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WO2012005454A2 - Système de coupe de substrat en verre utilisant un laser - Google Patents

Système de coupe de substrat en verre utilisant un laser Download PDF

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Publication number
WO2012005454A2
WO2012005454A2 PCT/KR2011/004388 KR2011004388W WO2012005454A2 WO 2012005454 A2 WO2012005454 A2 WO 2012005454A2 KR 2011004388 W KR2011004388 W KR 2011004388W WO 2012005454 A2 WO2012005454 A2 WO 2012005454A2
Authority
WO
WIPO (PCT)
Prior art keywords
glass substrate
laser
cutting
unit
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2011/004388
Other languages
English (en)
Korean (ko)
Other versions
WO2012005454A3 (fr
Inventor
윤덕환
정찬구
엄태준
박종진
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
A&E TECHNOLOGY Co Ltd
Original Assignee
A&E TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by A&E TECHNOLOGY Co Ltd filed Critical A&E TECHNOLOGY Co Ltd
Publication of WO2012005454A2 publication Critical patent/WO2012005454A2/fr
Publication of WO2012005454A3 publication Critical patent/WO2012005454A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/02—Carriages for supporting the welding or cutting element
    • B23K37/0211—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track
    • B23K37/0235—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track the guide member forming part of a portal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/047—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

  • the present invention relates to a glass substrate cutting processing system using a laser
  • the glass substrate can be precisely processed by real-time correction of the cutting schedule line for irradiating the laser beam to the glass substrate that is seated on the process table in detail
  • Tak time can be significantly reduced by dividing the process of cutting both sides of the glass substrate, rotating the process by 90 °, and cutting the other side of the glass substrate on a continuous line.
  • the fixed rod part and the conveyor part disposed at the outermost part of the plurality of fixed rod parts and the plurality of conveyor parts provided on the table are installed to be folded and extended at right angles to their respective longitudinal directions and are seated on the upper surface of the process table. Glass substrate cutting process sheath using laser which can be cut to compatible specifications of glass substrate Relate to.
  • a glass substrate for a display means glass used for display apparatuses, such as a liquid crystal display, a plasma display, an organic electroluminescent display.
  • the scribe wheel method is a method of forming a scribe line having a predetermined depth on the surface of the glass substrate by installing a fine diamond on the circumferential surface of the disc having a predetermined diameter, and contacting the cutting schedule line to be cut while rotating it at high speed.
  • the scribing wheel method is a method in which a crack is propagated and cut along the scribe line by applying a physical impact to the glass substrate on which the scribe line is formed.
  • the scribe wheel method requires a cutting edge of a predetermined area or more, particles are generated during cutting and require a separate cleaning process and a drying process to remove them, the cutting surface is not smooth, and the cost of consumables increases. There was a downside.
  • a glass substrate cutting apparatus using a laser was introduced.
  • a method of moving the processing table in which the glass substrate is located in the cutting direction while maintaining the laser cutting head in a fixed state is used.
  • the laser oscillation part has a load of about 250 kg to 300 kg. When this load is moved, the structure supporting the laser cutting head is sag and the path position of the laser beam is distorted, thereby reducing the cutting accuracy and stability. Is generated.
  • a cutting head having a gantry stage structure and a laser oscillator connected integrally with the cutting head move forward and backward along the direction in which the glass substrate moves to solve the above problems.
  • the entire gantry stage is inevitably driven for the operation of the cutting head, which leads to unnecessary management and operation.
  • the glass substrate to be transported to the upper surface of the processing table is minutely distorted at a certain angle, it is necessary to correct such distortion.
  • Another problem arises in that there is no means to cut and finely cut glass substrates.
  • the present invention has been proposed in view of the above, and an object of the present invention is to provide a glass substrate cutting processing system using a laser that can cut the glass substrate more precisely and reduce the tack time as compared to the conventional one. There is.
  • the centering portion for correcting a certain direction before moving in a state in which the rectangular glass substrate is seated;
  • One side or both sides of the glass substrate, which has been uniformly transferred straight from the centering part, are cut along the transfer direction of the glass substrate by dividing the cutting schedule line, and a rectangular glass substrate with respect to the transfer direction of the glass substrate.
