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WO2009031450A1 - 基板熱処理装置及び基板の熱処理方法 - Google Patents

基板熱処理装置及び基板の熱処理方法 Download PDF

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Publication number
WO2009031450A1
WO2009031450A1 PCT/JP2008/065395 JP2008065395W WO2009031450A1 WO 2009031450 A1 WO2009031450 A1 WO 2009031450A1 JP 2008065395 W JP2008065395 W JP 2008065395W WO 2009031450 A1 WO2009031450 A1 WO 2009031450A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
substrate heat
radiation
treating
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/065395
Other languages
English (en)
French (fr)
Inventor
Masami Shibagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Canon Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Anelva Corp filed Critical Canon Anelva Corp
Priority to JP2008555546A priority Critical patent/JP4288309B2/ja
Priority to CN2008800011475A priority patent/CN101569000B/zh
Publication of WO2009031450A1 publication Critical patent/WO2009031450A1/ja
Priority to US12/418,063 priority patent/US8090245B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Tunnel Furnaces (AREA)

Abstract

　輻射率の高いカーボン又はカーボン被覆材料で構成した基板ステージを備えた基板ホルダユニットを昇降可能に真空チャンバ内に設け、真空チャンバ内の基板ホルダユニットの上方に、基板ステージと対向する放熱面を備えた加熱ユニットを設け、基板ステージを放熱面に接近させて、基板ステージ上に載置された基板と非接触状態で、放熱面からの輻射熱で基板を加熱できるようにすると共に、基板ホルダユニットに輻射版、反射板を備えた基板熱処理装置とする。
PCT/JP2008/065395 2007-09-03 2008-08-28 基板熱処理装置及び基板の熱処理方法 Ceased WO2009031450A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008555546A JP4288309B2 (ja) 2007-09-03 2008-08-28 基板熱処理装置及び基板の熱処理方法
CN2008800011475A CN101569000B (zh) 2007-09-03 2008-08-28 衬底热处理设备和衬底热处理方法
US12/418,063 US8090245B2 (en) 2007-09-03 2009-04-03 Apparatus for heat-treating substrate and method for heat-treating substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-227449 2007-09-03
JP2007227449 2007-09-03

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/418,063 Continuation US8090245B2 (en) 2007-09-03 2009-04-03 Apparatus for heat-treating substrate and method for heat-treating substrate

Publications (1)

Publication Number Publication Date
WO2009031450A1 true WO2009031450A1 (ja) 2009-03-12

Family

ID=40428771

Family Applications (1)

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PCT/JP2008/065395 Ceased WO2009031450A1 (ja) 2007-09-03 2008-08-28 基板熱処理装置及び基板の熱処理方法

Country Status (4)

Country Link
US (1) US8090245B2 (ja)
JP (2) JP4288309B2 (ja)
CN (1) CN101569000B (ja)
WO (1) WO2009031450A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010116606A (ja) * 2008-11-13 2010-05-27 Sharp Corp 気相成長装置及びガス供給方法
CN101847573A (zh) * 2009-03-27 2010-09-29 佳能安内华股份有限公司 用于加热设备的温度控制方法
CN102473641A (zh) * 2009-08-04 2012-05-23 佳能安内华股份有限公司 热处理设备以及半导体装置制造方法
JP2012142333A (ja) * 2010-12-28 2012-07-26 Canon Anelva Corp 基板熱処理装置
US8426323B2 (en) 2008-12-15 2013-04-23 Canon Anelva Corporation Substrate processing apparatus, substrate annealing method, and semiconductor device manufacturing method
JP2014110294A (ja) * 2012-11-30 2014-06-12 Panasonic Corp 真空加熱炉及び有機半導体素子の製造方法
US9431281B2 (en) 2009-12-25 2016-08-30 Canon Anelva Corporation Temperature control method for substrate heat treatment apparatus, semiconductor device manufacturing method, temperature control program for substrate heat treatment apparatus, and recording medium

