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WO2012016976A1 - Liquides supports pour abrasifs - Google Patents

Liquides supports pour abrasifs Download PDF

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Publication number
WO2012016976A1
WO2012016976A1 PCT/EP2011/063276 EP2011063276W WO2012016976A1 WO 2012016976 A1 WO2012016976 A1 WO 2012016976A1 EP 2011063276 W EP2011063276 W EP 2011063276W WO 2012016976 A1 WO2012016976 A1 WO 2012016976A1
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WO
WIPO (PCT)
Prior art keywords
cutting
carrier liquid
cutting fluid
wafers
grains
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2011/063276
Other languages
German (de)
English (en)
Inventor
Hans-Peter Seelmann-Eggebert
Andreas Senf
Markus Roesch
Joachim Bentele
Kati Schmidt
Udo Stefanowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
BASF SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF SE filed Critical BASF SE
Priority to PL11738239T priority Critical patent/PL2601280T3/pl
Priority to SG2013008172A priority patent/SG187691A1/en
Priority to CN201180046812.4A priority patent/CN103154214B/zh
Priority to AU2011287623A priority patent/AU2011287623B9/en
Priority to RU2013109141/04A priority patent/RU2542974C2/ru
Priority to BR112013002486A priority patent/BR112013002486A2/pt
Priority to ES11738239.0T priority patent/ES2525017T3/es
Priority to EP11738239.0A priority patent/EP2601280B1/fr
Priority to CA2806936A priority patent/CA2806936A1/fr
Priority to KR1020137005241A priority patent/KR101505334B1/ko
Priority to JP2013522230A priority patent/JP5543030B2/ja
Publication of WO2012016976A1 publication Critical patent/WO2012016976A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M107/00—Lubricating compositions characterised by the base-material being a macromolecular compound
    • C10M107/20—Lubricating compositions characterised by the base-material being a macromolecular compound containing oxygen
    • C10M107/30—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M107/32—Condensation polymers of aldehydes or ketones; Polyesters; Polyethers
    • C10M107/34—Polyoxyalkylenes
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M107/00—Lubricating compositions characterised by the base-material being a macromolecular compound
    • C10M107/20—Lubricating compositions characterised by the base-material being a macromolecular compound containing oxygen
    • C10M107/30—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/04—Elements
    • C10M2201/041—Carbon; Graphite; Carbon black
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/04—Elements
    • C10M2201/05—Metals; Alloys
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/06—Metal compounds
    • C10M2201/061—Carbides; Hydrides; Nitrides
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/06—Metal compounds
    • C10M2201/062—Oxides; Hydroxides; Carbonates or bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C10M2209/104—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C10M2209/104—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only
    • C10M2209/1045—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only used as base material
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C10M2209/107—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of two or more specified different alkylene oxides covered by groups C10M2209/104 - C10M2209/106
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2020/00—Specified physical or chemical properties or characteristics, i.e. function, of component of lubricating compositions
    • C10N2020/01—Physico-chemical properties
    • C10N2020/02—Viscosity; Viscosity index
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2020/00—Specified physical or chemical properties or characteristics, i.e. function, of component of lubricating compositions
    • C10N2020/09—Characteristics associated with water
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
    • C10N2030/02—Pour-point; Viscosity index
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2040/00—Specified use or application for which the lubricating composition is intended
    • C10N2040/20—Metal working
    • C10N2040/22—Metal working with essential removal of material, e.g. cutting, grinding or drilling

Definitions

  • the invention relates to the use of modified polyglycols for the production of carrier liquids for abrasives, new carrier liquids for abrasives, in particular cutting fluids, the use of the carrier liquid in the removal of material, in particular when cutting wafers, and wafers produced with the aid of the cutting fluid.
  • Abrasives also called abrasives or abrasives, are substances, preferably hard-material grains, which are used for the removal of a material. It is known to use abrasives as a dispersion in liquids, for example grinding or cutting fluids. Abrasives can be used in this way for polishing wafers, for example made of silicon, but also for polishing plastics, for example for lenses. It is also known to use abrasives in cutting fluids for cutting wafers. Wafers are thin slices of semiconductors that are used, for example, in photovoltaic. From wafers electronic components, especially integrated circuits can be produced.
  • the wafers are usually made of brittle material, such as silicon, but also of gallium arsenide or cadmium telluride, etc.
  • Basis for the wafer production are usually cylindrical or cubic single or polycrystals, which are sawed into the individual slices, the wafer.
  • Sawing also referred to as cutting or lapping
  • This is a separation process using a thin wire as a cutting edge and using unbound cutting grains in a carrier liquid.
  • the wire usually has a diameter of 80 to 180 ⁇ . He immersed in a slurry of carrier liquid and cutting grain and pulls the hanging on the wire surface cutting grains in the kerf.
  • the cutting grains are used to cut the object to be sawn / lapped / silicon ingots into wafers, with particles being removed from the solid to be cut.
  • the carrier liquid for the cutting grains is applied as a slurry via a dipping bath, through which the wire runs, as well as generally via nozzles together with the cutting grain.
