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WO2010114274A3 - Apparatus for depositing film and method for depositing film and system for depositing film - Google Patents

Apparatus for depositing film and method for depositing film and system for depositing film Download PDF

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Publication number
WO2010114274A3
WO2010114274A3 PCT/KR2010/001919 KR2010001919W WO2010114274A3 WO 2010114274 A3 WO2010114274 A3 WO 2010114274A3 KR 2010001919 W KR2010001919 W KR 2010001919W WO 2010114274 A3 WO2010114274 A3 WO 2010114274A3
Authority
WO
WIPO (PCT)
Prior art keywords
film
depositing
depositing film
substrate holders
deposition source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/001919
Other languages
French (fr)
Other versions
WO2010114274A2 (en
Inventor
Kyung Bin Bae
Hyung Seok Yoon
Chang Ho Kang
Hyun Goo Kwon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SNU Precision Co Ltd
Original Assignee
SNU Precision Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SNU Precision Co Ltd filed Critical SNU Precision Co Ltd
Priority to JP2012503318A priority Critical patent/JP5364200B2/en
Priority to CN201080015804.9A priority patent/CN102369306B/en
Publication of WO2010114274A2 publication Critical patent/WO2010114274A2/en
Publication of WO2010114274A3 publication Critical patent/WO2010114274A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

Provided are an apparatus for depositing a film, including: a chamber configured to provide a reaction space; first and second substrate holders spaced apart from each other and installed in the chamber; and a deposition source which is installed between the first and second substrate holders and configured to sequentially supply a deposition raw materials in directions of the first and second substrate holders, a method for depositing a film suitable for the apparatus, and a system for depositing a film including the apparatus. According to the present disclosure, since sequential film processes can be performed with respect to two or more process lines provided in each of the process chambers through the single deposition source provided in each of the process chambers, fabrication costs can be saved and at the same time productivity can be enhanced.
PCT/KR2010/001919 2009-03-31 2010-03-30 Apparatus for depositing film and method for depositing film and system for depositing film Ceased WO2010114274A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012503318A JP5364200B2 (en) 2009-03-31 2010-03-30 Thin film deposition apparatus, thin film deposition method and thin film deposition system
CN201080015804.9A CN102369306B (en) 2009-03-31 2010-03-30 Apparatus, method and system for depositing thin films

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0027351 2009-03-31
KR1020090027351A KR101097737B1 (en) 2009-03-31 2009-03-31 Apparatus for depositing film and method for depositing film and system for depositing film

Publications (2)

Publication Number Publication Date
WO2010114274A2 WO2010114274A2 (en) 2010-10-07
WO2010114274A3 true WO2010114274A3 (en) 2010-12-23

Family

ID=42828832

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/001919 Ceased WO2010114274A2 (en) 2009-03-31 2010-03-30 Apparatus for depositing film and method for depositing film and system for depositing film

Country Status (5)

Country Link
JP (1) JP5364200B2 (en)
KR (1) KR101097737B1 (en)
CN (1) CN102369306B (en)
TW (1) TWI427178B (en)
WO (1) WO2010114274A2 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100279021A1 (en) 2009-05-04 2010-11-04 Samsung Mobile Display Co., Ltd. Apparatus for depositing organic material and depositing method thereof
KR101151234B1 (en) * 2010-03-30 2012-06-14 주식회사 케이씨텍 Upright type deposition apparatus and transfer method for substrate
JP2013167001A (en) * 2012-02-16 2013-08-29 Hitachi High-Technologies Corp Vacuum deposition system and vacuum deposition method
KR102106414B1 (en) * 2013-04-26 2020-05-06 삼성디스플레이 주식회사 Depositing chamber, depositing system comprising the same and method for manufacturing organic light emitting diode display
KR20150053161A (en) * 2013-11-07 2015-05-15 삼성디스플레이 주식회사 Deposition apparatus, method for manufacturing organic light emitting display apparatus using the same
JP6328766B2 (en) * 2013-12-10 2018-05-23 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Evaporation source for organic material, deposition apparatus for depositing organic material in vacuum chamber, and method for evaporating organic material
KR102229761B1 (en) 2014-03-17 2021-03-23 삼성디스플레이 주식회사 Atomic layer deposition apparatus
WO2016087005A1 (en) * 2014-12-05 2016-06-09 Applied Materials, Inc. Material deposition system and method for depositing material in a material deposition system
DE102016110884A1 (en) 2016-06-14 2017-12-14 Aixtron Se Apparatus and method for depositing organic layers on one or more substrates
CN106435482A (en) * 2016-10-27 2017-02-22 安徽恒致铜铟镓硒技术有限公司 Independent box type evaporation source device
JP2019510129A (en) * 2017-02-03 2019-04-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Apparatus and method for continuous evaporation with adjacent substrates
CN108966676B (en) * 2017-03-17 2023-08-04 应用材料公司 Method of processing a mask assembly in a vacuum system, mask processing assembly and vacuum system for depositing material on a substrate
US11133430B2 (en) * 2017-08-09 2021-09-28 Kaneka Corporation Photoelectric conversion element production method
CN109423610B (en) 2017-08-24 2020-12-04 京东方科技集团股份有限公司 A kind of evaporation device and evaporation method
KR101921648B1 (en) * 2017-12-28 2018-11-26 주식회사 올레드온 Cluster type manufacturing equipment using vertical type plane source evaporation for high definition AMOLED devices
KR102355814B1 (en) * 2020-03-20 2022-01-26 주식회사 선익시스템 Deposition apparatus and organic material depositing method using the same
KR102430349B1 (en) * 2020-04-14 2022-08-08 주식회사 선익시스템 Cluster deposition system
KR102413664B1 (en) * 2020-04-20 2022-06-28 주식회사 선익시스템 Cluster deposition system
KR102407505B1 (en) * 2020-04-29 2022-06-13 주식회사 선익시스템 Deposition apparatus and in-line deposition system
CN111663104A (en) * 2020-06-24 2020-09-15 武汉华星光电半导体显示技术有限公司 Vapor deposition system and vapor deposition method
CN114875363A (en) * 2022-03-24 2022-08-09 广州华星光电半导体显示技术有限公司 Evaporation device and manufacturing method of display panel
CN115483359A (en) * 2022-09-19 2022-12-16 浙江合特光电有限公司 Perovskite thin film deposition process

