WO2014046133A1 - Package for accommodating electronic part, and electronic device - Google Patents

Abstract

[Problem] To provide a package for accommodating an electronic part, the package having high mounting reliability, and to provide an electronic device. [Solution] This package (1) for accommodating an electronic part is provided with: an insulating substrate (2) having one main surface (2a), another main surface (2b), a first recessed section (3) for accommodating an electronic part, the first recessed section (3) being provided to the one main surface (2a), and a second recessed section (4) for accommodating another electronic part, the second recessed section (4) being provided to the other main surface (2b). The insulating substrate (2) comprises a plurality of insulating layers (5) and has a protruding section (6) that protrudes from the side wall surface (4a) of the second recessed section (4). The side wall surface (4a) of the second recessed section (4) is positioned outward of the side wall surface (3a) of the first recessed section (3), as viewed in longitudinal section. The protruding section (6) has the same height as the side wall surface (4a) of the second recessed section (4).

Description

Electronic component storage package and electronic device

The present invention relates to an electronic component storage package and an electronic device in which, for example, electronic components are stored.

Conventionally, multiple electronic components such as semiconductor elements, image sensors, light emitting elements, capacitors, coils, resistors, and vibrators are mounted on both sides of the electronic component storage package via solder or other brazing material or conductive resin. Electronic devices are known.

For example, an electronic device in which an image sensor such as a CCD type or a CMOS type is mounted in the upper surface recess of the electronic component storage package and a capacitor, a resistor, or the like is mounted in the lower surface recess of the electronic component storage package can be configured.

JP 2008-159725 A

For example, in an electronic device in which an image sensor such as a CCD type or a CMOS type is mounted in a recess on the upper surface of an electronic component storage package, and a capacitor, a resistor, etc. are mounted in a recess on the lower surface of the electronic component storage package, a large number of capacitors, resistors, etc. are mounted. In order to do so, the width dimension of the lower surface recess may be increased.

Thus, in the electronic component storage package in which the width dimension of the lower surface concave portion is larger than the width dimension of the upper surface concave portion, for example, when the insulating base constituting the electronic component storage package is made of ceramic, it becomes an insulating layer. Cavity is formed by punching a ceramic green sheet (raw sheet) to form a through-hole serving as a side wall surface of the recess, and then laminating a plurality of these ceramic green sheets, followed by firing to form a recess having a substantially square shape in plan view. A package is produced.

However, in the laminated body of ceramic green sheets that is a package for storing electronic components in which the width dimension of the lower surface recess is larger than the width dimension of the upper surface recess, the side wall surface of the upper surface recess is inward of the side wall surface of the lower surface recess in a longitudinal sectional view. Is located. Therefore, the portion directly below the portion located on the side wall surface of the lower surface concave portion from the side wall surface of the upper surface concave portion in the laminated body is a cavity in a plane perspective, and from the side wall surface of the upper surface concave portion in the multilayer body in a planar perspective by pressurization during lamination. The part located on the side wall surface of the lower surface recess hangs down, and the side wall surface of the upper surface recess is easily deformed so as to fall inward, making it difficult to store the electronic component in the upper surface recess.

An electronic component storage package according to an aspect of the present invention is provided on one main surface, the other main surface, and the one main surface, and is provided on the first main surface, and on the other main surface. And an insulating base having a second recess for housing another electronic component, the insulating base comprising a plurality of insulating layers, and a protruding portion protruding from a side wall surface of the second recess. And the side wall surface of the second recess is located outside the side wall surface of the first recess in a longitudinal sectional view, and the protrusion has a height equivalent to the side wall surface of the second recess. is doing.

According to another aspect of the present invention, the electronic component storage package described above and the electronic components stored in the first recess and the second recess of the electronic component storage package are provided.

In the electronic component storage package according to one aspect of the present invention, the insulating base includes a plurality of insulating layers, and has a protruding portion protruding from the side wall surface of the second recessed portion. Since the protruding portion has a height equivalent to the side wall surface of the second recess, the side surface of the first recess in the laminate is seen through in plan view. Even if there is a hollow portion in a part directly below the location located on the side wall surface of the second recess from the wall surface, the location located on the side wall surface of the second recess from the side wall surface of the first recess in the laminate is a plan view. It can support by the protrusion part which has the height equivalent to the side wall surface of a 2nd recessed part. Therefore, the protrusion which has the height equivalent to the side wall surface of a 2nd recessed part on the side wall surface of a 2nd recessed part from the side wall surface of a 1st recessed part in a laminated body by the pressurization at the time of a lamination | stacking by the pressurization at the time of lamination | stacking Will be dispersed. Accordingly, the electronic component storage that makes it difficult to deform the portion located on the side wall surface of the second recess from the side wall surface of the first recess in the laminate in a plan view, and makes it easy to store the electronic component in the first recess. It is possible to obtain a package for use.

