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WO2013050258A3 - Selective hard gold deposition - Google Patents

Selective hard gold deposition Download PDF

Info

Publication number
WO2013050258A3
WO2013050258A3 PCT/EP2012/068604 EP2012068604W WO2013050258A3 WO 2013050258 A3 WO2013050258 A3 WO 2013050258A3 EP 2012068604 W EP2012068604 W EP 2012068604W WO 2013050258 A3 WO2013050258 A3 WO 2013050258A3
Authority
WO
WIPO (PCT)
Prior art keywords
hard gold
gold deposition
selective hard
deposition
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2012/068604
Other languages
French (fr)
Other versions
WO2013050258A4 (en
WO2013050258A2 (en
Inventor
Bernd Weyhmueller
Uwe Manz
Klaus Bronder
Mario Tomazzoni
Frank Oberst
Sascha Berger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Umicore Galvanotechnik GmbH
Original Assignee
Umicore Galvanotechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Umicore Galvanotechnik GmbH filed Critical Umicore Galvanotechnik GmbH
Publication of WO2013050258A2 publication Critical patent/WO2013050258A2/en
Publication of WO2013050258A3 publication Critical patent/WO2013050258A3/en
Publication of WO2013050258A4 publication Critical patent/WO2013050258A4/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Contacts (AREA)
  • Manufacture Of Switches (AREA)

Abstract

The present invention relates to a process for the electrolytic deposition of gold on, in particular, electric contacts. The process is characterized in that particular additives which allow undesirable deposition of gold in regions of low current density to be prevented are added to the electrolyte.
PCT/EP2012/068604 2011-10-06 2012-09-21 Selective hard gold deposition Ceased WO2013050258A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011114931.0 2011-10-06
DE201110114931 DE102011114931B4 (en) 2011-10-06 2011-10-06 Process for more selective electrolytic deposition of gold or a gold alloy

Publications (3)

Publication Number Publication Date
WO2013050258A2 WO2013050258A2 (en) 2013-04-11
WO2013050258A3 true WO2013050258A3 (en) 2013-06-06
WO2013050258A4 WO2013050258A4 (en) 2013-07-25

Family

ID=46970255

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/068604 Ceased WO2013050258A2 (en) 2011-10-06 2012-09-21 Selective hard gold deposition

Country Status (3)

Country Link
DE (1) DE102011114931B4 (en)
TW (1) TW201333275A (en)
WO (1) WO2013050258A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107419307A (en) * 2017-09-29 2017-12-01 佛山市春暖花开科技有限公司 A kind of electroplate liquid of alkaline gold cyanide
DE102019104644B3 (en) 2019-02-25 2020-07-09 Carl Zeiss Industrielle Messtechnik Gmbh Stylus change holder and stylus

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2967135A (en) * 1960-06-08 1961-01-03 Barnet D Ostrow Electroplating baths for hard bright gold deposits
DE2930035A1 (en) * 1978-08-31 1980-03-20 Lea Ronal Uk Ltd AQUEOUS GALVANIC BATH
EP0150439A1 (en) * 1983-12-22 1985-08-07 LeaRonal (UK) plc An acid bath for electrodeposition of gold or gold alloys, an electroplating method and the use of said bath
DE19643091A1 (en) * 1996-10-18 1998-04-23 Raschig Gmbh Treating fluid for metallic or metallised surfaces
US20110127168A1 (en) * 2008-08-25 2011-06-02 Rie Kikuchi Hard gold-based plating solution
EP2458036A2 (en) * 2010-11-25 2012-05-30 Rohm and Haas Electronic Materials LLC Gold plating solution

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3642589A (en) * 1969-09-29 1972-02-15 Fred I Nobel Gold alloy electroplating baths
DE2355581C3 (en) 1973-11-07 1979-07-12 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Galvanic bright gold bath with high deposition rate
CH606502A5 (en) * 1974-11-15 1978-10-31 Oxy Metal Industries Corp
FR2414082A1 (en) 1978-01-04 1979-08-03 Oxy Metal Industries Corp Bath for galvanic gold plating - contg. arsenic and poly:amine, giving uniform deposits on irregular shaped objects
GB2028873B (en) * 1978-08-31 1982-11-10 Lea Ronal Uk Ltd Gold alloy electroplating bath and method
DE3012999C2 (en) * 1980-04-03 1984-02-16 Degussa Ag, 6000 Frankfurt Bath and process for the galvanic deposition of high-gloss and ductile gold alloy coatings
HU191879B (en) * 1983-09-09 1987-04-28 Videoton Elekt Vallalat Processor fot the galvanic speretaion of hard gold plating for electronic purposes
JP4116718B2 (en) * 1998-11-05 2008-07-09 日本リーロナール有限会社 Electroless gold plating method and electroless gold plating solution used therefor
DE10007325A1 (en) 1999-06-17 2000-12-21 Degussa Acid bath for galvanically depositing glossy gold and gold alloy layers contains gold and optionally one or more alloying elements in dissolved form as well as an organic compound as brightening agent
JP4945193B2 (en) * 2006-08-21 2012-06-06 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Hard gold alloy plating solution
JP5317433B2 (en) * 2007-06-06 2013-10-16 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Acid gold alloy plating solution
DE102010055143B4 (en) 2010-12-18 2022-12-01 Umicore Galvanotechnik Gmbh Direct contact membrane anode for use in electrolytic cells

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2967135A (en) * 1960-06-08 1961-01-03 Barnet D Ostrow Electroplating baths for hard bright gold deposits
DE2930035A1 (en) * 1978-08-31 1980-03-20 Lea Ronal Uk Ltd AQUEOUS GALVANIC BATH
EP0150439A1 (en) * 1983-12-22 1985-08-07 LeaRonal (UK) plc An acid bath for electrodeposition of gold or gold alloys, an electroplating method and the use of said bath
DE19643091A1 (en) * 1996-10-18 1998-04-23 Raschig Gmbh Treating fluid for metallic or metallised surfaces
US20110127168A1 (en) * 2008-08-25 2011-06-02 Rie Kikuchi Hard gold-based plating solution
EP2458036A2 (en) * 2010-11-25 2012-05-30 Rohm and Haas Electronic Materials LLC Gold plating solution

Also Published As

Publication number Publication date
TW201333275A (en) 2013-08-16
DE102011114931A1 (en) 2013-04-11
WO2013050258A4 (en) 2013-07-25
DE102011114931B4 (en) 2013-09-05
WO2013050258A2 (en) 2013-04-11

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