  • a first cutting unit capable of irradiating a laser by correcting a cutting schedule line in real time to correspond to the distorted angle;
  • a first breaking part for physically cutting and leaving one side or both side edge portions of the glass substrate sequentially moved straight after being irradiated by the laser from the first cutting part;
  • a rotating part rotated by 90 ° to cut the other side of the glass substrate sequentially transferred straight through the first breaking part;
  • a second cutting unit capable of irradiating a laser by correcting a cutting schedule line in real time correspondingly; And a second breaking part for physically cutting one or both edge portions of the glass substrate sequentially transferred straight after being irradiated by the laser from the second cutting part.
  • a plurality of cameras are disposed at predetermined positions on the upper portion of the centering portion in order to measure positional data on the standard and constant orientation of the glass substrate seated on the centering portion.
  • a plurality of cameras are disposed at an upper predetermined position of the second breaking portion to measure the angle and parallelism of each edge and each side of the glass substrate seated with the edges of the four sides cut in the second breaking portion. Based on the position data measured by the camera, each cutting schedule line by laser irradiation of the first and second cutting units is configured to be corrected in real time.
  • Each of the first cutting portion and the second cutting portion includes: a base plate seated on the bottom surface; A process table disposed on an upper surface of the base plate to move the glass substrate straight in a predetermined direction; A pair of guide tables installed side by side on an upper surface of both ends of the base plate; A pair of laser oscillators for oscillating the laser to process the glass substrate located on the upper surface of the process table while moving in a forward and backward direction along the pair of guide tables; And a pair of laser irradiation units which are conveyed along a pair of guide tables integrally with the laser oscillation unit and irradiate the glass substrate with the laser oscillated from the laser oscillation unit.
  • the pair of laser irradiation units are installed to be moved along the pair of guide tables in the forward and rear directions, and at the same time independently moveable in a left and right direction perpendicular to the longitudinal direction of the guide table. It is connected to each other cantilever (cantilever) structure from each laser oscillation portion is moved independently.
  • the laser irradiation unit for providing an initial crack to the glass substrate;
  • a reflector for guiding the laser beam oscillated from the laser oscillator;
  • a shopping lens unit for condensing the laser beam transmitted from the reflecting means;
  • a quenching nozzle unit for injecting cooling mist along the laser beam irradiated from the shopping lens;
  • an air suction unit for sucking dust generated from the cooling mist sprayed from the quenching nozzle unit and the initial crack of the glass substrate.
  • the laser oscillation unit is installed on the upper part of the pair of guide tables so as to be movable in the front and rear directions along the longitudinal direction of the guide table, and includes a laser source unit for oscillating the laser and a power supply unit for driving the laser source unit. It is composed.
  • Each of the process tables provided in the first and second cutting parts may include: a plurality of fixed rod parts disposed on an upper surface of the base plate side by side in the longitudinal direction of the guide table; And a plurality of conveyor parts disposed in parallel with each of the fixed rod parts alternately with the plurality of fixed rod parts, the height of the fixed rod being adjustable up and down with respect to the height of the fixed rod parts.
  • the centering portion the base plate seated on the bottom surface; And a process table disposed on an upper surface of the base plate to move the glass substrate straight to the first cutting portion, wherein the process table includes a plurality of fixed rods disposed on the upper surface of the base plate along a conveying direction of the glass substrate. And a plurality of conveyor parts disposed alternately with each of the plurality of fixed rod parts and arranged in parallel with each of the fixed rod parts, the height of which being adjustable up and down with respect to the height of the fixed rod parts.
  • the process table provided in the centering part includes: a plurality of stoppers disposed at the front end of the fixed rod part to temporarily stop the front end of the glass substrate seated on the fixed rod part; A plurality of side alignment parts disposed on the side of each of the fixed rod parts positioned at the outermost side of the plurality of fixed rod parts to correct centering and orientation of the glass substrate; And a plurality of rear alignment parts disposed at the rear end of the fixed rod part and interlocked with the stopper and the side alignment to correct the centering and the orientation of the glass substrate.
  • the process table provided in each of the centering part, the first cutting part, and the second cutting part is disposed at the outermost part of the plurality of fixed rod parts and the plurality of conveyor parts so as to be compatible with the specifications of the glass substrate seated on the upper surface of each process table.
  • Arranged fixed rod portion and the conveyor portion is installed to be able to fold and expand at right angles to each longitudinal direction.
  • the glass substrate cutting system of the present invention provides the following advantages.