  • the carrier liquid has the task of ensuring that the cutting grains adhere to the wire and removing removed particles from the solid to be broken up.
  • the carrier liquid has the task to provide for cooling and the transport of the abrasion through the shegeschlitz.
  • EP 1 757 419 A1 a method for separating a workpiece, for example a wafer, by means of wire saws is already known, one on the wire applied slurry is used and the water content of at least a portion of the slurry surrounded gaseous medium is regulated or controlled. It is further known from EP 1 757 419 A1 to use glycols as the carrier substance.
  • DE 199 83 092 B4 and US Pat. No. 6,383,991 B1 disclose a cutting oil comprising a) a polyether compound and b) silica particles, and the use of this cutting oil composition for cutting a billet using a wire saw, in particular for cutting silicon ingots.
  • 4,828,735 disclose water-based lubricants based on polyethers. From the Chinese patent application CN 101205498 A cutting fluids are also known, while a reduction in water absorption is not specified.
  • the compounds specifically mentioned are polyalkyleneoxy compounds etherified with alcohols having 1 to 4 carbon atoms.
  • a sawing suspension consisting of an abrasive in an aqueous phase which contains one or more water-soluble polymers as thickener.
  • US 2007/0010406 A1 discloses hydroxypolyethers as additives for aqueous cutting fluids which can be used inter alia for the production of silicon wafers.
  • the known cutting fluids are generally based on an aqueous or a water-soluble basis.
  • water is disadvantageous because it both causes corrosion and, for example, when cutting silicon wafers by reaction of water and silicon hydrogen evolution can take place.
  • silicate or polysilicate formation there is a silicate or polysilicate formation on the wafer and in the slurry.
  • the known water-soluble systems can also contain water and, because of their microscopic properties, attract water, so that the same disadvantages can occur as with aqueous systems.
  • the object of the invention was to provide improved carrier fluids for abrasives, in particular cutting fluids, which in particular lead to a reduction in water absorption and a reduction in the energy required for sawing.
  • the invention relates to the use of compounds of the formula I.
  • x is a number from 3 to 12, in particular 5 to 10
  • y is a number from 0 to 10, in particular 4 to 8
  • z is a number from 1 to 6, in particular 1 to 3 for the production of carrier liquids for abrasives, in particular cutting fluids with reduced water absorption for removing material, in particular for sawing wafers with a wire saw.
  • the invention further relates to carrier liquids for abrasives, in particular cutting fluids, containing at least one compound of the formula I.
  • R is a z-valent alkyl radical having 5 to 10 carbon atoms
  • x is a number from 3 to 12, in particular 5 to 10
  • y is a number from 0.5 to 10, in particular 4 to 8
  • z is a number from 1 to 6, in particular 1 to 3.
  • the invention further relates to novel compounds II of the formula
  • R 1 is 2-methylbutyl or 3-methylbutyl
  • x is a number from 3 to 12, in particular 5 to 10
  • y is a number from 0 to 10, in particular 4 to 8
  • z is a number from 1 to 6, in particular 1 to 3
  • at least as many EO units as PO units are present.
  • Very particularly preferred compounds of the formula II are given in the following table:
  • the ratio x to y in the compound of the formula I and II is equal to or less than 1.
  • compounds of the formula II are particularly preferred embodiments of compounds of the formula I.
  • R 1 is pentyl, preferably
  • the recurring units (EO) and (AO) can be present as a block or randomly distributed (random). In a preferred embodiment, they are statistically distributed. Surprisingly, it has been found that in the case of statistical distribution of the recurring units (AO) and (EO), the viscosity of the compounds is largely independent of temperature.
  • the compounds of the formula I to be used according to the invention are distinguished by a viscosity index in a slurry with 40% by weight of Carborex F 800 PV silicon carbide from Washington Mills AS, NO -7300 Orkanger, Norway, of not more than 45%, preferably less than 30%, in particular less than 20%, the viscosity index being defined as follows:
  • the viscosity index in the context of the present invention denotes the percentage decrease in the viscosity of the compounds of the formula I. at 50 ° C compared to the viscosity at 30 ° C.
  • the viscosity here is the dynamic viscosity (Brookfield, spindle V-73) determined according to DIN EN 12092.
  • the carrier liquids according to the invention may contain not only a compound of the formula I but also mixtures of compounds of the formula I.
  • the carrier liquids for abrasives consist of the compound of the formula I.
  • the molecular weight of the compound of the formula I is preferably from 200 to 1200 g / mol.
  • alkylene alcohols based on ethylene oxides, propylene oxides or copolymers of ethylene and propylene oxides are present, preferably having a molecular weight of from 200 to 800 g / mol.
  • the cutting fluid in use for sawing contains abrasives, in particular cutting grains.
