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WO2009038097A1 - エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物 - Google Patents

エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物 Download PDF

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Publication number
WO2009038097A1
WO2009038097A1 PCT/JP2008/066774 JP2008066774W WO2009038097A1 WO 2009038097 A1 WO2009038097 A1 WO 2009038097A1 JP 2008066774 W JP2008066774 W JP 2008066774W WO 2009038097 A1 WO2009038097 A1 WO 2009038097A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
type
microcapsule
curing agent
pack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/066774
Other languages
English (en)
French (fr)
Inventor
Shigeaki Funyuu
Yutaka Okada
Yoshii Morishita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to KR1020127000991A priority Critical patent/KR101243511B1/ko
Priority to CN200880107917A priority patent/CN101802050A/zh
Priority to JP2009533162A priority patent/JP5158088B2/ja
Publication of WO2009038097A1 publication Critical patent/WO2009038097A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/02—Making microcapsules or microballoons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Dispersion Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

本発明は、コア及びこれを被覆するカプセルを有するマイクロカプセル型潜在性硬化剤に関する。本発明に係るマイクロカプセル型硬化剤において、コアはアミンアダクトを含み、カプセルはイソシアネートと活性水素基を有する化合物及び／又は水との反応生成物を含む。反応生成物のうち少なくとも一部はアミンアダクトとの反応によりコアに結合している。
PCT/JP2008/066774 2007-09-20 2008-09-17 エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物 Ceased WO2009038097A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020127000991A KR101243511B1 (ko) 2007-09-20 2008-09-17 에폭시 수지용 마이크로캡슐형 잠재성 경화제 및 그의 제조 방법, 및 일액성 에폭시 수지 조성물 및 그의 경화물
CN200880107917A CN101802050A (zh) 2007-09-20 2008-09-17 环氧树脂用微囊型潜在性固化剂及其制造方法,和一液性环氧树脂组合物及其固化物
JP2009533162A JP5158088B2 (ja) 2007-09-20 2008-09-17 エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2007-243851 2007-09-20
JP2007243852 2007-09-20
JP2007243851 2007-09-20
JP2007-243852 2007-09-20
JP2008-043346 2008-02-25
JP2008043346 2008-02-25
JP2008-166246 2008-06-25
JP2008166246 2008-06-25

Publications (1)

Publication Number Publication Date
WO2009038097A1 true WO2009038097A1 (ja) 2009-03-26

Family

ID=40467907

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066774 Ceased WO2009038097A1 (ja) 2007-09-20 2008-09-17 エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物

Country Status (5)

Country Link
JP (1) JP5158088B2 (ja)
KR (2) KR20100072030A (ja)
CN (2) CN101802050A (ja)
TW (2) TW201008971A (ja)
WO (1) WO2009038097A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101086701B1 (ko) * 2009-06-10 2011-11-25 한국과학기술연구원 물리화학적 결합 시스템을 이용한 향상된 보존안정성을 갖는 잠재성 경화제 복합체 입자와 그 제조 방법
CN111087576A (zh) * 2019-12-31 2020-05-01 芜湖天道绿色新材料有限公司 一种可降解微胶囊固化剂的制备及应用
CN111518500A (zh) * 2020-04-22 2020-08-11 湖北回天新材料股份有限公司 溶剂型单组分环氧微胶囊预涂螺纹锁固胶及其制备方法
WO2025197915A1 (ja) * 2024-03-18 2025-09-25 旭化成株式会社 エポキシ樹脂用硬化剤、エポキシ樹脂組成物、封止材料、導電性材料、熱伝導性材料、絶縁性材料、カメラモジュール用接着剤、構造用接着剤、繊維強化プラスチック用マトリックス樹脂、含浸固着材、フィルム型ソルダーレジスト、エポキシ樹脂組成物の硬化物、半導体装置、プリント配線板、半導体チップパッケージ、及び電子装置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102270461B1 (ko) * 2016-03-10 2021-06-29 한국전자기술연구원 점접착제 조성물 및 그의 제조방법
KR101870777B1 (ko) * 2017-03-28 2018-06-26 한국신발피혁연구원 마이크로캡슐형 잠재성 경화제의 제조방법 및 이 방법에 의해 제조된 마이크로캡슐형 잠재성 경화제
KR102095115B1 (ko) * 2018-07-27 2020-03-30 한국전력공사 자가치유 실리콘 절연체 및 그 제조방법
CN111171285B (zh) * 2020-02-15 2022-04-26 常州大学 一种以聚氨酯为壳材的环氧树脂固化剂微胶囊及其制备方法
CN111389317B (zh) * 2020-04-28 2022-04-12 西北工业大学 基于巯基-异氰酸酯点击反应和油包油界面聚合的咪唑微胶囊的制备方法
JP7324377B2 (ja) * 2020-09-30 2023-08-09 旭化成株式会社 ポリウレタン系硬化剤及びその使用
JP7649379B2 (ja) * 2021-07-12 2025-03-19 旭化成株式会社 エポキシ樹脂組成物、フィルム、フィルムの製造方法、及び硬化物
CN114230767B (zh) * 2021-12-13 2024-03-19 江苏钛得新材料技术有限公司 胶粘剂用咪唑类衍生物微胶囊型潜伏固化剂及其制备方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11199655A (ja) * 1998-01-12 1999-07-27 Hitachi Ltd マイクロカプセル型りん系硬化促進剤とそれを用いた半導体封止用エポキシ樹脂組成物
JP2005344046A (ja) * 2004-06-04 2005-12-15 Asahi Kasei Chemicals Corp 潜在性硬化剤および組成物
WO2007037378A1 (ja) * 2005-09-29 2007-04-05 Asahi Kasei Chemicals Corporation 高安定性マイクロカプセル型エポキシ樹脂用硬化剤及びエポキシ樹脂組成物
JP2007091899A (ja) * 2005-09-29 2007-04-12 Asahi Kasei Chemicals Corp 高安定性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP2007091900A (ja) * 2005-09-29 2007-04-12 Asahi Kasei Chemicals Corp 速硬化性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP2007091901A (ja) * 2005-09-29 2007-04-12 Asahi Kasei Chemicals Corp 緩反応性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
WO2007088889A1 (ja) * 2006-02-03 2007-08-09 Asahi Kasei Chemicals Corporation マイクロカプセル型エポキシ樹脂用硬化剤、マスタ－バッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品
JP2007204669A (ja) * 2006-02-03 2007-08-16 Asahi Kasei Chemicals Corp 特定小粒径粒度分布エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP2007204670A (ja) * 2006-02-03 2007-08-16 Asahi Kasei Chemicals Corp 高含水含溶剤エポキシ樹脂用硬化剤およびエポキシ樹脂組成物

