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WO2010137868A2 - Boîtier matriciel de diodes électroluminescentes présentant une fonction de dissipation de la chaleur - Google Patents

Boîtier matriciel de diodes électroluminescentes présentant une fonction de dissipation de la chaleur Download PDF

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Publication number
WO2010137868A2
WO2010137868A2 PCT/KR2010/003325 KR2010003325W WO2010137868A2 WO 2010137868 A2 WO2010137868 A2 WO 2010137868A2 KR 2010003325 W KR2010003325 W KR 2010003325W WO 2010137868 A2 WO2010137868 A2 WO 2010137868A2
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting diode
light
conductive pattern
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/003325
Other languages
English (en)
Korean (ko)
Other versions
WO2010137868A3 (fr
Inventor
이성수
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Paragon Technologies Co Ltd
Original Assignee
Paragon Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=42083214&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2010137868(A2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Paragon Technologies Co Ltd filed Critical Paragon Technologies Co Ltd
Publication of WO2010137868A2 publication Critical patent/WO2010137868A2/fr
Publication of WO2010137868A3 publication Critical patent/WO2010137868A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N9/00—Details of colour television systems
    • H04N9/12—Picture reproducers
    • H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
    • H04N9/3141—Constructional details thereof
    • H04N9/315—Modulator illumination systems
    • H04N9/3164—Modulator illumination systems using multiple light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the present invention relates to a light emitting diode package, and more particularly to a light emitting diode array package having a heat radiation function.
  • a light emitting diode is a kind of semiconductor that converts an electrical signal into infrared or visible light using the characteristics of a compound semiconductor.
  • Light emitting diodes have been widely used for purposes such as simple light emitting display or numeric display to this day because of low brightness, low voltage, long life, low cost and small size.
  • lighting fields such as infrared emitters, infrared emitters, and infrared illuminators.
  • infrared light emitting diode when an infrared light emitting diode is used for illumination, not only the quality of light emission but also the light output of several tens of watts is required.
  • a plurality of light emitting diodes are used.
  • the light emitting diodes need to be connected in series and in parallel according to the voltage used and the amount of light required.
  • one block may be made of chips configured in parallel, and the blocks may be connected in parallel to form an array of light emitting diodes, and chip blocks formed by connecting at least one light emitting diode in parallel are generally surface mounted.
  • a copper pattern is connected to a printed circuit board (PCB) like a surface mounted device (SMD)
  • a copper pattern on the PCB is lifted by heat generated from chip blocks. This is because the heat generated from the light emitting diodes is so large that the temperature of the junction of the light emitting diode chip block, which is formed by connecting at least one light emitting diode in parallel, may increase to 150 degrees Celsius.
  • FIG. 1 is a view schematically showing an example of a general light emitting diode array package.
  • heat dissipation means are required to solve this problem because heat dissipation is more difficult than that of the chip blocks 120 present in the periphery. .
  • a method of radiating heat to the outside by attaching a heat sink made of aluminum or copper to the back of the stem 110 on which the light emitting diode package is mounted is generally used, but heat dissipation through such a method is limited. Therefore, the conductive patterns and heat generated from the light emitting diodes can be effectively arranged to effectively arrange the light emitting diodes in a small area and connect the light emitting diodes with a minimum of wires to form a parallel circuit. There is a need for heat dissipation means that can be released to the outside.
  • an object of the present invention is to provide a conductive pattern for effectively configuring a light emitting diode array.
  • another object of the present invention is to provide a light emitting diode array package having heat dissipation and excellent heat resistance.
  • a light emitting diode array package having a heat dissipation function according to a feature of the present invention for achieving the above object
  • the at least one LED may further include a lead pin for supplying power from the outside.
  • the power supply unit may be further connected to the lead pins.
  • At least one light emitting diodes are connected in parallel in one conductive pattern to obtain a required amount of light, and the conductive patterns in which the at least one light emitting diodes are connected in parallel are connected in parallel and parallel to each other according to a voltage used.
  • Arrays can be configured.
  • the conductive pattern is formed by the conductive pattern,
  • At least one light emitting diode disposed in a parallel connection part of another conductive pattern may be configured as a serial connection part connected through wire bonding.
  • the wire may be formed of gold or silver.
  • the series connecting portion of the conductive pattern may be configured to surround the parallel connecting portion of another adjacent conductive pattern.
  • the at least one light emitting diode may be disposed at the outermost portion of the parallel connection portion.
  • the conductive pattern is formed of gold
  • the heat dissipation substrate is made of any one of polymer, ceramic, and metal oxide
  • the adhesive member corresponds to any one of silver-epoxy, silver paste and solder, and the stem It may be plated with silver gold or silver.
  • the LED array package having a heat dissipation function of the present invention by providing a conductive pattern that can easily configure the LED array according to the voltage used and the amount of light required, it is possible to effectively arrange the LEDs in a small area There is.
