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WO2009121697A1 - Composant électroconducteur doté d’un support, de pistes conductrices et de plaquettes conductrices - Google Patents

Composant électroconducteur doté d’un support, de pistes conductrices et de plaquettes conductrices Download PDF

Info

Publication number
WO2009121697A1
WO2009121697A1 PCT/EP2009/052838 EP2009052838W WO2009121697A1 WO 2009121697 A1 WO2009121697 A1 WO 2009121697A1 EP 2009052838 W EP2009052838 W EP 2009052838W WO 2009121697 A1 WO2009121697 A1 WO 2009121697A1
Authority
WO
WIPO (PCT)
Prior art keywords
current
circuit boards
printed circuit
carrying component
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2009/052838
Other languages
German (de)
English (en)
Inventor
Harald Gamperl
Boris Thaller
Stefan Holzinger
Franz Knoll
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Original Assignee
Continental Automotive GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive GmbH filed Critical Continental Automotive GmbH
Publication of WO2009121697A1 publication Critical patent/WO2009121697A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Definitions

  • the invention relates to a current-carrying component which has a non-conducting carrier and one or more conductor tracks provided on this carrier.
  • An alternative is to make a printed circuit board thicker.
  • This has the disadvantage that more copper is used over the entire surface, which is usually not necessary.
  • the etching process for the production of the conductor tracks takes longer and consumes more raw materials.
  • the etching edges do not extend optimally vertically.
  • the printed circuit boards are becoming increasingly undercut with increasing copper height. As a consequence, components with a fine pitch spacing (soldering pads) can not be fitted. These are in particular CPUs and many other ICs, such as CAN drivers.
  • the object of the invention is to provide a suitable for guiding high currents, cost-effective current-carrying component with small dimensions.
  • the advantages of the invention are, in particular, that currents of high current intensities can be transmitted via the interconnects provided on the carrier without the interconnects needing to be unnecessarily wide or high.
  • This advantageously has the consequence that the dimensions of the carrier as well as the dimensions of a device housing in which the carrier is arranged can be kept small.
  • the invention also allows to integrate components with a small pin spacing on the same substrate as the line part.
  • printed circuit boards of identical shape and size are used as printed circuit boards, then these printed circuit boards can be inexpensively manufactured in large numbers and then be fixed on the printed conductors of the respective printed circuit board independently of the respective layout of the printed circuit board.
  • the attachment of the printed circuit boards on the strip conductors in the context of equipping the printed circuit board with SMD components can be carried out by means of a placement machine. Consequently, it does not require separate steps to attach the circuit board on the tracks.
  • Circuit boards are also chosen layout-dependent. This allows an optimal adaptation of the circuit board to the particular application.
  • a preferred embodiment of the invention is to provide a parallel or offset parallel arrangement of the printed circuit board to reduce the electrical resistance of a conductor track.
  • FIG. 1 shows sketches of a current-carrying component according to a first exemplary embodiment of the invention
  • FIG. 2 shows sketches of a current-carrying component according to a second exemplary embodiment of the invention
  • FIG. 3 shows sketches of a current-carrying component according to a third exemplary embodiment of the invention
  • FIG. 4 shows an electrical equivalent circuit diagram of a current-carrying component according to the invention
  • Figure 5 is a diagram for illustrating the advantages of
  • Figure 6 is a sketch of a current-carrying component according to a fourth embodiment of the invention.
  • FIG. 7 shows an electrical equivalent circuit diagram and a side view of a further current-carrying component according to FIG.
  • FIG. 1 shows sketches of a current-carrying component according to a first exemplary embodiment of the invention.
  • the current-carrying component 1 shown in FIG. 1 has a non-conducting carrier 2.
  • a conductor 3 is provided, which has a kink.
  • this conductor 3 are spaced from each other three printed circuit boards 4 are attached.
  • the size and shape of these three circuit boards is identical. They each have a rectangular cross-sectional shape.
  • the carrier 2 consists of a substrate, the conductor 3 and the circuit board 4 each predominantly of copper or other electrically conductive material.
