resin may be further filled inside the inner peripheral sealing wall on the second substrate.
  • the sealing property of the organic EL element can be improved by including the step of filling the sealing resin inside the inner peripheral sealing wall on the second substrate.
  • the filling portion is formed without increasing the number of steps. Can do.
  • the method for manufacturing the organic EL display device further includes an inert gas around the organic EL display device when the low pressure state is changed to the atmospheric pressure state between the fifth step and the sixth step.
  • the process of filling with may be included.
  • the periphery of the organic EL display device is filled with the inert gas.
  • the frit glass paste mixed with an acid or base-soluble material is patterned, and after the second step, the frit glass paste or the frit glass sealing wall is acid or base.
  • the soluble material may be dissolved by exposing to water.
  • the frit glass sealing wall efficiently adsorbs moisture contained in the outside air.
  • inflow of moisture contained in the outside air into the organic EL element can be prevented, damage to the organic EL element due to moisture can be reduced, and the life of the organic EL element can be extended.
  • banks having substantially the same height as the frit glass sealing wall may be provided at least at both ends of the region where the light emitting layer is formed.
  • the first substrate and the second substrate are brought into close contact with each other by pressure due to the pressure difference.
  • the bank becomes a support that maintains the distance between the first substrate and the second substrate. Therefore, the first substrate and the second substrate can be brought into close contact without being bent. Thereby, gap unevenness between the substrates can be suppressed.
  • the first substrate, the second substrate, and the frit are determined based on the volume of the space surrounded by the first substrate, the second substrate, the frit glass sealing wall, and the inner peripheral sealing wall.
  • the outer peripheral seal wall may be provided so that the volume of the space surrounded by the glass sealing wall and the outer peripheral seal wall is increased.
  • the first substrate, the second substrate, and the frit glass seal rather than the space surrounded by the first substrate, the second substrate, the frit glass sealing wall, and the inner peripheral sealing wall (that is, the inner sealed space).
  • the space surrounded by the stop wall and the outer peripheral seal wall (that is, the outer sealed space) has a larger capacity. Both of these spaces are in a low pressure state and can confine outgas generated by laser irradiation of the frit glass sealing wall.
  • the lower pressure state is the outer sealing. It is space. Therefore, when outgas is further generated from the inside of the frit glass sealing wall, the outgas is attracted to the outer sealed space. Therefore, outgas generated from the frit glass sealing wall can be guided to the outside of the frit glass sealing wall, and can be kept away from the organic EL element inside the frit glass. Therefore, since the outgas can be kept away from the organic EL element, the influence of the outgas on the organic EL element can be prevented. As a result, the lifetime of the organic EL element can be extended.
  • a plurality of the light emitting regions are formed on the first substrate, and in the second step, a plurality of light emitting regions are enclosed on the second substrate so as to surround each of the light emitting regions.
  • the frit glass paste is patterned, and in the third step, a plurality of inner peripheral sealing walls are provided along inner peripheries of the plurality of frit glass pastes, and in the fourth step, the plurality of frit glass pastes are provided. Only one outer peripheral sealing wall may be provided so as to surround the glass paste.
  • the volume of the sealed space outside the frit glass sealing wall can be made larger than the volume of the sealed space inside the frit glass sealing wall. Therefore, it is possible to easily confine the outgas generated when the frit glass sealing wall is formed in an outer sealed space away from the organic EL element. Therefore, since outgas can be kept away from the organic EL element, it is possible to prevent the outgas from affecting the organic EL element. As a result, the lifetime of the organic EL element can be extended.
  • the organic EL display device is a display device including a light emitting region sealed using two substrates and a frit glass sealing wall, and the frit glass sealing wall is a double layer. Surrounded by a peripheral seal (that is, an inner peripheral seal wall and an outer peripheral seal wall), the sealed space between the frit glass sealing wall and the peripheral seal is in a state where the pressure is reduced from the atmospheric pressure. .
  • FIG. 2A is a cross-sectional view showing an example of the configuration of the organic EL display device 200 of the present embodiment.
  • a double seal structure is formed so as to surround the frit glass sealing wall 240 by the outer peripheral seal wall 250a and the inner peripheral seal wall 250b.
  • the substrate 210 is an example of a first substrate, and is a substrate having a flat main surface including a drive circuit (not shown) composed of a TFT (Thin Film Transistor) that controls light emission of the organic light emitting element.
  • the substrate 210 is preferably a substrate having an oxygen transmission rate and a water transmission rate lower than predetermined threshold values in order to protect the organic EL element 220 from oxygen or moisture.
  • the substrate 210 is a substrate having a daily oxygen permeability and a moisture permeability of 10 ⁇ 3 cc / m 2 or less and a moisture permeability of 10 ⁇ 6 g / m 2 or less.
  • the substrate 210 and the sealing substrate 260 are opposed to each other, and for example, glass can be used as the substrate material.
  • the substrate 210 and the sealing substrate 260 may be plastic substrates, but in this case, it is preferable that heat resistance is ensured.
  • the organic EL element 220 includes an anode and a cathode, and an organic light emitting layer that is made of an organic compound and emits light according to a voltage applied between the anode and the cathode, and is formed between the substrate 210 and the sealing substrate 260.
  • the organic EL element 220 constitutes a display (light emitting region) that emits light by controlling the applied voltage for each pixel.
  • the organic EL element 220 may be driven by either an active matrix method or a passive matrix method. Further, either a top emission structure or a bottom emission structure may be used.
  • a TFT array layer, an electrode layer, and a passivation film are sequentially laminated on a substrate 210, and an organic EL element 220 is formed thereon.
  • the organic EL element 220 includes, for example, a planarization film, a reflective electrode, a hole injection layer, a light emitting layer, an electron injection layer, and a transparent electrode (not shown).
  • the TFT array layer is a layer in which thin film transistors (TFTs) for controlling light emission of the light emitting layer for each pixel by an active matrix method are formed in an array.
  • TFTs thin film transistors
  • the electrode layer is a layer in which scanning lines and signal lines are formed.
  • the planarizing film is a layer that planarizes the upper surface of the electrode layer.
  • a silicon oxide film SiO x
  • CVD Chemical Vapor Deposition
  • a sputtering method a sputtering method
  • resist etch back method or a whole surface etching is performed. It is formed by planarization by a back method, a CMP (Chemical Mechanical Polishing) method, or the like.
  • the reflective electrode contains a reflective metal and injects holes into the light emitting layer through the hole injection layer.
  • Reflective metals include, for example, silver, aluminum, nickel, chromium, molybdenum, copper, iron, platinum, tungsten, lead, tin, antimony, strontium, titanium, manganese, indium, zinc, vanadium, tantalum, niobium, lanthanum, Any one of cerium, neodymium, samarium, europium, palladium, copper, nickel, cobalt, molybdenum, platinum, and silicon, an alloy of these metals, or a laminate of these metals can be used.
