[go: up one dir, main page]

WO2011049303A3 - In-line vacuum deposition system which is connectable to a coating process, and deposition method using same - Google Patents

In-line vacuum deposition system which is connectable to a coating process, and deposition method using same Download PDF

Info

Publication number
WO2011049303A3
WO2011049303A3 PCT/KR2010/006770 KR2010006770W WO2011049303A3 WO 2011049303 A3 WO2011049303 A3 WO 2011049303A3 KR 2010006770 W KR2010006770 W KR 2010006770W WO 2011049303 A3 WO2011049303 A3 WO 2011049303A3
Authority
WO
WIPO (PCT)
Prior art keywords
line
vacuum deposition
connectable
same
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/006770
Other languages
French (fr)
Korean (ko)
Other versions
WO2011049303A2 (en
Inventor
김윤택
양순석
조상무
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
VACOS CO Ltd
Original Assignee
VACOS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by VACOS CO Ltd filed Critical VACOS CO Ltd
Publication of WO2011049303A2 publication Critical patent/WO2011049303A2/en
Publication of WO2011049303A3 publication Critical patent/WO2011049303A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The present invention relates to an in-line vacuum deposition system which is connectable to a coating process and to a deposition method using same. In detail, the present invention relates to an in-line vacuum deposition system which is connectable to a coating process and to a deposition method using same, wherein the in-line vacuum deposition system comprises: i) a conveyor line for transferring a coating jig, on which a product base-coated in a base-coating line is mounted, to a middle coating line and to a top coating line; ii) first and second vacuum deposition lines (20-1, 20-2) which are arranged parallel to each other to perform vacuum deposition on the product being transferred from the conveyor line (10), and each of which consists of loading chambers (21), reaction chambers (22), and unloading chambers (23); iii) a first carrier station (30-1) which reciprocates between the loading chamber (21) of the first vacuum deposition line (20-1) and the unloading chamber (23) of the second vacuum deposition line (20-2); and iv) a second carrier station (30-2) which reciprocates between the unloading chamber (23) of the first vacuum deposition line (20-1) and the loading chamber (21) of the second vacuum deposition line (20-2).
PCT/KR2010/006770 2009-10-21 2010-10-05 In-line vacuum deposition system which is connectable to a coating process, and deposition method using same Ceased WO2011049303A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0100133 2009-10-21
KR1020090100133A KR20100075721A (en) 2009-10-21 2009-10-21 In-line vacuum deposition system which can connect with coating system. and deposition method using the same

Publications (2)

Publication Number Publication Date
WO2011049303A2 WO2011049303A2 (en) 2011-04-28
WO2011049303A3 true WO2011049303A3 (en) 2011-10-06

Family

ID=42637788

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/006770 Ceased WO2011049303A2 (en) 2009-10-21 2010-10-05 In-line vacuum deposition system which is connectable to a coating process, and deposition method using same

Country Status (2)

Country Link
KR (1) KR20100075721A (en)
WO (1) WO2011049303A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103184413A (en) * 2011-12-28 2013-07-03 英莱新能（上海）有限公司 Vacuum coater and vacuum coating method
CN111606025B (en) * 2020-04-22 2021-09-07 广东生波尔光电技术有限公司 Special workpiece coating equipment

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103014640B (en) * 2013-01-04 2014-09-24 赫得纳米科技(昆山)有限公司 Automatic loading and unloading device for jig
KR102353897B1 (en) * 2021-03-05 2022-01-20 주식회사 가람테크 Deposition System for menufacturing cosmetic vessel

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0169148B1 (en) * 1992-05-20 1999-01-15 요오이치 무라야마 In-line Plasma Deposition System
KR20070044420A (en) * 2007-04-09 2007-04-27 주식회사 아텍 Aluminum Wheel Dry Plating Method for Automobiles
KR20070099579A (en) * 2005-07-29 2007-10-09 가부시키가이샤 아루박 Vacuum processing unit
KR20090027805A (en) * 2007-09-13 2009-03-18 (주)정보마이다스 Vacuum Deposition System with Oxide Coating

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0169148B1 (en) * 1992-05-20 1999-01-15 요오이치 무라야마 In-line Plasma Deposition System
KR20070099579A (en) * 2005-07-29 2007-10-09 가부시키가이샤 아루박 Vacuum processing unit
KR20070044420A (en) * 2007-04-09 2007-04-27 주식회사 아텍 Aluminum Wheel Dry Plating Method for Automobiles
KR20090027805A (en) * 2007-09-13 2009-03-18 (주)정보마이다스 Vacuum Deposition System with Oxide Coating

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103184413A (en) * 2011-12-28 2013-07-03 英莱新能（上海）有限公司 Vacuum coater and vacuum coating method
CN111606025B (en) * 2020-04-22 2021-09-07 广东生波尔光电技术有限公司 Special workpiece coating equipment

Also Published As

Publication number Publication date
KR20100075721A (en) 2010-07-05
WO2011049303A2 (en) 2011-04-28

Similar Documents

Publication Publication Date Title
WO2009099721A3 (en) Processing system for fabricating compound nitride semiconductor devices
WO2010128811A3 (en) Thin film deposition apparatus and thin film deposition system comprising same
TW200729380A (en) Substrate processing equipment
NZ589480A (en) Packaging machine and method of packaging articles
SI2195267T2 (en) Method for unstacking plate-shaped parts
WO2007120776A8 (en) Plasma deposition apparatus and method for making solar cells
WO2011049303A3 (en) In-line vacuum deposition system which is connectable to a coating process, and deposition method using same
WO2012148801A3 (en) Semiconductor substrate processing system
WO2011085010A3 (en) System for batch processing of magnetic media
WO2010114274A3 (en) Apparatus for depositing film and method for depositing film and system for depositing film
WO2008070004A3 (en) High throughput wafer notch aligner
WO2009072426A1 (en) Vacuum processing apparatus and substrate processing method
RU2009136423A (en) VACUUM INSTALLATION FOR COATING
TW200609378A (en) Device and method for high-throughput chemical vapor deposition
WO2009142446A3 (en) Vacuum processing system, buffer module used therein and tray transferring method of the vacuum processing system
ATE435830T1 (en) METHOD FOR FORMING A BACK-TO-BACK WAFER CHARGE TO BE POSITIONED IN A PROCESS BOAT AND HANDLING SYSTEM FOR FORMING THE BACK-TO-BACK WAFER CHARGE
WO2011034751A3 (en) Hot wire chemical vapor deposition (cvd) inline coating tool
WO2010144303A3 (en) Continuous feed chemical vapor deposition system
WO2012057770A3 (en) Reactor clean
CN102847630A (en) Spraying production line
WO2007016592A3 (en) Gas manifold valve cluster
WO2011057247A3 (en) System and method for handling multiple workpieces for matrix configuration processing
CN101431004A (en) Processing device and method for processing a subtrate
WO2006124472A3 (en) Method and apparatus for vertical transfer of semiconductor substrates in a cleaning module
TW200730664A (en) Machine for treating substrates and method

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10825128

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10825128

Country of ref document: EP

Kind code of ref document: A2