WO2011086627A1 - Film de polyimide et son procédé de production - Google Patents
Film de polyimide et son procédé de production Download PDFInfo
- Publication number
- WO2011086627A1 WO2011086627A1 PCT/JP2010/006726 JP2010006726W WO2011086627A1 WO 2011086627 A1 WO2011086627 A1 WO 2011086627A1 JP 2010006726 W JP2010006726 W JP 2010006726W WO 2011086627 A1 WO2011086627 A1 WO 2011086627A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film
- bis
- polyamic acid
- polyimide film
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- UHOVQNZJYSORNB-UHFFFAOYSA-N c1ccccc1 Chemical compound c1ccccc1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1021—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the catalyst used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Definitions
- the linear expansion coefficient and dimensional stability of the resulting film tend to be improved.
- imidization proceeds too quickly with a large amount of imidizing agent, it becomes insoluble before filming, which causes problems such as inability to cast.
- a method of casting or coating on an endless belt, or a method of casting or coating on a substrate having a predetermined size can be employed.
- cooling after firing it is preferable to cool by providing a step of continuously cooling or holding the film in an atmosphere lower than at least one maximum firing temperature.
- Example 3 A gel film was prepared in the same manner as in Example 1. Heat drying was performed at 150 ° C. for 4 minutes, 200 ° C. for 5 minutes, 250 ° C. for 3 minutes, 300 ° C. for 2 minutes 30 seconds, and 380 ° C. for 2 minutes. Furthermore, after cooling at 260 ° C. for 60 seconds and at 130 ° C. for 60 seconds during cooling, the temperature was returned to room temperature to obtain a polyimide film 3.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
L'invention porte sur un procédé pour la production d'un film de polyimide transparent qui consiste à utiliser du dianhydride 3,3',4,4'-biphényltétracarboxylique et de la 2,2'-bis(trifluorométhyl)benzidine comme monomères et qui permet de produire un tel film qui présente une variation dimensionnelle réduite sous l'effet de la chaleur. Un film de polyimide qui présente une excellente stabilité dimensionnelle sous l'effet de la chaleur peut être obtenu par : mélange d'une solution de poly(acide amique) avec un agent d'imidation chimique pour préparer une couche de gel ; cuisson de la couche de gel à haute température ; puis refroidissement du film ainsi obtenu tout en abaissant progressivement la température du procédé de refroidissement.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-007232 | 2010-01-15 | ||
| JP2010007232 | 2010-01-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2011086627A1 true WO2011086627A1 (fr) | 2011-07-21 |
Family
ID=44303934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2010/006726 Ceased WO2011086627A1 (fr) | 2010-01-15 | 2010-11-17 | Film de polyimide et son procédé de production |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2011086627A1 (fr) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013105610A1 (fr) * | 2012-01-13 | 2013-07-18 | 宇部興産株式会社 | Composition de type solution de précurseur de polyimide et son procédé de production |
| US20210095083A1 (en) * | 2019-09-30 | 2021-04-01 | Sk Innovation Co., Ltd. | Polyimide Based Film and Display Device Comprising the Same |
| US20210115192A1 (en) * | 2018-06-28 | 2021-04-22 | Kaneka Corporation | Polyimide resin, production method for polyimide resin, polyimide film, and production method for polyimide film |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002355832A (ja) * | 2001-02-20 | 2002-12-10 | Central Glass Co Ltd | ポリイミド板状体の製造方法 |
| JP2006083207A (ja) * | 2004-09-14 | 2006-03-30 | Du Pont Toray Co Ltd | ポリイミドフィルム、その製造方法およびこれを基材とした金属配線板 |
| JP2007046054A (ja) * | 2005-08-03 | 2007-02-22 | E I Du Pont De Nemours & Co | 光学的応用分野において有用な低着色ポリイミド樹脂組成物ならびにそれに関連する方法および組成物 |
| JP2007063492A (ja) * | 2005-09-02 | 2007-03-15 | Kaneka Corp | 欠陥の少ないポリイミドフィルム |
| WO2009028862A1 (fr) * | 2007-08-27 | 2009-03-05 | Kolon Industries, Inc. | Film de polyimide |
| JP2010235789A (ja) * | 2009-03-31 | 2010-10-21 | Nippon Steel Chem Co Ltd | 白色ポリイミドの製造方法 |
| WO2010131442A1 (fr) * | 2009-05-12 | 2010-11-18 | 株式会社カネカ | Procédé pour la production d'une solution de l'acide polyamique et film de polyimide |
-
2010
- 2010-11-17 WO PCT/JP2010/006726 patent/WO2011086627A1/fr not_active Ceased
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002355832A (ja) * | 2001-02-20 | 2002-12-10 | Central Glass Co Ltd | ポリイミド板状体の製造方法 |
| JP2006083207A (ja) * | 2004-09-14 | 2006-03-30 | Du Pont Toray Co Ltd | ポリイミドフィルム、その製造方法およびこれを基材とした金属配線板 |
| JP2007046054A (ja) * | 2005-08-03 | 2007-02-22 | E I Du Pont De Nemours & Co | 光学的応用分野において有用な低着色ポリイミド樹脂組成物ならびにそれに関連する方法および組成物 |
| JP2007063492A (ja) * | 2005-09-02 | 2007-03-15 | Kaneka Corp | 欠陥の少ないポリイミドフィルム |
| WO2009028862A1 (fr) * | 2007-08-27 | 2009-03-05 | Kolon Industries, Inc. | Film de polyimide |
| JP2010235789A (ja) * | 2009-03-31 | 2010-10-21 | Nippon Steel Chem Co Ltd | 白色ポリイミドの製造方法 |
| WO2010131442A1 (fr) * | 2009-05-12 | 2010-11-18 | 株式会社カネカ | Procédé pour la production d'une solution de l'acide polyamique et film de polyimide |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013105610A1 (fr) * | 2012-01-13 | 2013-07-18 | 宇部興産株式会社 | Composition de type solution de précurseur de polyimide et son procédé de production |
| JP2013144752A (ja) * | 2012-01-13 | 2013-07-25 | Ube Industries Ltd | ポリイミド前駆体水溶液組成物、及びポリイミド前駆体水溶液組成物の製造方法 |
| CN104159975A (zh) * | 2012-01-13 | 2014-11-19 | 宇部兴产株式会社 | 水性聚酰亚胺前体溶液组合物及制备水性聚酰亚胺前体溶液组合物的方法 |
| US11407868B2 (en) | 2012-01-13 | 2022-08-09 | Ube Industries, Ltd. | Method for producing aqueous polyimide precursor solution composition |
| US20210115192A1 (en) * | 2018-06-28 | 2021-04-22 | Kaneka Corporation | Polyimide resin, production method for polyimide resin, polyimide film, and production method for polyimide film |
| US20210095083A1 (en) * | 2019-09-30 | 2021-04-01 | Sk Innovation Co., Ltd. | Polyimide Based Film and Display Device Comprising the Same |
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