According to another aspect of the present invention, the electronic device includes the electronic component storage package having the above-described configuration, thereby improving the mounting reliability of the electronic component.

FIG. 2A is a plan perspective view showing an electronic component storage package according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line AA of the electronic component storage package shown in FIG. FIG. 2C is a longitudinal sectional view, and FIG. 2C is a longitudinal sectional view showing a section taken along line BB of the electronic component housing package shown in FIG. (A) is a plane perspective view showing a modification of the electronic component storage package in the embodiment of the present invention, and (b) is a cross-sectional view taken along the line AA of the electronic component storage package shown in FIG. FIG. 3 is a longitudinal sectional view showing a section, and FIG. 2C is a longitudinal sectional view showing a section taken along line BB of the electronic component storage package shown in FIG. It is a plane perspective view which shows the other modification of the electronic component storage package in embodiment of this invention. (A) is a longitudinal cross-sectional view which shows the electronic device in embodiment of this invention, (b) is a longitudinal cross-sectional view which shows the other modification of the electronic device in embodiment of this invention. (A) is a plan perspective view showing a modified example of the electronic component storage package in the embodiment of the present invention, and (b) is an AA line of the electronic component storage package shown in FIG. 5 (a). FIG. 6 is a longitudinal sectional view showing a section, and FIG. 5C is a longitudinal sectional view showing a section taken along line BB of the electronic component storage package shown in FIG. It is a plane perspective view which shows the modification of the electronic component storage package in embodiment of this invention. (A) is a longitudinal cross-sectional view showing a cross section taken along the line AA of the electronic component storage package shown in FIG. 6, and (b) is a BB line of the electronic component storage package shown in FIG. It is a longitudinal cross-sectional view which shows the cross section in.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the drawings. For convenience, an orthogonal coordinate system xyz is defined and described below.

The electronic component storage package in the embodiment of the present invention will be described with reference to FIGS. The electronic component storage package 1 according to the present embodiment includes one main surface 2a, the other main surface 2b, a first recess 3 provided on the one main surface 2a, and a second recess 4 provided on the other main surface 2b. It has the insulating base | substrate 2 which has these.

The insulating base 2 is composed of a plurality of insulating layers 5 and has a protruding portion 6 protruding from the side wall surface 4 a of the second recess 4.

The insulating base 2 has, for example, a first recess 3 for storing the electronic component 11 therein and a second recess 4 for storing the other electronic component 12, for example, an aluminum oxide sintered body, mullite. A plurality of substantially rectangular insulating layers 5 made of electrically insulating ceramics such as a sintered material, a silicon carbide material, an aluminum nitride material, a silicon nitride material, a glass ceramic material, etc. Is formed.

When the insulating base 2 is made of, for example, an aluminum oxide sintered body, first, it is suitable for a raw material powder such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), and magnesia (MgO). An organic solvent and a solvent are added and mixed to form a slurry. At the same time, a ceramic green sheet is obtained by forming this into a sheet by employing a conventionally known doctor blade method or calendar roll method. Next, the ceramic green sheet is appropriately punched or laser processed, and a plurality of sheets are laminated as necessary, and fired at a high temperature (about 1500 to 1800 ° C.), whereby the insulating substrate 2 is manufactured. In order to form the first concave portion 3 and the second concave portion 4 of the insulating base 2, some of the ceramic green sheets for the insulating base 2 are used for the first concave portion 3 and the second concave portion at the time of the above punching or laser processing. A through hole for the recess 4 may be formed by a die, punching by punching, laser processing, or the like. Further, when the second recess 4 is formed in the insulating base 2, a part or all of the through hole for the second recess 4 is larger than the through hole for the first recess 3 in each ceramic green sheet. It only has to be formed.