  • the hole injection layer assists hole generation and injects holes into the light emitting layer.
  • the hole injection layer is made of polyaniline, polypyrrole, copper phthalocyanine (CuPc), or the like.
  • the light emitting layer is a layer containing an organic material that emits light by carriers (electrons and holes) injected from the anode and the cathode.
  • the light emitting layer is made of, for example, a low molecular light emitting material such as an aluminum-kylinol complex (Alq3), or a polymer light emitting material such as polythiophene or polyparaphenylene.
  • the electron injection layer assists the generation of electrons and injects electrons into the light emitting layer.
  • the electron injection layer is a metal layer containing at least one of an alkali metal and an alkaline earth metal as a main component, and may contain two or more kinds of alkali metals and alkaline earth metals. This includes the case of containing both alkali metals and alkaline earth metals.
  • the electron injecting layer is not particularly limited, but lithium, rubidium, cesium, calcium, and barium can be preferably used.
  • the transparent electrode injects electrons into the light emitting layer through the electron injection layer. Further, light from the light emitting layer is transmitted.
  • the transparent electrode for example, indium tin oxide or indium zinc oxide is used.
  • the layers are laminated on the substrate in the order of the anode (reflecting electrode), the hole injection layer, the light emitting layer, the electron injection layer, and the cathode (transparent electrode). There may be.
  • each layer with which the organic EL element 220 shown above is provided is formed by a method such as coating or vapor deposition such as a printing method.
  • a method such as coating or vapor deposition such as a printing method.
  • the details of the process of forming the organic EL element 220 on the substrate 210 are described in various documents such as Patent Document 4 and may be formed by any method.
  • the passivation film 230 is a protective film that is formed on the substrate 210 and the organic EL element 220 and protects the organic EL element 220 by covering the organic EL element 220.
  • the passivation film 230 is made of a silicon nitride film (SiN) or a silicon oxynitride film (SiON), and is formed by plasma CVD or sputtering.
  • the film thickness is, for example, 1 ⁇ m to 50 ⁇ m.
  • the passivation film 230 may not be formed depending on the material of the filling portion 270.
  • the passivation film 230 may not be formed. Thereby, the man-hour in manufacture of the organic electroluminescence display 200 can be reduced.
  • the sealed space inside the frit glass sealing wall 240 is defined by the passivation film 230, the sealing substrate 260, the frit glass sealing wall 240, and the inner peripheral sealing wall 250b. It is formed.
  • the sealed space outside the frit glass sealing wall 240 is formed by the passivation film 230, the sealing substrate 260, the frit glass sealing wall 240, and the outer peripheral sealing wall 250a.
  • the passivation film 230 is interposed between the substrate 210 and the frit glass sealing wall 240, between the substrate 210 and the outer peripheral seal wall 250a, and between the substrate 210 and the inner peripheral seal wall 250b.
  • the space surrounded by the passivation film 230, the sealing substrate 260, the outer peripheral seal wall 250a, and the inner peripheral seal wall 250b is a sealed space whose atmospheric pressure is lower than atmospheric pressure.
  • a frit glass sealing wall 240 is disposed between the outer peripheral seal wall 250a and the inner peripheral seal wall 250b.
  • the frit glass sealing wall 240 is formed between the substrate 210 and the sealing substrate 260 so as to surround the organic EL element 220.
  • the substrate 210 and the sealing substrate 260 are sealed. It has a function of sealing the organic EL element 220 together with the substrate 260. Thereby, oxygen and moisture from the outside can be prevented from reaching the organic EL element 220.
  • the bottom surface of the frit glass sealing wall 240 (the adhesive surface to the substrate 210 and the adhesive surface to the sealing substrate 260) is flat. This is because the substrate and the frit glass sealing wall are securely bonded to prevent moisture and the like from entering the organic EL element, and to ensure the bonding strength of the substrate.
  • the cross-sectional shape in the minor axis direction of the frit glass sealing wall 240 at the cut surface perpendicular to the surface where the substrate 210 and the sealing substrate 260 face each other is preferably trapezoidal as shown in FIG. 2A.
  • the film thickness of the frit glass sealing wall 240 is desirably uniform.
  • the frit glass sealing wall 240 is solidified by drying and pre-baking the frit glass paste 241, and the frit glass 242 is irradiated with a laser to perform main firing (
  • the frit glass sealing wall 240 is formed by melting and solidifying (details will be described later).
  • the area where the frit glass sealing wall 240 and the substrate 210 are in contact with each other can be increased.
  • the adhesion between the frit glass sealing wall 240 and the substrate 210 can be enhanced, and the sealing performance of the organic EL element can be sufficiently enhanced to achieve a long life.
  • the frit glass sealing wall 240 is formed by melting and solidifying a frit glass paste containing a frit, a binder, and a solvent by heating and cooling.
  • the frit glass sealing wall 240 includes, for example, a glass component such as silicon oxide and at least one transition metal such as zinc oxide. By containing a transition metal, it becomes easy to absorb infrared rays, and heating is performed efficiently. Specific examples of transition metals will be described later.
  • the width of the frit glass sealing wall 240 is controlled by the application amount of the frit glass paste applied on the sealing substrate 260 at the time of formation, and can be about 500 ⁇ m to 5 mm.
  • the height of the frit glass sealing wall 240 can be about 5 ⁇ m to 50 ⁇ m.
  • the outer peripheral seal wall 250 a is formed between the substrate 210 and the sealing substrate 260 and surrounds the frit glass sealing wall 240 along the periphery of the frit glass sealing wall 240.
  • the outer peripheral seal wall 250a is made of a resin material, for example, UV curable or thermosetting epoxy resin or acrylic resin.
  • the outer peripheral sealing wall 250 a connects the substrate 210 and the sealing substrate 260 to form a sealed space together with the frit glass sealing wall 240, the substrate 210, and the sealing substrate 260.
  • the air pressure in the space sealed by the outer peripheral seal wall 250a, the frit glass sealing wall 240, the substrate 210, and the sealing substrate 260 is lower than atmospheric pressure, and is preferably a vacuum (for example, 10 Pa or less).
  • the space surrounded by the substrate 210, the sealing substrate 260, the outer peripheral seal wall 250a, and the inner peripheral seal wall 250b is a sealed space, and the pressure of the sealed space is lower than the atmospheric pressure.
  • the frit glass sealing wall 240 is disposed between the outer peripheral seal wall 250a and the inner peripheral seal wall 250b in the sealed space.
  • the width of the outer peripheral seal wall 250a is determined by the amount of sealant (adhesive) applied on the sealing substrate 260 during formation, and can be about 500 ⁇ m to 3 mm.