  • the carrier liquids for abrasives are combined with at least one further additive, in particular with at least one
  • carrier fluid carrier fluid
  • At least one of the following additives is added to the following parts by weight per 100 parts by weight of the compound I: alkylene glycols: 10 to 90, in particular 20 to 60 parts by weight
  • Wetting agent 1 to 100, especially 10 to 40 parts by weight
  • Thickener 0.5 to 20, in particular 1 to 10 parts by weight
  • Dispersant 0.1 to 20, especially 0.5 to 10 parts by weight
  • Corrosion inhibitor 0.1 to 10, in particular 0.1 to 3 parts by weight
  • Complexing agent 0.1 to 10, in particular 1 to 5 parts by weight
  • Other additives 0.05 to 10, in particular 0.1 to 5 parts by weight
  • the water content of the composition according to the invention is, based on the total composition, not more than 10, preferably not more than 5, in particular less than 1 wt .-%.
  • sorbitan esters e.g. Poly (oxyethylene) sorbitan monolaurate, poly (oxyethylene) sorbitan monooleate, (poly (oxyethylene) sorbitan trioleate)
  • fatty amines e.g. Tallow aminooxyethylates, soya aminooxyethylates,
  • castor oil e.g. Rizinusöloxyethylate
  • alkanolamides e.g. coconut oil alkanolamidooxyethylates
  • fatty acids e.g., oleic acid oxyethylates, lauric acid oxyethylates, oxyethylated oxyethylates
  • glycerol compounds e.g. B.
  • Quaternary compounds e.g. B. quaternary ammonium ethosulfate.
  • Suitable nonionic, cationic, anionic or amphoteric wetting agents are in particular alkoxylated C 4 - to C 2 2 alcohols such as fatty alcohol alkoxylates or oxoalcohol alkoxylates. These may be alkoxylated with ethylene oxide, propylene oxide and / or butylene oxide. Suitable wetting agents here are all alkoxylated alcohols which contain at least two molecules of one of the abovementioned alkylene oxides added. Here are block polymers of ethylene oxide,
  • the nonionic wetting agents generally contain from 2 to 50, preferably from 3 to 20, moles of at least one alkylene oxide per mole of alcohol.
  • the alcohols preferably have 10 to 18 carbon atoms.
  • the alkoxylates have a broad or narrow alkylene oxide homolog distribution;
  • Alkylphenolalkoxylate such as Alkylphenolethoxylate with C 6 - to C 4 alkyl chains and 5 to 30 alkylene oxide units;
  • Alkylpolyglucosides having 8 to 22, preferably 10 to 18 carbon atoms in the alkyl chain and generally 1 to 20, preferably 1, 1 to 5, glucoside units Sorbitanalkanoate, also alkoxylated;
  • N-alkylglucamides fatty acid alkoxylates, FettTexreaminalkoxylate, FettTexreamidalkoxylate, FettTexrealkanolamidalkoxylate, alkoxylated, block copolymers of ethylene oxide, propylene oxide and / or butylene oxide, polyisobutene ethoxylates, polyisobutene-maleic anhydride derivatives, optionally alkoxylated monoglycerides, glycerol monostearates, sorbitan esters and bisglycerides.
  • Particularly suitable nonionic wetting agents are alkyl alkoxylates or mixtures of alkyl alkoxylates, as described, for example, in DE-A 102 43 363, DE-A 102 43 361, DE-A 102 43 360, DE-A 102 43 365, DE-A 102 43 366, DE-A 102 43 362 or in DE-A 43 25 237 are described. These are alkoxylation products obtained by reacting alkanols with alkylene oxides in the presence of alkoxylation catalysts or mixtures of alkoxylation products.
  • Particularly suitable starter alcohols are the so-called Guerbet alcohols, in particular ethylhexanol, propylheptanol and butyloctanol.
  • propylheptanol Particularly preferred is propylheptanol.
  • Preferred alkylene oxides are propylene oxide and ethylene oxide, with alkyl alkoxylates with direct attachment of a preferably short Poylypropylenoxidblocks to the starter alcohol, as described for example in DE-A 102 43 365, are particularly preferred because of their low residual alcohol content and their good biodegradability.
  • a preferred class of suitable nonionic wetting agents are the alcohol alkoxylates of the general formula (Nl)
  • R at least single branched C 4 . 22 -alkyl or -alkylphenol
  • R 2 C 3 4- alkyl
  • R 5 is C 1-4 -alkyl
  • R 6 is methyl or ethyl
  • n mean value from 1 to 50
  • m mean value from 0 to 20, preferably 0.5 to 20
  • r mean value from 0 to 50
  • s mean value from 0 to 50
  • m is at least 0.5 when R 5 is methyl or ethyl or r is 0.
  • It may also be a mixture of 20 to 95 wt .-%, preferably 30 to 95 wt .-% of at least one above alcohol alkoxylate and 5 to 80 wt .-%, preferably 5 to 70 wt .-%, of a corresponding alcohol alkoxylate, in which R 1, however, is an unbranched alkyl radical having the same carbon number act.
  • R 3 branched or unbranched C 4 . 22 -alkyl or -alkylphenol,
  • N branched alcohol alkoxylate
  • R 2 is preferably propyl, in particular n-propyl.
  • n has an average value of 4 to 15, particularly preferably 6 to 12, in particular 7 to 10.
  • m has an average value of 0.5 to 4, particularly preferably 0.5 to 2, in particular 1 to 2.
  • the radical R 1 is preferably C 8 -15, particularly preferably C 8 -13, in particular C 8 .i 2 -alkyl radical which is branched at least once. There may also be multiple branches.
