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WO2011065796A2 - Procédé de préparation de verre anti-éblouissant - Google Patents

Procédé de préparation de verre anti-éblouissant Download PDF

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Publication number
WO2011065796A2
WO2011065796A2 PCT/KR2010/008505 KR2010008505W WO2011065796A2 WO 2011065796 A2 WO2011065796 A2 WO 2011065796A2 KR 2010008505 W KR2010008505 W KR 2010008505W WO 2011065796 A2 WO2011065796 A2 WO 2011065796A2
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WO
WIPO (PCT)
Prior art keywords
glass substrate
etching solution
coating layer
ceramic coating
surface roughness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/008505
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English (en)
Korean (ko)
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WO2011065796A3 (fr
Inventor
윤인수
정윤교
김태정
이용수
노동수
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MICO C&C Ltd
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MICO C&C Ltd
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Filing date
Publication date
Application filed by MICO C&C Ltd filed Critical MICO C&C Ltd
Publication of WO2011065796A2 publication Critical patent/WO2011065796A2/fr
Publication of WO2011065796A3 publication Critical patent/WO2011065796A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G02B1/113—Anti-reflection coatings using inorganic layer materials only
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2204/00—Glasses, glazes or enamels with special properties
    • C03C2204/08—Glass having a rough surface

Definitions

  • This invention relates to the antiglare glass manufacturing method. It is related with the antiglare glass manufacturing method for preventing the glare of a glass substrate.
  • glass substrates are glare due to reflection of light.
  • the surface of the glass substrate is treated in various ways to prevent glare of the glass substrate.
  • a surface roughness may be formed on the glass substrate by etching the surface of the glass substrate with an etching solution.
  • the surface roughness causes diffused reflection of light to prevent glare.
  • the present invention provides an antiglare glass manufacturing method in which a glass substrate can have a uniform surface roughness at low cost.
  • the anti-glare glass manufacturing method comprises the steps of forming a ceramic coating layer having a uniform thickness on the glass substrate, and peeling the ceramic coating layer from the glass substrate with a first etching solution to the first roughness on the surface of the glass substrate And forming a second surface roughness on the surface of the glass substrate by etching the surface of the glass substrate with a second etching solution.
  • the ceramic coating layer may be formed by a thermal spray coating process.
  • the particle size of the ceramic powder may be adjusted during the spray coating process.
  • the particle size of the ceramic powder may range from 20 to 30 ⁇ m.
  • the thickness of the ceramic coating layer may be in the range of 10 to 25 ⁇ m.
  • peeling of the ceramic coating layer may be performed by immersing the glass substrate on which the ceramic coating layer is formed in the first etching solution or spraying the first etching solution onto the glass substrate on which the ceramic coating layer is formed. have.
  • the first etching solution is made of a mixed solution of hydrofluoric acid, nitric acid and water, the weight percent ratio of the hydrofluoric acid, nitric acid and water ranges from 5 to 10: 10 to 30: 60 to 85 Can be.
  • the etching of the glass substrate may be performed by immersing the glass substrate having the first roughness in the second etching solution or spraying the second etching solution onto the glass substrate having the first roughness. Can be done.
  • the second etching solution is made of a mixed solution of hydrofluoric acid, hydrochloric acid, nitric acid and water, the weight percent ratio of the hydrofluoric acid, hydrochloric acid, nitric acid and water is 30 ⁇ 70: 10 ⁇ 20: 0.5 ⁇ 5: may range from 5 to 59.5.
  • the first surface roughness has a 10-point average roughness (Rz) value of 1 to 2 ⁇ m
  • the second surface roughness has a 10-point average roughness (Rz) value of 0.6 to 1.3. May be in the ⁇ m range.
  • a ceramic coating film formed by using a thermal spray coating process is etched to form a first roughness on the surface of the glass substrate, and a glass substrate having the first roughness is etched to form a second surface on the glass substrate surface. Roughness can be formed uniformly. Therefore, glare of the said glass substrate can be prevented.
  • the roughness formed on the surface of the glass substrate may be easily adjusted by adjusting the size of the ceramic powder during the spray coating process.
