[go: up one dir, main page]

WO2014064040A1 - Système de réalisation d'une mesure sans contact sur un échantillon et porte-échantillon - Google Patents

Système de réalisation d'une mesure sans contact sur un échantillon et porte-échantillon Download PDF

Info

Publication number
WO2014064040A1
WO2014064040A1 PCT/EP2013/071952 EP2013071952W WO2014064040A1 WO 2014064040 A1 WO2014064040 A1 WO 2014064040A1 EP 2013071952 W EP2013071952 W EP 2013071952W WO 2014064040 A1 WO2014064040 A1 WO 2014064040A1
Authority
WO
WIPO (PCT)
Prior art keywords
heating
substrate
sample
sample carrier
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2013/071952
Other languages
German (de)
English (en)
Inventor
Anna Ohlander
Gerhard Klink
Karlheinz Bock
Arman RUSSOM
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority to EP13783510.4A priority Critical patent/EP2895268B8/fr
Publication of WO2014064040A1 publication Critical patent/WO2014064040A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L7/00—Heating or cooling apparatus; Heat insulating devices
    • B01L7/52—Heating or cooling apparatus; Heat insulating devices with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/06—Fluid handling related problems
    • B01L2200/0673—Handling of plugs of fluid surrounded by immiscible fluid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/14—Process control and prevention of errors
    • B01L2200/141—Preventing contamination, tampering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/06—Auxiliary integrated devices, integrated components
    • B01L2300/0627—Sensor or part of a sensor is integrated
    • B01L2300/0645—Electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0809—Geometry, shape and general structure rectangular shaped
    • B01L2300/0816—Cards, e.g. flat sample carriers usually with flow in two horizontal directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/18—Means for temperature control
    • B01L2300/1805—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
    • B01L2300/1827—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks using resistive heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/007—Heaters using a particular layout for the resistive material or resistive elements using multiple electrically connected resistive elements or resistive zones