  • R 5 is preferably methyl or ethyl, especially methyl.
  • R 6 is preferably ethyl.
  • oxo alcohols which have a proportion of linear and a proportion of branched alcohol chains.
  • a Ci 3 / i 5 -Oxoalkohol often about 60 wt .-% of completely linear alcohol chains, but also about 40 wt .-% ⁇ -methyl branched and C> 2 -branched alcohol chains.
  • R3 is preferably a branched or unbranched C 8 -15 alkyl group, more preferably a branched or unbranched C 8 .i 3 alkyl radical and especially a branched or unbranched C. 8 12- alkyl radical.
  • R 4 is preferably propyl, especially n-propyl.
  • p preferably has an average value of 4 to 15, particularly preferably an average value of 6 to 12 and in particular a mean value of 7 to 10.
  • q preferably has an average value of 0.5 to 4, particularly preferably 0.5 to 2, in particular 1 to 2.
  • the alcohol alkoxylates of the general formula (NN) may also be present as mixtures with unbranched and branched alcohol radicals.
  • Alcohol components on which the alcohol alkoxylates are based are not only pure alkanols, but also homologous mixtures having a range of carbon atoms. Examples are C 8 / i o-alkanols, Ci o / 12-alkanols, Ci 3 / i 5 alkanols, Ci 2 / i 5-alkanols. It is also possible to mix several alkanols.
  • the above alkanol alkoxylates or mixtures according to the invention are preferably prepared by reacting alcohols of the general formula R 1 -OH or R 3 -OH or mixtures of corresponding branched and unbranched alcohols, optionally first with C 3 . 6 -alkylene oxide, then with ethylene oxide and subsequently optionally with C 3 . 4 -alkylene oxide and then with a corresponding C 5 . 6 - Alkylene oxide.
  • the alkoxylations are preferably carried out in the presence of alkoxylation catalysts.
  • basic catalysts such as potassium hydroxide are used.
  • alkoxylation catalysts such as modified bentonites or hydrotalcites, as described, for example, in WO 95/04024, the statistical distribution of the amounts of the incorporated alkylene oxides can be greatly reduced, so that one obtains "narrow-range" alkoxylates.
  • alkoxylate mixtures containing alkoxylates of the general formula (NIM) are provided.
  • alkoxylates A2 1 to 30 wt .-% alkoxylates A2, in which C 5 Hn has the meaning CaHsCl-KCl-yCHz and / or CH 3 CH (CH 3 ) CH 2 CH 2 , present in a mixture.
  • p is a number from 0 to 10, preferably 0 to 5, in particular 0 to 3. If blocks (B) p are present, p is preferably a number from 0.1 to 10, particularly preferably 0, 5 to 5, in particular 1 to 3.
  • n is preferably a number in the range of 0.25 to 10, especially 0.5 to 7
  • m is preferably a number in the range of 2 to 10, especially 3 to 6.
  • B is preferably propyleneoxy and / or butyleneoxy, especially propyleneoxy at both positions.
  • q is preferably a number in the range of 1 to 5, more preferably in the range of 2 to 3.
  • the sum p + n + m + q is at least 1, preferably 3 to 25, more preferably 5 to 15, in particular 7 to 13.
  • the alkoxylates preferably contain 3 or 4 alkylene oxide blocks.
  • the alcohol residue is then initially followed by ethyleneoxy units, followed by propylene oxide units and subsequently ethyleneoxy units.
  • the alcohol radical is then initially followed by propyleneoxy units, then ethyleneoxy units, then propyleneoxy units and finally ethyleneoxy units.
  • the other indicated alkyleneoxy units may also be present.
  • p, n, m and q denote an average value, which results as an average for the alkoxylates. Therefore, p, n, m, q can also differ from integer values.
  • alkoxylation of alkanols a distribution of the degree of alkoxylation is generally obtained, which can be adjusted to some extent by using different alkoxylation catalysts.
  • suitable ter amounts of groups A and B the property spectrum of the alkoxylate mixtures according to the invention can be adjusted depending on the practical requirements.
  • the alkoxylate mixtures are obtained by alkoxylation of the parent alcohols C5H 11 CH (C 3 H7) CH 2 OH.
  • the starting alcohols can be mixed from the individual components, resulting in the ratio according to the invention. They can be prepared by aldol condensation of valeraldehyde and subsequent hydrogenation.
  • the preparation of valeraldehyde and the corresponding isomers is carried out by hydroformylation of butene, as described for example in US 4,287,370; Beilstein E IV 1, 32 68, Ullmann's Encyclopedia of Industrial Chemistry, 5th Edition, Volume A1, pages 323 and 328 f.
  • the subsequent aldol condensation is described, for example, in US Pat. No. 5,434,313 and Römpp, Chemie Lexikon, 9th edition, keyword "Aldol addition” on page 91.
  • the hydrogenation of the aldol condensation product follows general hydrogenation conditions.
