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WO2009038081A1 - 不飽和ポリエステル樹脂組成物及びそれを用いた電気・電子部品成形品 - Google Patents

不飽和ポリエステル樹脂組成物及びそれを用いた電気・電子部品成形品 Download PDF

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Publication number
WO2009038081A1
WO2009038081A1 PCT/JP2008/066754 JP2008066754W WO2009038081A1 WO 2009038081 A1 WO2009038081 A1 WO 2009038081A1 JP 2008066754 W JP2008066754 W JP 2008066754W WO 2009038081 A1 WO2009038081 A1 WO 2009038081A1
Authority
WO
WIPO (PCT)
Prior art keywords
polyester resin
unsaturated polyester
resin composition
electrical
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/066754
Other languages
English (en)
French (fr)
Inventor
Hidekazu Kaneoka
Ryujin Ishiuchi
Akifumi Tamura
Hiroaki Sugita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Resonac Holdings Corp
Original Assignee
Showa Highpolymer Co Ltd
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Highpolymer Co Ltd, Toyota Motor Corp filed Critical Showa Highpolymer Co Ltd
Publication of WO2009038081A1 publication Critical patent/WO2009038081A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/01—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to unsaturated polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/06—Unsaturated polyesters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Motor Or Generator Frames (AREA)

Abstract

　本発明に係る不飽和ポリエステル樹脂組成物は、不飽和ポリエステル樹脂、架橋剤、低収縮剤、熱伝導率が２０～２５０Ｗ／ｍ・Ｋである無機充填材及びガラス繊維を含み、前記低収縮剤が、スチレン－酢酸ビニルブロック共重合体であることを特徴とする。本発明において、前記スチレン－酢酸ビニルブロック共重合体は、スチレンと酢酸ビニルとのモル比が９０：１０～４０：６０であることが好ましい。本発明に係る不飽和ポリエステル樹脂組成物により、１．０Ｗ／ｍ・Ｋ以上の熱伝導率を確保しつつ、硬化時の収縮が極めて少ない硬化物を提供することができる。
PCT/JP2008/066754 2007-09-21 2008-09-17 不飽和ポリエステル樹脂組成物及びそれを用いた電気・電子部品成形品 Ceased WO2009038081A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007245528A JP2009073975A (ja) 2007-09-21 2007-09-21 不飽和ポリエステル樹脂組成物及びそれを用いた電気・電子部品成形品
JP2007-245528 2007-09-21

Publications (1)

Publication Number Publication Date
WO2009038081A1 true WO2009038081A1 (ja) 2009-03-26

Family

ID=40467891

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066754 Ceased WO2009038081A1 (ja) 2007-09-21 2008-09-17 不飽和ポリエステル樹脂組成物及びそれを用いた電気・電子部品成形品

Country Status (2)

Country Link
JP (1) JP2009073975A (ja)
WO (1) WO2009038081A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014188854A1 (ja) * 2013-05-21 2014-11-27 昭和電工株式会社 制振材用成形材料並びにこれを成形して得られる制振材及び構造部材用成形品
WO2018193735A1 (ja) * 2017-04-20 2018-10-25 昭和電工株式会社 電子制御装置封止用樹脂組成物、電子制御装置及びその製造方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011006542A (ja) * 2009-06-24 2011-01-13 Showa Denko Kk 不飽和ポリエステル樹脂組成物及び封入モータ
EP2787015B1 (en) * 2011-12-14 2017-11-29 Showa Denko K.K. Unsaturated polyester resin composition and encapsulated motor
WO2015115186A1 (ja) * 2014-01-29 2015-08-06 昭和電工株式会社 熱硬化性樹脂組成物、その硬化物、電気電子部品
WO2025126710A1 (ja) * 2023-12-13 2025-06-19 株式会社レゾナック モールドステータ及びモータ
WO2025126665A1 (ja) * 2023-12-13 2025-06-19 株式会社レゾナック モールドステータ及びモータ