In the insulating base 2, the side wall surface 4 a of the second recess 4 is positioned outside the side wall surface 3 a of the first recess 3 in the longitudinal sectional view, and the protruding portion 6 is equivalent to the side wall surface 4 a of the second recess 4. Has a height. As described above, the insulating base 2 has the protruding portion 6 protruding from the side wall surface 4 a of the second recessed portion 4, and the protruding portion 6 has the same height as the side wall surface 4 a of the second recessed portion 4. Accordingly, the side wall surface 4a of the second concave portion 4 is located outside the side wall surface 3a of the first concave portion 3 in a longitudinal sectional view, and the second concave portion is seen from the side wall surface 3a of the first concave portion 3 in the laminate in a plan view. Even if there is a hollow part in a part immediately below the part located on the side wall surface 4a of the part 4, the part located on the side wall surface 4a of the second concave part 4 from the side wall surface 3a of the first concave part 3 in the laminated body Can be supported by the protruding portion 6 having the same height as the side wall surface 4a of the second recess 4. Therefore, the stress applied from the side wall surface 3a of the first concave portion 3 to the side wall surface 4a of the second concave portion 4 in the laminated body is equal to that of the side wall surface 4a of the second concave portion 4 due to pressurization during lamination. The protrusions 6 having a height are dispersed. Therefore, the part located in the side wall surface 4a of the 2nd recessed part 4 becomes difficult to deform | transform from the side wall surface 3a of the 1st recessed part 3 in a laminated body by planar perspective, and it is easy to accommodate the electronic component 11 in the 1st recessed part 3. The electronic component storage package 1 can be obtained. Further, the portion where the protruding portion 6 is formed is directly above the side wall surface 4a of the second concave portion 4 in the laminated body when it further includes a square corner formed by the side wall surface 4a of the second concave portion 4 in plan view. Thus, the stress applied to the square corner portion formed by the side wall surface 4 a of the second recess 4 and the vicinity thereof in the plan view is more easily dispersed by the protrusion 6. A portion located on the side wall surface 4a of the second concave portion 4 from the side wall surface 3a of the first concave portion 3 in the laminated body is preferably more difficult to be deformed in plan view. In addition, it is shown by C part of the electronic component storage package 1 shown by FIG.1 (b) that the protrusion part 6 has the height equivalent to the side wall surface 4a of the 2nd recessed part 4. FIG. Thus, in the thickness direction of the insulating layer 5 in the laminated body, the thickness of the protruding portion 6 is equivalent to the thickness of the side wall surface 4a of the second recess 4.

When the insulating substrate 2 is made of ceramic, the protruding portion 6 is formed of an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, glass It is formed by laminating a plurality of insulating layers 5 made of electrically insulating ceramics such as a ceramic sintered body.

The protruding portion 6 formed from the insulating layer 5 is located at a location where the side wall surface 4a of the second concave portion 4 is located outside the side wall surface 3a of the first concave portion 3 in the second concave portion 4 of the insulating base 2 in a longitudinal sectional view. It is formed. In order to form the protrusions 6 in the second recesses 4 of the insulating base 2, the second recesses may be formed on some of the ceramic green sheets for the insulating base 2 when the through holes for the second recesses 4 are formed. What is necessary is just to form by the above-mentioned metal mold | die, punching by punching, laser processing, etc. so that it may become the protrusion part 6 in the location used as 4. FIG. Thus, when the protrusion part 6 is formed from the insulating layer 5, for example, when the electronic component 11 and the other electronic component 12 are accommodated in the first recess 3 and the second recess 4 respectively, the electronic part 11 is placed in the protrusion 6. Even if the other electronic components 12 come into contact with each other, it is preferable that no short circuit occurs.

Further, in one electronic component storage package 1, at least one protrusion 6 is formed, and the shape of the protrusion 6 may be a rectangular shape with a plan view and a corner having an arc, and the corner is the starting point. It is preferable that chipping or the like does not easily occur, and may be a semicircular shape or a trapezoidal shape with circular arcs at corners. Moreover, in one electronic component storage package 1, the shapes of the protrusions 6 may be different from each other.

