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WO2012093895A3 - 수지 조성물, 이를 이용한 프리프레그 및 프린트 배선판 - Google Patents

수지 조성물, 이를 이용한 프리프레그 및 프린트 배선판 Download PDF

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Publication number
WO2012093895A3
WO2012093895A3 PCT/KR2012/000166 KR2012000166W WO2012093895A3 WO 2012093895 A3 WO2012093895 A3 WO 2012093895A3 KR 2012000166 W KR2012000166 W KR 2012000166W WO 2012093895 A3 WO2012093895 A3 WO 2012093895A3
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WO
WIPO (PCT)
Prior art keywords
resin composition
wiring board
printed wiring
prepreg
inorganic filler
Prior art date
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Ceased
Application number
PCT/KR2012/000166
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English (en)
French (fr)
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WO2012093895A2 (ko
Inventor
한승진
나재익
조경운
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Doosan Corp
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Doosan Corp
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Publication of WO2012093895A2 publication Critical patent/WO2012093895A2/ko
Publication of WO2012093895A3 publication Critical patent/WO2012093895A3/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)

Abstract

본 발명은 (a) 1분자 중에 적어도 2개 이상의 에폭시기를 갖는 에폭시 수지; (b) 경화제 및 경화촉진제로 구성된 군으로부터 선택된 1종 이상의 경화 성분; 및 (c) 무기 충전제를 포함하며, 상기 무기 충전제는 알루미나 및 질화붕소를 포함하되, 질화붕소의 함량이 알루미나 100 중량부 대비 5 내지 50 중량부 범위인 것이 특징인 프린트 배선판 형성용 수지 조성물, 상기 수지 조성물로부터 형성된 프리프레그 및 상기 프리프레그를 포함하는 프린트 배선판을 제공한다. 본 발명에서는 낮은 경도와 저열팽창율, 열전도성이 높은 질화붕소와 알루미나 무기 필러를 무기 충전제로 채택하여 사용하므로, 드릴 가공성, 열전도성이 우수하고 낮은 열팽창계수로 인해 반도체 패키지의 신뢰성을 향상시킬 수 있다.
PCT/KR2012/000166 2011-01-06 2012-01-06 수지 조성물, 이를 이용한 프리프레그 및 프린트 배선판 Ceased WO2012093895A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0001378 2011-01-06
KR1020110001378A KR101236642B1 (ko) 2011-01-06 2011-01-06 수지 조성물, 이를 이용한 프리프레그 및 프린트 배선판

Publications (2)

Publication Number Publication Date
WO2012093895A2 WO2012093895A2 (ko) 2012-07-12
WO2012093895A3 true WO2012093895A3 (ko) 2012-10-18

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PCT/KR2012/000166 Ceased WO2012093895A2 (ko) 2011-01-06 2012-01-06 수지 조성물, 이를 이용한 프리프레그 및 프린트 배선판

Country Status (2)

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KR (1) KR101236642B1 (ko)
WO (1) WO2012093895A2 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9434870B2 (en) 2012-09-19 2016-09-06 Momentive Performance Materials Inc. Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
US8946333B2 (en) 2012-09-19 2015-02-03 Momentive Performance Materials Inc. Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
US20140077125A1 (en) * 2012-09-19 2014-03-20 Kang Yi Lin Composition comprising exfoliated boron nitride and method for forming such compositions
KR101556658B1 (ko) 2013-11-26 2015-10-01 주식회사 두산 내열성 및 저유전 손실 특성을 가진 열경화성 수지 조성물, 이를 이용한 프리프레그, 및 동박적층판
CN103834168B (zh) 2014-02-25 2016-09-07 广东生益科技股份有限公司 一种无卤阻燃型树脂组合物
CN105778414B (zh) 2014-12-26 2018-05-29 广东生益科技股份有限公司 一种环氧树脂组合物以及使用它的预浸料和层压板
CN106916282B (zh) 2015-12-28 2019-07-26 广东生益科技股份有限公司 一种环氧树脂组合物以及使用其的预浸料和层压板
KR102057255B1 (ko) 2017-03-22 2019-12-18 주식회사 엘지화학 반도체 패키지용 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판
CN113527837A (zh) * 2020-04-17 2021-10-22 景旺电子科技(龙川)有限公司 一种低模量环氧树脂组合物及铝基板
CN115083660B (zh) * 2022-07-07 2025-06-20 深圳市百柔新材料技术有限公司 一种易磨高导热绝缘塞孔浆料、制备方法及其应用
CN118459936B (zh) * 2024-07-01 2025-10-28 上海道宜半导体材料有限公司 一种C-Mold工艺用环氧树脂模塑料及其制备方法和应用
CN119101325A (zh) * 2024-08-30 2024-12-10 华中科技大学 一种低热膨胀系数的环氧树脂复合材料、固化物及应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001348488A (ja) * 2000-06-06 2001-12-18 Matsushita Electric Works Ltd 熱伝導性樹脂組成物、プリプレグ、放熱性回路基板及び放熱性発熱部品
KR20080014654A (ko) * 2006-08-10 2008-02-14 내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션 열 전도성 재료
JP2010205498A (ja) * 2009-03-02 2010-09-16 Sekisui Chem Co Ltd 絶縁シート及び積層構造体
KR20100103942A (ko) * 2009-03-16 2010-09-29 (주)켐텍 에폭시 수지 조성물 및 이를 이용하여 제조된 프린트 배선판용 접착 필름

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001348488A (ja) * 2000-06-06 2001-12-18 Matsushita Electric Works Ltd 熱伝導性樹脂組成物、プリプレグ、放熱性回路基板及び放熱性発熱部品
KR20080014654A (ko) * 2006-08-10 2008-02-14 내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션 열 전도성 재료
JP2010205498A (ja) * 2009-03-02 2010-09-16 Sekisui Chem Co Ltd 絶縁シート及び積層構造体
KR20100103942A (ko) * 2009-03-16 2010-09-29 (주)켐텍 에폭시 수지 조성물 및 이를 이용하여 제조된 프린트 배선판용 접착 필름

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Publication number Publication date
KR101236642B1 (ko) 2013-02-22
KR20120079986A (ko) 2012-07-16
WO2012093895A2 (ko) 2012-07-12

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