  • 2-propylheptanol can be prepared by condensation of 1-pentanol (as a mixture of the corresponding methylbutanols-1) in the presence of KOH at elevated temperatures, see e.g. Marcel Guerbet, CR. Acad Be Paris 128, 511, 1002 (1899). Furthermore, Römpp, Chemie Lexikon, 9th edition, Georg Thieme Verlag Stuttgart, and the quotations mentioned therein and Tetrahedron, Vol. 23, pages 1723-1733, should be noted.
  • the radical C the meaning nC 5 H n, C 2 H 5 CH (CH 3) CH 2 or CH 3 CH 5 Hn (CH 3) CH 2 CH 2 have.
  • the alkoxylates are mixtures in which
  • the radical C 3 H 7 preferably has the meaning nC 3 H 7 . It may also be block-shaped iso Tridecanolalkoxylate the general formula (NV)
  • R denotes an iso-tridecyl radical
  • m is the number 2 and at the same time
  • n is the number 3 or 4
  • m is the number 3 or 4 and at the same time
  • n is the number 2 and
  • x and y independently of one another represent numbers from 1 to 20,
  • Another suitable nonionic surfactant class is end-capped alcohol alkoxylates, especially of the aforementioned alcohol alkoxylates.
  • these are the corresponding end-capped alcohol alkoxylates of the alcohol alkoxylates of the general formulas (III), (NN), (NIM) and (NV).
  • the end group closure can be carried out, for example, using dialkyl sulfate, C 1-10 -alkyl halides, C 1-10 -halohalides, preferably -chlorides, -bromides, particularly preferably cyclohexyl chloride, cyclohexyl bromide, phenyl chloride or phenyl bromide.
  • R ' is hydrogen or CC 2 o-alkyl
  • R "and R m are the same or different and are each independently of one another hydrogen, methyl or ethyl,
  • R IV is C 1 -C 4 -alkyl, preferably C 4 -alkyl, or cyclohexyl or phenyl, m 'and n' are the same or different and are greater than or equal to 0,
  • alkyl polyglucosides having preferably 6 to 22, more preferably 10 to 18, carbon atoms in the alkyl chain. These compounds generally contain 1 to 20, preferably 1, 1 to 5 glucoside units.
  • nonionic wetting agents are the end-capped fatty acid amide alkoxides of the general formula ## STR4 ## known from WO-A 95/1 1225 R'-CO-NH- (CH 2 ) y -O- (A 1 O) x -R 2 in the
  • R 1 denotes a C 5 - to C 2 -alkyl or alkenyl radical
  • R 2 is a C 1 to C 4 alkyl group
  • a ' is C 2 - to C 4 -alkylene
  • y denotes the number 2 or 3
  • x has a value of 1 to 6.
  • Examples of such compounds are the reaction products of n-butyltriglycolamine of the formula H 2 N- (CH 2 -CH 2 -O) 3-C 4 H 9 with dodecanoic acid methyl ester or the reaction products of ethyltetraglycolamine of the formula H 2 N- (CH 2 -CH 2 -O) 4 - C 2 H 5 with a commercially available mixture of saturated C 8 - to C 8 fatty acid methyl esters.
  • nonionic wetting agents are polyhydroxy or polyalkoxy fatty acid derivatives such as polyhydroxy fatty acid amides, N-alkoxy or N-aryloxy polyhydroxy fatty acid amides, fatty acid amide ethoxylates, in particular end-capped, and fatty acid alkanolamide alkoxylates.
  • block copolymers suitable for use as nonionic surfactants of ethylene oxide, propylene oxide and / or butylene oxide (Pluronic ® - and Tetronic ® BASF SE BASF Corp. or grades).
  • block copolymers of ethylene oxide, propylene oxide and / or butylene oxide which are closed on one or two sides, can preferably also be used.
  • a one-sided closure can be achieved, for example, by using as starting compound for the reaction with an alkylene oxide an alcohol, in particular a Ci- 22 alkyl alcohol, for example methanol used.
  • nonionic wetting agents or a combination of different nonionic surfactants. It is possible to use nonionic wetting agents of only one class, in particular only alkoxylated C 4 - to C 22 -alcohols. Alternatively, one can also use wetting agent mixtures from different classes.
  • the concentration of nonionic wetting agent in the composition of the invention may vary depending on the conditions of leaching, in particular depending on the material to be leached.
  • Suitable anionic wetting agents are alkanesulfonates such as C 8 to C 24 , preferably cio to cis alkanesulfonates and soaps such as the Na and K salts of saturated and / or unsaturated C 8 . to C 24 carboxylic acids.
  • Suitable anionic wetting agents are linear C 8 - to C 2 o-alkylbenzenesulfonates ("LAS"), preferably linear C 9 - to C -alkylbenzenesulfonates and -alkyltoluenesulfonates
  • LAS o-alkylbenzenesulfonates
  • Thickeners are compounds that increase the viscosity of the chemical composition. Non-limiting examples are for. As specified in WO 2009/090169 A1: polyacrylates and hydrophobically modified polyacrylates.
  • the advantage of using thickeners is that higher viscosity fluids on inclined or vertical surfaces have a longer residence time than lower viscosity fluids. This increases the interaction time between composition and surface.