In the example shown in FIGS. 1 to 4, the protrusion 6 is provided so as to have a height equivalent to the side wall surface 4 a of the second recess 4, so that the first recess 3 of the laminate can be seen through in plan view. A protrusion 6 having a height equivalent to that of the side wall surface 4 a of the second recess 4 can be supported at a position located on the side wall surface 4 a of the second recess 4 from the side wall surface 3 a. Therefore, the stress applied from the side wall surface 3a of the first concave portion 3 to the side wall surface 4a of the second concave portion 4 in the laminated body is equal to that of the side wall surface 4a of the second concave portion 4 due to pressurization during lamination. The protrusions 6 having a height are dispersed. Therefore, the portion located on the side wall surface 4a of the second concave portion 4 from the side wall surface 3a of the first concave portion 3 in the laminated body is more difficult to be deformed in plan view, and the electronic component 11 is accommodated in the first concave portion 3. It is possible to obtain the electronic component storage package 1 that is easy to obtain. Further, in the manufactured electronic component storage package 1, the width dimension of the second recess 4 is made larger than the width dimension of the first recess 3, and the second dimension from the side wall surface 3a of the first recess 3 is seen in a plan view. A part of the concave portion 4 located directly below the side wall surface 4a is hollow. Therefore, it becomes easy to deform | transform into the 2nd recessed part 4 side with the stress added when mounting the electronic component 11 in the 1st recessed part 3, and a crack generate | occur | produces around the corner part of the 1st recessed part 3 and the 2nd recessed part 4. Although there is a possibility, the protrusion 6 is provided so as to have the same height as the side wall surface 4 a of the second recess 4, so that the stress applied when the electronic component 11 is mounted on the first recess 3 is increased. 2 The stress applied in a concentrated manner immediately above the side wall surface 4 a of the recess 4 is easily dispersed by the protrusion 6. Accordingly, the portion located on the side wall surface 4a of the second recess 4 from the side wall surface 3a of the first recess 3 is less likely to be deformed in a plan view, and the generation of cracks in the electronic component storage package 1 is further reduced. Can do. In addition, since the protrusion 6 is provided on the same plane as the surface on which the electronic component 11 is mounted, the reinforcement against deformation of the insulating base 2 is the same plane as the surface to which stress is applied when mounting the electronic component 11. The deformation of the insulating base 2 can be suppressed, and the generation of cracks around the corners of the first recess 3 and the second recess 4 can be further reduced.

Further, in the above configuration, as shown in FIGS. 1 to 3, since the protruding portion 6 is formed so as to overlap the side wall surface 3a of the first recess 3 in a plan view, it is possible to apply pressure during stacking. As a result, the stress directly under the side wall surface 3a of the first recess 3 in the laminate is more easily dispersed by the protrusions 6, and the side surface 3a of the first recess 3 in the laminate from the side of the second recess 4 in plan view The entire portion located on the wall surface 4a is difficult to be uniformly deformed, and it is possible to obtain the electronic component storage package 1 with less deformation.

In the above configuration, as shown in FIGS. 1 to 3, the shape formed by the side wall surface 4 a of the second recess 4 is a square shape in plan view, and the protruding portion 6 is the side wall surface of the second recess 4. Since it is formed at the center of at least one surface of 4a, the portion located from the side wall surface 3a of the first concave portion 3 to the side wall surface 4a of the second concave portion 4 in a planar view by pressing during lamination Therefore, the stress applied to the entire surface is easily dispersed efficiently by the protrusion 6. Therefore, the whole part located in the side wall surface 4a of the 2nd recessed part 4 from the side wall surface 3a of the 1st recessed part 3 in a laminated body becomes more difficult to deform | transform in a planar see-through, and an electronic component storage package with much less deformation | transformation 1 can be obtained. Furthermore, since the protrusion 6 is located at the center of at least one side formed by the side wall surface 4a of the second recess 4 in plan view, the side wall surface 3a of the first recess 3 in the stack is shown in plan view by pressing during stacking. Therefore, the stress applied to the entire portion located on the side wall surface 4 a of the second recess 4 is easily dispersed efficiently by the protrusion 6. Therefore, the upper surface of the electronic component storage package 1 located in the vicinity of at least one side formed by the side wall surface 4a of the second recess 4 in a plan view is flat, and the upper surface of the electronic component storage package 1 is 1 When the lid is provided so as to cover the recess 3, the lid can be joined to the electronic component storage package 1 as being difficult to tilt.

In the example shown in FIG. 1, among the side wall surfaces 4 a of the second recesses 4, the side wall surfaces 4 a of the second recesses 4 extending in the x direction and the side wall surfaces 3 a of the first recesses 3 are located at the same position. Each of the side wall surfaces 4 a of the second recesses 4 extending in the y direction is located outside the side wall surfaces 3 a of the first recesses 3. And in the example shown in FIG. 1, the protrusion part 6 is provided in each of the two side wall surfaces 4a extended in ay direction. The protrusions 6 are respectively provided at the centers of the side wall surfaces 4a extending in the y direction.

In the example shown in FIG. 2, all four side wall surfaces 4 a in the second recess 4 are located outside the side wall surface 3 a of the first recess 3. Each of these four side wall surfaces 4a is provided with a protruding portion 6, and each protruding portion 6 is provided at the center of each of the four side wall surfaces 4a. In the second recess 4 shown in FIG. 2, two sets of opposing side wall surfaces 4a are provided. The protrusions 6 provided on one side wall surface 4a have a longer length from the side wall surface 4a to the center of the second recess 4 than the protrusions 6 provided on the other side wall surface 4a. In the example shown in FIG. 2, one set of side wall surfaces 4a is a side wall surface 4a extending in the y direction, and the other set of side wall surfaces 4a is a side wall surface 4a extending in the x direction.