  • a substrate for the carrier 2 for example, hard paper, FR4, ceramics, etc., can be used.
  • FIG. 2 shows sketches of a current-carrying component according to a second exemplary embodiment of the invention.
  • the current-carrying component shown in FIG. 2 has a non-conducting carrier 2.
  • a conductor 3 is provided, which has a kink.
  • a printed circuit board 4 is fixed, the size and shape of which is adapted to the shape of the conductor 3.
  • the printed circuit board 4 as well as the conductor track 3 has a kink.
  • the carrier 2 consists of a substrate, the conductor 3 and the printed circuit board 4 are each predominantly made of copper or another electrically conductive material.
  • FIG. 3 shows sketches of a current-carrying component according to a third exemplary embodiment of the invention.
  • the current-carrying component shown in FIG. 3 has a non-conducting carrier 2.
  • a conductor 3 is provided, which has a kink.
  • On this conductor 3 are spaced from each other a total of five printed circuit boards 4 attached.
  • the shape of these circuit boards is identical.
  • the circuit boards are each formed rectangular. The size of these ser circuit board is different in the present embodiment.
  • the three printed circuit boards arranged at the bottom in FIG. 3 have a greater length and a greater width than the two printed circuit boards arranged at the top in FIG.
  • the carrier 2 consists of a substrate, the conductor 3 and the circuit board 4 each predominantly of copper or other electrically conductive material.
  • the circuit board 4 are offset in parallel. They can also be arranged parallel to one another.
  • additional electrically conductive surfaces which are implemented in the form of printed circuit boards 4, are respectively applied to the conductor track 3 of a carrier 2.
  • These printed circuit boards 4 like conventional SMD components, can be placed onto the respective position on the printed conductor 3 using an automatic placement machine, optionally connected thereto, for example glued, and then soldered to it, for example.
  • the printed circuit board 4 are electrically contacted with the respective conductor track. They contribute to the power supply and thereby relieve the respective track. This allows a transmission of currents of high currents, without that the conductor must be designed widened accordingly.
  • the placement of the conductor track or the conductor tracks of a carrier with the circuit board can be made in an advantageous manner in the same operation, in which also the placement of the carrier takes place with SMD components. Additional further steps are not necessary.
  • the printed circuit board 4 are pressed as well as the SMD components in applied solder paste and soldered as well as the SMD components on the carrier or the conductor track.
  • FIG. 4 shows a simplified electrical equivalent circuit diagram of a current-carrying component according to the invention.
  • the lower resistance line symbolizes the ohms Resistors R (3) in the longitudinal direction of a conductor 3 and the upper resistance line, the ohmic resistors R (4) of the longitudinally spaced apart conductor plates 4. It can be seen that in each case a resistor R (4) of a printed circuit board 4 parallel to each associated resistor R (3) of the conductor track is arranged. As a result, the current fed into the conductor track is divided between the two resistance lines, so that the conductor track 3 is relieved of its current conduction through the printed circuit board 4.
  • Figure 5 is a diagram for illustrating the advantages of the invention.
  • the width b of a conductor track and along the ordinate of the current i fed into the conductor track are recorded. From the diagram it can be seen that in the case of a width bl of
  • Conductor without applied printed circuit board is the maximum possible current il and with applied printed circuit boards, the maximum possible current is i2, where i2 is much greater than il. Furthermore, it is apparent from the diagram that the conductor without a printed circuit board a
  • the straight line K2 is valid, which has a greater slope than the straight line Kl. It is evident borrowed that with a much smaller width bl the same current i2 can be performed.
  • An application of printed circuit boards on a conductor allows it after all, to transmit a much larger current over said strip conductor as without applying the printed circuit board. For the transmission of larger currents, consequently, no broadening of a conductor track is required.
  • FIG. 6 shows a sketch of a current-carrying component according to a fourth exemplary embodiment of the invention.
  • a current-carrying component 1 is provided which comprises a carrier 2, a conductor 3 provided on the carrier and a conductor 3 fixed to the carrier 3.
  • FIG. 7 shows a detailed electrical equivalent circuit diagram and a side view of a further current-carrying component according to the invention.