  • the height of the outer peripheral seal wall 250a is substantially the same as the frit glass sealing wall 240, that is, substantially the same.
  • an adhesive such as UV curable or thermosetting epoxy resin or acrylic resin can be used.
  • the inner peripheral seal wall 250 b is between the substrate 210 and the sealing substrate 260, and is formed between the frit glass sealing wall 240 and the organic EL element 220 so as to surround the organic EL element 220.
  • the inner peripheral seal wall 250b is made of a resin material, and is, for example, a UV curable or thermosetting epoxy resin or an acrylic resin.
  • the inner peripheral sealing wall 250 b connects the substrate 210 and the sealing substrate 260 to form a sealed space together with the frit glass sealing wall 240, the substrate 210, and the sealing substrate 260.
  • the pressure in the space sealed by the inner peripheral sealing wall 250b, the frit glass sealing wall 240, the substrate 210, and the sealing substrate 260 is lower than atmospheric pressure, and is preferably a vacuum (for example, 10 Pa or less).
  • the space surrounded by the substrate 210, the sealing substrate 260, the inner peripheral sealing wall 250b, and the frit glass sealing wall 240 is a sealed space, and the pressure of the sealed space is lower than the atmospheric pressure.
  • the width of the inner peripheral seal wall 250b is determined by the width of the sealant (adhesive) applied on the sealing substrate 260 at the time of formation, and can be about 500 ⁇ m to 3 mm.
  • the height of the inner peripheral seal wall 250b is substantially the same as that of the frit glass sealing wall 240.
  • the inner peripheral seal wall 250b is a UV curable or thermosetting adhesive, and for example, an adhesive such as an epoxy resin or an acrylic resin can be used.
  • the outer peripheral seal wall 250a and the inner peripheral seal wall 250b are preferably made of the same material.
  • the sealing substrate 260 is an example of a second substrate and has a flat main surface and is optically transparent. However, a color filter or the like may be formed as necessary.
  • a substrate having an oxygen transmission rate and a water transmission rate lower than a predetermined threshold is desirable.
  • the oxygen permeability per day is 10 ⁇ 3 cc / m 2 or less and the moisture permeability is 10 ⁇ 6 g / m 2 or less.
  • the sealing substrate 260 is a glass substrate made of an alkali-free glass that satisfies the transmittance condition and has a high melting point.
  • the sealing substrate 260 may be a plastic substrate or the like. In this case, it is preferable that heat resistance is ensured.
  • the filling unit 270 fills the space sealed by the substrate 210, the sealing substrate 260, and the inner peripheral seal wall 250b, that is, the space in which the organic EL element 220 is formed, with the filler.
  • the refractive index of the filling portion 270 is preferably not less than the refractive index of the sealing substrate 260 and not more than the refractive index of the passivation film 230. For example, when the refractive index of the sealing substrate 260 (glass substrate) is 1.5 and the refractive index of the passivation film 230 (SiN) is 1.9, the refractive index of the filling portion 270 is 1.6. Can do.
  • the filler used for the filling portion 270 is a UV curable or thermosetting adhesive, for example, an epoxy resin or an acrylic resin.
  • the filler is preferably cured by the same means as the sealant used for forming the outer peripheral seal wall 250a and the inner peripheral seal wall 250b.
  • the organic EL display device 200 includes the organic EL element 220 by the frit glass sealing wall 240 and the outer peripheral seal wall 250a and the inner peripheral seal wall 250b constituting the double seal structure. Seal. Furthermore, since the space between the frit glass sealing wall 240 and the outer peripheral seal wall 250a and the inner peripheral seal wall 250b is in a vacuum state, the frit glass sealing wall 240 has a problem such as a crack. However, impurities can be confined in the vacuum space.
  • the organic EL display device 200 includes double sealing walls on the inner side and the outer side of the frit glass sealing wall 240. Even if the adhesion to the substrate is weakened due to deformation or the like, the sealed space is maintained by the double seal wall and the two substrates. Therefore, the sealing effect is not lost and the deterioration of the organic EL element 220 can be prevented.
  • the inner peripheral seal wall 250 b also has a function of preventing outgas generated when forming the frit glass sealing wall 240 from entering the organic EL element 220. Further, intrusion from the outside such as oxygen and moisture can be prevented by the frit glass sealing wall 240, the outer peripheral sealing wall 250a, and the inner peripheral sealing wall 250b. Therefore, it is possible to prevent gas, moisture, and the like that adversely affect the organic EL element 220 during and after the manufacture of the organic EL display device 200 from reaching the organic EL element 220. Can be prevented. That is, the lifetime of the organic EL display device 200 of the present embodiment can be extended.
  • the organic EL display device according to another aspect of the embodiment of the present invention may not include the outer peripheral seal wall.
  • the organic EL display device 200a does not include the outer peripheral seal wall 250a.
  • the organic EL display device 200a can be a display device with a so-called narrow frame.
  • the display apparatus which has a larger display screen (light emission area
  • FIG. 2C is a diagram for explaining one of the effects of the organic EL display device of the present embodiment.
  • FIG. 2C is a cross-sectional view of the sealed space portion of the organic EL display device 200 or 200a shown in FIG. 2A or 2B.
  • the sealed space surrounded by the substrate 210 (or the passivation film 230), the sealing substrate 260, the frit glass sealing wall 240, and the inner peripheral sealing wall 250b is more atmospheric than atmospheric pressure. Is low, preferably in a vacuum. For this reason, when the frit glass sealing wall 240 is formed, outgas generated from the frit glass 242 can be confined in the sealed space. That is, when the frit glass 242 is heated, the outgas generated by the vaporization of the binder and the solvent remaining in the frit glass 242 is confined in a sealed space whose atmospheric pressure is lower than the atmospheric pressure.
  • the sealed space also plays a role of reducing the heat transmitted from the frit glass 242 when the frit glass sealing wall 240 is formed from being transmitted to the inner peripheral seal wall 250b made of a resin material. This is because there is little air that transmits heat in the sealed space, and thus heat at the time of heating the frit glass 242 is hardly transmitted to the inner peripheral seal wall 250b.
  • the frit glass sealing wall 240 when the frit glass sealing wall 240 is formed, heat is used to vaporize the binder and the solvent contained in the frit glass paste and to solidify the frit glass 242. Add However, when the heat at this time is transmitted to the inner peripheral seal wall 250b, the resin constituting the inner peripheral seal wall 250b is deteriorated, and the sealing effect of the organic EL element 220 is reduced.