Definitions

  • the present invention relates to non-contact measurements on samples such as e.g. biological and / or chemical samples, systems for such measurements, and sample carriers suitable for such systems.
  • ⁇ 8 Micro Total Analysis Systems
  • lab-on chips are used in areas such as microsystems. global health and medical research will play an important role. You reduce costs and time for testing and analysis. The limitation that they are disposable, material selection, design, and manufacturing are all aspects that must be considered in order to keep chip costs low and thus produce a device with marketability. Numerous biological and chemical assays are temperature dependent, e.g. PCR (Polymerase Chain Reaction) and MCA (Melting Curve Analysis). When such a study is scaled down to micro size, precise temperature control and thermal homogeneity of integrated miniaturized heating and sensing elements in microfluidic features become critical factors for a functional device.
  • PCR Polymerase Chain Reaction
  • MCA Melting Curve Analysis
  • Microheating devices are ubiquitous in various MEMS and microfluidic devices. The latter provide various functions in physical or chemical sensors (SC Roth, YM Choi and SY Kim Sensors Actuators A, 2006, 128, 1-6, D. Briand, S. Colin and A. Gangadharaiah, Sensors Actuators A, 2006, 132, 317-24), chemical reactors (T. Becker, S. Muhlberger and W. Benecke, J. Microelectromech., Syst. 200, 9, 478-84, A. Splinter, J. Sturmann and O. Bartels, Sensors Actuators B, 2002, 83, 169-74) or pumps (Z. Yin and A. Prosperetti, J.
  • a typical layout of a micro-heater is a thin metallic or doped Si layer, which is patterned in a serpentine form on a dielectric substrate.
  • a temperature measurement can be made possible by integration of a second trace or by a four-point measurement.
  • Different applications have different limitations, but generally thermal homogeneity across the heated surface is important for accurate measurements and controls. But that is not easy to achieve on the basis of physical facts.
  • Material selection and heater design are factors that may be modified to affect heat distribution in the heated area (W.-J. Hwang, KS Shin, and JH Roh. Sensors, 2011, 11, 2580-2591, D. Caputo, G. de Cesare and M. Nardini, IEEE SENSORS JOURNAL, 2012, 12 (5), 1209-13, http://www.allflexheaters.com/Profiled Heaters.cfm).
  • Transparent heating elements for lab-on-chip applications were prepared by patterning ITO (indium tin oxide) on glass (K. Sun, A. Yamaguchi and Y. Ishida, Sensor and Actuators B, 2002, 84, 283 -289, J.-Y. Cheng, M.-H. Yen and C.-T. Kuo, Biomicrofluidics, 2008, 2, 024105- (1-12), J.-L. Lin, M.-H. Wu and C.Y. Kuo, Biomed Microdevices, 2010, 12, 389-398, S. Kumar Jha, R. Chand and D. Han, Lab Chip, 2012, doi: 10.1039 / C2LC40727B).
  • ITO indium tin oxide
  • Transparent electrodes are also used in a large range of optoelectronic components, such as organic LEDs, photovoltaic cells and liquid crystal displays, essential elements that serve to generate voltage for the optoelectronic or electro-optical conversion.
  • metal meshes have been used as semi-transparent electrode materials to replace the commonly used ITO in the search for a more favorable electrode material (M.G. Kang and LJ Guo, Advanced Materials, 2007, 19 (10), 1391-1396, M G-Kang, MS, Kim and J Kim, Advanced Materials, Adv. Mater., 2008, 20, 4408-4413) or to reduce resistance and improve electrical homogeneity of the material (S. Choi, WJ Potscavage, Jr. and B.
  • the object of the present invention is therefore to provide a system and a method for carrying out a non-contact measurement of a sample as well as a sample carrier with improved characteristics.
  • a sample carrier when carrying out a non-contact measurement on a sample, a sample carrier is used, in which the heating paths on the substrate form a parallel connection between the first and the second heating termination, so that when by applying a voltage between the first and the second heating terminal is heated, a sample applied to the sample carrier, the heating properties of the sample carrier are not affected even if individual interruptions of the heating paths due to, for example, process variations in the production of the heating tracks are present.
  • heating paths even form a two-dimensional lattice structure, isolated interruptions and cross-sectional constrictions of the heating lanes have a less negative effect on homogeneity of the sample heating via the heating region of the substrate covered by the heating lanes, since their occurrence in individual lugs of the two-dimensional lattice is limited by the lattice structure or lattice structure adjacent bridges are bridged. It is thus possible to reduce the manufacturing tolerances in favor of lower production costs. Furthermore, it is possible to make the heating paths optically intransparent, and nevertheless to maintain a semitransparency of the sample carrier with any transparency of the substrate present, since the grid interspaces or meshes of the two-dimensional lattice preserve the transparency of the substrate in the thickness direction of the substrate.
  • a sample carrier in which the heating tracks are arranged in such a way that the area density of the heating tracks increases from the center of the substrate to the outside. That way it's possible to do the otherwise often occurring inhomogeneities of the heating profile across the substrate, after which usually the heating decreases at the edge of the substrate to avoid.
  • FIG. 1 is a schematic drawing of a system for carrying out a contactless measurement on a sample according to an embodiment
  • FIG. 2 is a schematic plan view of a sample carrier according to an embodiment
  • FIG. FIG. 3 shows a schematic plan view of a sample carrier according to an alternative exemplary embodiment with outwardly increasing heater path density
  • FIG. 4a shows a schematic plan view of a sample carrier according to an alternative embodiment with non-rectilinear grid bars
  • 4b is a schematic plan view of a sample carrier 14 according to an embodiment with complete representation of the substrate front side;
  • 4c is a schematic plan view of a sample carrier according to an exemplary embodiment with non-linear extension of the Schubahngitternetzes;
  • 4 shows a schematic side sectional view of a sample carrier according to an embodiment, in which a protective layer covers the heating paths;
  • 4e shows a schematic view of a sample carrier according to an embodiment, in which the side of the substrate provided with the heating paths together with a cover element forms at least one channel or chamber to which the heating area adjoins;
  • 5 shows a flow chart of a method for carrying out a non-contact measurement on a sample according to an exemplary embodiment;