  • Further particularly suitable thickeners are, for example, bentonite, xanthan and cellulose and also cellulose derivatives, in particular cellulose ethers and cellulose esters, in particular methylcellulose, hydroxyethylcellulose and carboxymethylcellulose.
  • Further examples of thickeners are polyacrylamides, polyethers or associative polyurethane thickeners, polyvinyl alcohols and polyvinylpyrrolidones. Dispersants / scale inhibitors
  • At least one dispersing agent for example selected from the group consisting of salts of naphthalenesulfonic acids, condensation products of naphthalenesulfonic acids and formaldehyde and also polycarboxylates, can additionally be used.
  • Appropriate dispersing agents are commercially available for example under the trade name Tamol ®, Sokalan ® and Nekal ® from BASF SE as well as under the trade name Solsperse ® from Lubrizol.
  • these dispersants can also act as scale inhibitors (coating inhibitors), since they disperse the calcium carbonate CaCO 3 forming in the alkaline medium and thus prevent, for example, clogging of nozzles or deposit formation in pipelines.
  • the composition according to the invention may additionally contain at least one further scaling inhibitor. Suitable scale inhibitors are described, for example, in WO 04/099092 which describes (meth) acrylic acid copolymers which
  • the (meth) acrylic acid copolymers provided according to WO 04/099092 preferably have a weight-average molecular weight of the sulfone-containing polymer of from 1,000 to 20,000 g / mol and can preferably be prepared by the following process steps:
  • scaling inhibitors are, for example:
  • Formulations containing complexing agents such as ethylenediaminetetraacetic acid (EDTA) and / or diethylenetriaminepentaacetic acid (DTPA) (according to US Pat
  • Naphthylamine polycarboxylates (according to EP 0 538 969),
  • polyacrylic acid such as Sokalan from BASF SE ® types and polyaspartic acids, in particular .beta.-polyaspartic acids with a molecular weight of 2,000 to 10,000 g / mol.
  • polymeric compounds containing carboxylic acid groups are the acrylic acid homopolymers specified in EP 2 083 067 A1. These preferably have a number-average molecular weight in the range from 1000 to 50,000, more preferably from 1,500 to 20,000.
  • homopolymers of acrylic acid which are particularly suitable as polymeric compounds containing carboxylic acid groups are the Sokalan® PA grades from BASF SE.
  • Suitable polymeric compounds containing carboxylic acid groups are also oligomaleic acids, as described, for example, in EP-A 451 508 and EP-A 396 303.
  • polymeric compounds containing carboxylic acid groups are copolymers which comprise in copolymerized form as monomer A) at least one unsaturated mono- or dicarboxylic acid or a dicarboxylic acid anhydride or a salt thereof and at least one comonomer B).
  • the monomer A) is chosen from C 3 -C 0 monocarboxylic acids, salts of C 3 -C 0 monocarboxylic acids, C 4 -C 8 - dicarboxylic acids, anhydrides of C 4 -C 8 dicarboxylic acids, salts of C 4 -C 8 - dicarboxylic acids and mixtures thereof.
  • Monomers A) in salt form are preferably used in the form of their water-soluble salts, in particular the alkali metal salts, such as potassium and especially sodium salts or ammonium salts.
  • the monomers A) can each be completely or partially in anhydride form. Of course, it is also possible to use mixtures of the monomers A).
  • the monomers (A) are preferably selected from acrylic, methacrylic, crotonic, vinylacetic, maleic, maleic, fumaric, citraconic, citraconic, itaconic and mixtures thereof. Particularly preferred monomers (A) are acrylic acid, methacrylic acid, maleic acid, maleic anhydride and mixtures thereof. These copolymers preferably comprise at least one monomer A) in an amount of from 5 to 95% by weight, particularly preferably from 20 to 80% by weight, in particular from 30 to 70% by weight, based on the total weight of the monomers used for the polymerization, in copolymerized form.
  • carboxylic acids As corrosion inhibitors z. B. in WO 2008/071582 A1 specified means, for. B. carboxylic acids. These can be straight-chain or branched. mixtures various carboxylic acids may be particularly preferred. Caprylic acid, ethylhexanoic acid, isononanoic acid and isodecanoic acid are particularly preferred carboxylic acids. Since anticorrosive emulsions are often neutral to slightly alkaline, it may be advantageous to use the carboxylic acids at least partially in neutralized form, ie as a salt. Particularly suitable for neutralization are sodium and / or potassium hydroxide, as well as alkanolamines. Particularly preferred is the use of mono- and / or trialkanolamines. The use of dialkanolamines is less preferred because of the danger of formation of nitrosamines. However, dialkanolamines can also be used alone or together with mono- and / or trialkanolamines for neutralization.
  • Suitable corrosion inhibitors are in particular: aliphatic carboxylic acid amides having 14 to 36 carbon atoms, for example myristic acid amide, palmitic acid amide and oleic acid amide; Alkenylsuccinamides having 6 to 36 carbon atoms, for example octenylsuccinamide, dodecenylsuccinamide; Mercatobenzothiazole.
  • Particularly preferred corrosion inhibitors are alkylene oxide adducts with aliphatic amines, particularly triethanolamine and ethylenediamine adducts with 2 to 8 mol% of propylene oxide.