  • a hermetic pressure lower than the atmospheric pressure is sealed between the frit glass sealing wall 240 and the inner peripheral sealing wall 250b. Since the space is formed, heat transfer to the inner peripheral seal wall 250b can be suppressed. That is, since there is little air which transmits heat in this sealed space, the transfer of heat to the inner peripheral seal wall 250b can be suppressed. Therefore, the sealing effect of the organic EL element 220 can be improved.
  • the inner peripheral sealing wall 250b is not provided as in the prior art, the adhesion between the frit glass sealing wall 240 and the substrate is weakened, for example, when the frit glass sealing wall 240 is deformed for some reason. In this case, moisture, oxygen and the like reach the organic EL element 220 from the outside.
  • the inner peripheral seal wall 250b is between the organic EL element 220 and the frit glass sealing wall 240, and is generated from the frit glass 242 when the frit glass sealing wall 240 is formed as shown in FIG. 2C. This prevents outgas from entering the organic EL element 220.
  • the organic EL display device 200 has not only the gas confinement effect by the sealed space but also the gas blocking effect by the inner peripheral seal wall 250b. Therefore, the sealing effect of the organic EL element 220 is greatly improved as compared with the conventional case.
  • the volume of the sealed space outside the frit glass sealing wall 240 is the volume of the sealed space inside the frit glass sealing wall 240. It is formed to be larger.
  • the volume of the space surrounded by the substrate 210, the sealing substrate 260, the frit glass sealing wall 240, and the outer peripheral sealing wall 250a is equal to the volume of the substrate 210, the sealing substrate 260, the frit glass sealing wall 240, and the inner peripheral sealing wall. It is larger than the volume of the space surrounded by 250b.
  • the distance between the frit glass sealing wall 240 and the outer peripheral seal wall 250a is the same as the distance between the frit glass sealing wall 240 and the inner peripheral seal wall 250b.
  • the area in the plane of the sealed space outside the frit glass sealing wall 240 is the area in the plane of the sealed space inside. Become bigger. Therefore, the volume of the sealed space outside the frit glass sealing wall 240 is larger than the volume of the sealed space of the frit glass sealing wall 240.
  • the outgas generated from the frit glass 242 is easily attracted toward the outer sealed space. Therefore, since the outgas can be kept away from the organic EL element 220, the influence of the outgas on the organic EL element 220 can be prevented.
  • the organic EL display device 200 of the present embodiment includes the frit glass sealing wall 240, the outer peripheral seal wall 250a, and the inner peripheral seal wall 250b, and the frit glass sealing wall 240 and the outer peripheral seal wall.
  • a sealed space having a pressure lower than the atmospheric pressure is formed between the space 250a and between the frit glass sealing wall 240 and the inner peripheral seal wall 250b.
  • FIG. 3 is a perspective view and a cross-sectional view showing an example of a manufacturing process of the organic EL display device 200 of the present embodiment.
  • the sealing substrate 260 is cut out (FIG. 3A), the frit glass 242 is formed (FIG. 3B), the sealing agents 251a and 251b are applied, and the filler 271 is formed. (Fig. 3 (c)), bonding of substrates in vacuum (Fig. 3 (d)), bonding of substrates by atmospheric pressure pressing (Fig. 3 (e)), UV or thermal curing (Fig. f)), sealing by laser annealing (FIG. 3 (g)), and various inspections (FIG. 3 (h)) in order. Further, the above process shall be carried out in a nitrogen (N 2) atmosphere. Note that the process may be performed not only in a nitrogen atmosphere but also in an inert gas atmosphere that does not affect the organic EL element 220, that is, does not include oxygen and moisture.
  • a sealing substrate 260 is prepared.
  • an alkali-free glass substrate having dimensions of 370 mm ⁇ 470 mm ⁇ 0.7 mm is used as the sealing substrate 260.
  • the dimensions are not limited to this.
  • the first step of forming the light emitting region including the organic EL element 220 on the substrate 210 may be performed until the fifth step of bonding the substrate 210 and the sealing substrate 260 together.
  • FIG. 4 is a cross-sectional view showing an example of a process for forming the frit glass 242 of the present embodiment.
  • the cross-sectional view shown in FIG. 4 is a cross-sectional view taken along the AA direction shown in FIG.
  • the frit glass paste 241 is patterned on the sealing substrate 260. Specifically, first, a frit glass paste 241 is applied (see FIG. 4A). For example, the frit glass paste 241 is applied onto the sealing substrate 260 using a dispenser, a screen printing apparatus, a die coating apparatus, or the like.
  • the frit glass paste 241 applied on the sealing substrate 260 has, for example, a width of 100 ⁇ m to 2 mm and a height of 5 ⁇ m to 100 ⁇ m. Note that since the height of the frit glass 242 is a gap between the substrate 210 and the sealing substrate 260, the height of the frit glass paste 241 needs to be at least the height of the frit glass 242. Here, as an example, the height of the frit glass 242 is 20 ⁇ m, the height of the frit glass paste 241 is 50 ⁇ m, and the width is 1 mm.
  • the frit glass paste 241 is a paste containing a frit, a binder, and a solvent.
  • the softening point of the frit is about 450 ° C.
  • the temperature at which the binder sublimates (evaporates) is about 300 ° C.
  • the boiling point of the solvent is about 180 ° C.
  • the frit is made of zinc oxide (ZnO), boron oxide (B 2 O 3 ), tin oxide (SnO), bismuth oxide (Bi 2 ) in addition to components that form a glass skeleton such as silicon oxide (SiO 2 ).
  • the frit desirably contains at least one kind of transition metal. In order to prevent damage to the organic EL element 220, the frit is alkali-free.
  • the binder is a material for adjusting the viscosity of the frit glass paste 241.
  • an acrylic resin using cellulose such as nitrocellulose or ethylcellulose, methyl methacrylate, propyl methacrylate, butyl methacrylate, or the like as a raw material monomer is used.
  • nitrocellulose having a low decomposition temperature by baking is used.
  • terpineol butyl carbitol
  • isobornyl acetate butyl carbitol acetate
  • cyclohexane methyl ethyl ketone
  • toluene xylene
  • ethyl acetate butyl stearate, or the like
  • the frit glass paste 241 is molded by a mechanical press using the mold 300 (see FIG. 4B) (see FIG. 4C). Specifically, the upper surface of the frit glass paste 241 is planarized.
  • a digging 301 is formed in a region where the frit glass 242 is to be formed (that is, a region where the frit glass paste 241 is applied), and the height of the digging 301 is the height of the frit glass 242. Greater than that. This is because when the frit glass paste 241 is heated, the frit glass paste 241 contracts, so that the height of the frit glass 242 is lower than the frit glass paste 241 after molding.
  • the coating layer 302 is exposed on the bottom surface of the digging 301.
  • the coating layer 302 has water repellency so as to prevent the frit glass paste 241 from adhering to the mold 300.