  • 6a and 6b show a schematic plan view and an associated heating distribution of a sample carrier with a meandering guided heating path;
  • FIGS. 7a and 7b show a schematic top view and an associated heating distribution of a sample carrier with exemplary square meshes in the heating grid lattice:
  • FIGS. 7a and 7b show a schematic plan view and an associated heating distribution of a sample carrier with narrower square heating grid systems than FIGS. 7a and 7b.
  • sample 12 may be, for example, a liquid, such as a solution, a suspension or the like.
  • sample 12 contains a particular analyte.
  • sample 12 could also be a solid, such as a sediment.
  • the analyte mentioned above can be atoms, molecules or other substances of any kind, such as biological cells, DNA, gene-antigen compounds, etc. The following is without limitation and merely for the sake of clarity assumed that it Sample 12 is a biological / chemical sample.
  • the system includes a sample carrier 14 having a substrate 15, first and second heating ports 16 and 18, and heating paths 20.
  • the heating paths 20 are disposed on the substrate 15, such as a front side 22 thereof.
  • the heating connections 16 and 18 can also be arranged on the same front side 22, but according to an alternative, the latter are arranged on a rear side 24 of the substrate 15 facing away from the front side 22 or on a side surface of the substrate 15.
  • the heating tracks 20 on the substrate form a parallel connection between the heating terminals 16 and 18, so that the biological / chemical sample can be heated after applying the same to the sample carrier 14 by applying a voltage between the heating terminals 16 and 18.
  • the system 10 further comprises a measuring arrangement 26 for carrying out a contactless measurement on the biological / chemical sample 12.
  • FIG. 1 it is indicated as an optical measuring arrangement with a light source 28 and an optical system 30 for carrying out a transmissive optical measurement, namely for the optical Observation through A user of the system, but there are a variety of alternatives, such as other optical measurements, such as reflective measurements, interferometric measurements, or non-optical measurements.
  • other optical measurements such as reflective measurements, interferometric measurements, or non-optical measurements.
  • the sample 12 was shown as being applied to the front side 22 and the heating tracks 20, the application for carrying out the non-contact measurement could also take place on the rear side 16. In any case, the application is made such that, in a projection along a thickness direction of the substrate 15, the sample 12 and the heating area 32 laterally covered by the heating paths 20 overlap.
  • FIG. 2 shows by way of example a plan view of the front side 22 of the substrate 15 in order to show a possible embodiment of the heating tracks 20 and their guidance on the front side 22. 2 shows the heating connections 16 and 18 and the heating paths 20 between them.
  • the heating paths 20 form a two-dimensional lattice structure of conductor lattice web sections 34 which meet at lattice nodes and grid interspaces or meshes 36, which are enclosed by not further reducible loops of webs 34, and in which the grid of heating paths 20, the substrate 15 can be exposed.
  • the grid interstices 36 are exemplified to be square in shape, but in alternative embodiments could also have other shapes, such as rectangular, circular, hexagonal, or similar shapes.
  • the webs 34 may, depending on which mesh shape is present, have a cross section that is constant along their length between the respective lattice nodes 40 or a variable cross section, for example, but a constant thickness, especially in a direction transverse to their length.
  • the number of lattice webs 34 meeting in the lattice node 40 may differ among the nodes 36, depending, for example, on whether the node is at the edge of the lattice or not.
  • the shapes of the meshes 36 may be congruent to one another, but need not. They also need not have a similar shape, as is still the case in an embodiment described below.
  • FIG. 2 shows a sample carrier in which the heating paths 20 form a two-dimensional lattice structure, which in turn forms a regular lattice in which a surface density of the heating lanes 20 across the surface 22 of the substrate in the region 32 is constant laterally constant surface density may not necessarily be.
  • the two-dimensional lattice structure forms an irregular lattice in which an areal density of the heating lanes 20 increases outwardly from a lateral center of the irregular lattice, that is, the meshes 36 become smaller from the inside of the lattice toward the outside.
  • the mesh does not necessarily have to have similar shapes to each other. Rather, the shapes of the meshes can also differ from each other.
  • FIG. 4a shows, for example, that the webs 32 surrounding the meshes 36 of the lattice formed by the heating lanes 20 do not necessarily have to extend in a straight line between the lattice nodes 40, but may also be laterally curved.
  • 4b shows that the heating connections 16 and 18 could be formed by electrodes which are arranged in opposite edge regions 42 and 44 of the rectangular or cuboid substrate 15 on the rectangular front side 22, for example.
  • the heating area 32 is laterally between the heating ports 16 and 18. It may, as illustrated in Fig.
  • 4b be elongate to extend along its length between the heating ports 16 and 18 extend so that the latter are located at the two ends of the area 32.
  • 4c shows an alternative in which the heating region 32 is elongated but bent along its length so as to extend non-rectilinearly like a web across the front face 22, with the thickness across the web width and the web length of the region 32 Heating paths 20 formed grids from one heating connection 16 to the other heating connection 18 extends.
  • the main connection 16 and the main connection 18 are located in the vicinity of the same shorter edge of the front side 22, which is rectangular by way of example here, by way of example.
  • FIG. 4 d merely shows an alternative embodiment of a sample carrier to FIG. 1, according to which a protective layer 46 covers the front side 22 of the substrate 15 and the heating paths 20 arranged thereon and, as is the case here by way of example, the electrodes 16 and 18.
  • 4e still shows that the front side 22 of the substrate 15 does not necessarily have to be completely exposed for the sample. Rather, it is possible that the front side 22 is covered by, for example, a lid member 90, such that between Front side 22 of the substrate 15 and cover member 90, a channel or a chamber 92 is formed along the front side 22 along or adjacent to the front, in such a way that the heating region 32 adjacent to the channel or the chamber 92.