  • FIG. 1 is a view schematically showing an example of a typical light emitting diode array package.
  • Figure 2 is a schematic cross-sectional view of a light emitting diode array package having a heat radiation function according to an embodiment of the present invention.
  • Figure 3 is a schematic perspective view of a light emitting diode array package having a heat radiation function according to an embodiment of the present invention.
  • Figure 4 is a top view of the light emitting diode array package having a heat radiation function according to an embodiment of the present invention.
  • the light emitting diode array package 200 having a heat dissipation function includes at least one light emitting diode 210 that emits light and a conductive pattern in which the light emitting diodes are disposed. 230, a wire 220 connecting the conductive pattern and the light emitting diodes, a heat dissipation substrate 240 for dissipating heat generated from the light emitting diodes, the light emitting diode 210 and the conductive pattern 230, and the heat dissipation substrate 240.
  • a stem 260 is accommodated, and the adhesive member 250 for adhering the heat radiation board 240 and the stem 260.
  • Gold or silver may be used as the material of the wire 220 and is preferably formed of gold.
  • the conductive pattern 230 corresponds to a conductive line connecting the light emitting diodes 210 in series or in parallel, and gold is preferably used as a material of the conductive pattern, because the conductive pattern 230 is connected to the wire 220 and the conductive pattern connected to the conductive pattern.
  • the back of the light emitting diode 210 in contact, that is, the cathode is also generally made of gold, which is advantageous for mutual bonding, and also has excellent thermal conductivity to transfer heat generated from the light emitting diodes 210 to the heat dissipation substrate 240. Because it is easy to do.
  • the conductive pattern formed of gold may be manufactured by, for example, vacuum deposition using a mask by photoetching or chemical plating using a mask. The configuration of the light emitting diode array and the light emitting diode arrangement using the conductive pattern will be described in more detail with reference to FIG. 4.
  • the heat dissipation substrate 240 is formed at a lower side of the parallel circuit composed of the conductive pattern 230 and the light emitting diodes 210 and emits heat generated from the light emitting diodes 210 to the outside.
  • the heat dissipation substrate 240 may be manufactured using any one material of a polymer, a ceramic, and a metal oxide, and is preferably made of a ceramic having good heat resistance and good thermal conductivity.
  • the stem 260 is a portion in which the light emitting diode 210, the conductive pattern 230, and the heat dissipation substrate 240 are accommodated.
  • the stem 260 may also be plated with gold or silver because the thermal conductivity must be high, and a heat sink (not shown) may be further adhered to the bottom of the stem to release heat to the outside.
  • the adhesive member 250 is for bonding the radiating substrate 240 and the stem 260, and may be formed of any one of silver-epoxy, silver paste, and solder, and the silver paste has excellent thermal conductivity and adhesion. Since the process and the like are convenient and effective, they are preferably formed as a silver paste.
  • FIG. 3 is a schematic perspective view of a light emitting diode array package having a heat dissipation function according to an embodiment of the present invention.
  • a light emitting diode array package having a heat dissipation function according to an embodiment of the present invention includes lead pins 330a and 330b and lead pins 330a and 330b for applying power to the light emitting diodes.
  • the lead fin heads 340a and 340b formed outside the heat dissipation substrate 310 may be further provided.
  • a pair of lead pins 330a and 330b and lead pin heads 340a and 340b are illustrated, but a pair of lead pins and lead pin heads may be used.
  • a lens may be further provided to seal the light emitting diode and to focus light generated by the light emitting diode.
  • FIG. 4 is a top view of a light emitting diode array package having a heat dissipation function according to an exemplary embodiment of the present invention.
  • the power supply unit 430 of the conductive pattern in the light emitting diode array package having the heat dissipation function is directly connected to the lead pin head 420a and the wire 440 to supply power from the outside. It corresponds to a pattern for supplying power to the light emitting diodes.
  • the parallel connection portion 450 of the conductive pattern is an area in which at least one light emitting diode to be configured in parallel is actually disposed, and may bond the cathode and the parallel connection portion of the light emitting diodes to be connected in parallel to obtain a necessary light amount.
  • the lead pin head 420b for supplying power from the outside may be directly connected to a wire to supply power to the light emitting diodes.
  • the series connection part 460 of the conductive pattern may be configured to surround the parallel connection part of another adjacent conductive pattern.
  • the LED chip blocks may be connected in series by connecting the anode of the LED and the serial connector 460 in the parallel connection 450 of another adjacent conductive pattern through a wire.
  • 5V, 12V, and 24V voltages can be applied to the LED array package.
  • the light emitting diodes 470 are disposed at the outermost portion of the parallel connection portion 450 of the conductive pattern. If the length of the wire becomes longer, there is a risk of disconnection and short circuit due to the influence of gravity or the filling of the epoxy resin to be finished, and thus there is a risk of disconnection and short-circuit. It is possible to prevent the degradation of the reliability of the LED array package, which may occur due to wire breakage.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Led Device Packages (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)

