WO2011140940A1 - Led encapsulation structure with simple structure - Google Patents

Abstract

A light emitting diode(LED) encapsulation structure with simple structure relates to the technology of LED encapsulation, and comprises a substrate(1) and an insulating layer(2), wherein a plurality of installation areas(3) and a plurality of through holes(4) are formed on the substrate(1). The insulating layer(2) is formed at a time in the way that plastic cement is covered on the substrate(1) except for the installation areas(3) and poured into all the through holes(4) in the mode of injection molding, and meanwhile, pit-shaped installation grooves(5) with the functions of installation and light reflection are formed on the substrate(1), with the installation areas(3) as the bottom surfaces of the installation grooves(5); installation bases(6) and electrode points(7) are arranged on installation areas(3), namely the bottom surfaces of the installation grooves(5); LED luminescence chips(8) are mounted on the installation bases(6); buckles(9) with the function of clamping and connecting are arranged at the openings of the installation grooves(5); and light transmitting bodies(10) arranged on the installation grooves(5) are connected with the installation grooves(5) in a clamping manner through the buckles(9). The LED encapsulation structure has the benefits of simple encapsulation structure and encapsulation process, good effect, high production efficiency, suitability for large-scale production and very reliable product quality.

Description

 A simple structure of LED package structure

 The utility model relates to an LED packaging technology, in particular to a simple LED packaging structure. Background technique

 In recent years, with the decline of manufacturing costs and the breakthrough of technical bottlenecks such as luminous efficiency and light decay, China's LED lighting industry has entered an accelerated development stage, and the application market has grown rapidly, which has led to a huge market for LED packaging products. Become the first largest producer of LED packaging in the world.

There are many kinds of conventional LED packages. The patent application No. 2006 1 0 1 4209 1 . 8 proposes an LED package structure comprising: a double-layer substrate, at least one chip, at least two connecting wires, and the above The at least one chip and the at least two connecting wires are coated on the glue of the double-layer substrate, wherein the double-layer substrate is mainly provided with a conductive pattern on an insulating substrate, and a layer of a spacer is coated on the top surface, and is coated. When the adhesive is separated, a bonding area and a plurality of electrode areas are reserved on the top surface, and the chip is combined in the bonding area, and the chip is connected to the conductive pattern through the two connecting wires, and then sealed by the colloid in the bonding area to complete LED package. However, this traditional LED packaging method, although smaller than the previous bracket type LED package structure, still has a certain volume, and in the modern and ever-changing technology, each electronic product is marked. Light, thin, short, and small, so this traditional LED package structure has not met the needs of modern products; The LED chip wastes the light emitted from the side of the LED chip and cannot be effectively utilized.

 The application number is 200680018945. The patent of X further proposes a substrate for LED and

LED package: A substrate for LED, characterized in that an insulating layer through which an LED mounting hole is formed is bonded to a flat surface of a heat radiating portion, and a wiring portion constituting a wiring pattern is provided on the insulating layer. The LED chip is packaged in the heat sink portion in the LED mounting hole of the LED substrate 1, and the LED chip is electrically connected to the wiring portion. Although the LED package structure improves the light-emitting efficiency of the LED chip, and the substrate for the LED also effectively solves the problem of rapid heat dissipation of the heat generated when the LED chip emits light, the substrate structure for the LED is complicated. The production process is cumbersome and is not suitable for mass production, which makes it difficult to increase production efficiency. Utility model content

 The technical problem to be solved by the present invention is to overcome the above-mentioned deficiencies of the prior art, and to provide a simple LED package structure, which is suitable for mass production and can improve production efficiency, and the production process is mature and reliable.