  • the process of cutting both sides of the glass substrate through the first cutting portion and the first breaking portion, the process of rotating 90 ° through the rotating portion, and the other side of the glass substrate is cut through the second cutting portion and the second breaking portion It is possible to remarkably reduce the tack time by dividing each process into a continuous line.
  • the fixed rod portion and the conveyor portion disposed at the outermost of the plurality of fixed rod portion and the plurality of the conveyor portion provided on the process table are installed to be folded and extended at right angles to the respective longitudinal directions of the process table.
  • the pair of laser irradiation unit, the process of moving forward and backward along the pair of guide table and the process of moving a predetermined distance in the left and right directions perpendicular to the front and rear directions of the longitudinal direction of the guide table The cantilever structure is independently connected to each laser oscillation unit so as to be able to operate independently, so that the pair of laser irradiation units are mounted on the process table of the first and second cutting units in association with the interpolated control signals of the external interpolation controller.
  • One side or both sides of the glass substrate has the advantage that can be precisely cut processing in the micro unit by the desired width.
  • FIG. 1 and 2 is a schematic diagram showing the overall configuration of a glass substrate cutting processing system using a laser according to the present invention
  • Figure 3 is a schematic diagram showing a process of centering the glass substrate in the centering portion in accordance with the specifications of the glass substrate processed by the present invention
  • 4 and 5 are schematic diagrams showing a process of cutting the cutting schedule line through the interpolation control in the first cutting unit and the second cutting unit based on the position data measured from the camera provided in the second braking unit of the present invention
  • FIG. 6 is a perspective view showing an extract of a part of the present invention.
  • FIG. 7 is another perspective view showing a part of the configuration of the present invention.
  • FIG. 8 is a perspective view showing an extract of the process table disposed in the centering portion of the present invention.
  • FIG. 9 is a flowchart illustrating a process of operating a glass substrate cutting processing system using a laser according to the present invention.
  • FIG. 10 is a flowchart illustrating a process of operating a process table by position data measured by a camera of a centering unit according to the present invention
  • FIG. 11 is a flowchart illustrating a process of operating each laser irradiation unit based on the position data measured by the camera of the second breaking unit according to the present invention.
  • FIG. 1 and 2 is a schematic diagram showing the overall configuration of a glass substrate cutting processing system using a laser according to the present invention.
  • the part shown in FIG. 1 and the part shown in FIG. 2 are connected to constitute an entire glass substrate cutting processing system.
  • the rectangular glass substrate (G) is a centering portion (100) for correcting the constant direction before moving in the seated state;
  • a first cutting part 200 capable of irradiating a laser by correcting a cutting schedule line in real time so as to correspond to an angle at which the rectangular glass substrate G is twisted with respect to the feeding direction of (G);
  • a first breaking part 300 which physically cuts and detaches one side portion or both side edge portions of the glass substrate G sequentially moved straight after being irradiated by the laser from the first cutting portion 200;
  • a rotating part 400 which is rotated by 90 ° to cut the other side of the glass substrate G sequentially straight transferred through the first breaking part 300;
  • Reference numeral G3 of Figs. 1 and 2 denotes a cut piece in which a predetermined portion of both side edges of the glass substrate is cut from the first and second breaking parts.
  • Figure 3 is a schematic diagram showing the process of centering the glass substrate in the centering portion in accordance with the specifications of the glass substrate processed by the present invention, the position of the standard and constant orientation of the glass substrate (G) seated on the centering portion 100
  • a plurality of cameras 500 are disposed at a predetermined position on the upper portion of the centering unit 100.
  • the plurality of cameras 500 disposed in the centering unit 100 are fixedly positioned at a predetermined position, and photograph each side and each corner of a relatively large glass substrate G1 and a relatively small glass substrate G2 interchangeably. It is divided into being arranged to move a certain distance so that it can be measured.
  • the camera 500 is also provided at both ends of the center reference line L, which is commonly used as a reference to the glass substrate G located in the centering part 100, so that the position data of the glass substrate G, that is, the X and Y coordinate axes Provide a reference value.
  • the measured position data of the glass substrate G that is, the X and Y coordinate values are transmitted to an external interpolation control device in real time.
  • FIGS. 4 and 5 are schematic diagrams illustrating a process of cutting a cutting schedule line through interpolation control in the first and second cutting units based on position data measured from a camera provided in the second breaking unit of the present invention.
