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WO2012005434A3 - 마이크로폰 - Google Patents

마이크로폰 Download PDF

Info

Publication number
WO2012005434A3
WO2012005434A3 PCT/KR2011/002566 KR2011002566W WO2012005434A3 WO 2012005434 A3 WO2012005434 A3 WO 2012005434A3 KR 2011002566 W KR2011002566 W KR 2011002566W WO 2012005434 A3 WO2012005434 A3 WO 2012005434A3
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
sound hole
case
microphone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2011/002566
Other languages
English (en)
French (fr)
Other versions
WO2012005434A2 (ko
Inventor
이상호
심용현
허형용
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DONGGUAN BAOXING ELECTRONICS Co Ltd
RONGCHENG BAOXING ELECTRONIC CO Ltd
TIANJIN BSE ELECTRONICS CO Ltd
BSE Co Ltd
Original Assignee
DONGGUAN BAOXING ELECTRONICS Co Ltd
RONGCHENG BAOXING ELECTRONIC CO Ltd
TIANJIN BSE ELECTRONICS CO Ltd
BSE Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DONGGUAN BAOXING ELECTRONICS Co Ltd, RONGCHENG BAOXING ELECTRONIC CO Ltd, TIANJIN BSE ELECTRONICS CO Ltd, BSE Co Ltd filed Critical DONGGUAN BAOXING ELECTRONICS Co Ltd
Publication of WO2012005434A2 publication Critical patent/WO2012005434A2/ko
Publication of WO2012005434A3 publication Critical patent/WO2012005434A3/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Micromachines (AREA)

Abstract

본 발명은, 마이크로폰에 관한 것으로서, 외부 음공이 형성된 케이스; 상기 케이스의 내부에 결합되고, 상기 외부 음공과 연통되는 내부 음공이 형성된 제 1 인쇄회로기판; 상기 제 1 인쇄회로기판의 내측면에 실장되되, 상기 내부 음공이 형성된 위치에 실장된 멤스칩(MEMS Chip); 상기 케이스의 내부에 결합되되, 상기 제1인쇄회로기판과 이격되어 위치하도록 결합되고, 그 외측면에는 복수의 연결단자가 형성된 제 2 인쇄회로기판; 상기 제 1 인쇄회로기판과 제 2 인쇄회로기판을 전기적으로 연결하는 복수의 도전성 연결부재; 및 제 1 인쇄회로기판과 제 2 인쇄회로기판이 상호 간격을 유지하며 지지될 수 있도록, 상기 제 1 인쇄회로기판과 제 2 인쇄회로기판의 사이에 구비된 이격지지부재를 포함하여 형성된 것을 특징으로 한다. 본 발명의 마이크로폰은 백챔버 공간을 충분히 확보할 수 있고, 조립이 용이하며, 필요에 따라 그 형상과 부피를 조절하는 것이 용이하다는 장점이 있다.
PCT/KR2011/002566 2010-07-09 2011-04-12 마이크로폰 Ceased WO2012005434A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0066414 2010-07-09
KR1020100066414A KR101130335B1 (ko) 2010-07-09 2010-07-09 마이크로폰

Publications (2)

Publication Number Publication Date
WO2012005434A2 WO2012005434A2 (ko) 2012-01-12
WO2012005434A3 true WO2012005434A3 (ko) 2012-03-01

Family

ID=45429155

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/002566 Ceased WO2012005434A2 (ko) 2010-07-09 2011-04-12 마이크로폰

Country Status (4)

Country Link
KR (1) KR101130335B1 (ko)
CN (2) CN202135313U (ko)
TW (1) TW201208394A (ko)
WO (1) WO2012005434A2 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8995694B2 (en) 2012-02-01 2015-03-31 Knowles Electronics, Llc Embedded circuit in a MEMS device
US9485560B2 (en) 2012-02-01 2016-11-01 Knowles Electronics, Llc Embedded circuit in a MEMS device
CN102790940A (zh) * 2012-07-25 2012-11-21 中山市天键电声有限公司 防风传声器
KR20150058467A (ko) * 2012-09-27 2015-05-28 노우레스 일렉트로닉스, 엘엘시 Ｍｅｍｓ 기기에 임베드된 회로
CN108235832B (zh) * 2017-03-09 2021-01-05 华为技术有限公司 一种消费电子产品的主板及终端
CN115767948B (zh) * 2022-11-14 2024-04-02 北京自动化控制设备研究所 Mems惯性系统高密度低应力集成方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100737732B1 (ko) * 2006-04-21 2007-07-10 주식회사 비에스이 멤스 마이크로폰의 패키징 구조
KR100737726B1 (ko) * 2006-07-10 2007-07-10 주식회사 비에스이 멤스 마이크로폰 패키징 구조체
KR20080005801A (ko) * 2006-07-10 2008-01-15 주식회사 비에스이 멤스 마이크로폰 패키징 구조
KR20090004982A (ko) * 2006-04-19 2009-01-12 호시덴 가부시기가이샤 일렉트릿 컨덴서 마이크로폰
US20090257614A1 (en) * 2008-04-10 2009-10-15 Jia-Xin Mei Package for micro-electro-mechanical acoustic transducer with improved double side mountable electrodes

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090004982A (ko) * 2006-04-19 2009-01-12 호시덴 가부시기가이샤 일렉트릿 컨덴서 마이크로폰
KR100737732B1 (ko) * 2006-04-21 2007-07-10 주식회사 비에스이 멤스 마이크로폰의 패키징 구조
KR100737726B1 (ko) * 2006-07-10 2007-07-10 주식회사 비에스이 멤스 마이크로폰 패키징 구조체
KR20080005801A (ko) * 2006-07-10 2008-01-15 주식회사 비에스이 멤스 마이크로폰 패키징 구조
US20090257614A1 (en) * 2008-04-10 2009-10-15 Jia-Xin Mei Package for micro-electro-mechanical acoustic transducer with improved double side mountable electrodes

Also Published As

Publication number Publication date
TW201208394A (en) 2012-02-16
KR20120005768A (ko) 2012-01-17
KR101130335B1 (ko) 2012-03-26
WO2012005434A2 (ko) 2012-01-12
CN102316402A (zh) 2012-01-11
CN202135313U (zh) 2012-02-01

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