The utility model relates to a simple LED package structure, which comprises a substrate and an insulating layer, and a plurality of mounting areas are arranged on the substrate: a plurality of through holes are formed on the substrate, and the insulating layer is formed by injection molding to avoid the substrate. A plurality of the mounting areas cover the plastic on the substrate and are simultaneously poured into each of the through holes. When the insulating layer is injection molded, each of the mounting areas on the substrate is formed as a bottom surface of the groove. a pit-shaped mounting groove; a mounting seat and an electrode point are arranged on the mounting area, that is, the bottom surface of the groove of the mounting groove, and an LED light-emitting chip is mounted on the mounting seat, and the mounting seat is electrically connected with the electrode point, the electrode point and the corresponding circuit Electrically connecting; a sidewall of the mounting groove forms a reflective surface that reflects light emitted by the LED light emitting chip, The light emitted by the LED light-emitting chip is fully utilized; the slot of the mounting slot is provided with a snap-fit function, and the light-transmitting body disposed on the mounting slot is engaged with the mounting slot by the buckle . In fact, the mounting slot has both an installation function and a reflective function.

 Further elaborate on the above technical solutions:

 The buckle is integrally formed with the insulating layer by injection molding.

 The buckle is a convex edge extending outward of the notch of the mounting groove.

 The light transmitting body has a sheet shape, and a surface of the LED light emitting chip is coated with a phosphor layer.

 The substrate is a printed circuit board, either a single layer or a double layer, or a metal substrate or a non-metal substrate.

 The material of the insulating layer can be a general plastic type, such as PMMA, ΡΡΑ, PBI, ABS, and the like.

 The material of the light transmissive body may be glass or a transparent plastic such as PMMA, PC, PS, or the like.

 Compared with the prior art, the utility model has the following beneficial effects:

 Firstly, the utility model covers the plastic on the substrate and the insulating through hole by means of injection molding, so that the insulating layer, the mounting groove, the reflective side wall of the mounting groove and the buckle on the notch of the mounting groove are integrally formed. , greatly simplifies the LED package structure, is suitable for mass production, and is more conducive to improving production efficiency.

 Secondly, through the simultaneous infusion of the insulating layer in the through hole on the substrate, the insulating layer and the substrate are firmly fixed, and the structural process is simple and the effect is good.

Third, the injection molding process is now very mature, making the product quality very guilty. Fourthly, the utility model replaces the traditional LED package, not only on the basis of the traditional LED package, but also more effectively and greatly reduces the volume of the LED. Since the LED chip is directly packaged on the substrate, if it is a high heat dissipation type substrate, it can also be effective. Improve the efficiency of heat dissipation.

 Fifthly, the light transmissive body of the utility model adopts a glass or light transmissive plastic plus phosphor coating structure, instead of the traditional resin plus phosphor filling structure, the manufacturing process is simple, the cost is low, and the method is effective. It accelerates the emission of heat when the LED chip emits light, and reduces the speed of the phosphor due to direct high temperature aging. DRAWINGS

 Fig. 1 is a cross-sectional view showing a substrate for an LED of the present invention.

 Fig. 2 is a cross-sectional view showing a substrate for LED and an LED package of the present invention.

 3 is a cross-sectional view of a plurality of LED light emitting chip packages of the present invention.

 4 is a cross-sectional view showing a curved surface of the light transmitting body of the present invention.

 In the figure: 1. Substrate; 2. Insulation layer; 3. Installation area: 4. Through hole, 5. Installation groove;

6, the mount; 7, the electrode point; 8, LED light-emitting chip; 9, buckle; 10, light-transmitting body;

11, the phosphor layer. detailed description

As shown in FIG. 1 , FIG. 2 , FIG. 3 and FIG. 4 , the present invention has a simple LED package structure, comprising a substrate 1 and an insulating layer 2 , and a plurality of mounting regions 3 are disposed on the substrate 1 : on the substrate 1 A plurality of through holes 4 are formed, and the insulating layer 2 is coated on the substrate 1 and simultaneously poured into the plurality of through holes 4 by means of injection molding to avoid each of the mounting areas 3 on the substrate 1. Formed, at the same time as the injection molding of the insulating layer 2, each of the mounting areas 3 on the substrate 1 is a grooved bottom surface forming a sinking-shaped mounting groove 5; in the mounting area 3 The mounting base 6 and the electrode point 7 are disposed on the bottom surface of the slot of the mounting slot 5. The LED light emitting chip 8 is mounted on the mounting base 6, and the mounting base 6 is electrically connected to the electrode point 7, and the electrode point 7 is electrically connected to the corresponding circuit; The side wall of the mounting groove 5 forms a reflective surface that reflects the light emitted by the LED light-emitting chip 8; the slot of the mounting groove 5 is provided with a buckle 9 having a snap-fit function, and the buckle 9 is disposed in the mounting slot The light transmitting body 10 on the fifth surface is engaged with the mounting groove 5. In fact, the mounting groove 5 has both an installation function and a reflective function.

