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WO2012005454A3 - Système de coupe de substrat en verre utilisant un laser - Google Patents

Système de coupe de substrat en verre utilisant un laser Download PDF

Info

Publication number
WO2012005454A3
WO2012005454A3 PCT/KR2011/004388 KR2011004388W WO2012005454A3 WO 2012005454 A3 WO2012005454 A3 WO 2012005454A3 KR 2011004388 W KR2011004388 W KR 2011004388W WO 2012005454 A3 WO2012005454 A3 WO 2012005454A3
Authority
WO
WIPO (PCT)
Prior art keywords
glass substrate
laser
cutting
cutting system
substrate cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2011/004388
Other languages
English (en)
Korean (ko)
Other versions
WO2012005454A2 (fr
Inventor
윤덕환
정찬구
엄태준
박종진
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
A&E TECHNOLOGY Co Ltd
Original Assignee
A&E TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by A&E TECHNOLOGY Co Ltd filed Critical A&E TECHNOLOGY Co Ltd
Publication of WO2012005454A2 publication Critical patent/WO2012005454A2/fr
Publication of WO2012005454A3 publication Critical patent/WO2012005454A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/02—Carriages for supporting the welding or cutting element
    • B23K37/0211—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track
    • B23K37/0235—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track the guide member forming part of a portal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/047—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

La présente invention porte sur un système de coupe de substrat en verre utilisant un laser. En détail, le système de coupe de substrat en verre utilisant un laser peut corriger une ligne de coupe irradiée avec un faisceau laser sur un substrat en verre transféré logé sur une table de traitement en temps réel afin de traiter avec précision le substrat en verre. L'invention porte également sur un procédé de coupe de deux parties latérales du substrat en verre, sur un procédé de rotation du substrat en verre à un angle d'environ 90 degrés, et sur un procédé de coupe de toutes les autres parties latérales du substrat en verre, qui peut être effectué sur une ligne continue de façon à réduire significativement un temps de saisie. De plus, la partie de tige de fixation située le plus à l'extérieur et la partie de transporteur d'une pluralité de parties de tige de fixation et de parties de transporteur peuvent être pliées et étendues perpendiculairement par rapport à une direction de la longueur afin de couper de façon compatible le substrat en verre logé sur une surface supérieure de la table de traitement en taille.
PCT/KR2011/004388 2010-07-06 2011-06-15 Système de coupe de substrat en verre utilisant un laser Ceased WO2012005454A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0064633 2010-07-06
KR1020100064633A KR101009454B1 (ko) 2010-07-06 2010-07-06 레이저를 이용한 유리기판 절단가공 시스템

Publications (2)

Publication Number Publication Date
WO2012005454A2 WO2012005454A2 (fr) 2012-01-12
WO2012005454A3 true WO2012005454A3 (fr) 2012-05-03

Family

ID=43616515

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/004388 Ceased WO2012005454A2 (fr) 2010-07-06 2011-06-15 Système de coupe de substrat en verre utilisant un laser

Country Status (2)

Country Link
KR (1) KR101009454B1 (fr)
WO (1) WO2012005454A2 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103539343A (zh) * 2012-07-09 2014-01-29 三和科技有限公司 一种混合加工有色玻璃的方法
KR101950451B1 (ko) * 2012-08-09 2019-02-21 (주)하드램 필름 부착된 유리 기판용 레이저 절단 장치
DE102012021723A1 (de) * 2012-11-05 2014-02-20 Gallus Druckmaschinen Gmbh Vorrichtung und Verfahren zum Schneiden mit Laser-Array
EP3098018A1 (fr) * 2015-05-27 2016-11-30 Preco, Inc. Transporteur de séparation
US20160346874A1 (en) 2015-05-27 2016-12-01 Preco, Inc. Singulation conveyor
CN106395382A (zh) * 2016-11-25 2017-02-15 中建材凯盛机器人（上海）有限公司 玻璃掰片系统及其相应的控制方法
CN109704557B (zh) * 2019-02-21 2022-03-04 北京航天控制仪器研究所 一种高精度石英玻璃激光切割定位方法
CN109759724B (zh) * 2019-03-06 2023-09-22 武汉三工光电设备制造有限公司 自动划片机
US11105985B2 (en) 2020-01-31 2021-08-31 Corning Research & Development Corporation Lens-based connector assemblies having precision alignment features and methods for fabricating the same
US11249257B2 (en) 2020-01-31 2022-02-15 Corning Research & Development Corporation Ferrule assemblies having a lens array
CN114985957B (zh) * 2022-04-14 2024-03-26 武汉华工激光工程有限责任公司 膜片激光切割方法以及自动灌装封膜生产线
CN117228945B (zh) * 2023-11-15 2024-01-23 成都新世佳特种玻璃技术开发有限公司 一种特种玻璃生产用切割装置及分切工艺
CN117285241B (zh) * 2023-11-24 2024-04-19 苏州优备精密智能装备股份有限公司 对位机构和切割设备
CN120002211A (zh) * 2025-04-02 2025-05-16 江苏迪鼎机械有限公司 一种叉车配件生产用激光切割装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6407360B1 (en) * 1998-08-26 2002-06-18 Samsung Electronics, Co., Ltd. Laser cutting apparatus and method
US6563082B2 (en) * 2000-09-20 2003-05-13 Seiko Epson Corporation Laser cutting method, laser cutting apparatus, and method and apparatus for manufacturing liquid crystal device
KR100541275B1 (ko) * 2003-04-18 2006-01-11 류재식 인쇄제판용 판재의 자동 절단장치 및 그 방법
KR100845113B1 (ko) * 2007-05-30 2008-07-10 주식회사 오에스티 글라스 절단 장치
KR100949152B1 (ko) * 2007-11-23 2010-03-25 삼성코닝정밀유리 주식회사 유리 기판 레이저 절단 장치

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5057088B2 (ja) 2008-07-29 2012-10-24 オムロン株式会社 ガラス板の切断方法、及びガラス板切断用テーブル装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6407360B1 (en) * 1998-08-26 2002-06-18 Samsung Electronics, Co., Ltd. Laser cutting apparatus and method
US6563082B2 (en) * 2000-09-20 2003-05-13 Seiko Epson Corporation Laser cutting method, laser cutting apparatus, and method and apparatus for manufacturing liquid crystal device
KR100541275B1 (ko) * 2003-04-18 2006-01-11 류재식 인쇄제판용 판재의 자동 절단장치 및 그 방법
KR100845113B1 (ko) * 2007-05-30 2008-07-10 주식회사 오에스티 글라스 절단 장치
KR100949152B1 (ko) * 2007-11-23 2010-03-25 삼성코닝정밀유리 주식회사 유리 기판 레이저 절단 장치

Also Published As

Publication number Publication date
WO2012005454A2 (fr) 2012-01-12
KR101009454B1 (ko) 2011-01-19

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