Further, in the above configuration, as shown in FIG. 3, the shape formed by the side wall surface 4 a of the second recess 4 in a plan view is square, and the protrusion 6 is formed on the side wall surface 4 a of the second recess 4. A plurality of them are formed on at least one surface. The plurality of protrusions 6 are formed side by side on at least one side formed by the side wall surface 4a of the second recess 4 in plan view, so that the first recess 3 in the stack can be seen in plan view by pressing during stacking. The stress applied from the side wall surface 3 a to the entire portion located on the side wall surface 4 a of the second recess 4 is easily dispersed effectively by the plurality of protrusions 6. Therefore, the whole part located in the side wall surface 4a of the 2nd recessed part 4 from the side wall surface 3a of the 1st recessed part 3 in a laminated body becomes more difficult to deform | transform in a planar see-through, and an electronic component storage package with much less deformation | transformation 1 can be obtained. Further, since the plurality of protrusions 6 are located on at least one side formed by the side wall surface 4a of the second recess 4 in plan view, the side wall surface 3a of the first recess 3 in the stack is shown in plan view by pressurization during stacking. Therefore, the stress applied to the entire portion located on the side wall surface 4 a of the second recess 4 is easily and effectively dispersed by the plurality of protrusions 6. Therefore, the upper surface of the electronic component storage package 1 located in the vicinity of at least one side formed by the side wall surface 4a of the second recess 4 in a plan view is flat, and the upper surface of the electronic component storage package 1 is 1 When the lid is provided so as to cover the recess 3, the lid can be joined to the electronic component storage package 1 as being difficult to tilt.

In the example shown in FIG. 3, all four side wall surfaces 4 a in the second recess 4 are located outside the side wall surface 3 a of the first recess 3. A plurality of protrusions 6 are provided on each of the four side wall surfaces 4a. In the second recess 4 shown in FIG. 3, two sets of opposing side wall surfaces 4a are provided. The number of protrusions 6 provided on each side wall surface 4a of one set may be the same as or different from the number of protrusions 6 provided on each side wall surface 4a of the other set. good. In the example shown in FIG. 3, the number of protrusions 6 provided on each side wall surface 4a of one set is four, and the number of protrusions 6 provided on each side wall surface 4a of the other set is There are three, and they are different. In the example shown in FIG. 3, one set of side wall surfaces 4a is a side wall surface 4a extending in the y direction, and the other set of side wall surfaces 4a is a side wall surface 4a extending in the x direction.

In the insulating base 2, for example, electrodes for connecting electronic components 7 are formed on the bottom surfaces of the first recess 3 and the second recess 4 of the insulating base 2, and the first recess 3 and the second recess 4 of the insulating base 2. A wiring conductor 8 including a through-hole conductor such as a via-hole conductor or a through-hole conductor is deposited and formed from the bottom surface to the inside and the bottom surface of the insulating base 2. As a result, the electronic component connecting electrode 7 is electrically connected to the external circuit board 21 through the wiring conductor 8. When the insulating substrate 2 is made of ceramic, the electronic component connecting electrode 7 and the wiring conductor 8 are made of metal metallization such as tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), or copper (Cu). Insulating the ceramic green sheet for the insulating substrate 2 by printing a metal paste for the electronic component connecting electrode 7 and the wiring conductor 8 in a predetermined shape by screen printing or the like, and firing the ceramic green sheet simultaneously with the ceramic green sheet. It is formed at a predetermined position of the base 2. Of the internal conductors, the through conductor that penetrates the ceramic green sheet in the thickness direction may be filled with a through hole formed in the ceramic green sheet by printing a metal paste. Such a metal paste can be appropriately obtained by adding an appropriate solvent and binder to metal powder such as tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), or copper (Cu) and kneading them. It is produced by adjusting to a proper viscosity. In order to increase the bonding strength with the insulating substrate 2, glass or ceramics may be included.

A plurality of the electronic component connecting electrodes 7 are formed on the bottom surfaces of the first concave portion 3 and the second concave portion 4 of the insulating base 2, and are electrically connected to the respective electrodes of the electronic component 11 or other electronic components 12 by gold bumps or the like. It is connected to the.

Further, as shown in FIG. 2, the electronic component connection electrode 7 provided on the bottom surface of the first recess 3 is provided so as to overlap the protrusion 6 in a plan view. Thereby, the stress applied when the electronic component 11 housed in the first recess 3 is connected to the electronic component connecting electrode 7 by flip chip mounting or wire bonding mounting can be dispersed by the protruding portion 6. The electronic component connecting electrode 7 can be satisfactorily connected.

