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WO2009034857A1 - Film for metal film transfer and adhesive film with metal film - Google Patents

Film for metal film transfer and adhesive film with metal film Download PDF

Info

Publication number
WO2009034857A1
WO2009034857A1 PCT/JP2008/065523 JP2008065523W WO2009034857A1 WO 2009034857 A1 WO2009034857 A1 WO 2009034857A1 JP 2008065523 W JP2008065523 W JP 2008065523W WO 2009034857 A1 WO2009034857 A1 WO 2009034857A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
film
metal
copper
metal film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/065523
Other languages
French (fr)
Japanese (ja)
Inventor
Hirohisa Narahashi
Shigeo Nakamura
Tadahiko Yokota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2009532136A priority Critical patent/JPWO2009034857A1/en
Publication of WO2009034857A1 publication Critical patent/WO2009034857A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

This invention provides a film for metal film transfer and a process for producing a circuit board using a film for metal film transfer, which can realize satisfactory removal of a residue (desmear) present on a via bottom. The film for metal film transfer is a film (10) for metal film transfer comprising a first metal layer (2) resistant to a copper etching liquid and a second metal layer (3) of copper or a copper alloy provided in that order on a support layer (1). The process for producing a circuit board comprises the step of providing a board comprising a copper layer or a copper alloy layer (a wiring) and a curable resin composition layer provided as a surface layer on the copper or copper alloy layer, superimposing and stacking a film (10) for metal film transfer on the board so that a second metal layer (3) is brought into contact with the curable resin composition layer, and curing the curable resin composition layer, the step of separating the support layer (1), the step of forming vias by a laser beam, the step of removing a via bottom residue, and the step of etching the surface of the via bottom substrate copper layer or copper alloy layer.
PCT/JP2008/065523 2007-09-11 2008-08-29 Film for metal film transfer and adhesive film with metal film Ceased WO2009034857A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009532136A JPWO2009034857A1 (en) 2007-09-11 2008-08-29 Metal film transfer film and adhesive film with metal film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007236001 2007-09-11
JP2007-236001 2007-09-11

Publications (1)

Publication Number Publication Date
WO2009034857A1 true WO2009034857A1 (en) 2009-03-19

Family

ID=40451866

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065523 Ceased WO2009034857A1 (en) 2007-09-11 2008-08-29 Film for metal film transfer and adhesive film with metal film

Country Status (3)

Country Link
JP (1) JPWO2009034857A1 (en)
TW (1) TW200924965A (en)
WO (1) WO2009034857A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011025532A (en) * 2009-07-24 2011-02-10 Ajinomoto Co Inc Film with metal film
WO2014074558A2 (en) 2012-11-08 2014-05-15 Toray Plastics (America) Inc. Releasable polyester metal transfer film
JP2017123452A (en) * 2016-01-04 2017-07-13 サムソン エレクトロ−メカニックス カンパニーリミテッド． Electronic component and manufacturing method thereof
US10099462B2 (en) 2013-06-28 2018-10-16 Toray Plastics (America), Inc. Releasable polyester high gloss metal transfer film
KR101948111B1 (en) * 2017-03-31 2019-02-15 (주)심텍 seed structure for plating, method of fabricating seed structure, and method of fabricating printed circuit board substrate using seed structure
CN113966099A (en) * 2021-06-30 2022-01-21 西安空间无线电技术研究所 Microwave integrated circuit thin film thickening process suitable for fixed products
WO2023149007A1 (en) * 2022-02-07 2023-08-10 尾池工業株式会社 Electroconductive film for circuit substrate, and method for producing electroconductive film for circuit substrate

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101682886B1 (en) * 2009-07-14 2016-12-06 아지노모토 가부시키가이샤 Copper clad adhesive film
KR102465117B1 (en) * 2017-11-29 2022-11-11 주식회사 잉크테크 Method for manufacturing printed circuit board
CN115261859B (en) * 2022-08-11 2023-06-20 李祥庆 Copper etching liquid composition and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049459A (en) * 1998-07-28 2000-02-18 Matsushita Electric Works Ltd Manufacture of multilayer printed wiring board
JP2001053420A (en) * 1999-08-12 2001-02-23 Reiko Co Ltd Transfer film for printed wiring board, printed wiring board obtained by using the film, and manufacturing method of the printed wiring board
JP2002301790A (en) * 2001-02-01 2002-10-15 Toray Ind Inc Release film
JP2006245213A (en) * 2005-03-02 2006-09-14 Shinko Electric Ind Co Ltd Manufacturing method of wiring circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049459A (en) * 1998-07-28 2000-02-18 Matsushita Electric Works Ltd Manufacture of multilayer printed wiring board
JP2001053420A (en) * 1999-08-12 2001-02-23 Reiko Co Ltd Transfer film for printed wiring board, printed wiring board obtained by using the film, and manufacturing method of the printed wiring board
JP2002301790A (en) * 2001-02-01 2002-10-15 Toray Ind Inc Release film
JP2006245213A (en) * 2005-03-02 2006-09-14 Shinko Electric Ind Co Ltd Manufacturing method of wiring circuit board

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011025532A (en) * 2009-07-24 2011-02-10 Ajinomoto Co Inc Film with metal film
WO2014074558A2 (en) 2012-11-08 2014-05-15 Toray Plastics (America) Inc. Releasable polyester metal transfer film
EP2917910A4 (en) * 2012-11-08 2017-02-22 Toray Plastics (America) , Inc. Releasable polyester metal transfer film
US9630385B2 (en) 2012-11-08 2017-04-25 Toray Plastics (America), Inc. Releasable polyester metal transfer film
EP3332963A1 (en) * 2012-11-08 2018-06-13 Toray Plastics (America) , Inc. Releasable polyester metal transfer film
US10596794B2 (en) 2012-11-08 2020-03-24 Toray Plastics (America), Inc. Releasable polyester high gloss metal transfer film method
US10099462B2 (en) 2013-06-28 2018-10-16 Toray Plastics (America), Inc. Releasable polyester high gloss metal transfer film
JP2017123452A (en) * 2016-01-04 2017-07-13 サムソン エレクトロ−メカニックス カンパニーリミテッド． Electronic component and manufacturing method thereof
KR101948111B1 (en) * 2017-03-31 2019-02-15 (주)심텍 seed structure for plating, method of fabricating seed structure, and method of fabricating printed circuit board substrate using seed structure
CN113966099A (en) * 2021-06-30 2022-01-21 西安空间无线电技术研究所 Microwave integrated circuit thin film thickening process suitable for fixed products
WO2023149007A1 (en) * 2022-02-07 2023-08-10 尾池工業株式会社 Electroconductive film for circuit substrate, and method for producing electroconductive film for circuit substrate

Also Published As

Publication number Publication date
TW200924965A (en) 2009-06-16
JPWO2009034857A1 (en) 2010-12-24

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