  • the example liquid sample can be passed through the channel 92 to the heating region 32 or brought by filling in the chamber to the heating region 32.
  • the lid member 90 may be, for example, a substrate of also transparent material. It may be glued to the front 22 or otherwise secured.
  • the exemplary embodiment of FIG. 4e can be combined with the exemplary embodiment of FIG. 4d, ie it is also possible to provide the protective layer 22 for covering the heating tracks 20, wherein the protective layer can be, for example, an inert material.
  • the material of the protective layer 22 may be, for example, a curable material such as polymer.
  • the substrate 15 of FIG. 1 is a substrate, preferably transparent to the light of the optical measuring system, of a transparent material, such as glass or the like. Of course, in the case of other measuring arrangements which work non-optically, the transparency could also be absent.
  • the material of the heating sheets 20 does not necessarily have to be selected in terms of transparency. It does not necessarily consist of ITO.
  • the material for the heating tracks 20 may be metal or a suitable semiconductor material. The application can be done by microlithography or otherwise.
  • the substrate 15 may be rigid or flexible.
  • the sample carrier in order to carry out a four-point measurement, can additionally also have electrodes 50 and 52, which are formed integrally with the electrodes 16 and 18, respectively.
  • a dashed line symbolized in Fig. 2 readout circuit 54 could detect a sensor value via these two electrodes 50 and 52, which could be a measure of a resistance of the heating paths 20.
  • the readout circuit could be part of the system of FIG. 5 shows by way of example the sequence of a method for carrying out a non-contact measurement in a sample according to an exemplary embodiment. First, in a step 56, one of the sample carriers described above is provided. Subsequently, in a step 58, the sample is applied to the sample carrier.
  • the application can take place on the front side 22 or on the rear side 24, but each overlap laterally with the heating region 32.
  • the sample is heated by applying a voltage between the electrodes 16 and 18 and causing a current to flow through the heating paths 20.
  • one step 62 is then performed in the heated state of the sample, the non-contact measurement on the same.
  • the above embodiments have shown examples of a sample carrier that could serve as a heating element in biological or chemical applications.
  • material for the heating tracks 20 metal could be used.
  • the metal mesh structure would then form an array of regular or gradually varying openings 36 in the form of, for example, squares or rectangles, as shown above, or circles or any kind of regular polygons .
  • the heating tracks could in particular be formed from an electrically conductive thin-film layer, for example by structuring the same.
  • the thin film layer could be applied to the transparent, rigid or flexible substrate 15 in different ways, for example.
  • the structuring can also be done in different ways.
  • the applications of the above embodiments include samples in biology or chemistry.
  • Biological applications such as Proteomics, genetics and cell samples as well as bioreactors with the need for heating and optical transparency may be considered.
  • Other applications may be hydrogels and other polymer systems that require temperature control.
  • a network structure represents a higher manufacturing robustness compared to a meander / serpentine. If an interruption of a conductor in a meander would occur, the heater or sample carrier would lose its function while a network heater structure would still function because the electrical line is distributed over only a plurality of conductors or lands 32.
  • the net heater is more tolerant of compensating for deviations from the design geometry of the conductor. For example, lead constraints due to etch defects lead to local high resistances and hot spots in a meandering structure. Instead, the network structure attempts to compensate for the source of nonuniformity by passing current away from the high resistance regions.
  • a meandering heater has a more circular hot spot when heated, while a mesh has a more rectangular shape, which is significant.
  • the mesh expands heat more efficiently relative to its own heater surface than a meander heater.
  • a larger surface area can be uniformly heated. See for example Fig. 6 and 7.
  • Fig. 6a shows a meandering device with 15 ⁇ line / heating and 150 ⁇ space on a PEN film substrate and
  • Fig. 6b shows their corresponding heat profile in a substrate on the thermochromic liquid crystal layer at 62 ° C.
  • the heater surface is 1.5 x 3 mm.
  • FIG. 7a shows a network heating device or a sample carrier with 15 ⁇ m line / heating path and 150 ⁇ m space on a PEN film substrate
  • FIG. 7b shows its corresponding heat profile, as it results in a thermochromic liquid crystal layer at 62 ° C.
  • the heater surface is 1, 5 x 3 mm 2 . As can be seen, the heat distributes more evenly in the case of Fig. 7b.
  • the heat distribution on the overall heater surface can be further improved by using the array of gradually varying size geometries as in FIG. 3, where heat losses at the periphery of the heater can be compensated by increasing the number of heating lines.
  • a heating device may be mounted on a substrate of low thermal conductivity, such as e.g. Glass or polymer, in only one metallization step; i.e. no additional heat spreading layer is required, which increases the manufacturing costs and limits the transparency.
  • Fig. 8a shows in comparison with Fig. 7a a Netzer tediousnnungsvortechnisch with 5 ⁇ line and 50 ⁇ space on a PEN film substrate and Fig. 8b shows their corresponding heat profile, as it results in a thermochromic liquid crystal layer at 62 ° C.
  • the heater surface is 1.5 x 3 mm.
  • one or more metal layers eg vapor-deposited or sputtered
  • one or more very thin layers will be sufficient to achieve the adequate resistance. This is particularly advantageous for samples where the heater topography interferes with further processing or, if integrated into fluidic structures, could interfere with flow characteristics in channels, such as in the case of Fig. 4e.
  • the heating tracks do not have to be made of ITO, which is expensive. This consequently promotes cost-effective production, which is essential for diagnostic products.
  • a net has less resistance than a meander. Therefore, less voltage must be applied to the grid for a given heating power than to a meandering heater. This is an advantage for low supply voltage systems, especially battery powered portable devices.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Hematology (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • Molecular Biology (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)

