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WO2009038081A1 - Unsaturated polyester resin composition and electrical/electronic component molded by using the same - Google Patents

Unsaturated polyester resin composition and electrical/electronic component molded by using the same Download PDF

Info

Publication number
WO2009038081A1
WO2009038081A1 PCT/JP2008/066754 JP2008066754W WO2009038081A1 WO 2009038081 A1 WO2009038081 A1 WO 2009038081A1 JP 2008066754 W JP2008066754 W JP 2008066754W WO 2009038081 A1 WO2009038081 A1 WO 2009038081A1
Authority
WO
WIPO (PCT)
Prior art keywords
polyester resin
unsaturated polyester
resin composition
electrical
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/066754
Other languages
French (fr)
Japanese (ja)
Inventor
Hidekazu Kaneoka
Ryujin Ishiuchi
Akifumi Tamura
Hiroaki Sugita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Resonac Holdings Corp
Original Assignee
Showa Highpolymer Co Ltd
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Highpolymer Co Ltd, Toyota Motor Corp filed Critical Showa Highpolymer Co Ltd
Publication of WO2009038081A1 publication Critical patent/WO2009038081A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/01—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to unsaturated polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/06—Unsaturated polyesters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Motor Or Generator Frames (AREA)

Abstract

Disclosed is an unsaturated polyester resin composition characterized by containing an unsaturated polyester resin, a crosslinking agent, a low shrinking agent, an inorganic filler having a thermal conductivity of 20-250 W/m•K, and a glass fiber. This unsaturated polyester resin composition is also characterized in that the low shrinking agent is composed of a styrene-vinyl acetate block copolymer. The styrene-vinyl acetate block copolymer preferably has a molar ratio between styrene and vinyl acetate of from 90:10 to 40:60. This unsaturated polyester resin composition enables to obtain a cured product which is extremely low in shrinkage during curing, while maintaining a thermal conductivity of not less than 1.0 W/m•K.
PCT/JP2008/066754 2007-09-21 2008-09-17 Unsaturated polyester resin composition and electrical/electronic component molded by using the same Ceased WO2009038081A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007245528A JP2009073975A (en) 2007-09-21 2007-09-21 Unsaturated polyester resin composition and molded article of electric / electronic parts using the same
JP2007-245528 2007-09-21

Publications (1)

Publication Number Publication Date
WO2009038081A1 true WO2009038081A1 (en) 2009-03-26

Family

ID=40467891

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066754 Ceased WO2009038081A1 (en) 2007-09-21 2008-09-17 Unsaturated polyester resin composition and electrical/electronic component molded by using the same

Country Status (2)

Country Link
JP (1) JP2009073975A (en)
WO (1) WO2009038081A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014188854A1 (en) * 2013-05-21 2014-11-27 昭和電工株式会社 Molding material for damping material, and damping material and structural member molded article obtained by molding same
WO2018193735A1 (en) * 2017-04-20 2018-10-25 昭和電工株式会社 Resin composition for sealing electronic control device, electronic control device, and method for manufacturing same

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011006542A (en) * 2009-06-24 2011-01-13 Showa Denko Kk Unsaturated polyester resin composition and encapsulated motor
EP2787015B1 (en) * 2011-12-14 2017-11-29 Showa Denko K.K. Unsaturated polyester resin composition and encapsulated motor
WO2015115186A1 (en) * 2014-01-29 2015-08-06 昭和電工株式会社 Thermosetting resin composition, cured product thereof, and electric/electronic component
WO2025126710A1 (en) * 2023-12-13 2025-06-19 株式会社レゾナック Molded stator and motor
WO2025126665A1 (en) * 2023-12-13 2025-06-19 株式会社レゾナック Molded stator and motor