  • FIG. 1 is a flowchart illustrating a method for manufacturing anti-glare glass according to an embodiment of the present invention.
  • FIG. 2 to 6 are cross-sectional views illustrating a method of manufacturing the anti-glare glass shown in FIG. 1.
  • FIG. 7 is a flowchart illustrating a method for manufacturing anti-glare glass according to another embodiment of the present invention.
  • FIG. 8 and 9 are cross-sectional views illustrating a method of manufacturing the anti-glare glass shown in FIG. 7.
  • first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.
  • the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.
  • FIG. 1 is a flowchart illustrating a glass substrate processing method according to the present invention
  • Figures 2 to 6 are views for explaining the glass substrate processing method shown in FIG.
  • the plasma gun 10 includes a cathode 12, an anode 14, an outer circumferential portion 15, a support 16, and a powder injection hole 17.
  • the plasma gas is injected through the gas injection port 11 formed in the plasma gun 10.
  • the plasma gas may be an inert gas such as argon gas or helium gas, or an inert gas such as hydrogen gas or oxygen gas. These inert gases and inert gases may be used alone but may be used in combination.
  • the gas injection hole is formed between the outer circumferential portion 15 and the cathode 12 and finally extends to a narrow space between the anodes 14.
  • the plasma gas injected into the gas inlet is changed into a plasma flame by the high voltage DC high power applied between the cathode 12 and the anode 14, and is injected from the plasma gun 10.
  • the high voltage DC high power should have a sufficient value to change the plasma gas into a plasma flame and is generally applied under voltage conditions ranging from about 30 kV to about 100 kv and current conditions ranging from about 400 A to about 1000 A.
  • the end portion of the cathode 12 has a sharp shape in order to easily generate a plasma flame.
  • the end portion of the cathode 12 generally includes tungsten or tungsten-reinforced metal having physically strong strength and hardness to prevent damage such as erosion due to the generation of the plasma flame 18.
  • the anode 14 is generally formed using a conductive material such as copper or copper alloy.
  • a cooling passage 13 is formed inside the anode 14 and configured to discharge heat applied to the anode 14 through the cooling passage 13 to the outside. Since the cooling passage 13 is configured, thermal damage to the anode 14 can be minimized, and consequently, the life of the anode 14 can be extended.
  • the outer circumferential portion 15 is a portion located at the outer shell of the plasma gun 10, and a cathode 12 is positioned inside the plasma gun 10 to support the anode 14.
  • the outer circumferential portion 15 is also preferably made of a material that can minimize thermal damage due to the generation of plasma flame.
  • the support 16 is coupled to one side of the outer circumference and the powder inlet 17 is positioned on the support 16.
  • the ceramic powder may be provided to the plasma flame through the powder inlet 17.
  • the ceramic powder provided to the plasma flame through the powder inlet 17 is melted and sprayed toward the glass substrate 100 facing the plasma gun 10.
  • the sprayed ceramic powder 18 is bonded to the glass substrate 100 to form a ceramic coating layer 110 (step S110).
  • the ceramic coating layer 110 may be formed only on one surface of the glass substrate 100, but may be formed on both surfaces of the glass substrate 100 as necessary.
  • the plasma gun 10 forms the ceramic coating layer 110 while moving by a predetermined pitch in a direction parallel to the coating layer forming surface of the glass substrate 100.
  • a predetermined pitch exceeds about 5 mm, a portion in which the ceramic coating layer 110 is not formed may occur on the glass substrate 100.
  • the pitch is less than about 3mm, a portion where the ceramic coating layer 110 overlaps may occur. That is, the ceramic coating layer 110 is not formed to a uniform thickness. Therefore, in order to form the ceramic coating layer 110 having a uniform thickness, it is preferable to move the plasma gun 10 at a pitch of about 3 to 5 mm.
  • the speed of the ceramic powder sprayed from the plasma gun 10 is faster than about 18,000 cm / min, a portion in which the ceramic coating layer 110 is not formed on the glass substrate 100 may occur.