Further, when the distance between the protrusions 6 in the plurality of adjacent protrusions 6 shown in FIG. 3 in plan perspective is larger than the outer shape of the other electronic component 12 housed in the second recess 4, By disposing other electronic components 12 between the protrusions 6, it becomes easy to accommodate many other electronic components 12 in the second recess 4 and to reduce the size of the electronic device.

2 and 3, the projection 6 is formed so as to straddle the side wall surface 3 a of the first recess 3 in a plan view. As a result, the stress applied immediately below the side wall surface 3a of the first recess 3 in the laminate due to the pressurization during stacking is likely to be effectively dispersed by the projecting portions 6, and the first recess 3 of the laminate in the plan view is transparent. The entire portion located on the side wall surface 4a of the second recess 4 from the side wall surface 3a is difficult to be uniformly deformed, and it is possible to obtain the electronic component storage package 1 with less deformation.

Next, a method for manufacturing the electronic component storage package 1 of the present embodiment will be described.

The insulating base 2 is made of, for example, an aluminum oxide (Al ₂ O ₃ ) -based sintered body, and has, for example, a first recess 3 for storing the electronic component 11 and a second recess for storing another electronic component 12 on the bottom surface. 4, and the side wall surface 4 a of the second recess 4 is positioned outside the side wall surface 3 a of the first recess 3 in a longitudinal sectional view. When the insulating base 2 is made of an aluminum oxide sintered body whose main component is aluminum oxide (Al ₂ O ₃ ), silica (SiO ₂ ), magnesia (MgO) is used as a sintering aid for Al ₂ O ₃ powder. ) Or calcia (CaO) or the like, and further an appropriate binder, solvent and plasticizer are added, and then the mixture is kneaded to form a slurry. Thereafter, a ceramic green sheet for obtaining a large number of pieces is obtained by a conventionally known molding method such as a doctor blade method.

Using this ceramic green sheet, the electronic component storage package 1 is manufactured by the following steps (1) to (5).

(1) A punching process using a punching die for the side wall surface 3 a of the first recess 3, the side wall surface 4 a of the second recess 4, and the projecting portion 6.

(2) The electrode 7 for connecting an electronic component formed on the bottom surface of the first concave portion 3 and the second concave portion 4 of the insulating base 2 in plan view, and the first concave portion 3 and the second concave portion 4 of the insulating base 2 A metal paste printing application process for forming wiring conductors 8 each including a through-hole conductor such as a via-hole conductor or a through-hole conductor from the bottom surface to the inside of the insulating base 2 and the lower surface.

(3) A step of laminating ceramic green sheets to be the respective insulating layers 5 to produce a ceramic green sheet laminate.

(4) A step of firing the ceramic green sheet laminate to obtain a multi-piece substrate in which a plurality of insulating bases 2 each having the first recesses 3, the second recesses 4, and the protrusions 6 are arranged.

(5) A method in which a dividing groove is formed along the outer edge of the electronic component storage package 1 on the multi-cavity substrate obtained by firing, and the dividing groove is broken along the dividing groove, or For example, a method of cutting along the outer edge of the electronic component storage package 1 by a slicing method or the like can be used. The dividing groove can be formed by cutting the multi-cavity substrate smaller than the thickness of the multi-piece substrate after firing, but the cutter blade can be pressed against the ceramic green sheet laminate for the multi-piece substrate, or the slicing device May be formed by cutting smaller than the thickness of the generated shape.

Further, in order to protect the electronic component connecting electrode 7 and the wiring conductor 8 made of a metal layer exposed on the surface of the insulating base 2 and prevent oxidation, the exposed surfaces of the electronic component connecting electrode 7 and the wiring conductor 8 are A Ni plating layer having a thickness of 0.5 to 10 μm may be applied, or the Ni plating layer and a gold (Au) plating layer having a thickness of 0.5 to 3 μm may be applied in sequence.

The electronic component 11 or another electronic component 12 is stored in the electronic component storage package 1 formed in this way. As shown in FIG. 4A, an electronic device having the electronic component 11 mounted on the bottom surface of the first recess 3 and a plurality of other electronic components 12 mounted on the bottom surface of the second recess 4 is mounted on the external circuit board 21. Thus, the electronic component 11 housed in the first recess 3 is electrically connected to the external circuit board 21 via the electronic component connection electrode 7 and the wiring conductor 8. It should be noted that a plurality of other electronic components 12 housed in the second recess 4 may be mounted on the external circuit board 21 as shown in FIG. The electronic component 11 or the other electronic component 12 is, for example, a CCD type electronic device or a CMOS type image pickup device, a semiconductor device, a light emitting device such as an LED, a chip capacitor, a resistance device, and a vibrator. The electronic component 11 or other electronic component 12 is flip-chip mounted or wire-bonded mounted on the electronic component connecting electrode 7 and the external circuit board 21 of the electronic component storage package 1, and each electrode of the electronic component 11 is a gold bump, It is electrically connected by solder or the like or a bonding wire. Further, a bonding material made of a resin such as an epoxy resin may be used as a so-called underfill to make the electrical connection more reliable. Instead of using the above-described gold bumps or solder for the electrical connection between each electrode of the electronic component 11 or other electronic component 12 and the plurality of electronic component connection electrodes 7, a conductive resin (anisotropic conductive resin) is used. Etc.) may be used.

