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EP2895268B1 - Système de réalisation d'une mesure sans contact sur un échantillon et porte-échantillon - Google Patents

Système de réalisation d'une mesure sans contact sur un échantillon et porte-échantillon Download PDF

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Publication number
EP2895268B1
EP2895268B1 EP13783510.4A EP13783510A EP2895268B1 EP 2895268 B1 EP2895268 B1 EP 2895268B1 EP 13783510 A EP13783510 A EP 13783510A EP 2895268 B1 EP2895268 B1 EP 2895268B1
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EP
European Patent Office
Prior art keywords
heating
substrate
sample
electrode
sample carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
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EP13783510.4A
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German (de)
English (en)
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EP2895268B8 (fr
EP2895268A1 (fr
Inventor
Anna Ohlander
Gerhard Klink
Karlheinz Bock
Arman RUSSOM
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Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
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Publication of EP2895268B1 publication Critical patent/EP2895268B1/fr
Publication of EP2895268B8 publication Critical patent/EP2895268B8/fr
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L7/00—Heating or cooling apparatus; Heat insulating devices
    • B01L7/52—Heating or cooling apparatus; Heat insulating devices with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/06—Fluid handling related problems
    • B01L2200/0673—Handling of plugs of fluid surrounded by immiscible fluid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/14—Process control and prevention of errors
    • B01L2200/141—Preventing contamination, tampering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/06—Auxiliary integrated devices, integrated components
    • B01L2300/0627—Sensor or part of a sensor is integrated
    • B01L2300/0645—Electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0809—Geometry, shape and general structure rectangular shaped
    • B01L2300/0816—Cards, e.g. flat sample carriers usually with flow in two horizontal directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/18—Means for temperature control
    • B01L2300/1805—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
    • B01L2300/1827—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks using resistive heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/007—Heaters using a particular layout for the resistive material or resistive elements using multiple electrically connected resistive elements or resistive zones

Definitions

  • the present invention relates to non-contact measurements on samples such as e.g. biological and / or chemical samples, systems for such measurements, and sample carriers suitable for such systems.
  • ⁇ TAS Micro Total Analysis Systems
  • lab-on chips are used in areas such as microsystems. global health and medical research will play an important role. You reduce costs and time for testing and analysis. The limitation that they are disposable, material selection, design, and manufacturing are all aspects that must be considered in order to keep chip costs low, thus producing a device with marketability. Numerous biological and chemical assays are temperature dependent, e.g. PCR (Polymerase Chain Reaction) and MCA (Melting Curve Analysis). When such a study is scaled down to micro size, precise temperature control and thermal homogeneity of integrated miniaturized heating and sensing elements in microfluidic features become critical factors for a functional device.
  • Microheating devices are ubiquitous in various MEMS and microfluidic devices. The latter represent different functions in physical or chemical sensors ( SC Roth, YM Choi and SY Kim Sensors Actuators A, 2006, 128, 1-6 . D. Briand, S. Colin and A. Gangadharaiah, Sensors Actuators A, 2006, 132, 317-24 ), chemical reactors ( T. Becker, S. Muhlberger and W. Benecke, J. Microelectromech. Syst. 200, 9, 478-84 . A. Splinter, J. Sturmann and O. Bartels, Sensors Actuators B, 2002, 83, 169-74 ) or pumps ( Z. Yin and A. Prosperetti, J. Micromech.
  • a typical layout of a micro-heater is a thin metallic or doped Si layer patterned in a serpentine form on a dielectric substrate.
  • a temperature measurement can be made possible by integration of a second trace or by a four-point measurement.
  • Different applications have different limitations, but generally thermal homogeneity across the heated surface is important for accurate measurements and controls. But that is not easy to achieve on the basis of physical facts.
  • Material selection and heater design are factors that may be modified to affect the heat distribution in the heated area ( W.-J. Hwang, KS. Shin, and JH Roh. Sensors, 2011, 11, 2580-2591 . D. Caputo, G. de Cesare and M. Nardini, IEEE SENSORS JOURNAL, 2012, 12 (5), 1209-13, http://www.allflexheaters.com/Profiled Heaters.cfm ).