  • Four edges of the second breaking portion 300 'with the edges of the glass substrate (G) seated in a state in which cutting is cut, the angle and the parallelism of each side of the second braking portion 300' A plurality of cameras 500 'are arranged at an upper predetermined position, and the laser beams of the first and second cutting parts 200 and 200' are radiated based on the position data measured by the cameras 500 '.
  • Each cut schedule line is configured to be corrected in real time.
  • FIG. 5 is an analysis result parallelism, ie, a glass substrate, based on the position data of the glass substrate G measured from the plurality of cameras 500 'provided in the second braking unit 300'.
  • a pair of laser irradiation units 250 and 250 'provided in the first and second cutting units 200 and 200' are respectively integrated with the laser oscillating unit by the interpolation of the control signal. While moving along the tables 230 and 230 ′, they are gradually moved in a direction perpendicular to the direction of travel of the laser oscillator and obliquely at an angle with respect to the center reference line L.
  • the post-correction cutting schedule line L2 formed while moving in conjunction with the interpolated control signal for the pre-calibration cutting schedule line L1 formed while moving in conjunction with the original control signal parallel to the center reference line L in the center is It is corrected by a certain tilt angle.
  • the glass substrate G can be cut and processed more precisely than before by the movement of the laser irradiation units 250 and 250 ′ which are calibrated in real time.
  • FIG. 6 is a perspective view showing some components of the present invention
  • FIG. 7 shows another perspective view showing some components of the present invention.
  • each of the first cutting part 200 and the second cutting part 200 ′ may include: base plates 210 and 210 ′ mounted on a bottom surface thereof; Process tables 220 and 220 'disposed on the upper surfaces of the base plates 210 and 210' to move the glass substrate G straight in a predetermined direction; A pair of guide tables 230 and 230 'installed side by side on an upper surface of both ends of the base plates 210 and 210'; A pair of laser oscillators 240 and 240 'for oscillating the laser to process the glass substrate G located on the upper surface of the process table 220 and 220' while moving forward and backward along the pair of guide tables 230 and 230 '.
  • a pair of laser irradiators 250 and 250 ' which are conveyed along the pair of guide tables 230 and 230' integrally with the laser oscillators 240 and 240 'and irradiate the glass substrate G with the laser oscillated from the laser oscillators 240 and 240'. It is configured to include.
  • the rotating unit 400 serves to rotate 90 ° in order to cut the other side of the glass substrate G which is sequentially straight forwarded through the first breaking part 300.
  • the rotating unit 400 includes a base plate, a turntable 410 installed on the base plate, and a flat plate grid 420 seated on the turntable 410 and rotated by 90 °, and the turntable 410.
  • the glass substrate G is seated on the upper portion of the plate grid 420 rotated by the rotation of and rotates integrally.
  • the pair of laser irradiation units 250 and 250 ′ move forward and backward along the pair of guide tables 230 and 230 ′ and simultaneously independently of the guide tables 230 and 230 ′. It is installed to be movable a certain distance in the left and right directions perpendicular to the front and rear directions in the longitudinal direction.
  • the pair of laser irradiation units 250 and 250 ′ moves forward and backward along the pair of guide tables 230 and 230 ′ and is perpendicular to the front and rear directions of the guide tables 230 and 230 ′.
  • the process of moving a predetermined distance in the left and right directions is connected to the cantilever structure independently from each of the laser oscillators 240 and 240 'so as to operate independently.
  • the pair of laser irradiation units 250 and 250 ′ is mounted on the process tables 220 and 220 ′ of the first and second cutting units 200 and 200 ′ in association with the interpolated control signals of the external interpolation control apparatus.
  • One side or both sides of G) can be precisely cut in micro units by the desired width.
  • the laser irradiation units 250 and 250 ' move along the guide table integrally with the laser oscillating units 240 and 240' and move at right angles to the traveling direction of the laser oscillating units 240 and 240 'while irradiating laser beams to both sides of the glass substrate. Form the cut line.
  • the widths of the edge cut pieces of both sides cut from the glass substrate G may be different from each other.
  • the laser irradiator 250 or 250 ′ includes an initial cracker for providing an initial crack to the glass substrate G; A reflector for guiding the laser beam oscillated from the laser oscillators 240 and 240 '; A shopping lens unit for condensing the laser beam transmitted from the reflecting means; A quenching nozzle unit for injecting cooling mist along a laser beam irradiated from the shopping lens; And an air suction unit for sucking dust generated from the cooling mist sprayed from the quenching nozzle unit and the initial crack of the glass substrate (G).