In addition, this invention is not limited to the example of the above-mentioned embodiment, A various deformation | transformation is possible. For example, the wiring conductor 8 may be led out to either the main surface 2a or the other main surface 2b of the insulating base 2, and the vertical direction of the electronic component storage package 1 in the longitudinal section is not specified. Moreover, the electronic component connection electrode 7 or the wiring conductor 8 may be provided at a place other than the first recess 3 provided on the one main surface 2a of the insulating base 2. Also, the type of electronic component 11 or other electronic component 12 to be stored is not specified.

In the electronic component storage package 1 of the present embodiment, the insulating base 2 has a protruding portion 6 protruding from the side wall surface 4 a of the second recess 4, and the protruding portion 6 is equivalent to the side wall surface 4 a of the second recess 4. The portion located from the side wall surface 3a of the first recess 3 to the side wall surface 4a of the second recess 4 in the laminated body is equivalent to the side wall surface 4a of the second recess 4 in a plan view. The protrusion 6 having a height supports and stress applied to a portion located on the side wall surface 4a of the second concave portion 4 from the side wall surface 3a of the first concave portion 3 in the laminated body is seen through in plan view by pressurization at the time of stacking. 2 Dispersed by the protrusions 6 having the same height as the side wall surface 4a of the concave portion 4, and located in the laminate from the side wall surface 3a of the first concave portion 3 to the side wall surface 4a of the second concave portion 4 in a plan view. Becomes difficult to deform, and the electronic component 11 is moved to the first recess 3. Housed becomes easy.

The electronic device of this embodiment is improved in terms of mounting reliability by including the electronic component storage package 1 having the above-described configuration.

Referring to FIG. 5, another embodiment of the electronic component storage package of the present invention will be described. The electronic component storage package 1 in the present embodiment is different from the embodiment in the example shown in FIG. 1 in that a reinforcing layer 9 is provided.

In the example shown in FIG. 5, the reinforcing layer 9 is provided between the plurality of insulating layers 5, and the reinforcing layer 9 is formed so as to straddle the side wall surface of the second recess 4 in a plan view. .

Thereby, the side wall surface of the 1st recessed part 3 is located inside the side wall surface of the 2nd recessed part 4 in a longitudinal cross-sectional view, and the side wall surface of the 2nd recessed part 4 from the side wall surface of the 1st recessed part 3 in a laminated body is planarly viewed. Even if the portion located immediately below is a cavity, the stress applied immediately above the side wall surface of the second recess 4 in the laminated body due to the pressure applied during lamination is easily dispersed by the reinforcing layer 9. Therefore, the part located in the side wall surface of the 2nd recessed part 4 from the side wall surface of the 1st recessed part 3 in a laminated body by plane seeing becomes difficult to deform | transform, and the electronic component 11 is easy to be accommodated in the 1st recessed part 3. It is possible to obtain the electronic component storage package 1 to be performed.

The reinforcing layer 9 is not particularly limited, but a material that can be fired simultaneously with the ceramic material constituting the insulating base 2 is used. From the viewpoint of co-firing, the material of the reinforcing layer 9 is, for example, a metal layer made of metal metallization such as tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag) or copper (Cu), or Examples thereof include an insulating layer made of an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, a glass ceramic sintered body, and the like. For example, when the reinforcing layer 9 is made of an aluminum oxide sintered body, it is preferable to add zirconia, for example, to improve the reinforcing function.

In the example shown in FIG. 5, four reinforcing layers 9 are provided, but any number of reinforcing layers 9 may be provided as long as at least one is provided. In the example shown in FIG. 5, the shape of the reinforcing layer 9 in a top view is a rectangular shape, but may be a circular shape or an oval shape.

In the example shown in FIG. 5, the reinforcing layer 9 is provided between the uppermost insulating layer 5 and the insulating layer 5 immediately below the upper insulating layer 5, but may be provided between other layers. . For example, in the case of the example illustrated in FIG. 5, a further reinforcing layer 9 may be provided between the second insulating layer 5 from the top and the insulating layer 5 immediately below the second insulating layer 5.