  • conductor 3 is applied to a carrier 2. With this conductor 3 spaced-apart printed circuit board 4 are soldered. Each of these circuit boards has two solder joints 5 made of solder with the conductor 3.
  • the conductor 3 is made of copper.
  • the height of the conductor 3 is 70 microns.
  • the printed circuit board 4 are also made of copper. Their height is 500 microns each.
  • the associated equivalent circuit diagram is shown in the upper illustration of FIG. 7, the associated equivalent circuit diagram is shown.
  • the lower line symbolizes ohmic resistances, which characterize the 70 ⁇ m high conductor track.
  • Each second of these ohmic resistances is connected in parallel with a series connection of three further ohmic resistors, wherein the two ohmic resistors drawn in the vertical direction characterize the ohmic resistances of the solder joints 5 and wherein the upper ohmic resistance drawn in the horizontal direction characterizes the ohmic resistance of the respective printed circuit board 4.
  • the invention relates to a current-carrying component which has a carrier, one or more conductor tracks provided on the carrier and printed circuit boards attached to the conductor tracks. These circuit boards are preferably placed on the conductor tracks by means of a placement machine and secured thereto. This can be done in the same step, in which by means of the same placement machine and other SMD components are mounted on the carrier.
  • the printed circuit boards are preferably manufactured in standardized sizes which on the one hand have an optimized aspect ratio for soldering (size tolerances, temperature coefficients, distortion, etc.) and, on the other hand, for the automatic placement machine (gripping safety, positionability, placement speed, etc.). Deploying multiple sizes can support a large number of different layouts. Furthermore, the manufacturing costs of printed circuit boards are reduced by the high number of identical parts.
  • Another production alternative would be the stamping of endless material. This would allow platelets of different lengths with the same width or different width but with the same length. The advantage would be that you can adjust the size of the plates more closely to the requirements of a currently available layout.
  • the printed circuit boards serve to relieve the printed conductors in relation to the current conduction.
  • the invention allows a transmission of high currents through the tracks without the need for broadening the tracks. This makes it possible to dimension the housing of an electrical or electronic device, within which the carrier is positioned, small.
  • a further reduction of the electrical resistance of a printed conductor is possible by a parallel arrangement of the additional printed circuit boards.
  • the circuit boards may be realized as platelets of rectangular cross section, platelets of square cross section, platelets of round cross section, in the form of a stamped grid, in the form of domes or in the form of bridges. They can also be integrated part of the carrier.
  • the circuit boards are made of a highly electrically conductive material, preferably copper.
  • the printed circuit boards which are connected in an electrically conductive manner to the printed conductors, are glued, soldered, laser-soldered, welded or laser-welded, for example, to the printed conductors. They can also be inserted in the carrier.
  • the height of the printed circuit boards 4 is 500 ⁇ m in each case. This is only an example. Alternatively, the height of the printed circuit board 4, for example, 200 microns, 300 microns, 400 microns or 1000 microns.
  • the copper layer provided on a printed circuit board can also have different layer thicknesses.
  • Another alternative is to make vias through a trace and the carrier so that traces and leads disposed on the other side of the carrier can be contacted.
  • traces and leads disposed on the other side of the carrier can be contacted.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne un composant électroconducteur, présentant un support non électroconducteur et une ou plusieurs pistes conductrices prévues sur ce support. Sur au moins une de ces pistes conductrices sont fixées des plaquettes conductrices qui sont en contact électrique avec la piste conductrice respective. De cette manière, les pistes conductrices sont déchargées lors du passage du courant. L'invention permet la mise en place de composants avec un faible espacement, par exemple des CPU, et le passage de courants forts sur une seule et même plaque conductrice.
PCT/EP2009/052838 2008-04-01 2009-03-11 Composant électroconducteur doté d’un support, de pistes conductrices et de plaquettes conductrices Ceased WO2009121697A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008016661.8 2008-04-01
DE102008016661 2008-04-01