  • the speed of the ceramic powder sprayed from the plasma gun 10 is less than about 4,000 cm / min, a portion where the ceramic coating layer 110 overlaps may occur. That is, there is a possibility that the ceramic coating layer 110 is not formed to have a uniform thickness. Therefore, in order to form the ceramic coating layer 110 having a uniform thickness, it is preferable that the velocity of the ceramic powder sprayed from the plasma gun 10 is in the range of about 4,000 to 18,000 cm / min.
  • the distance between the plasma gun 10 and the glass substrate 100 is greater than about 50 cm, a portion in which the ceramic coating layer 110 is not formed on the glass substrate 100 may occur, and the plasma gun When the distance between the glass substrate 100 and the glass substrate 100 is closer than about 10 cm, a portion where the ceramic coating layer 110 overlaps may occur. That is, the thickness of the ceramic coating layer 110 may be uneven. In addition, when the distance between the plasma gun 10 and the glass substrate 100 is closer than about 10 cm, the glass substrate 100 may be damaged by thermal shock caused by the molten ceramic powder. Therefore, in order to form the ceramic coating layer 110 having a uniform thickness and to prevent the thermal shock, the distance between the plasma gun 10 and the glass substrate 100 may be in a range of about 10 to 50 cm. .
  • the ceramic powder may be used as powder, all nonmetallic inorganic solids capable of forming a coating layer.
  • the ceramic powder include Al 2 O 3 , Y 2 O 3 , ZrO 2 , AlC, TiN, AlN, TiC, MgO, CaO, CeO 2 , TiO 2 , BxCy, BN, SiO 2 , SiC, YAG (yttrium aluminum garnet), Mullite, AlF 3 and the like. These may be used alone or as mixtures or complexes thereof.
  • the size of the ceramic powder can be adjusted in various ways, preferably in the range of about 20 to 30 ⁇ m.
  • the ceramic coating layer 110 is formed by a spray coating process using the plasma gun 10 has a uniform thickness.
  • the ceramic coating layer 110 preferably has a thickness in the range of about 10 to 25 ⁇ m.
  • the ceramic coating layer 110 When the thickness of the ceramic coating layer 110 exceeds about 25 ⁇ m, the ceramic coating layer 110 may be peeled from the glass substrate 100. In particular, when the surface roughness of the glass substrate 100 is low, the ceramic coating layer 110 is likely to peel off from the glass substrate 100.
  • the thickness of the ceramic coating layer 110 is less than about 10 ⁇ m, it may be difficult to uniformly form the ceramic coating layer 110 on the glass substrate 100 because the thickness of the ceramic coating layer 110 is thin. In particular, when the surface roughness of the glass substrate 100 is low, the ceramic coating layer 110 may not be uniformly formed due to a decrease in surface adhesion between the ceramic coating layer 110 and the glass substrate 100.
  • the ceramic coating layer 110 does not have a uniform thickness, an etching rate difference with respect to the glass substrate 100 occurs in a thin portion and a thick portion of the ceramic coating layer 110 during an etching process described later. Accordingly, since the surface of the glass substrate 100 in the thin portion of the ceramic coating layer 110 is excessively etched, five acid heights and two acid heights within a predetermined length of the glass substrate 100 in which the ceramic coating layer 110 is etched. There is a problem that it is difficult to obtain a ten-point average roughness (Rz) value obtained by averaging bone depth to a desired level. In addition, since the 10-point average roughness (Rz) values are different in each portion of the glass substrate 110, the reflectivity is partially increased in the glass substrate 100, thereby causing a glare phenomenon or the glass substrate 100. This cloudy phenomenon can occur.
  • Rz ten-point average roughness
  • the ceramic coating layer 110 has a surface roughness due to the particle size of the ceramic powder.
  • the surface roughness of the ceramic coating layer 110 preferably has a center line average roughness Ra, which is an average height from a center line to a cross-sectional curve, in a range of about 2 to 5 ⁇ m.
  • the centerline average roughness value of the surface roughness is less than about 2 ⁇ m, it is difficult to form roughness on the surface of the glass substrate 100.