  • Transparent heating elements for lab-on-chip applications were prepared by patterning ITO (indium tin oxide) on glass ( K. Sun, A. Yamaguchi and Y. Ishida, Sensors and Actuators B, 2002, 84, 283-289 . JY Cheng, M.-H. Yen and C.-T. Kuo, Biomicrofluidics, 2008, 2, 024105 (1-12 ) J.-L. Lin, M.-H. Wu and C.-Y. Kuo, Biomed Micro Devices, 2010, 12, 389-398 . S. Kumar Jha, R. Chand and D. Han, Lab Chip, 2012, doi: 10.1039 / C2LC40727B ). However, due to its low abundance in the earth's crust, ITO is relatively expensive and therefore unsuitable for low cost diagnostics.
  • Transparent electrodes are also used in a large range of optoelectronic components, such as organic LEDs, photovoltaic cells and liquid crystal displays, essential elements that serve to generate voltage for the optoelectronic or electro-optical conversion.
  • metal grids have been used as semi-transparent electrode materials to replace the commonly used ITO in the search for a cheaper electrode material ( M.-G. Kang and LJ Guo, Advanced Materials, 2007, 19 (10), 1391-1396 .
  • M.-G. Kang, MS. Kim and J. Kim Advanced Materials, Adv. Mater. 2008, 20, 4408-4413
  • the US 2011/0056926 A1 proposes to perform PCR studies a microfluidic device having heating elements in the form of thin-film resistors extending in a web shape along each of a microfluidic channel of the microfluidic device to be individually controllable.
  • XP 11441122 discloses for carrying out PCR analyzes as a heating device a microscope glass slide with a resistance thin film, which is formed in the form of a serpentine extending between two electrodes.
  • the WO 2009/019658 A2 discloses an integrated microfluidic device with multiple PCR chambers that are individually fillable and heated via a serpentine conductor.
  • the US 2009/0211336 deals with so-called “preconcentrators” which are there to reversibly capture an analyte of interest, then to give it back to a detector in a so-called “desorption”. Therefore, the heating element is the US 2009/0211336 as an open grid to allow a fluidic medium with the analyte of interest to flow through the heating element to be trapped in the trapping phase by the heating element.
  • the EP2314552 A1 discloses a heating element having a transparent substance, a conductive heating line, bus bars and a power section, wherein 30% or more of the entire area of the transparent substance has a conductive heating line structure in which, when the straight line intersecting the conductive heating line is pulled, a ratio of a standard deviation with respect to an average of distances between adjacent intersections of the straight line and the conductive heating line is 2% or more.
  • the EP1972375 A1 discloses a microfluidic device having a two-dimensional array of components for processing a fluid and / or detecting properties of the fluid. Each component is coupled to at least one control port, which allows an active matrix to individually change the state of each component.
  • the components comprise at least one heating element.
  • the active matrix comprises a two-dimensional array of electronic components realized in thin film technology on a flexible substrate, this provides a high adaptability of the device.
  • the object of the present invention is therefore to provide a system and a method for carrying out a non-contact measurement of a sample as well as a sample carrier with improved characteristics.
  • a sample carrier when carrying out a non-contact measurement on a sample, a sample carrier is used, in which the heating paths on the substrate form a parallel connection between the first and the second heating termination, so that when by applying a voltage between the first and the second heating terminal is heated, a sample applied to the sample carrier, the heating properties of the sample carrier are not affected even if individual interruptions of the heating paths due to, for example, process variations in the production of the heating tracks are present.