  • the quenching nozzles in the laser irradiation units 250 and 250' may be formed along the upper surface of both sides of the glass substrate rapidly heated by the laser beam. Spray a cooling mist with a temperature significantly lower than the heating temperature.
  • the laser oscillators 240 and 240 ' are installed on the upper portion of the pair of guide tables 230 and 230' so as to be movable forward and backward along the longitudinal direction of the guide tables 230 and 230 ', and the laser source unit which oscillates the laser. And a power supply unit for driving the laser source unit.
  • each of the process tables 220 and 220 ′ disposed in the first cutting unit 200 and the second cutting unit 200 ′ has a length direction of the guide tables 230 and 230 ′.
  • a plurality of fixed rod parts 221 and 221 ' disposed on an upper surface of the base plates 210 and 210' side by side;
  • a plurality of conveyors are arranged in parallel with each of the fixed rods 221, 221 'alternately with the plurality of fixed rods 221, 221', and are installed to be capable of height adjustment up and down with respect to the height of the fixed rods 221,221 '. It comprises a portion (222,222 ').
  • FIG. 8 is a perspective view showing an extract of the process table disposed in the centering portion of the present invention, the centering portion 100, the base plate seated on the bottom surface; And a process table 120 disposed on an upper surface of the base plate to move the glass substrate G straight to the first cutting part 200.
  • the process table 120 includes a glass substrate G.
  • a plurality of fixing rods 121 and the plurality of fixing rods 121 disposed on the upper surface of the base plate along the conveying direction of the alternating arrangement is arranged in parallel to each of the fixing rods 121 and fixed rod portion 121 Consists of a plurality of conveyor portion 122 is installed so that the height can be adjusted up and down with respect to the height.
  • the process table 120 disposed in the centering part 100 may be disposed at the front end of the fixed rod part 121 and disposed at the front end of the glass substrate G seated on the fixed rod part 121.
  • a plurality of rear alignment parts 125 disposed at the rear end of the fixed rod part 121 and interlocking with the stopper 123 and the side alignment part 124 to correct the centering and the orientation of the glass substrate G; It is composed.
  • reference numeral 126 denotes a guide rod 126 that guides when the fixed rod 121 and the conveyor 122 disposed at the outermost portion of the process table 120 are folded or extended.
  • the process tables 120, 220, and 220 ′ provided in the centering unit 100, the first cutting unit 200, and the second cutting unit 200 ′ are each of the process tables 120, 220, and 220 ′.
  • the rod parts 121, 221, 221 ′ and the conveyor parts 121, 222, 222 ′ are installed to be able to be folded and extended at right angles to the respective longitudinal directions.
  • FIG. 9 is a flowchart illustrating a process of operating a glass substrate cutting processing system using a laser according to the present invention.
  • the process of cutting a glass substrate in detail is as follows.
  • the glass substrate before processing is input to the process table of the centering portion and seated.
  • a plurality of cameras disposed at an upper predetermined position of the centering unit measures position data such as parallelism with respect to each side of the glass substrate, right angle with each corner, and straightness with respect to the transfer direction with respect to a predetermined center reference line (S110). ).
  • the glass substrate sequentially moved straight through the centering part continues to move straight through the process table of the first cutting part.
  • the glass substrate is seated on the process table of the first cutting unit, and the laser irradiating unit provided in the first cutting unit continuously has a predetermined depth at a predetermined position at both edges of the glass substrate along the conveying direction of the glass substrate.
  • the cutting schedule line which is a crack is formed (S120).
  • the glass substrate sequentially moved straight through the first cutting part continues to move straight through the process table of the first breaking part.
  • the cutting device provided on both sides of the first breaking part is pressed and cut on both sides of the glass substrate based on the cutting schedule line generated by the laser irradiation part in the process of being seated on the process table of the first breaking part. Physically separated from the glass substrate body (S130).
  • the glass substrate sequentially transferred straight through the first breaking part is seated on the process table of the rotating part.
  • the glass substrate is seated on the plate grid provided on the upper surface of the rotating unit, and rotates by 90 ° using a turntable installed at the bottom of the plate grid in a state where the glass plate is seated on the plate grid (S140).
  • the glass substrate rotated by 90 ° by the rotation part is sequentially moved straight and is then placed on the process table of the second cutting part and continues to be transferred straight.
