WO2012133296A1 - Composite de composé organique et nanoparticules dotées d'un noyau en argent/d'une coque en cuivre et son procédé de production - Google Patents
Composite de composé organique et nanoparticules dotées d'un noyau en argent/d'une coque en cuivre et son procédé de production Download PDFInfo
- Publication number
- WO2012133296A1 WO2012133296A1 PCT/JP2012/057738 JP2012057738W WO2012133296A1 WO 2012133296 A1 WO2012133296 A1 WO 2012133296A1 JP 2012057738 W JP2012057738 W JP 2012057738W WO 2012133296 A1 WO2012133296 A1 WO 2012133296A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- silver
- organic compound
- copper
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- B01J13/02—Making microcapsules or microballoons
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/32—Inkjet printing inks characterised by colouring agents
- C09D11/322—Pigment inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Definitions
- the object of the present invention is to form a silver core copper shell nanoparticle having a small particle size with a uniform particle size, which can be stably dispersed in a medium, exhibit oxidation resistance, and form a film. It is to provide a complex with an organic compound useful as a protective agent capable of exhibiting high conductivity when post-baking, and to provide a simple production method thereof.
- the present inventors have used an organic compound having an appropriate coordination power such as the above-mentioned thioether (CSC) as a protective agent. I thought it was desirable to choose. Moreover, it was considered important to develop a melting point drop (so-called Kubo effect) due to the nanosize effect by controlling the particle size to be small and uniform. However, when the diameter is remarkably reduced, the specific surface area is increased and the oxidation resistance is lowered. Therefore, it was considered that metal nanoparticles containing copper having a particle diameter of about 20 to 50 nm are suitable from the balance of both.
- CSC thioether
- the polymer selected as the protective agent by the present inventor specifically has a structure represented by the following general formula (1).
- An average particle diameter (primary particle diameter) of 100 particles of the composite according to the TEM image is preferably in the range of 1 to 100 nm when used as a conductive material or the like.
- the average particle size obtained by the dynamic light scattering method is larger than the particle size obtained by TEM observation and is about 5 to 110 nm.
- a solvent that is suitable for the purpose of use is added and the medium is exchanged to obtain a dispersion in which the composite is dispersed in the medium selected according to the purpose. Can be prepared.
- this reaction mixture was circulated through a hollow fiber type ultrafiltration membrane module (HIT-1-FUS1582, 145 cm 2, molecular weight cut off 150,000) manufactured by Daisen Membrane Systems Co., Ltd. and subjected to nitrogen bubbling.
- A% hydrazine aqueous solution was circulated until the filtrate from the ultrafiltration module reached about 500 mL while being added in the same amount as the leaching filtrate.
- the supply of the 0.1% hydrazine aqueous solution was stopped and concentrated to obtain 27.9 g of a silver core copper shell nanoparticle dispersion.
- the non-volatile content in the dispersion was 15%, and the metal content in the non-volatile was 95%.
- Example 13 The nucleating agent usage ratio was changed to 7.0 milligram atoms of silver nanoparticles.
- the usage ratio of the silver nanoparticle dispersion 1 of Example 1 (particle size 25 nm, silver 3.0 milligram atoms, water solvent) was changed to silver.
- a silver core copper shell nanoparticle dispersion was prepared in the same manner as in Example 1 except that the concentration was 7.0 milligram atoms.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Inorganic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Composite Materials (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
Abstract
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201280006320.7A CN103328136B (zh) | 2011-03-31 | 2012-03-26 | 有机化合物与银芯铜壳纳米粒子的复合体及其制造方法 |
| JP2012525558A JP5077728B1 (ja) | 2011-03-31 | 2012-03-26 | 有機化合物と銀コア銅シェルナノ粒子との複合体及びその製造方法 |
| KR1020137009881A KR101495698B1 (ko) | 2011-03-31 | 2012-03-26 | 유기 화합물과 은 코어 / 구리 쉘 나노 입자와의 복합체 및 그 제조 방법 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011078620 | 2011-03-31 | ||