  • Complexing agents are compounds that bind cations. Typical examples are: EDTA ( ⁇ , ⁇ , ⁇ ', ⁇ '-ethylenediaminetetraacetic acid), NTA ( ⁇ , ⁇ , ⁇ -nitrilotriacetic acid), MGDA (2-methyl-glycine-N, N-diacetic acid), GLDA (glutamic acid diacetate), AS DA (aspartic acid diacetate), IDS (iminodisuccinate), HEIDA (hydroxyethylimine diacetate), EDDS (ethylenediamine disuccinate), citric acid, oxodisuccinic acid and butanetetracarboxylic acid or their fully or partially neutralized alkali metal or ammonium salts.
  • EDTA ⁇ , ⁇ , ⁇ ', ⁇ '-ethylenediaminetetraacetic acid
  • NTA ⁇ , ⁇ , ⁇ -nitrilotriacetic acid
  • MGDA 2-methyl-g
  • adhesion promoters are, for example, the amphiphilic water-soluble alkoxylated polyalkyleneimines of the general formula AI given in WO 2006/108856 A2 B
  • R is the same or different, linear or branched C 2 -C 6 -alkylene radicals
  • E is an alkyleneoxy unit of the formula
  • R1 is 1, 2-propylene, 1, 2-butylene and / or 1, 2-isobutylene
  • R3 1, 2-propylene
  • R4 is the same or different radicals: hydrogen; C1-C4 alkyl;
  • x, y, z are each a number from 2 to 150, where the sum x + y + z is a number from
  • Alkyleniminhimen means the average molecular weight Mw of
  • n is a rational number from 0 to 2;
  • n is a rational number from 6 to 18;
  • p is a rational number from 3 to 12, where 0.8 ⁇ n / p ⁇ 1, 0 (x + y + z) is 1/2.
  • the invention further relates to a slurry of the carrier liquid, in particular cutting fluid, abrasives, in particular grinding and / or cutting grains, and optionally additives.
  • the usual abrasives in particular grinding and / or cutting grains, can be used, for example metal, metal or semimetal, carbide, nitride, oxide, boride or diamond grains.
  • Particularly preferred cutting grains are carbide and boride, in particular silicon carbide (SiC) grains.
  • the cutting grains preferably have an adapted geometry depending on the materials and the wafers to be cut; a preferred particle size is between 0.5 and 50 ⁇ m.
  • the cutting grains may be in heterodisperse or homodisperse form.
  • the cutting grains are preferably contained in the cutting fluid composition in a concentration of 25 to 60% by weight, especially 40 to 50% by weight.
  • the carrier liquid in particular cutting fluid, a contact angle against V2A steel from 5 to 40 °, in particular from 10 to 30 °.
  • the contact angle is determined here at 25 ° C on a steel plate made of V2A steel, the surface was rinsed with water and acetone.
  • the carrier fluids according to the invention lead on average to a balance of the designation MDD2, Hermann Reichert Maschinenbau, Heidenhof Backnang, at a loading of 300 N and a running distance of 110 m and two repeated tests Weight loss of a maximum of 20 to 60 mg in one minute on a stainless steel cylinder of the designation M1 M6 / 05R, Torrington with a diameter of 12 mm.
  • the carrier liquids according to the invention, in particular cutting fluids, after storage in a Heraeus BBD 6220 CO 2 incubator at 38 ° C. and 78% relative humidity take a maximum of 30, preferably a maximum of 15% water after a time of 10 hours on.
  • a slurry of a carrier liquid according to the invention, in particular cutting fluid, and of 40 wt .-% of Abrasiva specified below, in particular grinding and / or cutting grains, preferably has a viscosity, measured at 30 ° C with a Brookfield LVDV-III Ultravorraum (Spindle V-73), from 140 to 200 mPas, in particular from 150 to 190 mPas, being used as Carborex BWF 800 PV silicon carbide grains from Washington Mills.
  • the invention further relates to a method for cutting wafers from in particular inorganic semiconductors, such as silicon ingots or silicon ingots, with a wire saw using a slurry based on the cutting fluid according to the invention and of cutting grains.
  • inorganic semiconductors such as silicon ingots or silicon ingots
  • the invention further relates to a method for grinding or polishing materials from, for example, silicon ingots or ingots by, for example, chemical mechanical polishing (CMP) or for grinding plastics, in particular for lenses, using abrasives which are dispersed in a carrier liquid to be used according to the invention.
  • CMP chemical mechanical polishing
  • the carrier liquid according to the invention in particular cutting fluid and the method according to the invention for cutting is particularly suitable for sawing ingots, ingots or cylinders (ingots) of monocrystalline or polycrystalline silicon single crystals or polycrystals, GaAs, CdTe and other semiconductors and ceramics.
  • the carrier liquid according to the invention in particular cutting fluid, is characterized in that it has little or no foaming, requires no additives, is pH-neutral and is not toxic. In addition, it contains no volatile organic components. Furthermore, the carrier liquid according to the invention, in particular cutting fluid, is outstandingly suitable for reprocessing by chemical-technical wet processing, for example in accordance with WO 02/40407 A1 and EP 1 390 184 A1.