  • the center line average roughness value of the surface roughness exceeds about 5 ⁇ m, the reflectivity of the glass substrate 100 may be low to suppress glare, but the surface roughness may be too large to form a glare phenomenon. It can be cloudy.
  • the pore size of the ceramic coating layer 110 varies according to the surface roughness value. For example, when the surface roughness value is large, the ceramic powder particle size is large and the pore size is also large. As another example, when the surface roughness value is large, since the ceramic powder particle size is small, the pore size is also reduced.
  • the surface roughness of the ceramic coating layer 110 may be adjusted by adjusting the particle size of the ceramic powder supplied to the plasma gun 10. For example, when the particle size of the ceramic powder supplied to the plasma gun 10 is small, the surface roughness of the ceramic coating layer 110 is also reduced. On the contrary, when the particle size of the ceramic powder supplied to the plasma gun 10 is large, the surface roughness of the ceramic coating layer 110 also increases.
  • the first etching solution 20 is supplied to the glass substrate 100 on which the ceramic coating layer 110 is formed.
  • the first etching solution 20 may be a mixed solution containing hydrofluoric acid (HF).
  • the first etching solution 20 may be an aqueous hydrofluoric acid solution.
  • the first etching solution 20 may be a mixed solution of hydrofluoric acid, nitric acid, and water.
  • the weight percent ratio of the hydrofluoric acid, nitric acid and water may range from about 5 to 10: 10 to 30: 60 to 85.
  • the glass substrate 100 may be immersed in the container 30 containing the first etching solution 20 to supply the first etching solution 20 to the glass substrate 100.
  • the first etching solution 20 is a mixed solution of hydrofluoric acid, nitric acid, and water
  • the glass substrate 100 may be immersed in the first etching solution 20 for about 10 to 300 minutes.
  • the first etching solution 20 may be sprayed to the spray nozzle 40 to supply the first etching solution 20 to the glass substrate 100.
  • the glass substrate 100 is vertically erected, and the first etching solution 20 is uniformly provided to the glass substrate 100 at the plurality of spray nozzles 40.
  • the first etching solution 20 penetrates into the surface of the glass substrate 100 on which the ceramic coating layer 110 is formed through the pores and cracks of the ceramic coating layer 110.
  • the fluorine (F) component of the first etching solution 20 The surface of the glass substrate 100 is etched by penetrating through the pores and cracks. Therefore, the glass substrate 100 of the portion where the pores and cracks are positioned is etched relatively much, and the glass substrate 100 of the portion where the pores and cracks are not positioned is relatively less etched.
  • the ceramic coating layer 110 may be peeled from the glass substrate 100 by etching the glass substrate 100.
  • the ceramic coating layer 110 when the ceramic coating layer 110 is made of the same material as the glass substrate 100, the ceramic coating layer 110 may be simultaneously etched with the glass substrate 100.
  • the sum of the thickness of the ceramic coating layer 110 and the thickness of the glass substrate 100 that are peeled or etched by the first etching solution 20 is about 50 to 300 ⁇ m.
  • the glass substrate 100 is uniformly in contact with the first etching solution 20 due to the immersion in the first etching solution 20 or the injection of the first etching solution 20. This can be etched uniformly.
  • the glass substrate 100 may be etched while the ceramic coating layer 110 is peeled off to form a first surface roughness 120 on a surface on which the ceramic coating layer 110 is formed (step S120).
  • the 10-point average roughness (Rz) value of the first surface roughness 120 is preferably in the range of about 1 to 2 ⁇ m.
  • the 10 point average roughness Rz value is less than about 1 ⁇ m or more than about 2 ⁇ m, it may be difficult to form a desired roughness on the glass substrate 100 through a subsequent etching process.
  • the thickness of the glass substrate 100 may be reduced.
  • a second etching solution is supplied to the glass substrate 100 having the first surface roughness 120.
  • the second etching solution may be a mixed solution containing hydrofluoric acid (HF).
  • the second etching solution may be an aqueous hydrofluoric acid solution.
  • the second etching solution may be a mixed solution of hydrofluoric acid, hydrochloric acid, nitric acid and water.