  • the heating paths even form a two-dimensional lattice structure, isolated breaks and cross-sectional tapers of the heating lanes have a less negative effect on homogeneity of the sample heating over the heating region of the substrate covered by the heating lanes, since their occurrence in individual lugs of the two-dimensional lattice through the lattice structure or adjacent lattices Bars are bridged. It is thus possible to reduce the manufacturing tolerances in favor of lower manufacturing costs. Furthermore, it is possible to make the heating paths optically intransparent, and nevertheless to maintain a semitransparency of the sample carrier with any transparency of the substrate present, since the grid interspaces or meshes of the two-dimensional lattice preserve the transparency of the substrate in the thickness direction of the substrate.
  • the heating tracks are arranged in such a way that the area density of the heating tracks increases from the center of the substrate to the outside. That way it's possible to do the otherwise often occurring inhomogeneities of the heating profile across the substrate, after which usually the heating decreases at the edge of the substrate to avoid.
  • Fig. 1 shows a system 10 for performing a non-contact measurement on an example biological and / or chemical sample 12.
  • the sample may be, for example, a liquid, such as a solution, a suspension or the like.
  • sample 12 contains a particular analyte.
  • sample 12 could also be a solid, such as a sediment.
  • the aforementioned analyte may be atoms, molecules or other matter of any kind, such as biological cells, DNA, gene-antigen compounds, etc.
  • the Sample 12 is a biological / chemical sample.
  • the system includes a sample carrier 14 having a substrate 15, first and second heating ports 16 and 18, and heating paths 20.
  • the heating paths 20 are disposed on the substrate 15, such as a front side 22 thereof.
  • the heating connections 16 and 18 can also be arranged on the very front side 22, but according to an alternative, the latter are arranged on a rear side 24 of the substrate 15 facing away from the front side 22 or on a side surface of the substrate 15.
  • heating paths 20 on the substrate a parallel connection between the heating terminals 16 and 18, so that the biological / chemical sample after application of the same on the sample carrier 14 by applying a voltage between the heating terminals 16 and 18th is heated.
  • the system 10 further includes a measuring assembly 26 for performing a non-contact measurement on the biological / chemical sample 12 Fig. 1 it is indicated as an optical measuring arrangement with a light source 28 and an optical system 30 for carrying out a transmissive optical measurement, namely for optical observation by a user of the system, but there are a variety of alternatives, such as other optical measurements, such as reflective measurements, interferometric measurements, or non-optical measurements.
  • a measuring assembly 26 for performing a non-contact measurement on the biological / chemical sample 12 Fig. 1 it is indicated as an optical measuring arrangement with a light source 28 and an optical system 30 for carrying out a transmissive optical measurement, namely for optical observation by a user of the system, but there are a variety of alternatives, such as other optical measurements, such as reflective measurements, interferometric measurements, or non-optical measurements.
  • the sample 12 has been shown as if it were applied on the front side 22 or on the heating tracks 20, the application could also be carried out on the rear side 16 for performing the non-contact measurement. In any case, the application is made such that, in a projection along a thickness direction of the substrate 15, the sample 12 and the heating area 32 laterally covered by the heating paths 20 overlap.
  • Fig. 2 shows by way of example a plan view of the front side 22 of the substrate 15 in order to show a possible embodiment of the heating tracks 20 and their guidance on the front side 22. You can see it in FIG. 2 the heating connections 16 and 18 and the heating tracks 20 therebetween.
  • the heating tracks 20 form a two-dimensional lattice structure of printed-wire lattice segments 34 which meet at lattice nodes, and lattice interspaces or meshes 36 which are surrounded by lugs 34 which can not be further reduced and in which the lattice of heating lanes 20 expose the substrate 15.
  • Fig. 2 shows by way of example a plan view of the front side 22 of the substrate 15 in order to show a possible embodiment of the heating tracks 20 and their guidance on the front side 22. You can see it in FIG. 2 the heating connections 16 and 18 and the heating tracks 20 therebetween.
  • the heating tracks 20 form a two-dimensional lattice structure of printed-wire lattice segments 34 which meet at lattice nodes, and
  • the grid interstices 36 are exemplified to be square, but, in alternative embodiments, could have other shapes, such as rectangular, circular, hexagonal, or similar shapes.