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH051378A (en) * 1991-03-25 1993-01-08 Shin Meiwa Ind Co Ltd Substrate holder transfer device for in-line film forming equipment
KR20040088238A (en) * 2003-04-09 2004-10-16 (주)네스디스플레이 System and Method for vacuum deposition
JP2007077493A (en) * 2005-09-15 2007-03-29 Applied Materials Gmbh & Co Kg Coating machine and operation method of coating machine
JP2007239071A (en) * 2006-03-10 2007-09-20 Fujifilm Corp Vacuum deposition equipment

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JPH0299959U (en) * 1989-01-24 1990-08-09
JP3232646B2 (en) * 1992-05-07 2001-11-26 日本板硝子株式会社 Method for producing transparent conductive glass for liquid crystal display element
JPH0941142A (en) * 1995-07-26 1997-02-10 Balzers & Leybold Deutsche Holding Ag Device for alternately positioning substrates to be coated in vacuo
JP3909888B2 (en) * 1996-04-17 2007-04-25 キヤノンアネルバ株式会社 Tray transfer type in-line deposition system
JP4034860B2 (en) * 1997-10-31 2008-01-16 キヤノンアネルバ株式会社 Tray transfer film forming apparatus and auxiliary chamber
JP4843873B2 (en) * 2001-07-05 2011-12-21 ソニー株式会社 Oblique deposition apparatus and oblique deposition method
KR100430104B1 (en) * 2001-09-18 2004-05-03 디지웨이브 테크놀러지스 주식회사 Vacuum plating apparatus and its plating method with linear plating and indirect heating
JP3822481B2 (en) * 2001-10-26 2006-09-20 株式会社アルバック Sputtering method
JP2004146369A (en) * 2002-09-20 2004-05-20 Semiconductor Energy Lab Co Ltd Manufacturing method of manufacturing device and light emitting device
JP4251857B2 (en) * 2002-11-27 2009-04-08 株式会社アルバック Vacuum film forming apparatus and vacuum film forming method
JP2008019477A (en) * 2006-07-13 2008-01-31 Canon Inc Vacuum deposition equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH051378A (en) * 1991-03-25 1993-01-08 Shin Meiwa Ind Co Ltd Substrate holder transfer device for in-line film forming equipment
KR20040088238A (en) * 2003-04-09 2004-10-16 (주)네스디스플레이 System and Method for vacuum deposition
JP2007077493A (en) * 2005-09-15 2007-03-29 Applied Materials Gmbh & Co Kg Coating machine and operation method of coating machine
JP2007239071A (en) * 2006-03-10 2007-09-20 Fujifilm Corp Vacuum deposition equipment

Also Published As

Publication number Publication date
JP2012522137A (en) 2012-09-20
CN102369306B (en) 2014-01-22
WO2010114274A2 (en) 2010-10-07
CN102369306A (en) 2012-03-07
TW201104008A (en) 2011-02-01
TWI427178B (en) 2014-02-21
JP5364200B2 (en) 2013-12-11
KR101097737B1 (en) 2011-12-22
KR20100108994A (en) 2010-10-08

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