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59113011A (en) * 1982-12-21 1984-06-29 Toshiba Corp Manufacture of unsaturated polyester resin molding material
JPH03285947A (en) * 1990-04-02 1991-12-17 Showa Highpolymer Co Ltd Unsaturated polyester resin composition
JPH047353A (en) * 1990-04-25 1992-01-10 Toshiba Chem Corp Unsaturated polyester resin molding material
JPH05222282A (en) * 1992-02-12 1993-08-31 Nippon Oil & Fats Co Ltd Low-shrinkage unsaturated polyester resin composition
JPH0797417A (en) * 1993-09-29 1995-04-11 Nippon Oil & Fats Co Ltd Shrinkage reducing agent comprising particulate block copolymer, its production, and unsaturated polyester resin composition containing same
WO1995029205A1 (en) * 1994-04-27 1995-11-02 Matsushita Electric Industrial Co., Ltd. Thermosetting composition, molding material, molded structure, and method of decomposing them
JPH09316311A (en) * 1996-05-31 1997-12-09 Matsushita Electric Ind Co Ltd Mold material, mold motor, and method for disassembling mold material
JPH1095904A (en) * 1996-09-25 1998-04-14 Matsushita Electric Ind Co Ltd Mold material and mold motor
JPH1095910A (en) * 1996-09-26 1998-04-14 Fuji Electric Co Ltd Unsaturated polyester resin composition for encapsulating semiconductor and molding method thereof
JP2000234050A (en) * 1999-02-15 2000-08-29 Matsushita Electric Works Ltd Unsaturated polyester resin molding material and molded product
JP2001226573A (en) * 2000-02-10 2001-08-21 Showa Highpolymer Co Ltd Unsaturated polyester resin composition
JP2002097377A (en) * 2000-09-26 2002-04-02 Nitto Shinko Kk Molding composition
JP2006206691A (en) * 2005-01-26 2006-08-10 Matsushita Electric Works Ltd Ester resin composition and its molded article
WO2006095414A1 (en) * 2005-03-08 2006-09-14 Showa Highpolymer Co., Ltd. Unsaturated polyester resin composition for lamp reflectors and moldings thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6099115A (en) * 1983-11-02 1985-06-03 Nippon Oil & Fats Co Ltd Unsaturated polyester resin composition
JPS62141058A (en) * 1985-12-16 1987-06-24 Nippon Oil & Fats Co Ltd Low-shrinkage unsaturated polyester resin composition
JPH11130953A (en) * 1997-10-30 1999-05-18 Hitachi Chem Co Ltd Low-shrinkage unsaturated polyester resin composition

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59113011A (en) * 1982-12-21 1984-06-29 Toshiba Corp Manufacture of unsaturated polyester resin molding material
JPH03285947A (en) * 1990-04-02 1991-12-17 Showa Highpolymer Co Ltd Unsaturated polyester resin composition
JPH047353A (en) * 1990-04-25 1992-01-10 Toshiba Chem Corp Unsaturated polyester resin molding material
JPH05222282A (en) * 1992-02-12 1993-08-31 Nippon Oil & Fats Co Ltd Low-shrinkage unsaturated polyester resin composition
JPH0797417A (en) * 1993-09-29 1995-04-11 Nippon Oil & Fats Co Ltd Shrinkage reducing agent comprising particulate block copolymer, its production, and unsaturated polyester resin composition containing same
WO1995029205A1 (en) * 1994-04-27 1995-11-02 Matsushita Electric Industrial Co., Ltd. Thermosetting composition, molding material, molded structure, and method of decomposing them
JPH09316311A (en) * 1996-05-31 1997-12-09 Matsushita Electric Ind Co Ltd Mold material, mold motor, and method for disassembling mold material
JPH1095904A (en) * 1996-09-25 1998-04-14 Matsushita Electric Ind Co Ltd Mold material and mold motor
JPH1095910A (en) * 1996-09-26 1998-04-14 Fuji Electric Co Ltd Unsaturated polyester resin composition for encapsulating semiconductor and molding method thereof
JP2000234050A (en) * 1999-02-15 2000-08-29 Matsushita Electric Works Ltd Unsaturated polyester resin molding material and molded product
JP2001226573A (en) * 2000-02-10 2001-08-21 Showa Highpolymer Co Ltd Unsaturated polyester resin composition
JP2002097377A (en) * 2000-09-26 2002-04-02 Nitto Shinko Kk Molding composition
JP2006206691A (en) * 2005-01-26 2006-08-10 Matsushita Electric Works Ltd Ester resin composition and its molded article
WO2006095414A1 (en) * 2005-03-08 2006-09-14 Showa Highpolymer Co., Ltd. Unsaturated polyester resin composition for lamp reflectors and moldings thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014188854A1 (en) * 2013-05-21 2014-11-27 昭和電工株式会社 Molding material for damping material, and damping material and structural member molded article obtained by molding same
WO2018193735A1 (en) * 2017-04-20 2018-10-25 昭和電工株式会社 Resin composition for sealing electronic control device, electronic control device, and method for manufacturing same
JPWO2018193735A1 (en) * 2017-04-20 2020-02-27 昭和電工株式会社 Electronic control device sealing resin composition, electronic control device, and method of manufacturing the same

Also Published As

Publication number Publication date
JP2009073975A (en) 2009-04-09

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