  • the webs 34 may, depending on which mesh shape is present, have a cross section that is constant along their length between the respective lattice nodes 40 or a variable cross section, for example, but a constant thickness, especially in a direction transverse to their length.
  • the number of lattice webs 34 meeting in the lattice node 40 may differ among the nodes 36, depending, for example, on whether the node is at the edge of the lattice or not.
  • the shapes of the meshes 36 may be congruent to one another, but need not. They also need not have a similar shape, as is still the case in an embodiment described below.
  • the heating tracks 20 according to Fig. 2 may occur any interruptions of the heating paths 20, as exemplified in Fig. 2 at 38 in a web of the grid, or cross-sectional tapers of the heating tracks 20 are bridged in webs of the grid so that no adverse effects on the heating homogeneity over the heating area 32 or away the same are mitigated.
  • FIG. 2 a sample carrier is shown in which the heating paths 20 form a two-dimensional lattice structure which in turn forms a regular lattice in which a surface density of the heating lanes 20 across the surface 22 of the substrate in the region 32 is constant, this laterally constant surface density need not necessarily be.
  • Fig. 3 11 shows an embodiment in which the two-dimensional lattice structure forms an irregular lattice in which an areal density of the heating lanes 20 increases outwardly from a lateral center of the irregular lattice, that is, the meshes 36 become smaller from the inside of the lattice toward the outside.
  • the mesh does not necessarily have to have similar shapes to each other. Rather, the shapes of the meshes can also differ from each other.
  • Fig. 4a shows, for example, that the webs 32 surrounding the meshes 36 of the lattice formed by the heating lanes 20 do not necessarily have to run in a straight line between the lattice nodes 40, but may also be laterally curved.
  • Fig. 4b shows that the heating terminals 16 and 18 could be formed by electrodes which are arranged in opposite edge regions 42 and 44 of the example rectangular or cuboid substrate 15 on the rectangular front side 22. In other words, in the case of Fig. 4b the heating region 32 laterally between the heating connections 16 and 18. It can, as it is in Fig.
  • Fig. 4b is illustrated to be elongated to extend along its length between the heating ports 16 and 18 so that the latter are at both ends of the region 32.
  • Fig. 4c shows an alternative in which the heating region 32 is elongate but bent along its length to extend non-rectilinearly like a web across the front surface 22, across the web width and web length of the region 32 that formed by the heating webs 20 Grating extends from a heating connection 16 to the other heating connection 18.
  • the main connection 16 and the main connection 18 are located in the vicinity of the same shorter edge of the front side 22 which is rectangular in this example.
  • FIG. 12 also shows that the front surface 22 of the substrate 15 need not necessarily be completely exposed to the sample. Rather, it is possible that the front side 22 is covered by, for example, a lid member 90, such that between Front side 22 of the substrate 15 and cover member 90, a channel or a chamber 92 is formed along the front side 22 along or adjacent to the front, in such a way that the heating region 32 adjacent to the channel or the chamber 92.
  • a lid member 90 such that between Front side 22 of the substrate 15 and cover member 90, a channel or a chamber 92 is formed along the front side 22 along or adjacent to the front, in such a way that the heating region 32 adjacent to the channel or the chamber 92.
  • the lid member 90 may be, for example, a substrate of also transparent material. It may be glued to the front 22 or otherwise secured.
  • the example of Fig. 4e is of course combinable with the example of FIG. 4d, ie it may also be provided the protective layer 22 for covering the heating tracks 20, wherein the protective layer may be, for example, an inert material.
  • the material of the protective layer 22 may be, for example, a curable material such as polymer.
  • the substrate 15 of Fig. 1 it is a preferably transparent to the light of the optical measuring system substrate of a transparent material, such as glass or the like.
  • the material of the heating sheets 20 does not necessarily have to be selected in terms of transparency. It does not necessarily consist of ITO.
  • the material for the heating tracks 20 may be metal or a suitable semiconductor material. The application can be done by microlithography or otherwise.