Abstract

Pour réaliser une mesure sans contact sur un échantillon (12), on utilise un porte-échantillon (14) dans lequel les pistes chauffantes (20) forment sur le substrat (15) un circuit en parallèle entre la première et la seconde connexion de chauffage (16, 18) de sorte que, lorsque l'application d'une tension entre la première et la seconde connexion de chauffage (16, 18) chauffe un échantillon (12) placé sur le porte-échantillon (14), les propriétés de chauffage du porte-échantillon (14) ne sont pas compromises même en présence de coupures individuelles des pistes chauffantes (20), dues par exemple à des fluctuations du processus de formation des pistes chauffantes (20). Dans un exemple de porte-échantillon (14), la densité superficielle des pistes chauffantes (20) augmente du milieu de la surface du substrat (15) vers l'extérieur. Ceci permet d'éviter les inhomogénéités du profil de chauffage qui sinon se manifestent fréquemment sur la surface du substrat (15), le chauffage diminuant la plupart du temps en direction de la périphérie du substrat (15).
PCT/EP2013/071952 2012-10-26 2013-10-21 Système de réalisation d'une mesure sans contact sur un échantillon et porte-échantillon Ceased WO2014064040A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP13783510.4A EP2895268B8 (fr) 2012-10-26 2013-10-21 Système de réalisation d'une mesure sans contact sur un échantillon et porte-échantillon

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012219656.0A DE102012219656A1 (de) 2012-10-26 2012-10-26 System zur durchführung einer berührungslosen messung an einer probe und probenträger
DE102012219656.0 2012-10-26

Publications (1)

Publication Number Publication Date
WO2014064040A1 true WO2014064040A1 (fr) 2014-05-01

Family

ID=49510120

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2013/071952 Ceased WO2014064040A1 (fr) 2012-10-26 2013-10-21 Système de réalisation d'une mesure sans contact sur un échantillon et porte-échantillon

Country Status (3)

Country Link
EP (1) EP2895268B8 (fr)
DE (1) DE102012219656A1 (fr)
WO (1) WO2014064040A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016211356B4 (de) 2016-06-24 2024-12-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Analysesystem und Verfahren zum Durchführen einer Analyse