  • fluorine polyimide resin for example, fluorine polyimide resin.
  • the shaped frit glass paste 241 is heated at the melting temperature of the frit glass (for example, about 480 ° C.) (preliminary firing process) to form a trapezoidal frit glass 242 (FIG. 4D). reference).
  • the frit glass 242 has a trapezoidal shape because the frit glass paste 241 is crushed by a mechanical press as shown in FIGS. 4B and 4C and does not necessarily have a trapezoidal shape. .
  • the upper surface of the frit glass 242 is bonded to the substrate 210 and thus needs to be flat.
  • the frit glass 242 is formed in a predetermined region on the sealing substrate 260 (FIG. 3B).
  • 5A and 5B are plan views showing an example of the positional relationship between the frit glass 242 and the sealing substrate 260 of this embodiment.
  • the frit glass 242 is formed so as to surround the light emitting region having the organic EL element 220.
  • a plurality of organic EL elements 220 organic EL displays
  • a plurality of frit glasses 242 are formed as shown in FIG. 5B.
  • the position where the frit glass 242 is formed is the size and position of the organic EL element 220 formed in the region surrounded by the frit glass 242 and the size and position of the outer peripheral seal wall 250a and the inner peripheral seal wall 250b. Determined by. That is, the position of the frit glass 242 is determined so that at least the outer peripheral seal wall 250a can be formed outside the frit glass 242 and the inner peripheral seal wall 250b and the organic EL element 220 can be formed inside the frit glass 242. Is done.
  • an inner peripheral seal wall 250b is provided along the inner periphery of the patterned frit glass paste 241 (frit glass 242).
  • an outer peripheral seal wall 250a is provided along the outer periphery of the patterned frit glass paste 241.
  • FIG. 6 is a cross-sectional view in the application process of the sealing agents 251a and 251b for constituting the double seal structure of the present embodiment.
  • the cross-sectional view shown in FIG. 6 is a cross-sectional view taken along the AA direction shown in FIG.
  • sealing agents 251a and 251b are applied onto the sealing substrate 260 using a dispenser or a screen printing apparatus.
  • the sealing agents 251a and 251b are UV curable or thermosetting adhesives, and are, for example, epoxy resins or acrylic resins.
  • the viscosity of the sealing agents 251a and 251b is 100,000 mPa ⁇ s to 1,000,000 mPa ⁇ s.
  • the height of the sealing agents 251a and 251b is at least the height of the frit glass 242 and the width is 100 ⁇ m to 300 ⁇ m.
  • a UV curable epoxy resin having a viscosity of 500,000 mPa ⁇ s, a height of 50 ⁇ m, and a width of 200 ⁇ m is used as the sealing agents 251a and 251b, and a dispenser is used in a predetermined region on the sealing substrate 260.
  • FIG. 7A to 7C are plan views showing an example of a positional relationship among the frit glass 242 of this embodiment, the sealing agents 251a and 251b, and the sealing substrate 260.
  • FIG. 1 the sealing agents 251 a and 251 b are formed so as to surround the light emitting region having the organic EL element 220.
  • a plurality of organic EL elements 220 organic EL display
  • a plurality of sealing agents 251a and 251b are applied as shown in FIG. 7B.
  • a vacuum space is formed between the frit glass 242 and the sealing agents 251a and 251b shown in the figure, and the organic EL element 220 is formed inside the sealing agent 251b.
  • an outer peripheral seal wall 250a may be provided so as to surround a plurality of frit glass pastes 241 (frit glass 242).
  • the sealing agent 251b is applied along the inner circumference of each of the plurality of frit glass pastes 241
  • the sealing agent 251a is applied so as to surround all of the plurality of frit glass pastes 241.
  • the volume of the sealed space (outer sealed space) between the frit glass 242 and the outer peripheral seal wall 250a is larger than the volume of the sealed space (inner sealed space) between the frit glass 242 and the inner peripheral seal wall 250b.
  • the plurality of organic EL display devices 200 are cut and separated between the frit glass sealing wall 240 (frit glass 242) and the inner peripheral seal wall 250b. . Therefore, the outgas confined in the outer sealed space is released to the atmosphere, and thus does not adversely affect the organic EL element 220. For this reason, since the deterioration of the organic EL element 220 can be prevented, the life of the organic EL display device 200 can be extended.
  • FIG. 8 is a cross-sectional view in the dropping step of the filler 271 of the present embodiment.
  • the cross-sectional view shown in FIG. 8 is a cross-sectional view taken along the AA direction shown in FIG.
  • the filler 271 is dropped on the sealing substrate 260 using a jet dispenser or the like (ODF (One Drop Filling) method).
  • the filler 271 is a UV curable or thermosetting adhesive, and is, for example, an epoxy resin or an acrylic resin. Note that the filler 271 is desirably the same property and the same material as the sealing agents 251a and 251b.
  • the viscosity of the filler 271 is 100 mPa ⁇ s to 500 mPa ⁇ s.
  • the drop volume per drop is 0.2 ⁇ L to 2.0 ⁇ L.
  • the number of drops is calculated by the total resin drop amount / drop amount per drop.
  • the total resin dripping amount is calculated from the gap between the substrate 210 and the sealing substrate 260, the area of the region surrounded by the sealing agent 251b, and the volume occupied by the organic EL element 220. Specifically, it is calculated by (Equation 1) shown below.
  • a UV curable epoxy resin having a viscosity of 200 mPa ⁇ s is dropped as a filler 271 at a drop amount of 1.0 ⁇ L per drop and a drop interval of 7 mm.
  • FIGS. 9A and 9B are plan views showing an example of the positional relationship among the frit glass 242, the sealing agents 251 a and 251 b, the filler 271, and the sealing substrate 260 of the present embodiment.
  • a filler 271 is dropped into a region surrounded by a sealant 251a on the sealing substrate 260.
  • a plurality of organic EL elements 220 organic EL displays
  • the filler 271 is in an area surrounded by a plurality of sealing agents 251a. Dripping into.
  • FIG. 10 is a cross-sectional view showing a sealing process of the organic EL element 220 of the present embodiment.
  • FIG. 10 is a cross-sectional view taken along the AA direction shown in FIGS. 3 (d) to 3 (f).
  • the organic EL element 220 is formed on the substrate 210, and the alignment between the substrate 210 on which the organic EL element 220 is formed and the sealing substrate 260 is vacuum (for example, 10 Pa or less). At this time, alignment marks can be accurately performed by previously forming alignment marks on both the substrate 210 and the sealing substrate 260. Note that the substrate 210 used at this time preferably has the same dimensions as the sealing substrate 260.
  • the substrate 210 and the sealing substrate 260 are bonded to such an extent that the sealing agents 251a and 251b are crushed.