  • the substrate 15 may be rigid or flexible. As it is in Fig. 2 is still shown as an example, for carrying out a four-point measurement of the sample carrier in addition also electrodes 50 and 52, which are integrally formed with the electrodes 16 and 18, respectively.
  • An in Fig. 2 A dashed line readout circuit 54 could detect a sensor value via these two electrodes 50 and 52, which could be a measure of a resistance of the heating tracks 20.
  • the readout circuit could be part of the system of Fig. 1 be.
  • Fig. 5 shows by way of example the sequence of a method for carrying out a non-contact measurement in a sample.
  • a step 56 one of the sample carriers described above is provided.
  • the sample is applied to the sample carrier.
  • the application may be on the front side 22 or on the rear side 24, but each overlap laterally with the heating region 32.
  • the sample is heated by applying a voltage between the electrodes 16 and 18 and causing a current to flow through the heating paths 20.
  • one step 62 is then performed in the heated state of the sample, the non-contact measurement on the same.
  • the above embodiments have shown examples of a sample carrier that could serve as a heating element in biological or chemical applications.
  • material for the heating tracks 20 metal could be used.
  • the metal mesh structure would then form an array of regular or gradually varying openings 36 in the form of, for example, squares or rectangles, as shown above, or circles or any type of regular polygon .
  • the heating tracks could in particular be formed from an electrically conductive thin-film layer, for example by structuring the same.
  • the thin film layer could be applied to the transparent, rigid or flexible substrate 15 in different ways, for example.
  • the structuring can also be done in different ways.
  • the applications of the above embodiments include samples in biology or chemistry.
  • Biological applications such as Proteomics, genetics and cell samples as well as bioreactors with the need for heating and optical transparency may be considered.
  • Other applications may be hydrogels and other polymer systems that require temperature control.
  • a meandering heater has a more circular hot spot when heated, while a mesh has a more rectangular shape, which means that the net dissipates heat more efficiently relative to its own heater surface than a meandering heater.
  • a mesh has a more rectangular shape, which means that the net dissipates heat more efficiently relative to its own heater surface than a meandering heater.
  • a larger surface area can be uniformly heated.
  • Fig. 6a shows a meandering heater with 15 ⁇ m line / heating track and 150 ⁇ m space on a PEN film substrate
  • Fig. 6b shows its corresponding heat profile in a substrate on the thermochromic liquid crystal layer at 62 ° C.
  • the heater surface is 1.5 x 3 mm 2 .
  • Fig. 7a shows a network heating device or a sample carrier with 15 microns line / heating path and 150 microns space on a PEN film substrate and Fig. 7b shows its corresponding heat profile, as it results in a thermochromic liquid crystal layer at 62 ° C.
  • the heater surface is 1.5 x 3 mm 2 . As you can see, the heat is distributed in the case of Fig. 7b even.
  • the heat distribution on the overall heater surface can be further improved using the array of gradually varying size geometries as in FIG Fig. 3 where heat losses at the periphery of the heater can be compensated by increasing the number of heating pipes.
  • a heating device can be manufactured on a substrate with low thermal conductivity, such as glass or polymer, in only one metallization step; ie no additional heat spreading layer which increases manufacturing costs and limits transparency is needed.
  • Fig. 8a shows in comparison with Fig. 7a a network heating device with 5 micron line and 50 micron space on a PEN film substrate and Fig. 8b shows its corresponding heat profile, as it results in a thermochromic liquid crystal layer at 62 ° C.
  • the heater surface is 1.5 x 3 mm 2 .
  • one or more metal layers eg vapor-deposited or sputtered
  • one or more very thin layers will be sufficient to achieve the adequate resistance. This is particularly advantageous for samples where the heating device topography interferes with further processing or, if integrated into fluidic structures, could interfere with flow characteristics in channels, such as in the case of Fig. 4e ,
  • the heating tracks do not have to be made of ITO, which is expensive. This consequently promotes cost-effective production, which is essential for diagnostic products.