| JP2011-078620 | 2011-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2012133296A1 true WO2012133296A1 (fr) | 2012-10-04 |
Family
ID=46931014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2012/057738 Ceased WO2012133296A1 (fr) | 2011-03-31 | 2012-03-26 | Composite de composé organique et nanoparticules dotées d'un noyau en argent/d'une coque en cuivre et son procédé de production |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5077728B1 (fr) |
| KR (1) | KR101495698B1 (fr) |
| CN (1) | CN103328136B (fr) |
| WO (1) | WO2012133296A1 (fr) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017110295A (ja) * | 2015-12-11 | 2017-06-22 | Dic株式会社 | 導電性ペースト |
| JP2017214609A (ja) * | 2016-05-30 | 2017-12-07 | Dic株式会社 | 接合体の製造方法 |
| IT201800009521A1 (it) * | 2018-10-17 | 2020-04-17 | Li Volsi Lorenzo Marco | Sostanza stabilizzante di una miscela acquosa e metodo per la realizzazione di pellicole contenenti tale sostanza stabilizzante |
| CN115815593A (zh) * | 2022-12-14 | 2023-03-21 | 西安交通大学 | 一种具有核-卫星结构的银-铜复合纳米颗粒的制备方法 |
| US20230303880A1 (en) * | 2020-12-01 | 2023-09-28 | Dreisam (Beijing) Medical Technology Co., Ltd. | Conductive ink functional material and application and preparation method thereof |
| CN117340265A (zh) * | 2023-11-24 | 2024-01-05 | 苏州银瑞光电材料科技有限公司 | 一种类球形铜粉的制备方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015098658A1 (fr) * | 2013-12-24 | 2015-07-02 | Dic株式会社 | Matériau adhésif contenant des nanoparticules métalliques |
| US20210162551A1 (en) | 2017-12-18 | 2021-06-03 | Dic Corporation | Copper fine particle sintered body |
| US20240316631A1 (en) * | 2021-07-20 | 2024-09-26 | Bioneer Corporation | Metal nanowire having core-shell structure |
| CN119387605B (zh) * | 2024-11-07 | 2025-08-12 | 深圳市哈深智材科技有限公司 | 一种银粉及银粉表面纳米结构的制备方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008248298A (ja) * | 2007-03-30 | 2008-10-16 | Tokai Rubber Ind Ltd | 金属ナノ粒子の製造方法および銀/銅ナノ粒子ならびに導電性ペースト |
| JP4784847B1 (ja) * | 2010-03-24 | 2011-10-05 | Dic株式会社 | 有機化合物とナノ銅粒子との複合体、有機化合物とナノ酸化銅(i)粒子との複合体、及びそれらの製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE531669T1 (de) * | 2003-06-10 | 2011-11-15 | Asahi Glass Co Ltd | Herstellungsverfahren für feines metallhydridteilchen, feines metallhydridteilchen enthaltende flüssige dispersion und metallisches material |
| KR100987973B1 (ko) * | 2006-08-09 | 2010-10-18 | 디아이씨 가부시끼가이샤 | 금속 나노 입자 분산체와 그 제조 방법 |
| CN101678460B (zh) * | 2007-05-16 | 2012-07-04 | Dic株式会社 | 含银纳米结构体的制造方法和含银纳米结构体 |
| TWI428394B (zh) * | 2008-01-31 | 2014-03-01 | 迪愛生股份有限公司 | 聚伸芳硫醚樹脂組成物、其製造方法及表面安裝用電子構件 |
-
2012
- 2012-03-26 KR KR1020137009881A patent/KR101495698B1/ko not_active Expired - Fee Related
- 2012-03-26 JP JP2012525558A patent/JP5077728B1/ja active Active
- 2012-03-26 WO PCT/JP2012/057738 patent/WO2012133296A1/fr not_active Ceased
- 2012-03-26 CN CN201280006320.7A patent/CN103328136B/zh active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008248298A (ja) * | 2007-03-30 | 2008-10-16 | Tokai Rubber Ind Ltd | 金属ナノ粒子の製造方法および銀/銅ナノ粒子ならびに導電性ペースト |
| JP4784847B1 (ja) * | 2010-03-24 | 2011-10-05 | Dic株式会社 | 有機化合物とナノ銅粒子との複合体、有機化合物とナノ酸化銅(i)粒子との複合体、及びそれらの製造方法 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017110295A (ja) * | 2015-12-11 | 2017-06-22 | Dic株式会社 | 導電性ペースト |
| JP2017214609A (ja) * | 2016-05-30 | 2017-12-07 | Dic株式会社 | 接合体の製造方法 |
| IT201800009521A1 (it) * | 2018-10-17 | 2020-04-17 | Li Volsi Lorenzo Marco | Sostanza stabilizzante di una miscela acquosa e metodo per la realizzazione di pellicole contenenti tale sostanza stabilizzante |
| US20230303880A1 (en) * | 2020-12-01 | 2023-09-28 | Dreisam (Beijing) Medical Technology Co., Ltd. | Conductive ink functional material and application and preparation method thereof |
| US12391844B2 (en) * | 2020-12-01 | 2025-08-19 | Dreisam (Beijing) Medical Technology Co., Ltd. | Conductive ink functional material and application and preparation method thereof |
| CN115815593A (zh) * | 2022-12-14 | 2023-03-21 | 西安交通大学 | 一种具有核-卫星结构的银-铜复合纳米颗粒的制备方法 |
| CN117340265A (zh) * | 2023-11-24 | 2024-01-05 | 苏州银瑞光电材料科技有限公司 | 一种类球形铜粉的制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5077728B1 (ja) | 2012-11-21 |
| JPWO2012133296A1 (ja) | 2014-07-28 |
| CN103328136B (zh) | 2014-12-03 |
| KR20130056903A (ko) | 2013-05-30 |
| KR101495698B1 (ko) | 2015-02-25 |
| CN103328136A (zh) | 2013-09-25 |
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