  • the weight percent ratio of hydrochloric acid, hydrofluoric acid, nitric acid and water may range from about 30 to 70:10 to 20: 0.5 to 5: 5 to 59.5.
  • the second etching solution may be supplied to the glass substrate 100 by immersing the glass substrate 100 in a container containing the second etching solution.
  • the second etching solution may be sprayed with a spray nozzle to supply the second etching solution to the glass substrate 100.
  • the glass substrate 100 is in a vertical position, and the second etching solution is uniformly provided to the glass substrate 100 at a plurality of spray nozzles.
  • the second surface roughness 130 may be formed by etching the glass substrate 100 on which the first surface roughness 120 is formed using the second etching solution (step S130).
  • the portion protruding from the glass substrate 100 has a large contact area with the second etching solution, and thus is relatively etched.
  • the concave portion of the glass substrate 100 has a relatively small contact area with the second etching solution, and thus has a relatively small contact area. Etched. Therefore, the value of the second surface roughness 130 may be smaller than the value of the first surface roughness 120.
  • the 10-point average roughness Rz of the second surface roughness 130 is preferably in the range of about 0.6 to 1.3 mu m, more preferably in the range of about 0.8 to 1.2 mu m.
  • the 10-point average roughness Rz exceeds about 1.3 ⁇ m, the reflectivity of the glass substrate 100 is low, so that glare does not occur, but the surface may be cloudy.
  • the 10-point average roughness (Rz) is less than about 0.6 ⁇ m, the glass substrate 100 looks clean but excessively high reflectivity may cause glare.
  • the glass substrate 100 After removing the glass substrate 100 having the second surface roughness formed from the second etching solution or stopping the injection of the second etching solution, the glass substrate 100 may be removed to remove the remaining second etching solution. After cleaning and drying, the surface treatment of the glass substrate 100 is completed.
  • the second surface roughness may be formed on the glass substrate 100 by using the anti-glare glass manufacturing method, the light incident on the glass substrate 100 may be diffusely reflected or refracted to prevent glare.
  • the anti-glare glass manufacturing method is a simple process, the surface treatment cost of the glass substrate 100 can be reduced.
  • FIG. 7 is a flowchart illustrating a glass substrate processing method according to another exemplary embodiment of the present invention
  • FIGS. 8 and 9 are cross-sectional views illustrating the glass substrate processing method illustrated in FIG. 7.
  • a blast process is performed on the surface of the glass substrate 200.
  • the blasting process may be performed using beads.
  • the blasting process may be performed using sand.
  • the first surface roughness 210 is formed on the surface of the glass substrate 200 (step S210).
  • the first surface roughness 210 may have a 10-point average roughness Rz, which is an average of five mountain heights and two bone depths within a predetermined length, in the glass substrate 200, in a range of about 1.2 to 1.7 ⁇ m. Do. When the 10-point average roughness Rz of the first surface roughness 210 is less than about 1.2 ⁇ m or exceeds about 1.7 ⁇ m, the glass substrate 200 may be etched even if the glass substrate 200 described later is etched. It is difficult to form roughness.
  • Rz is an average of five mountain heights and two bone depths within a predetermined length
  • the first surface roughness 210 varies according to the particle size of the bead or the sand. Therefore, the first surface roughness 210 may be adjusted by adjusting the particle size of the bead or the sand during the blasting process. For example, when the particle size of the beads or the sand is small, the first surface roughness 210 of the glass substrate 200 is also reduced. On the contrary, for example, when the particle size of the beads or the sand is large, the first surface roughness 210 of the glass substrate 200 also increases.
  • a plurality of micro glasses and micro cracks may exist on the surface of the glass substrate 200.
  • an etching solution is supplied to the glass substrate 200 having the first surface roughness 210.
  • the etching solution may be a mixed solution containing hydrofluoric acid (HF).
  • the etching solution may be an aqueous hydrofluoric acid solution.
  • the etching solution may be a mixed solution of hydrofluoric acid, nitric acid and water.
  • the weight percent ratio of the hydrofluoric acid, nitric acid and water may range from about 5 to 10: 10 to 30: 60 to 85.