  • a net has less resistance than a meander. Therefore, less voltage must be applied to the grid for a given heating power than to a meandering heater. This is an advantage for low supply voltage systems, especially battery powered portable devices.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Hematology (AREA)
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  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
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Claims (9)

  1. Porte-échantillon (14) pour un échantillon pour effectuer une mesure sans contact sur l'échantillon, aux caractéristiques suivantes:
    un substrat (15) sous forme d'un substrat de film PEN transparent;
    une première et une deuxième borne de raccordement de chauffage (16, 18) sur un côté avant du substrat; et
    des pistes chauffantes (20) qui sont disposées sur le côté avant du substrat et forment un circuit parallèle entre la première et la deuxième borne de raccordement de chauffage (16, 18) en ce que les pistes chauffantes (20) forment une structure en grille bidimensionnelle qui s'étend entre la première et la deuxième borne de raccordement,
    dans lequel la première et la deuxième borne de raccordement de chauffage (16, 18) sont formées par une première et une deuxième électrode,
    dans lequel la première et la deuxième électrode sont disposées dans des zones de bord opposées du substrat (15),
    dans lequel la première électrode est connectée de manière à former une seule pièce à une troisième électrode qui est disposée latéralement à côté de la première électrode sur le substrat (15) et la deuxième électrode est connectée de manière à former une seule pièce à une quatrième électrode qui est disposée latéralement à côté de la deuxième électrode sur le substrat (15), de sorte que soit possible une mesure électrique entre la troisième et la quatrième électrode.
  2. Porte-échantillon (14) selon la revendication 1, dans lequel lesdites pistes chauffantes (20) sont disposées de sorte qu'une densité de surface des pistes chauffantes (20) augmente d'un centre de la surface du substrat vers l'extérieur.
  3. Porte-échantillon (14) selon la revendication 1 ou 2,
    dans lequel la structure en grille bidimensionnelle présente un aménagement d'interstices de grille (36) présentant une même forme constituée d'une forme carrée, rectangulaire ou circulaire.
  4. Porte-échantillon (14) selon l'une des revendications 1 à 3,
    dans lequel les pistes chauffantes (20) sont réalisées à partir d'une couche de film mince structurée de manière électriquement conductrice sur le substrat (15).
  5. Porte-échantillon (14) selon l'une des revendications 1 à 4,
    dans lequel le substrat (15) du porte-échantillon (14) est flexible.
  6. Porte-échantillon (14) selon la revendication 1,
    dans lequel la structure en grille bidimensionnelle forme une grille régulière dans laquelle une densité de surface des pistes chauffantes (20) est latéralement constante.
  7. Système pour réaliser une mesure sans contact sur un échantillon, aux caractéristiques suivantes:
    un porte-échantillon (14) pour un échantillon pour effectuer une mesure sans contact sur l'échantillon selon la revendication 1;
    un aménagement de mesure (26) pour effectuer une mesure sans contact sur l'échantillon,
    dans lequel le système présente par ailleurs une commande et un circuit de lecture,
    dans lequel la commande est réalisée pour appliquer par l'intermédiaire de la première et de la deuxième électrode (A, B) une tension pour un courant de chauffage à travers les pistes chauffantes (20),
    dans lequel le circuit de lecture est réalisé pour détecter par l'intermédiaire de la troisième et de la quatrième électrode une valeur de capteur qui est une mesure de la résistance des pistes chauffantes (20).
  8. Système selon la revendication 7,
    dans lequel l'aménagement de mesure (26) est réalisé pour effectuer une mesure sur l'échantillon au moyen de lumière, et le substrat (15) du porte-échantillon (14) est transparent à la lumière.