  • the second substrate is cut while the glass substrate is seated and transferred to the process table of the second cutting part.
  • the laser irradiation part provided in the portion is formed along the transfer direction of the glass substrate, the cutting scheduled line, which is a crack of a predetermined depth, is continuously formed at a predetermined position at both edges of the glass substrate (S150).
  • the glass substrate sequentially moved straight through the second cutting part continues to move straight through the process table of the second breaking part.
  • the cutting device provided on both sides of the second breaking part is pressed and cut on both sides of the glass substrate based on the cutting schedule line generated by the laser irradiation part in the process of being seated on the process table of the second breaking part. Physically separate from the glass substrate body (S160).
  • the glass substrate after the cutting process is output to the outside through the buffer means buffer (S170).
  • FIG. 10 is a flowchart illustrating a process of operating a process table by position data measured by a camera of a centering unit according to the present invention, and interworking with an external interpolation control apparatus based on position data of a glass substrate measured by a centering unit. The process is described in detail as follows.
  • the parallelism of each side of the glass substrate, the perpendicularity to each corner Measure position data such as straightness in the feed direction.
  • the position data of the glass substrate thus measured is transmitted to an external interpolation control device (S210).
  • the measured position data of the glass substrate is analyzed by the interpolation controller, and the interpolation controller analyzes the values thus analyzed, that is, the X and Y coordinate values, so that the slope of each side of the glass substrate with respect to the predetermined center reference line, A linear equation corresponding to an error such as an angle is derived.
  • the interpolated control signal is generated with respect to the predetermined original control signal through the linear equation derived as described above (S220).
  • Each process table disposed in the centering unit, the first and second cutting units, and the first and second braking units performs a corrected operation in conjunction with the interpolated control signals through the control signals generated by the interpolation control apparatus (S230). ).
  • each process table executes a corrected operation in conjunction with the interpolated control signals of the interpolation control apparatus.
  • the fixed rod part and the conveyor part disposed at the outermost sides of the plurality of fixed rod parts and the plurality of conveyor parts arranged on each process table execute folding or expanding in a direction perpendicular to the longitudinal direction (S240).
  • the fixed rod part and the conveyor part extend in a direction perpendicular to the longitudinal direction.
  • the glass substrate before processing placed on the centering part is relatively small.
  • the fixed rod portion and the conveyor portion is to perform folding in a direction perpendicular to the longitudinal direction.
  • the edge of the glass substrate is supported by the support shaft with the fixed rod part and the conveyor part disposed at the outermost part. It can be pressurized.
  • the stopper, the side alignment unit, and the rear alignment unit provided in the process table of the centering unit operate in cooperation with each other according to the interpolated control signal of the interpolation controller (S250).
  • the stopper provided at the front end of the process table of the centering part and in close contact with the front end of the glass substrate seated on the process table temporarily stops the progress of the glass substrate.
  • the glass substrate is centered according to the interpolated control signal of the interpolation controller.
  • FIG. 11 is a flowchart illustrating a process of operating each laser irradiator based on position data measured by a camera of a second braking unit according to the present invention, and an external interpolation control apparatus based on position data measured by the second braking unit. The following describes the interworking process with.
  • a plurality of cameras disposed on the second breaking part with respect to the glass substrate that has been cut in the second breaking part has a parallelism with respect to each side of the glass substrate, a right angle with respect to each corner, and a transfer with respect to a predetermined center reference line. Measure position data such as straightness in the direction. The position data of the glass substrate thus measured is transmitted to an external interpolation control device (S310).
  • the measured position data of the glass substrate is analyzed through the interpolation control device, and the interpolation control device analyzes the values thus analyzed, that is, the X and Y coordinate values, and the slope and angle of each side of the glass substrate with respect to the predetermined center reference line.
  • the linear equation corresponding to the error of the angle, etc. is derived.
  • the interpolated control signal is generated with respect to the predetermined original control signal through the linear equation derived as described above (S320).
  • the interpolation control apparatus commands the laser irradiation units of the first and second cutting units to perform a corrected operation in accordance with the interpolated control signals through the control signals generated by the interpolation control apparatus (S330).
  • each laser irradiation part disposed in the first and second cutting parts and connected in a cantilever structure to the laser oscillation part moves in the same direction as the traveling direction of the glass substrate integrally with the laser oscillation part and is perpendicular to the moving direction of the laser oscillation part. It moves (S340).