 The buckle 9 is integrally molded with the insulating layer 2 by injection molding.

 The buckle 9 is a convex edge extending outward from the notch of the mounting groove 5.

 The light transmitting body 10 has a sheet shape, and a surface of the LED light emitting chip 8 is coated with a phosphor layer 11. The sheet-like light-transmissive body 10 can be formed into a flat shape (as shown in Fig. 2) or a curved surface (as shown in Fig. 4).

 The substrate 1 is a printed circuit board, either a single layer or a double layer, or a metal substrate or a non-metal substrate.

 The material of the insulating layer 2 may be a general plastic such as PMMA, PPA, PBI, ABS, or the like.

 The material of the transparent body 10 may be glass or a transparent plastic such as plastic.

PMMA, PC, PS, etc.

In the manufacturing and packaging of the utility model, the substrate 1 is first prepared, the through hole 4 is opened thereon, the mounting area 3 is set, and the insulating layer 2 is formed on the substrate 1 by injection molding, and the through hole 4 is poured and once The mounting groove 5 having the reflective function and the mounting function and the buckle 9 thereon are formed, and then the LED light-emitting chip 8 is mounted, and the light-transmitting body 10 is attached to the cover. On one mounting area 3, an LED light can be installed. The chip 8 (shown in FIG. 2) can also be mounted with two or more LED light-emitting chips 8 (as shown in FIG. 3), and the package structure and packaging process are simple. The specific embodiments of the present invention have been described in detail above. It is understood that the embodiments of the invention are not limited to the embodiments, and the description of the embodiments is only intended to aid the understanding of the spirit of the invention. Various modifications of the invention are intended to be included within the scope of the invention. The patentable scope of the invention is defined by the appended claims.

Claims

Claim 1. A simple LED package structure comprising a substrate (1) and an insulating layer (2), and a plurality of mounting regions (3) are disposed on the substrate (1): the substrate (1) is opened a plurality of through holes (4), the insulating layer (2) is formed by means of injection molding to avoid each of the mounting areas (3) on the substrate (1), covering the substrate (1) with plastic and simultaneously pouring One of the through holes (4) is formed at one time, and at the same time as the injection molding of the insulating layer (2), each of the mounting areas (3) on the substrate (1) is formed into a sinker shape with a groove bottom surface. Mounting groove (5) for function and reflective function; mounting seat (6) and electrode point (7) on the bottom surface of the mounting area (3), that is, the mounting groove (5), the mounting seat (6) The LED light-emitting chip (8) is mounted thereon, the mounting seat (6) is electrically connected to the electrode point (7), and the electrode point (7) is electrically connected to the corresponding circuit; the side wall of the mounting groove (5) Forming a reflective surface reflecting the light emitted by the LED light-emitting chip (8); the slot of the mounting groove (5) is provided with a snap-fit function (9) through which the buckle (9) is to be mounted The light transmitting body (10) on the groove (5) is engaged with the mounting groove (5).  2. A simple LED package structure according to claim 1, characterized in that: the buckle (9) is integrally formed by injection molding and the insulating layer (2).  3. A simple LED package structure according to claim 1, wherein: the buckle (9) is a convex edge extending outwardly from a notch of the mounting groove (5).  4. A simple LED package structure according to claim 1, wherein: said light transmissive body (10) is in the form of a sheet, and the surface of the LED light emitting chip (8) is coated with fluorescence. Powder layer (11).