  • the wetting agents or alkylene glycols Pluronic® PE 6200 or Plurafac® LF 401 added in Examples C6 and C7 are commercial products of BASF SE, Ludwigshafen.
  • the indicated analytical data refer to the component of the invention pentanol + 1, 5 PO + 6EO, block mode. Properties / Determination of the characteristic values
  • the water uptake of the cutting fluids was determined after storage in a Heraeus BBD 6220 C02 incubator at 38 ° C. and 78% relative humidity after 10 hours and 24 hours, respectively.
  • 1 g of cutting fluid was used in Petri dishes of an inner diameter of 60 mm. In each case, the mean value of a duplicate determination was determined.
  • the water absorption is given in percent by weight increase based on weight.
  • slurry viscosity a mixture of 60% by weight of the sawing liquid and 40% by weight of Carborex BW F 800 PV SiC manufactured by Washington Mills and the viscosity at 30 ° C and optionally 50 ° C with a viscometer from Brookfield, Model LVDV-III Ultra (Spindle V-73). The slurry viscosity is given in mPas.
  • the contact angle of the cutting fluids was determined at 25 ° C. one second after drop application on a steel plate made of V2A steel, the surface of which was rinsed with water and acetone and then dried in air for 1 h.
  • a video-assisted high-speed contact angle measuring device from Dataphysics Instruments GmbH, Raiffeisenstrasse 34, Filderstadt was used. The unit of the contact angle is given in °.
  • the abrasion behavior was on a Rebverschl adoptedwaage the designation MDD2, company Hermann Reichert mechanical engineering, Heidenhof Backnang, at a load of 300 N and a running distance of 100 m in 54.5 seconds on a stainless steel cylinder of the designation M1 M6 / 05R, Torrington with a diameter determined by 12 mm. A double determination was carried out in each case and the mean value of the weight decrease of the cylinder was determined. The weight loss is given in mg. Table 2
  • Pluriol® E 200 is a medium molecular weight polyethylene glycol 200 from BASF SE, Ludwigshafen. The example represents the prior art and is not according to the invention. Compounds 11.1 and II.2 gave comparable results to compounds C2 and C3. field trial
  • composition of the slurry 60% by weight of sawing fluid, 40% by weight of SiC

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  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Detergent Compositions (AREA)
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Abstract

L'invention concerne de nouveaux liquides supports pour abrasifs améliorés, en particulier des liquides de coupe, pour la fabrication de tranches, ainsi que leur utilisation et un procédé de coupe de tranches.
PCT/EP2011/063276 2010-08-03 2011-08-02 Liquides supports pour abrasifs Ceased WO2012016976A1 (fr)

Priority Applications (11)

Application Number Priority Date Filing Date Title
PL11738239T PL2601280T3 (pl) 2010-08-03 2011-08-02 Ciecze nośne do ścierniw
SG2013008172A SG187691A1 (en) 2010-08-03 2011-08-02 Carrier fluids for abrasives
CN201180046812.4A CN103154214B (zh) 2010-08-03 2011-08-02 用于磨料的载体流体
AU2011287623A AU2011287623B9 (en) 2010-08-03 2011-08-02 Carrier fluids for abrasives
RU2013109141/04A RU2542974C2 (ru) 2010-08-03 2011-08-02 Жидкости-носители для абразивов
BR112013002486A BR112013002486A2 (pt) 2010-08-03 2011-08-02 "uso de compostos, fluido de suporte, uso de um fluido de suporte, métodos para cortar pastilhas, e para polir materiais, pastilha, e, composto"
ES11738239.0T ES2525017T3 (es) 2010-08-03 2011-08-02 Líquidos portadores para abrasivos
EP11738239.0A EP2601280B1 (fr) 2010-08-03 2011-08-02 Liquide porteur pour abrasifs
CA2806936A CA2806936A1 (fr) 2010-08-03 2011-08-02 Liquides supports pour abrasifs
KR1020137005241A KR101505334B1 (ko) 2010-08-03 2011-08-02 연마제용 캐리어 유체
JP2013522230A JP5543030B2 (ja) 2010-08-03 2011-08-02 研磨材用の加工液

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EP10171716 2010-08-03

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JP (1) JP5543030B2 (fr)
KR (1) KR101505334B1 (fr)
CN (1) CN103154214B (fr)
AU (1) AU2011287623B9 (fr)
BR (1) BR112013002486A2 (fr)
CA (1) CA2806936A1 (fr)
ES (1) ES2525017T3 (fr)
PL (1) PL2601280T3 (fr)
RU (1) RU2542974C2 (fr)
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JP6266337B2 (ja) * 2013-12-25 2018-01-24 ニッタ・ハース株式会社 半導体基板用濡れ剤及び研磨用組成物
JP6909731B2 (ja) * 2016-02-10 2021-07-28 物産フードサイエンス株式会社 切削液、切削方法および切削面の平滑性向上剤
CN108998188A (zh) * 2018-09-10 2018-12-14 洛阳阿特斯光伏科技有限公司 一种金刚线切割硅片冷却液及其制备方法和应用

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