  • This adhesion is performed by, for example, a mechanical press.
  • the sealing agents 251a and 251b are crushed, the substrate 210, the sealing substrate 260, the sealing agent 251a, and the sealing agent 251b form a closed space (closed loop).
  • the frit glass 242 is sealed in the formed closed space.
  • an inert gas for example, nitrogen
  • an inert gas for example, nitrogen
  • the substrate 210 and the substrate 210 are released by returning from vacuum to atmospheric pressure, that is, by opening to the atmosphere.
  • the sealing substrate 260 is further adhered. Specifically, the upper surface of the frit glass 242 and the substrate 210 are bonded by atmospheric pressure. Since a vacuum space is formed between the substrate 210 and the sealing substrate 260, a uniform force (differential pressure between atmospheric pressure and vacuum) is applied from the upper part of the substrate 210 and the lower part of the sealing substrate 260.
  • the gap between the two substrates is determined by the height of the frit glass 242.
  • the filler 271 is adjusted at the time of dropping so as to fill the region surrounded by the sealing agent 251b, the substrate 210, and the sealing substrate 260 without any gap (see (Equation 1)).
  • the amount of the filler 271 is too small, a vacuum space is created in the space where the organic EL element 220 is formed. Therefore, the sealing substrate 260 may be deformed or damaged when released to the atmosphere.
  • the sealing agent 251b may be destroyed.
  • the sealing material 251a and 251b and the filler 271 are cured by irradiating the entire surface with UV from the sealing substrate 260 side, thereby producing the outer periphery.
  • a seal wall 250a, an inner peripheral seal wall 250b, and a filling portion 270 are formed.
  • UV with an intensity of 2 J / cm 2 is irradiated.
  • the sealants 251a and 251b and the filler 271 are made of the same material.
  • UV is radiated because the UV curable epoxy resin is used for the sealing agents 251a and 251b and the filler 271.
  • heat treatment is performed. This is done to cure the resin.
  • FIG. 11 is a cross-sectional view in the laser annealing step of the present embodiment.
  • FIG. 11 is a cross-sectional view taken along the AA direction shown in FIG.
  • the laser is irradiated from the sealing substrate 260 side toward the frit glass 242.
  • substrate 210 fuse
  • the remaining binder and solvent that have not been vaporized in the pre-baking are generated as outgas that causes deterioration of the organic EL element 220.
  • the generated outgas is confined in the sealed space inside and outside the frit glass sealing wall 240 as described above.
  • the wavelength of the laser beam used at this time is a wavelength that is absorbed by the frit glass 242 and is a wavelength that is not absorbed by the outer peripheral seal wall 250a, the inner peripheral seal wall 250b, the filling portion 270, the passivation film 230, and the like. Therefore, it is necessary to select the frit glass paste 241 and the materials for the sealing agents 251a and 251b, the filler 271 and the passivation film 230 so that the wavelengths to be absorbed are different.
  • the viewpoint of the output of the laser beam is to minimize the influence of damage to the electrode wiring, thermal damage to the organic EL element 220, deterioration of the filling portion 270, the outer peripheral seal wall 250a, and the inner peripheral seal wall 250b. From the above, it is desirable to reduce the frit glass to the minimum necessary for melting. Note that in this embodiment mode, a laser beam of approximately 500 ° C. to 1000 ° C. is irradiated using a semiconductor laser. As a result, the solvent and binder contained in the frit glass 242 are completely vaporized.
  • the portion irradiated with the laser beam is melted.
  • the outer peripheral seal wall 250a and the inner peripheral seal wall 250b are formed between the substrate 210 and the sealing substrate 260. Keeping the gap. Therefore, the substrate 210 and the sealing substrate 260 can be prevented from being bent, and the substrate can be prevented from being destroyed by the bending.
  • the manufactured organic EL display device 200 is subjected to various tests such as film thickness measurement, appearance inspection, chromatic aberration (CA) test, and the like.
  • the EL display device 200 is completed.
  • the frit glass sealing wall 240 and the sealing agents 251a and 251b are formed apart from each other, and the substrate 210 and the sealing substrate 260 are formed in a vacuum. Manufactured by bonding. Thus, a sealed space is formed by the frit glass sealing wall 240, the sealing agent 251a or 251b, the substrate 210, and the sealing substrate 260.
  • the frit glass paste 241 contains a binder and a solvent, and laser annealing may be performed while containing the binder and the solvent that have not evaporated or sublimated during the drying process.
  • laser annealing may be performed while containing the binder and the solvent that have not evaporated or sublimated during the drying process.
  • outgas that adversely affects the organic EL element 220 is generated.
  • the organic EL element 220 is deteriorated and the life of the organic EL element 220 is shortened.
  • the frit glass sealing wall 240, the inner peripheral sealing wall 250b, the substrate 210, and the seal are sealed between the frit glass sealing wall 240 and the organic EL element 220. Since the sealed substrate 260 forms a sealed space whose atmospheric pressure is lower than atmospheric pressure, the generated outgas can be confined. Thereby, deterioration due to outgassing to the organic EL element 220 can be reduced, and the life of the organic EL element 220 can be extended.
  • the inner peripheral seal wall 250b may cause the outgas generated from the frit glass sealing wall 240, or moisture and oxygen from the outside. Intrusion into the organic EL element 220 is prevented. For this reason, deterioration of the organic EL element 220 can be prevented, and the lifetime of the organic EL element 220 can be extended.
  • the space between the frit glass sealing wall 240 (frit glass 242) and the outer peripheral seal wall 250a and the inner peripheral seal wall 250b is lower than atmospheric pressure ( Since it is preferably a vacuum), heat at the time of laser irradiation is not easily transmitted to the outer peripheral seal wall 250a and the inner peripheral seal wall 250b. That is, since there is little air used as a medium for transmitting heat, it is possible to prevent heat during laser irradiation from being transmitted to the inner peripheral seal wall 250b. Therefore, since deterioration of the resin can be reduced, the life of the organic EL display device 200 of the present embodiment can be extended.
  • the sealed space has an atmospheric pressure lower than atmospheric pressure (preferably, a vacuum)
  • atmospheric pressure preferably, a vacuum
  • the frit glass sealing wall 240, the substrate 210, and the sealing substrate 260 are always under pressure by atmospheric pressure. So it is in close contact. Therefore, the frit glass sealing wall 240 and the substrate 210 can be securely bonded by melting and curing the bonding surface between the frit glass 242 and the substrate 210 by laser annealing.
  • the atmospheric pressure is used instead of a mechanical press that physically applies force even when the substrates are in close contact with each other, it is possible to apply a uniform force and improve adhesion.