  • the pair of the laser irradiation unit, the process of moving in the front and rear directions along the pair of guide table and the process of moving a predetermined distance in the left and right directions perpendicular to the front and rear directions in the longitudinal direction of the guide table It is connected to the cantilever structure independently from each laser oscillation portion so as to be operable independently.
  • the pair of laser irradiation units are precisely measured in micro units by the desired width of one side or both sides of the glass substrate which is mounted and moved to the process table of the first and second cutting units in association with the interpolated control signals of the external interpolation controller. It can be cut and processed.
  • the movement of the pair of laser irradiation units interlocked with the interpolated control signals from the interpolation control device may be performed even when an error in the movement distance is generated even though the laser irradiation units are minutely moved in the same direction as the laser oscillation unit.
  • the error is precisely corrected by the interpolated control signal of the external interpolation controller.
  • the pair of laser irradiators connected in a cantilever structure to the laser oscillator independently corrects the width of the distance moving at right angles to the moving direction of the laser oscillator in real time by interpolated control signals of the external interpolation controller.
  • the laser beam is irradiated from each laser irradiator so as to correspond to more precise parallelism, perpendicularity, and straightness of the glass substrate.
  • a pair of laser irradiation units are disposed on both sides of the process table of each of the first and second cutting units, and the pair of laser irradiation units are independently connected to each of the laser oscillating units and move.
  • the distance moving at right angles to the moving direction of the laser oscillator may vary depending on the interpolated control signal of the interpolation control apparatus.
  • This phenomenon is more pronounced when the squareness corresponding to each edge of the glass substrate is not symmetric with each other before being processed.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

La présente invention porte sur un système de coupe de substrat en verre utilisant un laser. En détail, le système de coupe de substrat en verre utilisant un laser peut corriger une ligne de coupe irradiée avec un faisceau laser sur un substrat en verre transféré logé sur une table de traitement en temps réel afin de traiter avec précision le substrat en verre. L'invention porte également sur un procédé de coupe de deux parties latérales du substrat en verre, sur un procédé de rotation du substrat en verre à un angle d'environ 90 degrés, et sur un procédé de coupe de toutes les autres parties latérales du substrat en verre, qui peut être effectué sur une ligne continue de façon à réduire significativement un temps de saisie. De plus, la partie de tige de fixation située le plus à l'extérieur et la partie de transporteur d'une pluralité de parties de tige de fixation et de parties de transporteur peuvent être pliées et étendues perpendiculairement par rapport à une direction de la longueur afin de couper de façon compatible le substrat en verre logé sur une surface supérieure de la table de traitement en taille.
PCT/KR2011/004388 2010-07-06 2011-06-15 Système de coupe de substrat en verre utilisant un laser Ceased WO2012005454A2 (fr)

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US11105985B2 (en) 2020-01-31 2021-08-31 Corning Research & Development Corporation Lens-based connector assemblies having precision alignment features and methods for fabricating the same
US11249257B2 (en) 2020-01-31 2022-02-15 Corning Research & Development Corporation Ferrule assemblies having a lens array
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CN117228945A (zh) * 2023-11-15 2023-12-15 成都新世佳特种玻璃技术开发有限公司 一种特种玻璃生产用切割装置及分切工艺
CN117285241A (zh) * 2023-11-24 2023-12-26 苏州优备精密智能装备股份有限公司 对位机构和切割设备
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JP5057088B2 (ja) 2008-07-29 2012-10-24 オムロン株式会社 ガラス板の切断方法、及びガラス板切断用テーブル装置

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CN109704557A (zh) * 2019-02-21 2019-05-03 北京航天控制仪器研究所 一种高精度石英玻璃激光切割定位方法
CN109704557B (zh) * 2019-02-21 2022-03-04 北京航天控制仪器研究所 一种高精度石英玻璃激光切割定位方法
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CN114985957B (zh) * 2022-04-14 2024-03-26 武汉华工激光工程有限责任公司 膜片激光切割方法以及自动灌装封膜生产线
CN117228945A (zh) * 2023-11-15 2023-12-15 成都新世佳特种玻璃技术开发有限公司 一种特种玻璃生产用切割装置及分切工艺
CN117228945B (zh) * 2023-11-15 2024-01-23 成都新世佳特种玻璃技术开发有限公司 一种特种玻璃生产用切割装置及分切工艺
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KR101009454B1 (ko) 2011-01-19

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