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59113011A (ja) * 1982-12-21 1984-06-29 Toshiba Corp 不飽和ポリエステル樹脂成形材料の製造方法
JPH03285947A (ja) * 1990-04-02 1991-12-17 Showa Highpolymer Co Ltd 不飽和ポリエステル樹脂組成物
JPH047353A (ja) * 1990-04-25 1992-01-10 Toshiba Chem Corp 不飽和ポリエステル樹脂成形材料
JPH05222282A (ja) * 1992-02-12 1993-08-31 Nippon Oil & Fats Co Ltd 低収縮性不飽和ポリエステル樹脂組成物
JPH0797417A (ja) * 1993-09-29 1995-04-11 Nippon Oil & Fats Co Ltd 微粒状ブロック共重合体よりなる低収縮化剤及びその製造方法並びに低収縮化剤を配合した不飽和ポリエステル樹脂組成物
WO1995029205A1 (en) * 1994-04-27 1995-11-02 Matsushita Electric Industrial Co., Ltd. Thermosetting composition, molding material, molded structure, and method of decomposing them
JPH09316311A (ja) * 1996-05-31 1997-12-09 Matsushita Electric Ind Co Ltd モールド材、モールドモータおよびモールド材の分解処理方法
JPH1095904A (ja) * 1996-09-25 1998-04-14 Matsushita Electric Ind Co Ltd モールド材、およびモールドモータ
JPH1095910A (ja) * 1996-09-26 1998-04-14 Fuji Electric Co Ltd 半導体封止用不飽和ポリエステル樹脂組成物とその成形方法
JP2000234050A (ja) * 1999-02-15 2000-08-29 Matsushita Electric Works Ltd 不飽和ポリエステル樹脂成形材料及び成形品
JP2001226573A (ja) * 2000-02-10 2001-08-21 Showa Highpolymer Co Ltd 不飽和ポリエステル樹脂組成物
JP2002097377A (ja) * 2000-09-26 2002-04-02 Nitto Shinko Kk 成形用組成物
JP2006206691A (ja) * 2005-01-26 2006-08-10 Matsushita Electric Works Ltd エステル樹脂組成物及びその成形品
WO2006095414A1 (ja) * 2005-03-08 2006-09-14 Showa Highpolymer Co., Ltd. ランプリフレクター用不飽和ポリエステル樹脂組成物及びその成形物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6099115A (ja) * 1983-11-02 1985-06-03 Nippon Oil & Fats Co Ltd 不飽和ポリエステル樹脂組成物
JPS62141058A (ja) * 1985-12-16 1987-06-24 Nippon Oil & Fats Co Ltd 低収縮性不飽和ポリエステル樹脂組成物
JPH11130953A (ja) * 1997-10-30 1999-05-18 Hitachi Chem Co Ltd 低収縮性不飽和ポリエステル樹脂組成物

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59113011A (ja) * 1982-12-21 1984-06-29 Toshiba Corp 不飽和ポリエステル樹脂成形材料の製造方法
JPH03285947A (ja) * 1990-04-02 1991-12-17 Showa Highpolymer Co Ltd 不飽和ポリエステル樹脂組成物
JPH047353A (ja) * 1990-04-25 1992-01-10 Toshiba Chem Corp 不飽和ポリエステル樹脂成形材料
JPH05222282A (ja) * 1992-02-12 1993-08-31 Nippon Oil & Fats Co Ltd 低収縮性不飽和ポリエステル樹脂組成物
JPH0797417A (ja) * 1993-09-29 1995-04-11 Nippon Oil & Fats Co Ltd 微粒状ブロック共重合体よりなる低収縮化剤及びその製造方法並びに低収縮化剤を配合した不飽和ポリエステル樹脂組成物
WO1995029205A1 (en) * 1994-04-27 1995-11-02 Matsushita Electric Industrial Co., Ltd. Thermosetting composition, molding material, molded structure, and method of decomposing them
JPH09316311A (ja) * 1996-05-31 1997-12-09 Matsushita Electric Ind Co Ltd モールド材、モールドモータおよびモールド材の分解処理方法
JPH1095904A (ja) * 1996-09-25 1998-04-14 Matsushita Electric Ind Co Ltd モールド材、およびモールドモータ
JPH1095910A (ja) * 1996-09-26 1998-04-14 Fuji Electric Co Ltd 半導体封止用不飽和ポリエステル樹脂組成物とその成形方法
JP2000234050A (ja) * 1999-02-15 2000-08-29 Matsushita Electric Works Ltd 不飽和ポリエステル樹脂成形材料及び成形品
JP2001226573A (ja) * 2000-02-10 2001-08-21 Showa Highpolymer Co Ltd 不飽和ポリエステル樹脂組成物
JP2002097377A (ja) * 2000-09-26 2002-04-02 Nitto Shinko Kk 成形用組成物
JP2006206691A (ja) * 2005-01-26 2006-08-10 Matsushita Electric Works Ltd エステル樹脂組成物及びその成形品
WO2006095414A1 (ja) * 2005-03-08 2006-09-14 Showa Highpolymer Co., Ltd. ランプリフレクター用不飽和ポリエステル樹脂組成物及びその成形物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014188854A1 (ja) * 2013-05-21 2014-11-27 昭和電工株式会社 制振材用成形材料並びにこれを成形して得られる制振材及び構造部材用成形品
WO2018193735A1 (ja) * 2017-04-20 2018-10-25 昭和電工株式会社 電子制御装置封止用樹脂組成物、電子制御装置及びその製造方法
JPWO2018193735A1 (ja) * 2017-04-20 2020-02-27 昭和電工株式会社 電子制御装置封止用樹脂組成物、電子制御装置及びその製造方法

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