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014221734A1 (de) 2014-10-24 2016-04-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Messvorrichtung und System zur Schmelzkurvenanalyse eines DNA Microarrays, sowie Verwendung eines Fluoreszenzdetektorarrays zur Analyse
JP6546691B2 (ja) 2015-04-07 2019-07-17 セル アイディー ピーティーイー リミテッドＣｅｌｌ Ｉｄ Ｐｔｅ Ｌｔｄ Ｄｃヒータ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009019658A2 (fr) * 2007-08-09 2009-02-12 Koninklijke Philips Electronics N.V. Dispositif microfluidique intégré avec commande de température local
US20090211336A1 (en) * 2008-02-22 2009-08-27 Qinetiq Limited Heater device
WO2010108692A2 (fr) 2009-03-27 2010-09-30 Polyic Gmbh & Co. Kg Couche fonctionnelle électrique, son procédé de fabrication et son utilisation
US20110056926A1 (en) * 2007-08-29 2011-03-10 Canon U.S. Life Sciences, Inc. Microfluidic devices with integrated resistive heater electrodes including systems and methods for controlling and measuring the temperatures of such heater electrodes

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1498074A (en) * 1975-03-10 1978-01-18 Orbaiceta Electric resistance heating devices
GB2154403A (en) * 1984-01-31 1985-09-04 Glaverbel Heatable glazing panels
DE4019357C1 (en) * 1990-06-18 1991-08-01 G. Bopp & Co Ag, Zuerich, Ch Flexible, electrically heatable, transparent panel - has heating grid embedded in sheet of thermoplastic material suitable for rear window of convertible car
FR2765967B1 (fr) * 1997-07-11 1999-08-20 Commissariat Energie Atomique Dispositif d'analyse a puce comprenant des electrodes a chauffage localise
HK1046381A1 (zh) * 1999-07-02 2003-01-10 Clondiag Chip Technologies Gmbh 用於复制和描述核酸的芯片矩阵装置
DE102006045514B4 (de) * 2006-08-16 2012-04-05 Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg Transparente Flächenelektrode
US20080199861A1 (en) * 2007-02-15 2008-08-21 Honeywell International, Inc. Real-time microarray apparatus and methods related thereto

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009019658A2 (fr) * 2007-08-09 2009-02-12 Koninklijke Philips Electronics N.V. Dispositif microfluidique intégré avec commande de température local
US20110056926A1 (en) * 2007-08-29 2011-03-10 Canon U.S. Life Sciences, Inc. Microfluidic devices with integrated resistive heater electrodes including systems and methods for controlling and measuring the temperatures of such heater electrodes
US20090211336A1 (en) * 2008-02-22 2009-08-27 Qinetiq Limited Heater device
WO2010108692A2 (fr) 2009-03-27 2010-09-30 Polyic Gmbh & Co. Kg Couche fonctionnelle électrique, son procédé de fabrication et son utilisation

Non-Patent Citations (17)

* Cited by examiner, † Cited by third party
Title
A. SPLINTER; J. STURMANN; O. BARTELS, SENSORS ACTUATORS B, vol. 83, 2002, pages 169 - 74
D. BRIAND; S. COLIN; A. GANGADHARAIAH, SENSORS ACTUATORS A, vol. 132, 2006, pages 317 - 24
D. CAPUTO; G. DE CESARE; M. NARDINI, IEEE SENSORS JOURNAL, vol. 12, no. 5, 2012, pages 1209 - 13
DOMENICO CAPUTO ET AL: "Monitoring of Temperature Distribution in a Thin Film Heater by an Array of a-Si:H Temperature Sensors", IEEE SENSORS JOURNAL, IEEE SERVICE CENTER, NEW YORK, NY, US, vol. 12, no. 5, 1 May 2012 (2012-05-01), pages 1209 - 1213, XP011441122, ISSN: 1530-437X, DOI: 10.1109/JSEN.2011.2167506 *
J. ZHANG; P. A. R. ADE; P. MAUSKOPF, APPL. OPT., vol. 50, no. 21, 2011, pages 3750 - 7
J.-L. LIN; M.-H. WU; C.-Y. KUO, BIOMED MICRODEVICES, vol. 12, 2010, pages 389 - 398
J.-Y. CHENG; M.-H. YEN; C.-T. KUO, BIOMICROFLUIDICS, vol. 2, no. 1-12, 2008, pages 024105
K. SUN; A. YAMAGUCHI; Y. ISHIDA, SENSORS UND ACTUATORS B, vol. 84, 2002, pages 283 - 289
M.-G. KANG; L. J. GUO, AD- VANCED MATERIALS, vol. 19, no. 10, 2007, pages 1391 - 1396
M.-G. KANG; M-S. KIM; J. KIM, ADVANCED MATERIALS, ADV. MATER., vol. 20, 2008, pages 4408 - 4413
P. A. R. ADE; G. PISANO; C. TUCKER, PROC. OFSPIE, vol. 6275, pages 62750U - 1
S. CHOI; W. J. POTSCAVAGE, JR.; B. KIPPELEN, JOURNAL OF APPLIED PHYSICS, vol. 106, 2009, pages 054507
S. KUMAR JHA; R. CHAND; D. HAN, LAB CHIP, 2012
S-C ROTH; Y-M CHOI; S-Y KIM, SENSORS ACTUATORS A, vol. 128, 2006, pages 1 - 6
T. BECKER; S. MUHLBERGER; W. BENECKE, J. MICROELECTROMECH. SYST., vol. 200, no. 9, pages 478 - 84
W.-J. HWANG; K-S. SHIN; J-H ROH., SENSORS, vol. 11, 2011, pages 2580 - 2591
Z. YIN; A. PROSPERETTI, J. MICROMECH. MICROENG., 2005, pages 1683 - 91