  • the outer peripheral seal wall 250a and the inner peripheral seal wall 250b are formed on both sides of the frit glass sealing wall 240, respectively.
  • the gap between the substrate 210 and the sealing substrate 260 can be maintained by the outer peripheral seal wall 250a and the inner peripheral seal wall 250b. Therefore, the subsidence of the substrate hardly occurs, and the occurrence of residual distortion can be reduced.
  • phosphoric acid which is a low melting point material, is often mixed with the frit glass paste 241.
  • frit glass containing phosphoric acid has low reliability in terms of strength and the like.
  • the frit glass sealing wall 240 (frit glass 242) is formed in a vacuum, so that the possibility of hydration is low. Accordingly, since a large amount of phosphoric acid can be contained in the frit glass 242, the melting temperature of the frit glass 242 can be further lowered. As a result, the intensity of the laser beam in the laser annealing treatment can be suppressed, so that damage to the electrode wiring and the like due to heat can be prevented, the organic EL element 220 and the filling portion 270 can be prevented from being deteriorated, and residual strain of the glass substrate can be reduced. Can be achieved.
  • the organic EL display device 200 has a gas, moisture, or the like that deteriorates the organic EL element 220 at the time of manufacturing and after manufacturing (when the organic EL display device 200 is used by a user). Since heat or the like can be prevented from reaching the organic EL element 220, the deterioration of the organic EL element 220 can be prevented.
  • the organic EL element 220 has a high sealing property, and the adhesion between the substrate 210 and the sealing substrate 260 is also high. It can be manufactured at low cost and high productivity.
  • the organic electroluminescence display device and the manufacturing method thereof according to the present invention have been described based on the embodiments.
  • the present invention is not limited to these embodiments. Unless it deviates from the meaning of this invention, what made the various deformation
  • the organic EL display device 200 includes the outer peripheral seal wall 250a and the inner peripheral seal wall 250b on both sides of the frit glass sealing wall 240, thereby enhancing the sealing effect of the organic EL element 220.
  • it may be configured to include only one of the outer peripheral seal wall 250a and the inner peripheral seal wall 250b. Even in this case, since the vacuum space is formed, adhesion between the frit glass sealing wall 240 and the substrate 210 and the sealing substrate 260 is ensured.
  • a vacuum space is formed by forming an inner peripheral sealing wall between the frit glass sealing wall 240 and the organic EL element 220. That is, it is desirable that the organic EL display device 200 includes the inner peripheral seal wall 250b. According to this configuration, outgas that can be generated from the frit glass 242 when performing the laser annealing treatment can be confined in the vacuum space. It is also possible to prevent the heat during the laser annealing process from being transmitted to the filling portion 270. Note that a space depressurized from the atmospheric pressure may be formed instead of the vacuum space.
  • the organic EL display device 200a shown in FIG. 2B that does not include the outer peripheral seal wall 250a will be described.
  • the organic EL display device 200 is manufactured according to the manufacturing process shown in FIG. That is, in the manufacturing process, the organic EL display device 200a includes an outer peripheral seal wall and an inner peripheral seal wall.
  • the substrate 210 and the sealing substrate 260 are cut (scribed) between the frit glass sealing wall 240 and the outer peripheral sealing wall 250a perpendicular to the substrate 210 and the sealing substrate 260. .
  • this step it is possible to manufacture the organic EL display device 200a that does not include the outer peripheral seal wall.
  • a so-called narrow frame display device can be manufactured. That is, a display device having a larger display screen (light emitting region) that can be installed in a small space can be manufactured. That is, space saving can be realized.
  • a step of cutting the substrate is similarly included. That is, after the process shown in FIG. 3, either the organic EL display device 200 having the outer peripheral seal wall or the organic EL display device 200a having no outer peripheral seal wall can be manufactured depending on the position at which the substrate is cut.
  • a plurality of organic EL display devices 200 can be manufactured by cutting between the outer peripheral seal walls 250a of adjacent organic EL display devices (cutting position 303 shown in FIG. 12). Also, a plurality of organic EL display devices 200a can be manufactured by cutting between the frit glass sealing wall 240 and the inner peripheral seal wall 250b (cutting position 304 shown in FIG. 12).
  • the organic EL display device 200 includes the outer peripheral seal wall, the sealing effect is high, and the organic EL display device 200a does not include the outer peripheral seal wall, so that space saving can be realized and both are useful. .
  • the organic EL display device 200 of the present embodiment may include a porous frit glass instead of the frit glass sealing wall 240.
  • FIG. 13 is a cross-sectional view showing a different example of the frit glass of the present embodiment.
  • the frit glass sealing wall 440 shown in the figure is a porous frit glass and has many holes 441. As a result, water molecules and the like are confined in the holes 441, that is, the frit glass sealing wall 440 can adsorb moisture, so that a higher sealing effect can be obtained.
  • porous frit glass sealing wall 440 In order to form the porous frit glass sealing wall 440, first, particles that are soluble in an acid such as aluminum (Al) are mixed into the frit glass paste as a material. Then, after preliminary firing (see FIG. 4D), the porous frit glass sealing wall 440 is formed by melting aluminum appearing on the surface of the frit glass using an acid or the like.
  • an acid such as aluminum (Al)
  • the organic EL display device 200 of the present embodiment may not include the filling unit 270.
  • the configuration of the organic EL display device 200 at this time is shown in FIG.
  • FIG. 14 is a cross-sectional view showing an example of a different configuration of the organic EL display device of the present embodiment.
  • An organic EL display device 500 shown in the figure includes a bank 580 instead of the filling unit 270.
  • the organic EL display device 500 does not include the filling portion 270, the space surrounded by the inner peripheral seal wall 250b, the substrate 210, and the sealing substrate 260, that is, the space in which the organic EL element 220 is formed is also a vacuum. . Accordingly, the substrate 210 and the sealing substrate 260 are difficult to maintain the flatness of the substrate because a force is applied from the outside due to the atmospheric pressure. Furthermore, there is a possibility that the substrate is cracked, the organic EL element is deformed, or a TFT portion (not shown) that is a drive circuit for controlling light emission of the organic EL element is deformed. . In order to prevent these problems, the organic EL display device 500 includes a bank 580 having substantially the same height as the frit glass sealing wall 240.
  • the bank 580 is a barrier that is used in an organic material application process when forming the organic EL element 220 and forms a region for accurately applying the organic material to a desired position.
  • the bank 580 is formed for each pixel or for each line including a plurality of pixels.
  • the bank 580 is an acrylic resin.
  • FIG. 15 is a cross-sectional view of the organic EL element 220 included in the organic EL display device 500 in the sealing process.
  • the organic EL element 220 is formed on the substrate 210, and the alignment between the substrate 210 on which the organic EL element 220 is formed and the sealing substrate 260 is in a vacuum (for example, 10 Pa or less). To do.