Abstract

La présente invention concerne un boîtier matriciel de diodes électroluminescentes présentant une fonction de dissipation de la chaleur, et plus particulièrement, un boîtier matriciel de diodes électroluminescentes comprenant: (1) au moins une diode électroluminescente pour émettre de la lumière; (2) un motif conducteur sur lequel ladite ou lesdites diodes électroluminescentes sont connectées ensemble; (3) un substrat de dissipation thermique pour dissiper la chaleur générée par ladite ou lesdites diodes électroluminescentes; et (4) une tige dans laquelle ladite ou lesdites diodes électroluminescentes, le motif conducteur et le substrat de dissipation de la chaleur sont logés; et (5) un élément collant pour coller le substrat de dissipation de la chaleur sur la tige. Le boîtier matriciel de diodes électroluminescentes présentant une fonction de dissipation de la chaleur selon la présente invention présente ledit motif conducteur, ce qui permet à la matrice de diodes électroluminescentes d'être différemment configurée suivant la tension de service et la quantité de lumière requise, ce qui permet ainsi d'agencer efficacement les diodes électroluminescentes sur une surface étroite. En outre, le substrat de dissipation de la chaleur présentant une résistance à la chaleur et une conductivité thermique supérieures est monté au-dessous d'un circuit série ou parallèle constitué par les diodes électroluminescentes, dissipant ainsi efficacement la chaleur générée par les diodes électroluminescentes, et produisant un boîtier matriciel de diodes électroluminescentes présentant une résistance à la chaleur.
PCT/KR2010/003325 2009-05-26 2010-05-26 Boîtier matriciel de diodes électroluminescentes présentant une fonction de dissipation de la chaleur Ceased WO2010137868A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090046155A KR100941412B1 (ko) 2009-05-26 2009-05-26 방열기능이 구비된 발광다이오드 어레이 패키지
KR10-2009-0046155 2009-05-26

Publications (2)

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WO2010137868A2 true WO2010137868A2 (fr) 2010-12-02
WO2010137868A3 WO2010137868A3 (fr) 2011-02-17

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ID=42083214

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PCT/KR2010/003325 Ceased WO2010137868A2 (fr) 2009-05-26 2010-05-26 Boîtier matriciel de diodes électroluminescentes présentant une fonction de dissipation de la chaleur

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KR (1) KR100941412B1 (fr)
WO (1) WO2010137868A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8492777B2 (en) 2010-04-09 2013-07-23 Everlight Electronics Co., Ltd. Light emitting diode package, lighting device and light emitting diode package substrate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0823145A (ja) * 1994-07-06 1996-01-23 Mitsubishi Materials Corp ハイブリッドｉｃ用基板
KR20060020089A (ko) * 2004-08-31 2006-03-06 서울옵토디바이스주식회사 다수의 셀이 결합된 발광 소자
KR100755615B1 (ko) * 2006-04-14 2007-09-06 삼성전기주식회사 발광 다이오드를 이용한 액정 표시 장치의 백라이트
JP2009111099A (ja) * 2007-10-29 2009-05-21 Mitsubishi Chemicals Corp 集積型発光源およびその製造方法

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Publication number Publication date
WO2010137868A3 (fr) 2011-02-17
KR100941412B1 (ko) 2010-02-10

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