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WO2010128833A3 - Method for manufacturing an fpcb using a bonding sheet - Google Patents

Method for manufacturing an fpcb using a bonding sheet Download PDF

Info

Publication number
WO2010128833A3
WO2010128833A3 PCT/KR2010/002948 KR2010002948W WO2010128833A3 WO 2010128833 A3 WO2010128833 A3 WO 2010128833A3 KR 2010002948 W KR2010002948 W KR 2010002948W WO 2010128833 A3 WO2010128833 A3 WO 2010128833A3
Authority
WO
WIPO (PCT)
Prior art keywords
bonding sheet
release film
fpcb
bending portion
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/002948
Other languages
French (fr)
Korean (ko)
Other versions
WO2010128833A2 (en
Inventor
양호민
남대우
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interflex Co Ltd
Original Assignee
Interflex Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interflex Co Ltd filed Critical Interflex Co Ltd
Publication of WO2010128833A2 publication Critical patent/WO2010128833A2/en
Publication of WO2010128833A3 publication Critical patent/WO2010128833A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

According to the present invention, a method for manufacturing an FPCB using a bonding sheet including a substrate portion having a substrate mounted thereon, and a bending portion to be bent, comprises the steps of: forming a circuit pattern on a copper foil surface of a copper clad laminate; removing a first release film of the bonding sheet having said first release film and a second release film attached to an adhesive layer on either surface thereof; stacking the bonding sheet on the circuit pattern formed on the substrate portion and the bending portion, such that the adhesive layer is opposite the bonding sheet; and removing the second release film of the stacked bonding sheet. According to the present invention, a bonding sheet is used on a bending portion of an FPCB, as opposed to the solder mask ink of the prior art, such that low repulsive forces can be provided and costs can be reduced through a simple process as compared to said solder mask ink printing process.
PCT/KR2010/002948 2009-05-08 2010-05-10 Method for manufacturing an fpcb using a bonding sheet Ceased WO2010128833A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0040334 2009-05-08
KR1020090040334A KR20100121264A (en) 2009-05-08 2009-05-08 Method of manufacturing flexible printed circuit board using bonding sheet

Publications (2)

Publication Number Publication Date
WO2010128833A2 WO2010128833A2 (en) 2010-11-11
WO2010128833A3 true WO2010128833A3 (en) 2011-02-17

Family

ID=43050655

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/002948 Ceased WO2010128833A2 (en) 2009-05-08 2010-05-10 Method for manufacturing an fpcb using a bonding sheet

Country Status (2)

Country Link
KR (1) KR20100121264A (en)
WO (1) WO2010128833A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101381327B1 (en) * 2013-12-06 2014-04-04 주식회사 에스아이 플렉스 The method of anti-wrinkle for anisotropic conductive film area
CN108165184B (en) * 2018-02-28 2024-07-16 江西航能技术有限公司 Release paper for photosensitive coating film, lamination tool and circuit board coating process

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09191182A (en) * 1996-01-08 1997-07-22 Toshiba Chem Corp Flex rigid multilayer wiring board
JP2000290611A (en) * 1999-04-08 2000-10-17 Ube Ind Ltd Adhesive sheet for coverlay and circuit board
JP2003133704A (en) * 2001-10-26 2003-05-09 Ube Ind Ltd Adhesive sheet for circuit board and coverlay
JP2008144141A (en) * 2006-11-15 2008-06-26 Shin Etsu Chem Co Ltd Adhesive sheet

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09191182A (en) * 1996-01-08 1997-07-22 Toshiba Chem Corp Flex rigid multilayer wiring board
JP2000290611A (en) * 1999-04-08 2000-10-17 Ube Ind Ltd Adhesive sheet for coverlay and circuit board
JP2003133704A (en) * 2001-10-26 2003-05-09 Ube Ind Ltd Adhesive sheet for circuit board and coverlay
JP2008144141A (en) * 2006-11-15 2008-06-26 Shin Etsu Chem Co Ltd Adhesive sheet

Also Published As

Publication number Publication date
WO2010128833A2 (en) 2010-11-11
KR20100121264A (en) 2010-11-17

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