  • the bank 580 is formed so as to have the same height as the frit glass sealing wall 240. Note that the bank 580 can also be used as a bank used for partitioning the light emitting area of each light emitting color when the organic light emitting layer of the organic EL element 220 is formed.
  • the height of the bank 580 formed when forming the organic EL element 220 is set to the height of the frit glass sealing wall 240, so that the flatness of the substrate can be improved without adding a new process. Can keep.
  • the organic EL display device 500 shown in FIG. 14 the light from the organic EL element 220 is totally reflected due to the difference between the refractive index of the layer located on the outermost surface of the organic EL element 220 and the refractive index of the vacuum space. Therefore, the light extraction efficiency decreases.
  • the same effect as the organic EL display device 200 shown in FIG. 2A can be obtained, which is very useful.
  • the organic electroluminescence element is sufficiently sealed to achieve a long life, and can be used for displays such as digital televisions and digital cameras. Can do.

Landscapes

  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne un dispositif d’affichage électroluminescent (EL) organique et un procédé destiné à fabriquer ledit dispositif de manière efficiente avec un coût modéré de manière à obtenir un effet d’étanchéité suffisant. Le dispositif d’affichage électroluminescent organique comporte : un substrat (210) ; un élément EL organique (220) formé sur le substrat (210) ; un substrat (260) d’étanchéité faisant face au substrat (210) ; une paroi (240) d’étanchéité en verre fritté placée entre le substrat (210) et le substrat (260) d’étanchéité de façon à entourer l’élément EL organique (220) et qui isole l’élément EL organique (220) en reliant le substrat (210) au substrat (260) d’étanchéité ; et une paroi intérieure (250b) d’étanchéité, configurée à partir d’un matériau en résine et formée entre l’élément EL organique (220) et la paroi (240) d’étanchéité en verre fritté située entre le substrat (210) et le substrat (260) d’étanchéité de façon à entourer l’élément EL organique (220). La pression dans l’espace isolé, délimité par le substrat (210), le substrat (260) d’étanchéité, la paroi (240) d’étanchéité en verre fritté et la paroi intérieure (250b) d’étanchéité, est inférieure à la pression atmosphérique.
PCT/JP2010/004306 2009-07-07 2010-06-30 Dispositif d’affichage électroluminescent organique et procédé pour sa fabrication Ceased WO2011004567A1 (fr)

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CN102237494A (zh) * 2011-06-30 2011-11-09 四川虹视显示技术有限公司 一种oled显示器件及其封装结构和封装方法
CN102790186A (zh) * 2012-08-24 2012-11-21 深圳市华星光电技术有限公司 有源矩阵式有机电致发光二极管面板的封装结构
CN103337596A (zh) * 2013-05-24 2013-10-02 四川虹视显示技术有限公司 一种有机发光二极管的封装结构及其制备方法
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CN103904253A (zh) * 2014-04-17 2014-07-02 上海和辉光电有限公司 一种oled器件的封装结构及其方法
CN104064683A (zh) * 2013-03-21 2014-09-24 海洋王照明科技股份有限公司 有机电致发光器件
CN104064684A (zh) * 2013-03-21 2014-09-24 海洋王照明科技股份有限公司 有机电致发光器件
WO2015192401A1 (fr) * 2014-06-17 2015-12-23 深圳市华星光电技术有限公司 Procédé de conditionnement de substrats
CN105655503A (zh) * 2016-03-01 2016-06-08 京东方科技集团股份有限公司 一种显示面板密封方法、显示面板和显示装置
US9678058B2 (en) 2010-09-03 2017-06-13 Anastasia Rigas Diagnostic method and breath testing device
JP6463876B1 (ja) * 2017-09-27 2019-02-06 シャープ株式会社 基板の封止構造体、及び表示装置とその製造方法
US10401318B2 (en) 2011-03-14 2019-09-03 Anastasia Rigas Breath analyzer and breath test methods
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WO2020217639A1 (fr) * 2019-04-25 2020-10-29 日本電気硝子株式会社 Dispositif électronique et son procédé de fabrication
CN115172621A (zh) * 2022-06-15 2022-10-11 深圳市华星光电半导体显示技术有限公司 显示面板的封装结构及其制备方法
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CN102231429A (zh) * 2011-06-30 2011-11-02 四川虹视显示技术有限公司 一种oled显示器件及其封装结构和封装方法
CN102790186A (zh) * 2012-08-24 2012-11-21 深圳市华星光电技术有限公司 有源矩阵式有机电致发光二极管面板的封装结构
US20140054553A1 (en) * 2012-08-24 2014-02-27 Chihche Liu Active matrix organic light-emitting diode panel packaging structure
WO2014029146A1 (fr) * 2012-08-24 2014-02-27 深圳市华星光电技术有限公司 Structure de mise en boîtier destinée à un panneau à diodes électroluminescentes organiques à matrice active
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CN103337596A (zh) * 2013-05-24 2013-10-02 四川虹视显示技术有限公司 一种有机发光二极管的封装结构及其制备方法
CN103904253A (zh) * 2014-04-17 2014-07-02 上海和辉光电有限公司 一种oled器件的封装结构及其方法
WO2015192401A1 (fr) * 2014-06-17 2015-12-23 深圳市华星光电技术有限公司 Procédé de conditionnement de substrats
CN105655503A (zh) * 2016-03-01 2016-06-08 京东方科技集团股份有限公司 一种显示面板密封方法、显示面板和显示装置
US10418584B2 (en) 2016-03-01 2019-09-17 Boe Technology Group Co., Ltd. Method of sealing display panel, display panel and display device
JP6463876B1 (ja) * 2017-09-27 2019-02-06 シャープ株式会社 基板の封止構造体、及び表示装置とその製造方法
US11211579B2 (en) 2017-09-27 2021-12-28 Sharp Kabushiki Kaisha Substrate sealing structure body, and, display device and production method therefor
US11437600B2 (en) 2017-09-27 2022-09-06 Sharp Kabushiki Kaisha Substrate sealing structure body, and, display device and production method therefor
WO2020063530A1 (fr) * 2018-09-28 2020-04-02 京东方科技集团股份有限公司 Structure d'encapsulation, appareil électronique et procédé d'encapsulation
US11805667B2 (en) 2018-09-28 2023-10-31 Boe Technology Group Co., Ltd. Encapsulation structure, electronic apparatus and encapsulation method
US12150752B2 (en) 2018-12-10 2024-11-26 Anastasia Rigas Hydrogen breath analyzer and breath test method
US12414710B2 (en) 2018-12-10 2025-09-16 Anastasia Rigas Breath analyzer devices and breath test methods
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