  • the etching solution may be a mixed solution of hydrofluoric acid, hydrochloric acid, nitric acid and water. In this case, the weight percent ratio of hydrofluoric acid, hydrochloric acid, nitric acid and water may range from about 30 to 70:10 to 20: 0.5 to 5: 5 to 59.5.
  • the glass substrate 200 may be immersed in a container containing an etching solution to supply the etching solution to the glass substrate 200.
  • the etching solution is a mixed solution of hydrofluoric acid, nitric acid, and water
  • the glass substrate 200 may be immersed in the etching solution for about 10 to 300 minutes.
  • the etching solution may be sprayed onto the etching solution to supply the etching solution to the glass substrate 200.
  • the glass substrate 200 is in a vertical position, and the etching solution is uniformly provided to the glass substrate 200 at a plurality of spray nozzles.
  • the etching solution etches the glass substrate 200. Since the glass substrate 200 immersed in the etching solution is in uniform contact with the etching solution, the glass substrate 200 may be uniformly etched. For example, the etching solution is removed by etching the micro glass on the surface of the glass substrate 200. In addition, the fluorine (F) component of the etching solution penetrates along the microcracks to etch the glass substrate 200.
  • F fluorine
  • the glass substrate 200 may be etched to form a second surface roughness 220 (step S220).
  • the ten point average roughness Rz which is an average of five mountain heights and two bone depths within a predetermined length, is preferably in the range of about 0.6 to 1.3 ⁇ m, and about 0.8 to 1.2 ⁇ m. More preferred.
  • the 10-point average roughness Rz exceeds about 1.3 ⁇ m, the reflectivity of the glass substrate 200 may be low to prevent glare, but the surface may become cloudy. In addition, when the 10-point average roughness Rz is less than about 0.6 ⁇ m, the glass substrate 200 looks clean but excessively high reflectivity may cause glare.
  • the glass substrate 200 on which the second surface roughness 220 is formed is removed from the etching solution or the spraying of the etching solution is stopped, and then the glass substrate 200 is cleaned to remove the remaining etching solution. And drying to complete the surface treatment of the glass substrate 200.
  • the second surface roughness 220 may be formed on the glass substrate 200 by using the anti-glare glass manufacturing method, the glare may be prevented by reflecting or refracting the light incident on the glass substrate 200. have.
  • the anti-glare glass manufacturing method is a simple process, it is possible to reduce the surface treatment cost of the glass substrate 200.
  • the glass substrate processing method according to the present invention is to peel off the ceramic coating film formed using the thermal spray coating process to form a first roughness on the surface of the glass substrate, and to etch the glass substrate having the first roughness to the second roughness
  • the glass substrate which has a can be formed. Therefore, glare of the said glass substrate can be prevented.
  • first roughness and the second roughness formed on the surface of the glass substrate may be easily adjusted by adjusting the size of the ceramic powder during the spray coating process.
  • the surface treatment cost of the glass substrate can be reduced.

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  • General Chemical & Material Sciences (AREA)
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  • Inorganic Chemistry (AREA)
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Abstract

L'invention porte sur un procédé de préparation de verre anti-éblouissant, ledit procédé comprenant les étapes suivantes : la formation d'une couche de revêtement céramique ayant une épaisseur uniforme sur un substrat en verre ; le détachement de la couche de revêtement céramique à partir du substrat en verre par une première solution de gravure de façon à former une première rugosité sur la surface du substrat en verre ; et la gravure de la surface du substrat en verre par une seconde solution de gravure de façon à former une seconde rugosité sur la surface du substrat en verre.
PCT/KR2010/008505 2009-11-30 2010-11-30 Procédé de préparation de verre anti-éblouissant Ceased WO2011065796A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0116761 2009-11-30
KR1020090116761A KR101408663B1 (ko) 2009-11-30 2009-11-30 안티 글레어 글래스 제조 방법

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WO2011065796A2 true WO2011065796A2 (fr) 2011-06-03
WO2011065796A3 WO2011065796A3 (fr) 2011-10-20

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KR20110060233A (ko) 2011-06-08
TWI401223B (zh) 2013-07-11

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