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JPWO2008123111A1 (ja) * 2007-03-20 2010-07-15 キヤノンアネルバ株式会社 基板加熱処理装置及び基板加熱処理方法
CN101669016B (zh) * 2007-05-16 2012-01-18 佳能安内华股份有限公司 加热处理设备
USD635597S1 (en) * 2008-11-17 2011-04-05 Applied Materials, Inc. Lift pin
USD640715S1 (en) * 2008-11-17 2011-06-28 Applied Materials, Inc. Lift pin assembly
USD650818S1 (en) * 2008-12-19 2011-12-20 Applied Materials, Inc. Inner lift pin
SG176270A1 (en) 2009-05-29 2012-01-30 Jx Nippon Oil & Energy Corp Isobutylene-based polymer and method for producing same
US8367531B1 (en) 2010-03-23 2013-02-05 L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Aluminum implant using new compounds
JP5517766B2 (ja) * 2010-06-16 2014-06-11 キヤノン株式会社 露光装置およびデバイス製造方法
US9719169B2 (en) * 2010-12-20 2017-08-01 Novellus Systems, Inc. System and apparatus for flowable deposition in semiconductor fabrication
US20120196242A1 (en) * 2011-01-27 2012-08-02 Applied Materials, Inc. Substrate support with heater and rapid temperature change
US20130067761A1 (en) * 2011-09-16 2013-03-21 Shenzhen China Star Optoelectronics Technology Co. Ltd. Drying apparatus
TWI534341B (zh) * 2011-09-26 2016-05-21 Hitachi Int Electric Inc A substrate processing apparatus, a manufacturing method of a semiconductor device, and a recording medium
US10224182B2 (en) * 2011-10-17 2019-03-05 Novellus Systems, Inc. Mechanical suppression of parasitic plasma in substrate processing chamber
CN104040691B (zh) 2011-12-27 2016-09-07 佳能安内华股份有限公司 基板热处理装置
JP6311955B2 (ja) * 2012-07-24 2018-04-18 日立金属株式会社 金型の焼入方法
JP2014194921A (ja) * 2013-03-01 2014-10-09 Tokyo Electron Ltd マイクロ波処理装置及びマイクロ波処理方法
US9165773B2 (en) 2013-05-28 2015-10-20 Praxair Technology, Inc. Aluminum dopant compositions, delivery package and method of use
US9847222B2 (en) 2013-10-25 2017-12-19 Lam Research Corporation Treatment for flowable dielectric deposition on substrate surfaces
JP6245475B2 (ja) * 2014-07-30 2017-12-13 公益財団法人鉄道総合技術研究所 異種金属複合部材の製造方法
US10049921B2 (en) 2014-08-20 2018-08-14 Lam Research Corporation Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor
US10388546B2 (en) 2015-11-16 2019-08-20 Lam Research Corporation Apparatus for UV flowable dielectric
SG11201807703YA (en) * 2016-03-18 2018-10-30 Acm Research Shanghai Inc Substrate heat treatment apparatus
IT201600099783A1 (it) * 2016-10-05 2018-04-05 Lpe Spa Reattore per deposizione epitassiale con riflettore esterno alla camera di reazione e metodo di raffreddamento di un suscettore e di substrati
US10861731B2 (en) * 2017-01-19 2020-12-08 Axcelis Technologies, Inc. Radiant heating presoak
KR102242975B1 (ko) * 2017-03-09 2021-04-23 주식회사 원익아이피에스 기판 처리 장치
CN108060406B (zh) * 2018-01-29 2023-09-08 北京北方华创微电子装备有限公司 遮挡压盘组件、半导体加工装置和方法
CN109888129B (zh) * 2019-01-30 2020-12-08 武汉华星光电半导体显示技术有限公司 用以去除柔性基板中气泡的设备与方法
JP2021197448A (ja) * 2020-06-15 2021-12-27 光洋サーモシステム株式会社 熱処理装置

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JPWO2008123111A1 (ja) 2007-03-20 2010-07-15 キヤノンアネルバ株式会社 基板加熱処理装置及び基板加熱処理方法
JP5468784B2 (ja) 2008-01-30 2014-04-09 キヤノンアネルバ株式会社 基板加熱装置、加熱処理方法および半導体デバイスを製造する方法
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JPH05190464A (ja) * 1992-01-16 1993-07-30 Toshiba Corp 気相成長装置
JPH07268627A (ja) * 1994-03-31 1995-10-17 Tokyo Electron Ltd 熱処理方法
JPH10125690A (ja) * 1996-10-17 1998-05-15 Nippon Pillar Packing Co Ltd ウエハー熱処理装置
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010116606A (ja) * 2008-11-13 2010-05-27 Sharp Corp 気相成長装置及びガス供給方法
US8426323B2 (en) 2008-12-15 2013-04-23 Canon Anelva Corporation Substrate processing apparatus, substrate annealing method, and semiconductor device manufacturing method
CN101847573A (zh) * 2009-03-27 2010-09-29 佳能安内华股份有限公司 用于加热设备的温度控制方法
CN102473641A (zh) * 2009-08-04 2012-05-23 佳能安内华股份有限公司 热处理设备以及半导体装置制造方法
CN102473641B (zh) * 2009-08-04 2015-04-22 佳能安内华股份有限公司 热处理设备以及半导体装置制造方法
US9147742B2 (en) 2009-08-04 2015-09-29 Canon Anelva Corporation Heat treatment apparatus and semiconductor device manufacturing method
US9431281B2 (en) 2009-12-25 2016-08-30 Canon Anelva Corporation Temperature control method for substrate heat treatment apparatus, semiconductor device manufacturing method, temperature control program for substrate heat treatment apparatus, and recording medium
JP2012142333A (ja) * 2010-12-28 2012-07-26 Canon Anelva Corp 基板熱処理装置
JP2014110294A (ja) * 2012-11-30 2014-06-12 Panasonic Corp 真空加熱炉及び有機半導体素子の製造方法

Also Published As

Publication number Publication date
US8090245B2 (en) 2012-01-03
JP2009147392A (ja) 2009-07-02
CN101569000A (zh) 2009-10-28
JPWO2009031450A1 (ja) 2010-12-16
US20090190908A1 (en) 2009-07-30
JP4988785B2 (ja) 2012-08-01
JP4288309B2 (ja) 2009-07-01
CN101569000B (zh) 2011-07-13

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