A method for forming the reinforcing layer 9 made of a metal layer will be described. For example, a metal paste serving as the reinforcing layer 9 is printed in a predetermined shape on a ceramic green sheet for the insulating substrate 2 by screen printing or the like, and is fired simultaneously with the ceramic green sheet for the insulating substrate 2. A reinforcing layer 9 is formed at each predetermined position. Such a metal paste is prepared by adding an appropriate solvent and binder to the metal powder and kneading them to adjust the viscosity to an appropriate level. In order to increase the bonding strength with the insulating substrate 2, glass or ceramics may be included.

A method for forming the reinforcing layer 9 made of an insulating layer will be described. For example, a ceramic green sheet for the reinforcing layer 9 manufactured in the same manner as the ceramic green sheet of the insulating base 2 is formed, and this ceramic green sheet is punched to extend over the side wall surface of the second recess 4 in a plan perspective. It arrange | positions in the position used as a location and it is baked with the green sheet for insulating base | substrates 2. As a result, the reinforcing layer 9 straddling the side wall surface of the second recess 4 is obtained. Further, after the ceramic paste for the insulating substrate 2 is printed at a position where it crosses over the side wall surface of the second concave portion 4 in a plane perspective by a screen printing method or the like in the same manner as the reinforcing layer 9 made of a metal layer, firing is performed. It can also be formed.

Referring to FIGS. 6 and 7, another embodiment of the electronic component storage package of the present invention will be described. For convenience, an orthogonal coordinate system xyz is defined and described below. The electronic component storage package 1 in this embodiment is different from the embodiment in the example shown in FIG. 1 in that the side wall surface of the first recess 3 is located outside the side wall surface of the second recess 4 in the y direction. It is.

6 and 7, as in the example shown in FIG. 1, the side wall surface of the second recess 4 is located outside the side wall surface of the first recess 3 in the x direction. The side wall surface of the first recess 3 is located outside the side wall surface of the second recess 4. Therefore, in the y direction, no cavity is formed in the main surface on the second concave portion side, directly below the side wall surface of the first concave portion 3, so that the pressurizing force at the time of stacking is sufficiently increased by the side wall surface on the second concave portion side. Can support you.

In the example shown in FIG. 1, the side wall surface of the first recess 3 and the side wall surface of the second recess 4 coincide with each other in the y direction. In the example shown in FIG. 2, the side wall surface of the first recess 3 is positioned on the inner side of the side wall surface of the second recess 4 in the y direction. The positional relationship in the y direction between the side wall surface of the first concave portion 3 and the side wall surface of the second concave portion 4 may be as shown in FIGS. 1 and 2, but supports the pressing force at the time of stacking. From the viewpoint, it is preferable that the side wall surface of the first concave portion 3 is located outside the side wall surface of the second concave portion 4 in the y direction as in the examples shown in FIGS.

DESCRIPTION OF SYMBOLS 1 ... Electronic component storage package 2 ... Insulation base | substrate 3 ... 1st recessed part 4 ... 2nd recessed part 5 ... Insulating layer 6 ... -Protruding part 9-Reinforcing layer 11-Electronic component 12-Other electronic components 21-External circuit board

Claims (6)

One main surface, the other main surface, a first recess provided on the one main surface for storing electronic components, and a second recess provided on the other main surface for storing other electronic components And an insulating base having
The insulating base is composed of a plurality of insulating layers, and has a protruding portion protruding from a side wall surface of the second recess,
The side wall surface of the second recess is located outside the side wall surface of the first recess in a longitudinal sectional view,
The electronic component storage package, wherein the protrusion has a height equivalent to a side wall surface of the second recess. 2. The electronic component storing package according to claim 1, wherein the projecting portion is formed so as to overlap with a side wall surface of the first recess in a plan view. The shape formed by the side wall surface of the second recess in plan view is square, and the protrusion is formed at the center of at least one of the side wall surfaces of the second recess. Item 2. A package for storing electronic components according to Item 1. The shape formed by the side wall surface of the second recess in a plan view is square, and a plurality of the projecting portions are formed on at least one of the side wall surfaces of the second recess. The electronic component storage package according to 1. The reinforcing layer is provided between the plurality of insulating layers, and the reinforcing layer is formed so as to straddle the side wall surface of the second recess in a plan view. Electronic component storage package. An electronic device comprising: the electronic component storage package according to claim 1; and the electronic components stored in the first recess and the second recess of the electronic component storage package.

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