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11199655A (ja) * 1998-01-12 1999-07-27 Hitachi Ltd マイクロカプセル型りん系硬化促進剤とそれを用いた半導体封止用エポキシ樹脂組成物
JP2005344046A (ja) * 2004-06-04 2005-12-15 Asahi Kasei Chemicals Corp 潜在性硬化剤および組成物
WO2007037378A1 (ja) * 2005-09-29 2007-04-05 Asahi Kasei Chemicals Corporation 高安定性マイクロカプセル型エポキシ樹脂用硬化剤及びエポキシ樹脂組成物
JP2007091899A (ja) * 2005-09-29 2007-04-12 Asahi Kasei Chemicals Corp 高安定性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP2007091900A (ja) * 2005-09-29 2007-04-12 Asahi Kasei Chemicals Corp 速硬化性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP2007091901A (ja) * 2005-09-29 2007-04-12 Asahi Kasei Chemicals Corp 緩反応性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
WO2007088889A1 (ja) * 2006-02-03 2007-08-09 Asahi Kasei Chemicals Corporation マイクロカプセル型エポキシ樹脂用硬化剤、マスタ－バッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品
JP2007204669A (ja) * 2006-02-03 2007-08-16 Asahi Kasei Chemicals Corp 特定小粒径粒度分布エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP2007204670A (ja) * 2006-02-03 2007-08-16 Asahi Kasei Chemicals Corp 高含水含溶剤エポキシ樹脂用硬化剤およびエポキシ樹脂組成物

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101086701B1 (ko) * 2009-06-10 2011-11-25 한국과학기술연구원 물리화학적 결합 시스템을 이용한 향상된 보존안정성을 갖는 잠재성 경화제 복합체 입자와 그 제조 방법
CN111087576A (zh) * 2019-12-31 2020-05-01 芜湖天道绿色新材料有限公司 一种可降解微胶囊固化剂的制备及应用
CN111518500A (zh) * 2020-04-22 2020-08-11 湖北回天新材料股份有限公司 溶剂型单组分环氧微胶囊预涂螺纹锁固胶及其制备方法
WO2025197915A1 (ja) * 2024-03-18 2025-09-25 旭化成株式会社 エポキシ樹脂用硬化剤、エポキシ樹脂組成物、封止材料、導電性材料、熱伝導性材料、絶縁性材料、カメラモジュール用接着剤、構造用接着剤、繊維強化プラスチック用マトリックス樹脂、含浸固着材、フィルム型ソルダーレジスト、エポキシ樹脂組成物の硬化物、半導体装置、プリント配線板、半導体チップパッケージ、及び電子装置

Also Published As

Publication number Publication date
JPWO2009038097A1 (ja) 2011-01-06
KR20100072030A (ko) 2010-06-29
CN102936331A (zh) 2013-02-20
KR20120024963A (ko) 2012-03-14
TW201244814A (en) 2012-11-16
KR101243511B1 (ko) 2013-03-20
CN101802050A (zh) 2010-08-11
TW201008971A (en) 2010-03-01
JP5158088B2 (ja) 2013-03-06

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