Publications (1)

Publication Number Publication Date
WO2009121697A1 true WO2009121697A1 (fr) 2009-10-08

Family

ID=40639753

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/052838 Ceased WO2009121697A1 (fr) 2008-04-01 2009-03-11 Composant électroconducteur doté d’un support, de pistes conductrices et de plaquettes conductrices

Country Status (1)

Country Link
WO (1) WO2009121697A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012113762A1 (fr) * 2011-02-22 2012-08-30 Continental Automotive Gmbh Carte de circuit imprimé à courant admissible élevé et procédé de fabrication d'une telle carte de circuit imprimé
EP2699065A4 (fr) * 2012-06-18 2014-08-13 Sanyo Electric Co Substrat de circuit
DE102013220162A1 (de) * 2013-10-07 2015-04-23 Robert Bosch Gmbh Leiterbahnelement
WO2015082267A1 (fr) 2013-12-02 2015-06-11 Delphi France Sas Procede de fabrication d'un circuit imprime de puissance et circuit imprime de puissance obtenu par ce procede
DE102011102484B4 (de) * 2011-05-24 2020-03-05 Jumatech Gmbh Leiterplatte mit Formteil und Verfahren zu dessen Herstellung

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2154958A1 (de) * 1971-11-05 1973-05-10 Nordmende Sicherheitsloetstelle in hochspannungsfuehrenden leiterbahnen in gedruckten schaltungen
US4694123A (en) * 1982-01-13 1987-09-15 Elxsi Backplane power connector system
EP0375428A1 (fr) * 1988-12-22 1990-06-27 Texas Instruments Incorporated Système pour augmenter la capacité portante de plaquettes à circuits imprimés
DE4425803A1 (de) * 1993-08-11 1995-02-16 Siemens Ag Oesterreich Leiterplatte
US6401332B1 (en) * 1997-02-17 2002-06-11 Magnetek S.P.A. Processing printed circuits and printed circuits thus obtained
US6683669B1 (en) * 1999-08-06 2004-01-27 Sharp Kabushiki Kaisha Apparatus and method for fabricating substrate of a liquid crystal display device and interconnects therein
US20070045816A1 (en) * 2004-01-06 2007-03-01 International Business Machines Corporation Electronic package with improved current carrying capability and method of forming the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2154958A1 (de) * 1971-11-05 1973-05-10 Nordmende Sicherheitsloetstelle in hochspannungsfuehrenden leiterbahnen in gedruckten schaltungen
US4694123A (en) * 1982-01-13 1987-09-15 Elxsi Backplane power connector system
EP0375428A1 (fr) * 1988-12-22 1990-06-27 Texas Instruments Incorporated Système pour augmenter la capacité portante de plaquettes à circuits imprimés
DE4425803A1 (de) * 1993-08-11 1995-02-16 Siemens Ag Oesterreich Leiterplatte
US6401332B1 (en) * 1997-02-17 2002-06-11 Magnetek S.P.A. Processing printed circuits and printed circuits thus obtained
US6683669B1 (en) * 1999-08-06 2004-01-27 Sharp Kabushiki Kaisha Apparatus and method for fabricating substrate of a liquid crystal display device and interconnects therein
US20070045816A1 (en) * 2004-01-06 2007-03-01 International Business Machines Corporation Electronic package with improved current carrying capability and method of forming the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012113762A1 (fr) * 2011-02-22 2012-08-30 Continental Automotive Gmbh Carte de circuit imprimé à courant admissible élevé et procédé de fabrication d'une telle carte de circuit imprimé
CN103477724A (zh) * 2011-02-22 2013-12-25 大陆汽车有限公司 具有高载流能力的印刷电路板和制造这种印刷电路板的方法
US9456491B2 (en) 2011-02-22 2016-09-27 Continental Automotive Gmbh High current-carrying printed circuit board and method for producing said printed circuit board
DE102011102484B4 (de) * 2011-05-24 2020-03-05 Jumatech Gmbh Leiterplatte mit Formteil und Verfahren zu dessen Herstellung
US10736214B2 (en) 2011-05-24 2020-08-04 Jumatech Gmbh Printed circuit board having a molded part and method for the production thereof
EP2699065A4 (fr) * 2012-06-18 2014-08-13 Sanyo Electric Co Substrat de circuit
DE102013220162A1 (de) * 2013-10-07 2015-04-23 Robert Bosch Gmbh Leiterbahnelement
WO2015082267A1 (fr) 2013-12-02 2015-06-11 Delphi France Sas Procede de fabrication d'un circuit imprime de puissance et circuit imprime de puissance obtenu par ce procede

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