  9. Procédé pour effectuer une mesure sans contact sur un échantillon, aux étapes suivantes consistant à:
    préparer un porte-échantillon (14) avec
    un substrat (15) sous forme d'un substrat de film PEN transparent;
    une première et une deuxième borne de raccordement de chauffage (16, 18) sur un côté avant du substrat; et
    des pistes chauffantes (20) qui sont disposées sur le côté avant du substrat et forment un circuit parallèle entre la première et la deuxième borne de raccordement de chauffage (16, 18) en ce que les pistes chauffantes (20) forment une structure en grille bidimensionnelle qui s'étend entre la première et la deuxième borne de raccordement, dans lequel la première et la deuxième borne de raccordement de chauffage (16, 18) sont formées par une première et une deuxième électrode,
    dans lequel la première et la deuxième électrode sont disposées dans des zones de bord opposées du substrat (15),
    dans lequel la première électrode est connectée de manière à former une seule pièce à une troisième électrode qui est disposée latéralement à côté de la première électrode sur le substrat (15) et la deuxième électrode est connectée de manière à former une seule pièce à une quatrième électrode qui est disposée latéralement à côté de la deuxième électrode sur le substrat (15);
    placer l'échantillon sur le porte-échantillon (14);
    chauffer l'échantillon en appliquant une tension entre la première et la deuxième borne de raccordement de chauffage (16, 18); et
    effectuer la mesure sans contact sur l'échantillon et une mesure électrique entre la troisième et la quatrième électrode.
EP13783510.4A 2012-10-26 2013-10-21 Système de réalisation d'une mesure sans contact sur un échantillon et porte-échantillon Not-in-force EP2895268B8 (fr)

Applications Claiming Priority (2)

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DE102012219656.0A DE102012219656A1 (de) 2012-10-26 2012-10-26 System zur durchführung einer berührungslosen messung an einer probe und probenträger
PCT/EP2013/071952 WO2014064040A1 (fr) 2012-10-26 2013-10-21 Système de réalisation d'une mesure sans contact sur un échantillon et porte-échantillon

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EP2895268A1 EP2895268A1 (fr) 2015-07-22
EP2895268B1 true EP2895268B1 (fr) 2017-03-29
EP2895268B8 EP2895268B8 (fr) 2017-08-02

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DE102014221734A1 (de) 2014-10-24 2016-04-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Messvorrichtung und System zur Schmelzkurvenanalyse eines DNA Microarrays, sowie Verwendung eines Fluoreszenzdetektorarrays zur Analyse
KR102385794B1 (ko) 2015-04-07 2022-04-11 셀 아이디 피티이 엘티디 Dc 히터
DE102016211356B4 (de) 2016-06-24 2024-12-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Analysesystem und Verfahren zum Durchführen einer Analyse

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GB1498074A (en) * 1975-03-10 1978-01-18 Orbaiceta Electric resistance heating devices
GB2154403A (en) * 1984-01-31 1985-09-04 Glaverbel Heatable glazing panels
DE4019357C1 (en) * 1990-06-18 1991-08-01 G. Bopp & Co Ag, Zuerich, Ch Flexible, electrically heatable, transparent panel - has heating grid embedded in sheet of thermoplastic material suitable for rear window of convertible car
FR2765967B1 (fr) * 1997-07-11 1999-08-20 Commissariat Energie Atomique Dispositif d'analyse a puce comprenant des electrodes a chauffage localise
ES2219374T3 (es) * 1999-07-02 2004-12-01 Clondiag Chip Technologies Gmbh Dispositivo de matriz de microchip para la multiplicacion y la caracterizacion de acidos nucleicos.
DE102006045514B4 (de) * 2006-08-16 2012-04-05 Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg Transparente Flächenelektrode
US20080199861A1 (en) * 2007-02-15 2008-08-21 Honeywell International, Inc. Real-time microarray apparatus and methods related thereto
WO2009019658A2 (fr) * 2007-08-09 2009-02-12 Koninklijke Philips Electronics N.V. Dispositif microfluidique intégré avec commande de température local
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WO2014064040A1 (fr) 2014-05-01
DE102012219656A1 (de) 2014-04-30
EP2895268A1 (fr) 2015-07-22

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