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016211356B4 (de) 2016-06-24 2024-12-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Analysesystem und Verfahren zum Durchführen einer Analyse

Also Published As

Publication number Publication date
EP2895268A1 (fr) 2015-07-22
DE102012219656A1 (de) 2014-04-30
EP2895268B1 (fr) 2017-03-29
EP2895268B8 (fr) 2017-08-02

Similar Documents

Publication Publication Date Title
EP2641452B1 (fr) Panneau chauffant à contrôle de température
EP2394156B1 (fr) Ensemble et procédé pour la mesure électrochimique de réactions biochimiques et procédé de fabrication de l'ensemble
DE102013200277A1 (de) Heizeinrichtung und Verfahren zur Temperaturmessung an der Heizeinrichtung
DE102013110291A1 (de) Verfahren zur Herstellung eines Rußsensors mit einem Laserstrahl
EP2895268B1 (fr) Système de réalisation d'une mesure sans contact sur un échantillon et porte-échantillon
EP3546931B1 (fr) Capteur de gaz thermorésistif, detecteur d'écoulement et capteur de conductivité thermique
EP2169391A1 (fr) Chambre d'analyse et dispositif de fixation de cette chambre
DE102012112575A1 (de) Sensorelement, Thermometer sowie Verfahren zur Bestimmung einer Temperatur
DE102004017750B4 (de) Analyse-Array mit heizbaren Elektroden
DE10059152A1 (de) Mikrosystem zur dielektrischen und optischen Manipulation von Partikeln
EP3042186B1 (fr) Capteur de détection de gaz oxydables
DE102008006831A1 (de) Heißfilmsensor
EP2739965B1 (fr) Capteur électrochimique
EP3671195B1 (fr) Capteur de gaz thermorésistif
WO2013117413A1 (fr) Dispositif et procédé d'analyse électrochimique d'échantillons liquides à l'aide de systèmes de test à flux latéral
DE102014204676A1 (de) Wärmesensor und Verfahren zur Herstellung eines Wärmesensors
DE102009033420B4 (de) Vorrichtung zum Bestimmen des Sauerstoffgehalts in einem Gas
DE10241099B3 (de) Reaktor zur Beaufschlagung einer Trägerplatte mit einer Probe
DE102018130547A1 (de) Sensorelement, Verfahren zu dessen Herstellung und thermischer Strömungssensor
DE102016201193A1 (de) Gedruckte Sensorvorrichtung zum Detektieren von Medien
DE102006050041B4 (de) Strahlungssensor mit einem Array mehrerer Thermopiles auf einem Substrat mit Membranflächen
WO2009056328A1 (fr) Système de détection de condensation actif par fibre optique
DE19701798C2 (de) Elektrochemische Durchflußzelle
DE102009001920A1 (de) Infrarotlichtdetektor mit hoher Auflösung und hoher Baudichte
DE102022213874A1 (de) Probenkartusche für die Durchführung eines Analyseprozesses mittels einer Fluoreszenz-Analyse

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13783510

Country of ref document: EP

Kind code of ref document: A1

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
REEP Request for entry into the european phase

Ref document number: 2013783510

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2013783510

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE